Panel dismounting and reflow production equipment

Abstract

The utility model discloses dismantle board reflow production facility, including reflow production line, first mounting bracket, second mounting bracket, third mounting bracket, fourth mounting bracket and portal frame, the reflow production line is used for the PCB board of reflow laminating completion, is equipped with scissors type lifting module, first drive module and dismantle board platform on first mounting bracket, and the scissors type lifting module is linked with dismantle board platform, and first drive module is linked with scissors type lifting module and first drive module drives scissors type lifting module to go up and down, and the reflow production line sets up in first mounting bracket rear side and is adjacent to first mounting bracket setting, and the reflow production line is still used for conveying the PCB board laminating completion to dismantle board platform, and second mounting bracket sets up in first mounting bracket left side and is adjacent to second mounting bracket setting, is equipped with first conveying line on second mounting bracket, and first conveying line is used for conveying the PCB board of completing dismantle board, is equipped with second conveying line on third mounting bracket. The utility model has the advantages of high degree of automation, reasonable in design, production efficiency is high.

Description

Technical Field

[0001] This utility model belongs to the field of PCB board manufacturing technology, specifically relating to a disassembly and reflow production equipment. Background Technology

[0002] In PCB manufacturing, multiple small boards are assembled into a single board to improve production efficiency. During the lamination process, steel plates are used to separate these boards. This separation ensures the quality of the multilayer board lamination, specifically by providing uniform pressure distribution, ensuring surface flatness, isolating impurities, controlling temperature distribution, and providing electromagnetic shielding. Uniform pressure distribution refers to the laminator bonding multiple copper-clad laminates (CCLs) together under high temperature and pressure to form a multilayer PCB. The steel plates placed between the CCL layers evenly distribute pressure to each layer, achieving bubble-free bonding and preventing delamination or warping. Ensuring surface flatness means that the steel plates are processed with high precision, controlling surface flatness errors to the micrometer level. During the lamination process, the steel plate can smoothly clamp each CCL layer, preventing the board from bending or deforming due to uneven stress, thus ensuring the flatness of the PCB surface and signal integrity. Isolating impurities means that the steel plate can effectively prevent particles, dust and other impurities generated during the lamination process from entering the CCL surface, ensuring the cleanliness of each layer, reducing the scrap rate, and improving production efficiency. Controlling temperature distribution means that the steel plate has good thermal conductivity, which can ensure that heat can be evenly transferred to each layer of material, so that each lamination operation can achieve the best results and help shorten the production cycle.

[0003] After lamination, the steel plates between the whole plates are removed, and the whole plate is then removed and separated into multiple smaller plates. The existing equipment for removing steel plates has low production efficiency and cannot meet the demand. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a high-efficiency depaneling and reflow production equipment.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] The equipment for dismantling and reflowing production includes:

[0007] A reflow production line for reflowing laminated PCBs;

[0008] The first mounting frame is equipped with a scissor-type lifting module, a first drive module, and a board removal table. The board removal table is connected to the scissor-type lifting module, and the first drive module is connected to the scissor-type lifting module and drives the scissor-type lifting module to lift. The reflow production line is located behind the first mounting frame and adjacent to the first mounting frame. The reflow production line is also used to transport the laminated PCB board to the board removal table.

[0009] The second mounting frame is located to the left of the first mounting frame and adjacent to the first mounting frame. The second mounting frame is equipped with a first conveyor line, which is used to convey the PCB board that has been disassembled.

[0010] The third mounting frame is located to the right of the first mounting frame and is adjacent to the first mounting frame. The third mounting frame is equipped with a second conveyor line, which is used to convey steel plates.

[0011] A gantry frame is installed between the second and third mounting frames. The gantry frame is equipped with a first displacement lifting and adsorption assembly and a second displacement lifting and adsorption assembly. The first displacement lifting and adsorption assembly is located to the right of the second displacement lifting and adsorption assembly. The first displacement lifting and adsorption assembly is used to adsorb steel plates for disassembly. The first displacement lifting and adsorption assembly is also used to transport the steel plates from the disassembly table to the second conveyor line. The second displacement lifting and adsorption assembly is used to adsorb the disassembled PCB board. The second displacement lifting and adsorption assembly is also used to transport the disassembled PCB board from the disassembly table to the first conveyor line.

[0012] And a fourth mounting frame, which is located to the right of the third mounting frame and adjacent to the third mounting frame. The fourth mounting frame is equipped with a flipping module, which is used to flip the steel plate conveyed by the second conveyor line.

[0013] Preferably, the first displacement lifting adsorption assembly includes a second drive module, a first X-axis, and a first adsorption component. The first X-axis is located on the right side of the gantry frame. The second drive module is mounted on the first X-axis and the first X-axis drives the second drive module to move left and right. The first adsorption component is mounted on the second drive module and the second drive module drives the first adsorption component to move up and down. The first adsorption component is used to adsorb steel plates for disassembly. The first adsorption component is also used to transport the steel plates from the disassembly table to the second conveyor line.

[0014] Preferably, the second displacement lifting adsorption assembly includes a third drive module, a second X-axis, and a second adsorption component. The second X-axis is located on the left side of the gantry frame. The third drive module is mounted on the second X-axis and the second X-axis drives the third drive module to move left and right. The second adsorption component is mounted on the third drive module and the third drive module drives the second adsorption component to move up and down. The second adsorption component is used to adsorb the PCB board that has been disassembled. The second adsorption component is also used to transport the disassembled PCB board from the disassembly table to the first conveyor line.

[0015] By adopting the above technical solution, this utility model has the following beneficial effects:

[0016] In practical application, the reflow production line, the first displacement lifting adsorption component, and the second displacement lifting adsorption component of this utility model can reflow the laminated PCB board and transport it to the board removal station. The first displacement lifting adsorption component and the second displacement lifting adsorption component can work together to complete the board removal and the transport of the disassembled PCB board. The overall automation level is high, the design is reasonable, and the production efficiency is high.

[0017] In summary, this utility model has the advantages of high automation, reasonable design, and high production efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model. Detailed Implementation

[0019] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0020] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0021] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] Example 1

[0025] In this embodiment, a board reflow production equipment is proposed, which can remove the steel plate and PCB board from the laminated PCB board, and the steel plate can be reflowed for reuse. After the PCB board is removed, it is separated into its own boards.

[0026] like Figure 1 As shown, in one embodiment of this utility model, the PCB reflow production equipment includes a reflow production line 1, a first mounting frame 2, a second mounting frame 6, a third mounting frame 8, a fourth mounting frame, and a gantry frame 10. The reflow production line 1 is used for reflowing laminated PCBs. The first mounting frame 2 is equipped with a scissor-type lifting module 3, a first drive module 4, and a disassembly table 5. The disassembly table 5 is connected to the scissor-type lifting module 3, and the first drive module 4 is connected to and drives the scissor-type lifting module 3 to move up and down. The reflow production line 1 is located behind and adjacent to the first mounting frame 2. The reflow production line 1 is also used to transport laminated PCBs to the disassembly table 5. The second mounting frame 6 is located to the left of and adjacent to the first mounting frame 2. The second mounting frame 6 is equipped with a first conveyor line 7, which is used to transport disassembled PCBs. The third mounting frame 8, the fourth mounting frame 9, the fourth mounting frame 10, and the gantry frame 10 are all located on the first mounting frame 2. The mounting frame 8 is located to the right of the first mounting frame 2 and is adjacent to the first mounting frame 2. The third mounting frame 8 is equipped with a second conveyor line 9, which is used to convey steel plates. The gantry frame 10 is located between the second mounting frame 6 and the third mounting frame 8. The gantry frame 10 is equipped with a first displacement lifting adsorption component and a second displacement lifting adsorption component. The first displacement lifting adsorption component is located to the right of the second displacement lifting adsorption component. The first displacement lifting adsorption component is used to adsorb steel plates for disassembly. The first displacement lifting adsorption component is also used to convey steel plates from the disassembly table 5 to the second conveyor line 9. The second displacement lifting adsorption component is used to adsorb the disassembled PCB board. The second displacement lifting adsorption component is also used to convey the disassembled PCB board from the disassembly table 5 to the first conveyor line 7. The fourth mounting frame is located to the right of the third mounting frame 8 and is adjacent to the third mounting frame 8. The fourth mounting frame is equipped with a flipping module, which is used to flip the steel plates conveyed by the second conveyor line 9.

[0027] Specifically, the scissor-type lifting module 3 of this utility model may include a scissor arm assembly and a guide mechanism. The scissor arm assembly consists of multiple sets of cross-hinged connecting rods (single-stage or multi-stage). Lifting is achieved by the relative movement of the hinge points. The guide mechanism is a linear guide rail or a slide to ensure verticality and stability during lifting. The first drive module 4 is a drive motor. Its transmission mechanism converts the rotational motion into linear thrust, which then pushes the hinge points of the scissor arm assembly to move. Then the scissor arm extends or retracts, and the disassembly table 5 is lifted. This is a mature existing technology. The more detailed structure will not be described in detail. The first conveyor line 7 and the second conveyor line 9 of this utility model can both be conveyor belts. After the first conveyor line 7 conveys the PCB board that has been disassembled, the PCB board can be unloaded manually. At this time, the PCB board can be understood as a whole board. The whole board can be manually lowered to separate it into smaller boards.

[0028] The flipping module of this utility model is also a mature existing technology. It can include a drive system, a flipping actuator, a conveying and positioning system, a positioning mechanism, a support and frame structure, a control system, etc. The drive system includes a power source and transmission components, and the anti-authoritarian type includes grippers. The conveying and positioning system includes belts, photoelectric sensors, etc. The control system is a PLC. In specific applications, the flipping module of this utility model can receive steel plates on the third mounting frame 8 and also flip the steel plates conveyed by the second conveyor line 9. After the steel plates are flipped, they continue to be recycled (specifically, they are used again for the production and lamination of PCB boards) and then returned to the recycling production line 1.

[0029] The first displacement lifting adsorption assembly of this utility model includes a second drive module 11, a first X-axis, and a first adsorption component 12. The first X-axis is located on the right side of the gantry frame 10. The second drive module 11 is mounted on the first X-axis and the first X-axis drives the second drive module 11 to move left and right. The first adsorption component 12 is mounted on the second drive module 11 and the second drive module 11 drives the first adsorption component 12 to move up and down. The first adsorption component 12 is used to adsorb steel plates for disassembly. The first adsorption component 12 is also used to transport the steel plates from the disassembly table 5 to the second conveyor line 9.

[0030] The second displacement lifting adsorption assembly of this utility model includes a third drive module 13, a second X-axis, and a second adsorption component 14. The second X-axis is located on the left side of the gantry frame 10. The third drive module 13 is mounted on the second X-axis and the second X-axis drives the third drive module 13 to move left and right. The second adsorption component 14 is mounted on the third drive module 13 and the third drive module 13 drives the second adsorption component 14 to move up and down. The second adsorption component 14 is used to adsorb the PCB board that has been disassembled. The second adsorption component 14 is also used to transport the disassembled PCB board from the disassembly table 5 to the first conveyor line 7.

[0031] In specific applications, this utility model relies on the reflow production line 1 to transport the laminated PCB board. The drive module can drive the scissor-type lifting module 3 to lift and lower, thereby adjusting the height of the disassembly table 5 to match the reflow production line 1, the second mounting frame 6, the third mounting frame 8, etc. The first displacement lifting adsorption component can adsorb the steel plate for disassembly and can also transport the steel plate from the disassembly table 5 to the second conveyor line 9. The second displacement lifting adsorption component can adsorb the disassembled PCB board and can also transport the disassembled PCB board from the disassembly table 5 to the first conveyor line 7. The overall structure is simple and the design is reasonable, which can complete the disassembly and reflow.

[0032] This embodiment does not impose any limitation on the shape, material, structure, etc. of this utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this utility model shall fall within the protection scope of this utility model.

Claims

1. A plate reflow production equipment, characterized in that, include: A reflow production line for reflowing laminated PCBs; The first mounting frame is equipped with a scissor-type lifting module, a first drive module, and a board removal table. The board removal table is connected to the scissor-type lifting module, and the first drive module is connected to the scissor-type lifting module and drives the scissor-type lifting module to lift. The reflow production line is located behind the first mounting frame and adjacent to the first mounting frame. The reflow production line is also used to transport the laminated PCB board to the board removal table. The second mounting frame is located to the left of the first mounting frame and adjacent to the first mounting frame. The second mounting frame is equipped with a first conveyor line, which is used to convey the PCB board that has been disassembled. The third mounting frame is located to the right of the first mounting frame and is adjacent to the first mounting frame. The third mounting frame is equipped with a second conveyor line, which is used to convey steel plates. A gantry frame is installed between the second and third mounting frames. The gantry frame is equipped with a first displacement lifting and adsorption assembly and a second displacement lifting and adsorption assembly. The first displacement lifting and adsorption assembly is located to the right of the second displacement lifting and adsorption assembly. The first displacement lifting and adsorption assembly is used to adsorb steel plates for disassembly. The first displacement lifting and adsorption assembly is also used to transport the steel plates from the disassembly table to the second conveyor line. The second displacement lifting and adsorption assembly is used to adsorb the disassembled PCB board. The second displacement lifting and adsorption assembly is also used to transport the disassembled PCB board from the disassembly table to the first conveyor line. And a fourth mounting frame, which is located to the right of the third mounting frame and adjacent to the third mounting frame. The fourth mounting frame is equipped with a flipping module, which is used to flip the steel plate conveyed by the second conveyor line.

2. The depanel reflow production equipment according to claim 1, characterized in that: The first displacement lifting adsorption assembly includes a second drive module, a first X-axis, and a first adsorption component. The first X-axis is located on the right side of the gantry frame. The second drive module is mounted on the first X-axis and the first X-axis drives the second drive module to move left and right. The first adsorption component is mounted on the second drive module and the second drive module drives the first adsorption component to move up and down. The first adsorption component is used to adsorb steel plates for disassembly. The first adsorption component is also used to transport the steel plates from the disassembly table to the second conveyor line.

3. The plate-return production equipment according to claim 1, characterized in that: The second displacement lifting adsorption assembly includes a third drive module, a second X-axis, and a second adsorption component. The second X-axis is located on the left side of the gantry frame. The third drive module is mounted on the second X-axis and the second X-axis drives the third drive module to move left and right. The second adsorption component is mounted on the third drive module and the third drive module drives the second adsorption component to move up and down. The second adsorption component is used to adsorb the PCB board that has been disassembled. The second adsorption component is also used to transport the disassembled PCB board from the disassembly table to the first conveyor line.

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