Multi-layer circuit board positioning device

Abstract

The utility model discloses an embodiment of a kind of multilayer circuit board positioning device, first positioning head is set to first profiling groove, and driving pad and driven slider are set in first guide groove, to guide the movement of driving pad and driven slider by first guide groove. Thus, driven slider can be moved under the driving of driving pad, when driving pad elevates driven slider, so that first positioning head can be in contact with the side surface of the upper layer board of circuit board, when heating equipment heats circuit board, ensure that circuit board is stably set in first profiling groove, prevent circuit board from moving. On the other hand, after completing heating operation, driving pad is separated from below driven slider, after driven slider falls into first guide groove, first positioning head can also position middle layer board or lower layer board under the driving of driving pad, and operator can directly take off upper layer board, without having to set other positioning head for circuit board.

Description

Technical Field

[0001] This utility model relates to the field of automation technology, and in particular to a multi-layer circuit board positioning device. Background Technology

[0002] In the inspection or repair of multilayer circuit boards, it is necessary to disassemble the upper and lower layers. Preheating the multilayer circuit board before disassembly melts the solder between the layers, facilitating separation. However, the circuit board needs to be positioned correctly during both preheating and disassembly to prevent movement. Furthermore, unstable placement can easily cause secondary damage. Therefore, simplifying the positioning method for multilayer circuit boards and improving the efficiency of repair and disassembly is a problem that needs to be solved. Utility Model Content

[0003] In view of this, this utility model embodiment provides a multi-layer circuit board positioning device. By utilizing different combinations of the driving pad and the driven slider, the first positioning head can position different locations on the circuit board during heating and disassembly. This simplifies the positioning method for multi-layer circuit boards and improves the efficiency of repair and disassembly.

[0004] The multilayer circuit board positioning device of this utility model embodiment includes:

[0005] A first carrier includes a first platform and a plurality of first positioning parts. The first platform has a first contouring groove and a plurality of first guide grooves. The first guide grooves extend laterally toward the first contouring groove. The plurality of first positioning parts are respectively disposed corresponding to the plurality of first guide grooves. Each first positioning part includes a first positioning member and a first driving member. The first positioning member includes a driven slider and a first positioning head. The first positioning head extends toward the first contouring groove. The first driving member includes a driving pad. The driven slider and the driving pad are slidably disposed in the first guide groove.

[0006] The first positioning part has a first combined state and a second combined state. In the first combined state, the driving pad is placed between the bottom of the first guide groove and the driven slider. In the second combined state, the driven slider abuts against the bottom of the first guide groove, and the driving pad pushes the first positioning head towards the first contour groove through the driven slider.

[0007] Furthermore, the inner wall of the first guide groove has two guide side surfaces and a guide bottom surface;

[0008] Both the driving pad and the driven slider abut against the two guide sides, and when switching from the first combined state to the second combined state, the driven slider slides along the depth direction of the first guide groove. In the second combined state, the driving pad and the driven slider slide on the bottom surface of the guide.

[0009] Furthermore, the first contouring groove has multiple notches on its side, and the multiple notches are correspondingly provided with multiple first guide grooves, with one end of the first guide groove connected to the corresponding first contouring groove;

[0010] The first positioning element further includes a connecting arm, one end of which is connected to the driven slider, and the other end of which extends toward the notch and bends away from the first platform, and is connected to the first positioning head.

[0011] Furthermore, an avoidance hole is provided at the bottom of the first guide groove;

[0012] The drive pad includes an intermediate body and two forks, the two forks being spaced apart and extending from the intermediate body into the first contour groove;

[0013] The first positioning element includes a first connecting post and a first operating block. The first operating block is located below the first platform. One end of the first connecting post is connected to the first operating block, and the other end passes through the clearance hole and is connected to the driven slider.

[0014] In the first combined state, the two fork heads extend to both sides of the first connecting post, and the intermediate body pushes against the first positioning head through the first connecting post.

[0015] Furthermore, the clearance hole includes two first guide surfaces, and the first connecting post is a prism;

[0016] When switching from the first combined state to the second combined state, the two first guide surfaces abut against the first connecting post and slide relative to each other.

[0017] Furthermore, the first guide surface has a first extending direction and a second extending direction, the first extending direction being parallel to the axial direction of the clearance hole, and the second extending direction being parallel to the extending direction of the first guide groove.

[0018] In the first combined state, the first connecting post moves up along the first extending direction and the first connecting post moves closer to the first contour groove along the second extending direction.

[0019] Furthermore, the first positioning part also includes a first elastic element and a washer;

[0020] The first connecting post passes through the washer, one end of the first elastic member abuts against the first operating block, and the other end abuts against the washer, and the first elastic member generates elastic compression.

[0021] The first connecting post moves along the second extending direction, and the side of the washer away from the first elastic member abuts against and slides relative to the edge of the clearance hole away from the first guide groove.

[0022] Furthermore, the first positioning part also includes a second elastic element and a guide element, the guide element including a first guide post;

[0023] The first driving member further includes a driving slider having a first slide rail, the driving slider sliding on the first guide post via the first slide rail, and the second elastic member generating an elastic force to drive the driving pad block closer to the first contour groove.

[0024] Furthermore, the first slide has a second guide surface, the first guide post is a prism and parallel to the extension direction of the first guide groove, and the second guide surface abuts against the side of the first guide post and slides on the first guide post.

[0025] Furthermore, the guide also includes two second guide posts, which are located on both sides of the first guide post and are parallel to the first guide post. The arrangement direction of the two second guide posts is parallel to the arrangement direction of the two forks.

[0026] The drive slider also has two second slides corresponding to the two second guide posts, the second guide posts being slidably disposed in the corresponding second slides.

[0027] Furthermore, the multilayer circuit board positioning device also includes:

[0028] The second carrier includes a second platform and a plurality of second positioning parts. The second platform has a second contour groove. The second positioning part includes a second positioning member. The second positioning member includes a second positioning head. The plurality of second positioning heads are operable to approach or move away from the second contour groove.

[0029] Furthermore, the second positioning head has an avoidance slope and a pressing surface, the pressing surface facing the bottom of the second contour groove, one side of the avoidance slope being connected to the pressing surface, and the other side being inclined away from the second contour groove;

[0030] The second platform has a third slide rail, and the second carrier further includes a second drive member, which drives a plurality of second positioning parts to move along the third slide rail;

[0031] The second positioning part further includes a third elastic element, which generates an elastic force that drives the pressing surface to move to the bottom of the second contour groove.

[0032] Furthermore, the second drive member has multiple connection holes;

[0033] The second positioning member further includes a second connecting post and a second operating block. A plurality of second connecting posts are correspondingly arranged with a plurality of connecting holes. One end of the second connecting post is connected to the second positioning head, and the other end passes through the corresponding connecting hole and is connected to the second operating block. The third elastic member abuts between the second driving member and the second operating block.

[0034] Furthermore, the second carrier also includes a magnetic part, which includes a first magnet, a second magnet, and a third magnet;

[0035] The first magnet is disposed on the second driving member, and the second magnet and the third magnet are disposed at a distance from each other on the second platform;

[0036] The second driving member drives multiple second positioning heads to move to the second contour groove, the first magnet and the second magnet attract each other, the second driving member drives multiple second positioning heads to a position away from the second contour groove, and the first magnet attracts the third magnet.

[0037] In this embodiment, the multilayer circuit board positioning device has a first positioning head facing the first contour groove, and a driving pad and a driven slider positioned in the first guide groove to guide their movement. Thus, on one hand, the driven slider can move under the drive of the driving pad. When the driving pad raises the driven slider, the first positioning head can abut against the side of the upper layer of the circuit board, ensuring the circuit board is stably positioned within the first contour groove and preventing movement during heating. On the other hand, after heating, the driving pad is removed from under the driven slider, and the driven slider falls into the first guide groove. Driven by the driving pad, the first positioning head can also position the middle or lower layer, allowing the operator to directly remove the upper layer without needing a separate positioning head, simplifying the circuit board positioning process and improving maintenance and disassembly efficiency. Attached Figure Description

[0038] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0039] Figure 1 This is a structural schematic diagram of one side of the multilayer circuit board positioning device according to an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the structure of the multilayer circuit board positioning device of this utility model embodiment on the other side;

[0041] Figure 3 This is an exploded view of the multilayer circuit board positioning device according to an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the working state of the multilayer circuit board positioning device in some embodiments of the present invention.

[0043] Figure 5 This is a schematic diagram of the working state of the multilayer circuit board positioning device according to an embodiment of the present invention in some other embodiments;

[0044] Figure 6 This is an exploded view of one side of the first vehicle according to an embodiment of the present invention;

[0045] Figure 7 This is an exploded schematic diagram of the other side of the first vehicle in this embodiment of the present invention;

[0046] Figure 8 This is an exploded view of one side of the first positioning part in an embodiment of this utility model;

[0047] Figure 9 This is an exploded view of the other side of the first positioning part in an embodiment of this utility model;

[0048] Figure 10 This is a schematic diagram of the working state of the first positioning part according to an embodiment of the present utility model;

[0049] Figure 11 This is an exploded schematic diagram of the second vehicle according to an embodiment of the present invention;

[0050] Figure 12 This is a schematic diagram of the working state of the second vehicle according to an embodiment of the present utility model;

[0051] Figure 13 This is a schematic flowchart of a multilayer circuit board splitting method according to an embodiment of the present invention.

[0052] Explanation of reference numerals in the attached figures:

[0053] 1-First vehicle;

[0054] 11-First positioning part; 111-First positioning component; 1111-First positioning head; 1112-Driven slider; 1113-Connecting arm; 1114-First connecting post; 1115-First operating block;

[0055] 112-First driving component; 1121-Driving pad block; 1122-Intermediate body; 1123-Fork head; 1124-Driving slider; 1125-First slide rail; 1126-Second guide surface; 1128-Second slide rail; 1129-Third operating block;

[0056] 113 - First elastic element;

[0057] 114 - Washer;

[0058] 115 - Second elastic element;

[0059] 116-Guide component; 1161-First guide post; 1162-Second guide post; 1163-Connecting rod;

[0060] 12 - First platform;

[0061] 121-First contour groove; 1211-Notch;

[0062] 122-First guide groove; 1221-Guide side surface; 1222-Guide bottom surface;

[0063] 123 - Clearance hole; 1231 - First guide surface;

[0064] 2-Second vehicle;

[0065] 21-Second platform; 211-Second contour groove; 212-Third slide;

[0066] 22-Second positioning part; 221-Second positioning component; 2211-Second positioning head; 2212-Pressure surface; 2213-Avoidance slope; 2214-Connecting hole; 2215-Second connecting post; 2216-Second operating block;

[0067] 2217 - Adjusting lever; 2218 - Positioning end;

[0068] 23-Second driving component; 231-Limiting groove; 2311-First limiting area; 2312-Second limiting area; 2313-First limiting surface; 2314-Second limiting surface;

[0069] 24 - Third elastic element;

[0070] 3-Base;

[0071] 41 - First combined state; 42 - Second combined state;

[0072] 5-Magnetic part;

[0073] 51 - First magnet; 52 - Second magnet; 53 - Third magnet;

[0074] 6- Heating equipment;

[0075] 7-Driven devices;

[0076] 8-Circuit board;

[0077] 81 - Upper layer; 82 - Middle layer; 83 - Lower layer. Detailed Implementation

[0078] The present invention will now be described based on embodiments, but it is not limited to these embodiments. In the following detailed description of the present invention, certain specific details are described in detail. Those skilled in the art will fully understand the present invention even without these details. To avoid obscuring the essence of the present invention, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0079] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0080] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0081] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0082] Unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0083] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.

[0084] Figure 1 and Figure 2 This is a schematic diagram of the multilayer circuit board positioning device in this embodiment.

[0085] In some implementations, such as Figures 1-2 As shown, the multilayer circuit board positioning device in this embodiment includes a first carrier 1, a second carrier 2, and a base 3. The first carrier 1 and the second carrier 2 are fixedly mounted on the base 3. The bottom of the base 3 is provided with support legs, thereby raising the height of the first carrier 1 and the second carrier 2.

[0086] Figure 3 This is an exploded view of the multilayer circuit board positioning device in this embodiment. Figure 4 and Figure 5 This is a schematic diagram of the working state of the multilayer circuit board positioning device in this embodiment.

[0087] Further reference Figures 3-5 As shown, the multilayer circuit board positioning device in this embodiment can be used to position circuit board 8. Circuit board 8 can be a multilayer circuit board. For example... Figure 4 As shown, the following embodiment uses a three-layer circuit board as an example. The circuit board 8 includes an upper layer board 81, a middle layer board 82, and a lower layer board 83. When the circuit board 8 is placed on the first carrier 1, the upper layer board 81 is located at the top of the circuit board 8, and the lower layer board 83 is located at the bottom of the circuit board 8. After the circuit board 8 is positioned by the multi-layer circuit board positioning device, the circuit board 8 can be heated by the heating device 6 to melt the solder. Then, the upper layer board 81 can be removed from the middle layer board 82 to facilitate the operator to inspect the circuit board 8 and its functional units. In the above process, the multi-layer circuit board positioning device can be driven by the driving device 7 below the multi-layer circuit board positioning device.

[0088] Figure 6 and Figure 7 This is an exploded schematic diagram of the first vehicle 1 in this embodiment. Figure 8 and Figure 9 This is an exploded view of the first positioning part 11 in this embodiment.

[0089] In some implementations, such as Figures 4-6 As shown, the multilayer circuit board positioning device includes a first carrier 1. The first carrier 1 includes a first platform 12 and a plurality of first positioning parts 11. The first platform 12 has a first contouring groove 121 and a plurality of first guide grooves 122. The first guide grooves 122 extend laterally toward the first contouring groove 121, and the plurality of first positioning parts 11 are respectively disposed corresponding to the plurality of first guide grooves 122. Further referring to... Figures 7-9 As shown, the first positioning part 11 includes a first positioning member 111 and a first driving member 112. The first positioning member 111 includes a driven slider 1112 and a first positioning head 1111. The first positioning head 1111 extends toward the first contour groove 121. The first driving member 112 includes a driving pad 1121. The driven slider 1112 and the driving pad 1121 are slidably disposed in the first guide groove 122.

[0090] Figure 10 This is a schematic diagram of the working state of the first positioning unit 11 in this embodiment. The first positioning unit 11 has a first combination state 41 (as shown in state I) and a second combination state 42 (as shown in state III).

[0091] Further reference Figure 10 As shown in state I, in the first combined state 41, the drive pad 1121 is placed between the bottom of the first guide groove 122 and the driven slider 1112. This raises the height of the first positioning head 1111, allowing it to match the height of the upper plate 81 of the circuit board 8. The height of the first positioning head 1111 can be configured such that, when the first positioning part 11 is in the first combined state 41, the first positioning head 1111 abuts against the side of the upper plate 81 without contacting the middle plate 82. This is to prevent the circuit board 8 from moving within the first contour groove 121 when the heating device 6 presses against it.

[0092] Optionally, the first positioning part 11 can also be configured such that, when the first positioning part 11 is in the first combined state 41, the first positioning head 1111 simultaneously abuts against the upper layer plate 81 and the middle layer plate 82. Furthermore, the height of the first positioning head 1111 is lower than the top of the upper layer plate 81 to prevent the heating device 6 from contacting the first positioning head 1111. During the heating process, after the solder melts, it also prevents the stress of the circuit board 8 itself from causing misalignment between the upper layer plate 81 and the middle layer plate 82.

[0093] Further reference Figure 10As shown in state III, in the second combined state 42, the driven slider 1112 abuts against the bottom of the first guide groove 122, and the driving pad 1121 pushes the first positioning head 1111 towards the first contour groove 121 via the driven slider 1112. In this configuration, the first positioning head 1111 sinks to the bottom of the first guide groove 122, so that the first positioning head 1111 corresponds to the middle layer plate 82 and is offset from the upper layer plate 81. Thus, the operator can directly remove the upper layer plate 81, thereby separating the upper layer plate 81 from the middle layer plate 82.

[0094] In summary, the multilayer circuit board positioning device of this embodiment has the first positioning head 1111 facing the first contour groove 121, and the driving pad 1121 and the driven slider 1112 disposed in the first guide groove 122, so as to guide the movement of the driving pad 1121 and the driven slider 1112 through the first guide groove 122. Thus, on the one hand, the driven slider 1112 can move under the drive of the driving pad 1121. When the driving pad 1121 raises the driven slider 1112, the first positioning head 1111 can abut against the side of the upper plate 81 of the circuit board 8. When the heating device 6 heats the circuit board 8, it ensures that the circuit board 8 is stably disposed in the first contour groove 121 and prevents the circuit board 8 from moving. On the other hand, after the heating operation is completed, the driving pad 1121 is pulled away from below the driven slider 1112. After the driven slider 1112 falls into the first guide groove 122, the first positioning head 1111 can also position the middle plate 82 or the lower plate 83 under the drive of the driving pad 1121. The operator can directly remove the upper plate 81 without having to set up other positioning heads for the circuit board 8, which simplifies the positioning process of the circuit board 8 and improves the efficiency of maintenance and disassembly.

[0095] In some implementations, such as Figure 4 As shown in the enlarged view, the inner wall of the first guide groove 122 has two guide side surfaces 1221 and a guide bottom surface 1222. The two side surfaces of the drive pad 1121 and the two side surfaces of the driven slider 1112 abut against the two guide side surfaces 1221.

[0096] During the transition from the first combination state 41 to the second combination state 42, the driven slider 1112 slides along the depth direction of the first guide groove 122 (as shown by arrow a1 in the figure). That is, when the driven slider 1112 is raised, it remains within the first guide groove 122 to ensure that it can fall to the bottom of the first guide groove 122 under the gravity of the first positioning member 111. When the first positioning part 11 is in the second combination state 42, the driving pad 1121 and the driven slider 1112 slide on the guide bottom surface 1222 and along its length (as shown by arrow a2 in the figure). This ensures that the driving pad 1121 and the driven slider 1112 are at the same height. At the same time, driven by the two guide sides 1221, the positioning surface of the first positioning head 1111 facing the circuit board 8 is parallel to the sides of the upper plate 81 and the middle plate 82. To prevent the first positioning head 1111 from damaging the circuit board 8.

[0097] In some implementations, such as Figure 4 As shown, the first contouring groove 121 has multiple notches 1211 on its side, and the multiple notches 1211 are correspondingly arranged with multiple first guide grooves 122. One end of the first guide groove 122 is connected to the corresponding first contouring groove 121. The first positioning member 111 also includes a connecting arm 1113. One end of the connecting arm 1113 is connected to the driven slider 1112, and the other end of the connecting arm 1113 extends toward the notch 1211 and bends away from the first platform 12. The end of the connecting arm 1113 away from the first contouring groove 121 is connected to the first positioning head 1111.

[0098] Specifically, the positioning surface of the first positioning head 1111 is closer to the circuit board 8 relative to the connecting arm 1113. When the positioning surface contacts the upper plate 81 or the middle plate 82, contact between the connecting arm 1113 and the circuit board 8 is avoided. Furthermore, in this embodiment, the height of the positioning surface is configured so that it matches the thickness of the upper plate 81 and the middle plate 82; for example, the height of the positioning surface is less than the thickness of the middle plate 82 and greater than or equal to the thickness of the upper plate 81.

[0099] In some implementations, such as Figure 4 As shown, a clearance hole 123 is formed at the bottom of the first guide groove 122 (the area shown by the cross-section in the figure). Further referencing... Figure 8 and Figure 9 As shown, the drive pad 1121 includes an intermediate body 1122 and two forks 1123, which are spaced apart and extend from the intermediate body 1122 into the first contour groove 121. The first positioning member 111 includes a first connecting post 1114 and a first operating block 1115. Further referencing... Figure 6As shown, the first operating block 1115 is located below the first platform 12. One end of the first connecting post 1114 is connected to the first operating block 1115, and the other end passes through the clearance hole 123 and is connected to the driven slider 1112. In the first combined state 41 (as shown in the image), Figure 10 As shown in state I, the two fork heads 1123 extend to both sides of the first connecting post 1114, and the intermediate body 1122 pushes against the first positioning head 1111 through the first connecting post 1114.

[0100] In this embodiment, the first positioning part 11 in the first assembly state 41 uses the first driving member 112 to press the first positioning head 1111 against the side of the upper plate 81, so that the first driving member 112 can provide thrust to the first positioning head 1111 during the heating and disassembly stages of the circuit board 8. At the same time, the forks 1123 located on both sides of the first connecting post 1114 can increase the contact area between the driving pad 1121 and the driven slider 1112, preventing the first positioning head 1111 from tilting.

[0101] In some implementations, such as Figure 4 As shown, the clearance hole 123 includes two first guide surfaces 1231. Further referencing... Figures 8-9 As shown, the first connecting post 1114 is a prism. During the process of the first positioning part 11 switching from the first combination state 41 to the second combination state 42, the two first guide surfaces 1231 abut against the first connecting post 1114 and slide relative to each other.

[0102] Specifically, the first connecting post 1114 is a quadrangular prism, which can be a cuboid. The first connecting post 1114 has two mutually opposing first planes, which respectively contact the two first guide surfaces 1231. The configuration of the first connecting post 1114 in this embodiment ensures that the first connecting post 1114 will not rotate, so that the positioning surface of the first positioning head 1111 remains parallel to the side of the circuit board 8.

[0103] In some implementations, such as Figure 4 and Figure 6 As shown, the first guide surface 1231 has a first extending direction and a second extending direction. The first extending direction is parallel to the axial direction of the clearance hole 123, and the second extending direction is parallel to the extending direction of the first guide groove 122. In the first combined state 41, the first connecting post 1114 moves up along the first extending direction, and the first connecting post 1114 approaches the first contour groove 121 along the second extending direction.

[0104] Specifically, in this embodiment, the clearance hole 123 is an elongated hole. When the driving pad 1121 is pulled out from below the driven slider 1112, the first plane slides downward along the first guide surface 1231 (in the depth direction of the clearance hole 123). When the driving pad 1121 pushes against the rear side of the driven slider 1112, the first plane slides along the first guide surface 1231 toward the first contour groove 121 (in the length direction of the clearance hole 123). In the above process, it can be ensured that the first positioning member 111 has a certain degree of freedom of movement in the clearance hole 123, and the rotation of the first positioning member 111 can be avoided. At the same time, the length of the clearance hole 123 is configured such that when the driving pad 1121 is completely pulled out from the bottom of the driven slider 1112 (at which time the first driving member 112 is in the position of the bottom), the length of the clearance hole 123 is ... Figure 10 (In the state between state II and state III), the drive pad 1121 is located behind the driven slider 1112, which allows the first connecting post 1114 to abut against the side wall of the end of the clearance hole 123 away from the first contour groove 121, so as to prevent the driven slider 1112 from moving backward with the drive pad 1121, causing the driven slider 1112 to be unable to fall into the bottom of the first guide groove 122.

[0105] In some implementations, such as Figures 6-9 As shown, the first positioning part 11 also includes a first elastic member 113 and a washer 114. The first connecting post 1114 passes through the washer 114. One end of the first elastic member 113 abuts against the first operating block 1115, and the other end abuts against the washer 114, and the first elastic member 113 generates an elastic compression. The first elastic member 113 can drive the first positioning member 111 to move downwards from the first platform 12, ensuring that the bottom of the driven slider 1112 abuts against the bottom of the first guide groove 122 or the top of the driving pad 1121. When the first connecting post 1114 moves along the second extending direction, the side of the washer 114 away from the first elastic member 113 abuts against the edge of the clearance hole 123 away from the first guide groove 122 and slides relative to it.

[0106] Specifically, the first elastic element 113 is a compression spring, and the first connecting post 1114 passes through the compression spring. The radial dimension of the compression spring matches the radial dimension of the washer 114. This allows the first elastic element 113 to place the washer 114 onto the lower edge of the clearance hole 123. When the first positioning element 111 moves horizontally or swings, the washer 114 ensures that the first elastic element 113 acts on the bottom of the first platform 12, preventing the first elastic element 113 from entering the clearance hole 123. When the driven slider 1112 tilts (e.g.) Figure 10 As shown in state II, the washer 114 can still contact the bottom of the first platform 12.

[0107] In some implementations, such as Figures 6-9As shown, the first positioning part 11 further includes a second elastic member 115 and a guide member 116, with the guide member 116 fixedly connected to the first platform 12. The guide member 116 includes a first guide post 1161. The first driving member 112 further includes a driving slider 1124, which has a first slide rail 1125. The driving slider 1124 slides on the first guide post 1161 via the first slide rail 1125, and the second elastic member 115 generates a spring force that drives the driving pad 1121 to approach the first contour groove 121. The first guide post 1161 serves a guiding function, ensuring that the first driving member 112 moves horizontally.

[0108] Furthermore, the first slide rail 1125 has a second guide surface 1126, the first guide post 1161 is a prism and parallel to the extension direction of the first guide groove 122, and the second guide surface 1126 abuts against the side of the first guide post 1161 and slides on the first guide post 1161.

[0109] Preferably, such as Figures 8-9 As shown, the number of second guide surfaces 1126 is configured to be four. The first guide post 1161 is a quadrangular prism, which can be a cuboid. The first guide post 1161 has four second planes corresponding to the four second guide surfaces 1126, which can prevent the first drive member 112 from rotating when it slides along the first guide post 1161.

[0110] In some implementations, such as Figures 8-9 As shown, the guide member 116 further includes two second guide posts 1162. The two second guide posts 1162 are located on both sides of the first guide post 1161 and are parallel to the first guide post 1161. The arrangement direction of the two second guide posts 1162 is parallel to the arrangement direction of the two forks 1123. The drive slider 1124 also has two second slide rails 1128 corresponding to the two second guide posts 1162, and the second guide posts 1162 are slidably disposed in the corresponding second slide rails 1128.

[0111] Specifically, the guide member 116 further includes a connecting rod 1163, and the first guide post 1161 and two second guide posts 1162 are all protruding from the same side of the connecting rod 1163. The second guide posts 1162 are also configured as cuboids. The two second slides 1128 are recessed from both sides of the drive slider 1124 towards the first slide 1125, and the shape of the second slides 1128 matches the second guide posts 1162. The second elastic member 115 is a compression spring and is sleeved on the first guide post 1161. One end of the second elastic member 115 abuts against the connecting rod 1163, and the other end abuts against the drive slider 1124. In this embodiment, the first positioning head 1111 applies a pushing force to the circuit board 8 through the second elastic member 115.

[0112] Figure 11This is an explosion diagram of the second vehicle 2 in this embodiment. Figure 12 This is a schematic diagram of the working state of the second vehicle 2 in this embodiment.

[0113] In some implementations, such as Figure 1 , Figure 3 and Figures 11-12 As shown, the multilayer circuit board positioning device also includes a second carrier 2. The second carrier 2 includes a second stage 21 and a plurality of second positioning parts 22. The second stage 21 has a second contouring groove 211. The second contouring groove 211 is arranged in pairs with the first contouring groove 121. The second positioning part 22 includes a second positioning member 221, and the second positioning member 221 includes a second positioning head 2211. The plurality of second positioning heads 2211 are operably close to or away from the second contouring groove 211.

[0114] Further reference Figure 4 and Figure 5 As shown, the second contour groove 211 is used to accommodate the disassembled upper layer plate 81. After the upper layer plate 81 is removed, the operator flips it so that the side of the upper layer plate 81 facing away from the middle layer plate 82 faces the bottom of the second contour groove 211. Therefore, the shape of the second contour groove 211 is approximately mirror-symmetrical to the shape of the first contour groove 121, and the depth of the second contour groove 211 is slightly less than that of the first contour groove 121. The second positioning part 22 moves into the second contour groove 211 to position the upper layer plate 81. This facilitates the operator's inspection of the side of the upper layer plate 81 facing the middle layer plate 82.

[0115] In some implementations, such as Figure 3 As shown, the second positioning head 2211 has a clearance ramp 2213 and a pressing surface 2212. The pressing surface 2212 faces the bottom of the second contour groove 211. One side of the clearance ramp 2213 is connected to the pressing surface 2212, and the other side is inclined away from the second contour groove 211. Further referencing... Figure 11 As shown, the second platform 21 has a third slide rail 212, and the second carrier 2 also includes a second drive member 23. The second drive member 23 drives multiple second positioning parts 22 to move along the third slide rail 212. The second positioning parts 22 also include a third elastic member 24. The third elastic member 24 generates a spring force that drives the pressing surface 2212 to move towards the bottom of the second contour groove 211. When the upper plate 81 is disposed in the second contour groove 211, the top of the upper plate 81 is slightly higher than the second contour groove 211. The avoidance slope 2213 can guide the pressing surface 2212 to press against the top of the upper plate 81, preventing the second positioning head 2211 from damaging the upper plate 81.

[0116] In some implementations, such as Figure 11As shown, the second driving member 23 has multiple connecting holes 2214. The second positioning member 221 also includes a second connecting post 2215 and a second operating block 2216. The multiple second connecting posts 2215 are correspondingly arranged with the multiple connecting holes 2214. One end of the second connecting post 2215 is connected to the second positioning head 2211, and the other end passes through the corresponding connecting hole 2214 and is connected to the second operating block 2216. A third elastic member 24 abuts between the second driving member 23 and the second operating block 2216. The second connecting post 2215 can float up and down under the action of the third elastic member 24 to automatically adjust according to the thickness of the upper plate 81.

[0117] In some implementations, such as Figures 11-12 As shown, the second carrier 2 also includes a magnetic part 5, which includes a first magnet 51, a second magnet 52, and a third magnet 53. The first magnet 51 is disposed on the second drive member 23, and the second magnet 52 and the third magnet 53 are disposed at intervals on the second platform 21.

[0118] Specifically, the first magnet 51, the third magnet 53, and the second magnet 52 are located on opposite sides of the bottom surfaces of the second positioning member 221 and the third slide rail 212. There are multiple first magnets 51, each corresponding to a second magnet 52 and a third magnet 53. When the second driving member 23 moves the multiple second positioning heads 2211 to the second contour groove 211 (e.g....), Figure 12 As shown in the second positioning member 221 on the left side, the first magnet 51 and the second magnet 52 are attracted to each other. This ensures that the operator can guarantee that the second positioning part 22 is in place, and the mutual attraction between the first magnet 51 and the second magnet 52 also prevents the upper plate 81 from lifting the second positioning part 22. When the second driving member 23 drives the multiple second positioning heads 2211 to a position away from the second contour groove 211 (e.g., ... Figure 12 (As shown in the second positioning member 221 on the right side), the first magnet 51 and the third magnet 53 are attracted together. In this configuration, the upper plate 81 can be placed into the second contour groove 211 or the upper plate 81 can be removed.

[0119] In some implementations, such as Figure 11 and Figure 12As shown, the second connecting post 2215 is rotatably connected to the connecting hole 2214. The second driving member 23 includes multiple limiting grooves 231, each limiting groove 231 having a first limiting area 2311 and a second limiting area 2312. Both the first limiting area 2311 and the second limiting area 2312 include a first limiting surface 2313 and a second limiting surface 2314. The connecting hole 2214 is formed at the bottom of the limiting groove 231 and is located between the first limiting surface 2313 and the second limiting surface 2314. The second positioning head 2211 includes an adjusting swing rod 2217 and a positioning end 2218. An avoidance slope 2213 and a pressing surface 2212 are formed at the positioning end 2218. The adjusting swing rod 2217 abuts against the bottom of the limiting groove 231 and is connected to the second connecting post 2215. The adjusting lever 2217 has rotational freedom within the limiting groove 231, and the adjusting lever 2217 rotates by a predetermined angle, with both sides of the adjusting lever 2217 simultaneously abutting against the first limiting surface 2313 and the second limiting surface 2314.

[0120] Specifically, the first limiting surface 2313 and the second limiting surface 2314 of the first limiting area 2311 are inclined in a direction away from each other on the side away from the connecting hole 2214, and the first limiting surface 2313 and the second limiting surface 2314 of the second limiting area 2312 are inclined in a direction away from each other on the side away from the connecting hole 2214. Therefore, when the second positioning part 22 approaches the upper plate 81, the adjusting lever 2217 can use its own rotational degree of freedom to adjust the position of the positioning end 2218, so that the positioning end 2218 can avoid the pads or components of the upper plate 81. Alternatively, the operator can directly rotate the second operating block 2216 to adjust the rotation amplitude of the adjusting lever 2217.

[0121] Figure 13 This is a schematic diagram of the process for splitting a multilayer circuit board into eight parts.

[0122] like Figure 13 As shown, the multilayer circuit board positioning device in the above embodiments can be operated in the following manner.

[0123] Step S100: Drive the first operating block 1115 to move the first positioning head 1111 away from the first contouring groove 121 (e.g., Figure 10 (As shown in state IV). In order to allow the first positioning head 1111 to avoid the circuit board 8, the first operating block 1115 can be driven by the driving device 7.

[0124] Step S200: Place the circuit board 8 in the first contour groove 121.

[0125] Step S300: Release the first operating block 1115 so that the second elastic element 115 pushes the first positioning head 1111 to abut against the side of the upper plate 81. In this step, the driving pad 1121 is placed below the driven slider 1112 (e.g., Figure 10 (As shown in state I).

[0126] Step S400: Heat the circuit board 8 to melt the solder. Heat the circuit board 8 using heating device 6.

[0127] Step S500: Drive the third operating block 1129 away from the first contouring groove 121, causing the driving pad block 1121 to be pulled away from the bottom of the driven slider 1112. During this process, as... Figure 10 As shown in state II, the driven slider 1112 falls to the bottom of the first guide groove 122.

[0128] Step S600: Release the third operating block 1129, and the second elastic element 115 pushes the driven slider 1112 through the drive pad block 1121, so that the first positioning head 1111 abuts against the side of the middle layer plate 82 (e.g., Figure 10 (As shown in state III). In this step, the first positioning head 1111 is located below the upper plate 81.

[0129] Step S700: Remove the upper plate 81, flip it over, and place it into the second contouring groove 211.

[0130] Specifically, the two second driving members 23 are driven to move closer to each other, so that the second positioning part 22 positions the upper plate 81.

[0131] Step S800: Drive the second positioning unit 22 to position the upper plate 81.

[0132] Optionally, after step S800, the method may further include: inspecting or testing the upper layer plate 81 and the middle layer plate 82.

[0133] Step S900: Drive the driven slider 1112 away from the first contour groove 121 by the first operating block 1115, so that the second elastic member 115 pushes the driving pad 1121 into the bottom of the driven slider 1112, and continue to drive the first operating block 1115 so that the first driving member 112 moves away from the first contour groove 121 together through the first positioning member 111.

[0134] Specifically, by driving the first operating block 1115, the driven slider 1112 is raised again by moving the first operating block 1115 (similar to...). Figure 10 (As shown in state II), the drive pad 1121 is inserted into the bottom of the driven slider 1112 again, and the first operating block 1115 is continued to be moved so that the first positioning head 1111 moves away from the first contouring groove 121.

[0135] Optionally, the middle layer plate 82 and the lower layer plate 83 can be removed from the first contour groove 121.

[0136] Step S1000: Drive the second positioning part 22 away from the second contour groove 211.

[0137] Alternatively, the upper plate 81 can be removed from the second contour groove 211.

[0138] In summary, the multilayer circuit board splitting method of this embodiment involves positioning the first positioning head 1111 towards the first contouring groove 121, and placing the driving pad 1121 and the driven slider 1112 in the first guide groove 122 to guide the movement of the driving pad 1121 and the driven slider 1112. Thus, on the one hand, the driven slider 1112 can move under the drive of the driving pad 1121. When the driving pad 1121 raises the driven slider 1112, the first positioning head 1111 can abut against the side of the upper plate 81 of the circuit board 8. When the heating device 6 heats the circuit board 8, this ensures that the circuit board 8 is stably positioned within the first contouring groove 121, preventing the circuit board 8 from moving. On the other hand, after the heating operation is completed, the driving pad 1121 is pulled away from below the driven slider 1112. After the driven slider 1112 falls into the first guide groove 122, the first positioning head 1111 can also position the middle layer plate 82 or the lower layer plate 83 under the drive of the driving pad 1121. The operator can directly remove the upper layer plate 81 without having to set up other positioning heads for the circuit board 8, which simplifies the positioning process of the circuit board 8 and improves the efficiency of maintenance and disassembly. In addition, in the above process, the driving device 7 drives the first positioning part 11 in the same direction, which simplifies the driving method of the driving device 7.

[0139] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principle of this utility model should be included within the protection scope of this utility model.

Claims

1. A multilayer circuit board positioning device, characterized in that, The multilayer circuit board positioning device includes: A first carrier includes a first platform and a plurality of first positioning parts. The first platform has a first contouring groove and a plurality of first guide grooves. The first guide grooves extend laterally toward the first contouring groove. The plurality of first positioning parts are respectively disposed corresponding to the plurality of first guide grooves. Each first positioning part includes a first positioning member and a first driving member. The first positioning member includes a driven slider and a first positioning head. The first positioning head extends toward the first contouring groove. The first driving member includes a driving pad. The driven slider and the driving pad are slidably disposed in the first guide groove. The first positioning part has a first combined state and a second combined state. In the first combined state, the driving pad is placed between the bottom of the first guide groove and the driven slider. In the second combined state, the driven slider abuts against the bottom of the first guide groove, and the driving pad pushes the first positioning head towards the first contour groove through the driven slider.

2. The multilayer circuit board positioning device according to claim 1, characterized in that, The inner wall of the first guide groove has two guide sides and a guide bottom. Both the driving pad and the driven slider abut against the two guide sides, and when switching from the first combined state to the second combined state, the driven slider slides along the depth direction of the first guide groove. In the second combined state, the driving pad and the driven slider slide on the bottom surface of the guide.

3. The multilayer circuit board positioning device according to claim 1, characterized in that, The first contour groove has multiple notches on its side, and the multiple notches are correspondingly provided with multiple first guide grooves. One end of the first guide groove is connected to the corresponding first contour groove. The first positioning element further includes a connecting arm, one end of which is connected to the driven slider, and the other end of which extends toward the notch and bends away from the first platform, and is connected to the first positioning head.

4. The multilayer circuit board positioning device according to claim 3, characterized in that, An avoidance hole is provided at the bottom of the first guide groove; The drive pad includes an intermediate body and two forks, the two forks being spaced apart and extending from the intermediate body into the first contour groove; The first positioning element includes a first connecting post and a first operating block. The first operating block is located below the first platform. One end of the first connecting post is connected to the first operating block, and the other end passes through the clearance hole and is connected to the driven slider. In the first combined state, the two fork heads extend to both sides of the first connecting post, and the intermediate body pushes against the first positioning head through the first connecting post.

5. The multilayer circuit board positioning device according to claim 4, characterized in that, The clearance hole includes two first guide surfaces, and the first connecting post is a prism; When switching from the first combined state to the second combined state, the two first guide surfaces abut against the first connecting post and slide relative to each other.

6. The multilayer circuit board positioning device according to claim 5, characterized in that, The first guide surface has a first extending direction and a second extending direction, the first extending direction being parallel to the axial direction of the clearance hole, and the second extending direction being parallel to the extending direction of the first guide groove. In the first combined state, the first connecting post moves up along the first extending direction and approaches the first contour groove along the second extending direction.

7. The multilayer circuit board positioning device according to claim 6, characterized in that, The first positioning part further includes a first elastic element and a washer; The first connecting post passes through the washer, one end of the first elastic member abuts against the first operating block, and the other end abuts against the washer, and the first elastic member generates elastic compression. The first connecting post moves along the second extending direction, and the side of the washer away from the first elastic member abuts against and slides relative to the edge of the clearance hole away from the first guide groove.

8. The multilayer circuit board positioning device according to claim 4, characterized in that, The first positioning part further includes a second elastic element and a guide element, the guide element including a first guide post; The first driving member further includes a driving slider having a first slide rail, the driving slider sliding on the first guide post via the first slide rail, and the second elastic member generating an elastic force to drive the driving pad block closer to the first contour groove.

9. The multilayer circuit board positioning device according to claim 8, characterized in that, The first slide has a second guide surface, the first guide post is a prism and parallel to the extension direction of the first guide groove, the second guide surface abuts against the side of the first guide post and slides on the first guide post.

10. The multilayer circuit board positioning device according to claim 9, characterized in that, The guide also includes two second guide posts, which are located on both sides of the first guide post and are parallel to the first guide post. The arrangement direction of the two second guide posts is parallel to the arrangement direction of the two forks. The drive slider also has two second slides corresponding to the two second guide posts, the second guide posts being slidably disposed in the corresponding second slides.

11. The multilayer circuit board positioning device according to claim 1, characterized in that, The multilayer circuit board positioning device further includes: The second carrier includes a second platform and a plurality of second positioning parts. The second platform has a second contour groove. The second positioning part includes a second positioning member. The second positioning member includes a second positioning head. The plurality of second positioning heads are operable to approach or move away from the second contour groove.

12. The multilayer circuit board positioning device according to claim 11, characterized in that, The second positioning head has an avoidance slope and a pressing surface. The pressing surface faces the bottom of the second contour groove. One side of the avoidance slope is connected to the pressing surface, and the other side is inclined away from the second contour groove. The second platform has a third slide rail, and the second carrier further includes a second drive member, which drives a plurality of second positioning parts to move along the third slide rail; The second positioning part further includes a third elastic element, which generates an elastic force that drives the pressing surface to move to the bottom of the second contour groove.

13. The multilayer circuit board positioning device according to claim 12, characterized in that, The second drive element has multiple connection holes; The second positioning member further includes a second connecting post and a second operating block. A plurality of second connecting posts are correspondingly arranged with a plurality of connecting holes. One end of the second connecting post is connected to the second positioning head, and the other end passes through the corresponding connecting hole and is connected to the second operating block. The third elastic member abuts between the second driving member and the second operating block.

14. The multilayer circuit board positioning device according to claim 12, characterized in that, The second carrier further includes a magnetic part, which includes a first magnet, a second magnet, and a third magnet; The first magnet is disposed on the second driving member, and the second magnet and the third magnet are disposed at a distance from each other on the second platform; The second driving member drives multiple second positioning heads to move to the second contour groove, the first magnet and the second magnet attract each other, the second driving member drives multiple second positioning heads to a position away from the second contour groove, and the first magnet attracts the third magnet.

Images