A tape tearing apparatus and a circuit board production system

By designing air blowing and suction ports on the tape tearing device, the high-temperature tape on the circuit board is automatically removed, solving the problems of low efficiency in manual removal and easy tearing in automatic tape tearing, and realizing a highly efficient and non-damaging tape removal process.

CN224684450UActive Publication Date: 2026-08-25GREE ELECTRIC APPLIANCE INC OF ZHUHAI
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Patent Information

Application Number
CN202521821675.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-26
Publication Date
2026-08-25
Estimated Expiration
2035-08-26

AI Technical Summary

Technical Problem

In existing technologies, manually removing high-temperature tape after circuit board soldering is inefficient and can easily scratch components. Automatic tape removal is also prone to tearing and difficult to absorb, resulting in low production efficiency.

Method used

The tape tearing device includes tape tearing grippers and a moving structure. The grippers are equipped with an air blowing port and an air suction port. One end of the tape is lifted by blowing air and then sucked up by the air suction port. After the tape is closed and clamped, the moving structure drives the grippers to remove the tape.

Benefits of technology

No manual operation is required, which improves production efficiency, avoids the problem of tweezers scratching products, and achieves highly efficient and automated adhesive removal.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of adhesive tape tearing equipment and circuit board production system, belong to electronic manufacturing field.Adhesive tape tearing equipment includes adhesive tape tearing clamp jaw and moving structure;Moving structure drives adhesive tape tearing clamp jaw to move;The first jaw of adhesive tape tearing clamp jaw is provided with the air outlet for blowing up the adhesive tape one end pasted on electronic product, and the second jaw is provided with the air suction port for adsorbing the adhesive tape blown up.After air suction port adsorbs adhesive tape, the first jaw and the second jaw are folded and clamp tight adhesive tape, then moving structure drives adhesive tape tearing clamp jaw to move, and tear adhesive tape.The whole process is torn by adhesive tape tearing clamp jaw and moving structure cooperation to realize adhesive tape, without manual operation, reduce manual labor intensity, improve production efficiency, and because of using air to blow adhesive tape, pincette is not needed, there is no problem of scratching product.
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Description

Technical Field

[0001] This utility model relates to the field of electronic manufacturing technology, and in particular, to a tape-tearing device and a circuit board production system. Background Technology

[0002] In electronic manufacturing, circuit boards often require the use of high-temperature tape to mask solder pads that do not need to be soldered before soldering. The tape needs to be removed after soldering. Currently, the high-temperature tape is usually removed manually. However, this manual tape removal method has the following problems:

[0003] 1) Currently, manually tearing adhesive tape is inefficient, the tape is prone to breakage and sticks to tweezers, and requires a large investment of manpower.

[0004] 2) When manually removing the adhesive with tweezers, there is a risk of the tweezers scratching components and PCB circuits.

[0005] 3) Currently, automatic tape removers have problems such as easy tearing and difficulty in absorbing high-temperature tape, resulting in a low success rate in tape removal. Summary of the Invention

[0006] To overcome the shortcomings of existing technologies, this utility model provides a tape-tearing device and a circuit board production system. This addresses the problems of manual tape removal after circuit board soldering, which not only wastes a lot of manpower but also easily damages the circuit board with tweezers, affecting product quality. Existing automated solutions for removing high-temperature tape suffer from problems such as the tape being easily torn and difficult to absorb, resulting in a low success rate and making them unsuitable for mass production.

[0007] The technical solution adopted by this utility model to solve its technical problem is:

[0008] In a first aspect, a tape-tearing device is provided, comprising: tape-tearing grippers and a movable structure;

[0009] The movable structure drives the tape-tearing gripper to move;

[0010] The first claw of the tape-tearing gripper is provided with an air blowing port for blowing up one end of the tape pasted on the electronic product, and the second claw is provided with an air suction port for adsorbing the blown tape.

[0011] The first and second claws of the tape-tearing gripper can close together.

[0012] As an optional implementation of this application, the first claw and / or the second claw of the tape-tearing gripper are provided with a friction structure for anti-slip.

[0013] As an optional implementation of this application, the moving structure includes at least one of the following:

[0014] A first moving mechanism for controlling the left and right movement of the tape-tearing gripper;

[0015] A second moving mechanism for controlling the back-and-forth movement of the tape-tearing gripper;

[0016] A third moving mechanism for controlling the up-and-down movement of the tape-tearing gripper.

[0017] As an optional implementation of this application, it also includes: a gripper connection structure;

[0018] The tape-tearing gripper is connected to the movable structure via the gripper connection structure;

[0019] The gripper connection structure includes:

[0020] Mounting side plate of the movable structure;

[0021] A movable cylinder for driving the tape-tearing gripper;

[0022] The movable cylinder is fixed to the mounting side plate.

[0023] As an optional implementation of this application, it also includes: a transmission device for conveying electronic products to be torn tape.

[0024] As an optional implementation of this application, the transmission device is provided with a blocking structure;

[0025] The blocking structure includes:

[0026] A blocking baffle used to stop the electronic products being transported by the transmission device;

[0027] A blocking cylinder for driving the blocking baffle.

[0028] As an optional implementation of this application, the transmission device is provided with a clamping structure;

[0029] The clamping structure includes:

[0030] A clamping block used to press the electronic product after the product is stopped by the blocking baffle;

[0031] A clamping cylinder for driving the clamping block.

[0032] As an optional implementation of this application, the tape includes:

[0033] Used to cover the adhesive portion of the product;

[0034] Tape tearing hands;

[0035] The tape tear handle is located at one end of the adhesive part;

[0036] The air inlet of the tape tearing claw blows the tape tearer, and the air inlet of the tape tearing claw absorbs the tape tearer.

[0037] As an optional implementation of this application, it also includes:

[0038] A collection device for collecting the tape torn off by the tape-tearing claw.

[0039] On the other hand, a circuit board manufacturing system is provided, comprising: a tape-tearing device as described in any of the preceding claims.

[0040] The application employs the above technical solution and has at least the following beneficial effects:

[0041] This application provides a tape-tearing device and a circuit board production system. The tape-tearing device includes tape-tearing jaws and a moving structure. The moving structure drives the tape-tearing jaws to move. The first jaw of the tape-tearing jaws is equipped with an air inlet for blowing up one end of the tape adhered to the electronic product, and the second jaw is equipped with an air suction inlet for adsorbing the blown tape. After the air suction inlet adsorbs the tape, the first and second jaws close to clamp the tape, and then the moving structure drives the tape-tearing jaws to move, tearing off the tape. The entire process is achieved by the tape-tearing jaws and the moving structure working together to tear the tape, eliminating the need for manual operation, reducing labor costs, improving production efficiency, and because air is used to blow the tape, tweezers are not needed, eliminating the problem of scratching the product. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the overall structure of a tape-tearing device provided in an embodiment of this utility model;

[0044] Figure 2 This is a schematic diagram of the tape-tearing gripper structure in a tape-tearing device provided by an embodiment of this utility model;

[0045] Figure 3 This is an enlarged schematic diagram of the first and second claws of a tape-tearing gripper provided in an embodiment of this utility model;

[0046] Figure 4 This is a schematic diagram of an easy-tear tape structure provided in an embodiment of this utility model;

[0047] Figure 5This is a schematic diagram of the overall structure of a tape-tearing device from another perspective, provided by an embodiment of this utility model;

[0048] Figure 6 This is a schematic diagram of the overall structure of a tape-tearing device from a third-person perspective, provided by an embodiment of this utility model.

[0049] Explanation of reference numerals in the attached figures:

[0050] 10- Tape tearing gripper, 11- First gripper, 12- Second gripper, 13- Air inlet, 14- Air intake, 15- Air supply connection pipe, 16- Vacuum pump connection pipe, 17- Friction structure, 20- Moving structure, 21- First moving mechanism, 22- Second moving mechanism, 30- Transmission device, 31- Blocking structure, 32- Pressing structure, 40- Collection device, 50- Gripper connection structure, 51- Mounting side plate, 52- Movable cylinder, 60- Electronic product, 70- Tape, 71- Adhesive part, 72- Tape tearing gripper. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this utility model will be described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] Reference Figure 1 and Figure 2 This utility model provides a tape-tearing device, including: tape-tearing grippers 10 and a movable structure 20;

[0053] The movable structure 20 drives the tape-tearing gripper 10 to move;

[0054] The first claw 11 of the tape-tearing claw 10 is provided with an air blowing port 13 for blowing up one end of the tape 70 pasted on the electronic product 60, and the second claw 12 is provided with an air suction port 14 for adsorbing the blown tape 70.

[0055] The first claw 11 and the second claw 12 of the tape-tearing gripper 10 can close together.

[0056] Among them, electronic products generally refer to circuit boards or PCBs.

[0057] Compared to existing technologies that use tweezers to tear tape, the tape-tearing device used in this application removes the tape 70 using the tape-tearing gripper 10. The general process is as follows: the tape 70 is blown off the electronic product 60 through the air inlet 13, then the blown tape 70 is absorbed through the air inlet 14. Next, the first gripper 11 and the second gripper 12 close to clamp the tape 70, and then the moving structure 20 moves to remove the tape 70 from the electronic product 60.

[0058] The tape-tearing device also includes: a gripper connection structure 50;

[0059] The tape-tearing gripper 10 is connected to the movable structure 20 via the gripper connecting structure 50;

[0060] The gripper connection structure 50 includes:

[0061] The mounting side plate 51 of the movable structure 20;

[0062] The movable cylinder 52 is used to drive the tape-tearing gripper 10;

[0063] The movable cylinder 52 is fixed to the mounting side plate 51. The movable cylinder 52 can control whether the first claw 11 and the second claw 12 are closed.

[0064] The blowing port 13 is connected to a blowing device such as an air pump via an air inlet connecting pipe 15. The suction port 14 is connected to a suction device such as a vacuum pump via a vacuum pump connecting pipe 16.

[0065] In a preferred embodiment of this application, the first claw 11 and / or the second claw 12 of the tape-tearing gripper 10 are provided with a friction structure 17 for anti-slip. Because the tape-tearing gripper 10 removes the tape 70 from the electronic product 60 by relying on the friction provided by the closing of the first claw 11 and the second claw 12, when the friction provided by the closing of the first claw 11 and the second claw 12 is large, the tape 70 can be removed from the electronic product 60. However, if both the first claw 11 and the second claw 12 are smooth, the friction provided by the closing of the first claw 11 and the second claw 12 is small, and the tape 70 easily slips off between the first claw 11 and the second claw 12, causing the tape-tearing gripper 10 to be unable to remove the tape 70 from the electronic product 60. Therefore, a friction structure 17 is provided in the first claw 11 and / or the second claw 12 to increase the friction force provided after the first claw 11 and the second claw 12 are closed, so as to ensure that the tape tearing claw 10 can remove the tape 70 from the electronic product 60.

[0066] For example, such as Figure 3As shown, the friction structure 17 adopts a serrated structure. When both the first claw 11 and the second claw 12 adopt a serrated structure, the serrated structures of the first claw 11 and the second claw 12 cooperate with each other (that is, after closing, the protruding part of the first claw 11 is located in the concave part of the second claw 12, and the protruding part of the second claw 12 is located in the concave part of the first claw 11).

[0067] In practical use, while conventional adhesive tape may not adhere firmly to electronic products in certain areas after welding, some sections may still adhere quite firmly. In such cases, blowing air from the nozzle may not be able to lift the tape, and even if it is lifted, it may not be guaranteed that the sides will be lifted, because if the middle section is lifted, the suction port cannot absorb it. Therefore, this application also provides an adhesive tape structure that is easy to tear off. Figure 4 As shown:

[0068] The tape 70 includes:

[0069] Used to cover the adhesive portion 71 of the product;

[0070] Tape tearing tool 72;

[0071] The tape tear handle 72 is disposed at one end of the adhesive part 71;

[0072] The air inlet 13 of the tape tearing claw 10 blows the tape tearing handle 72, and the air inlet 14 of the tape tearing claw 10 adsorbs the tape tearing handle 72.

[0073] The adhesive part 71 is exactly the same as the existing tape 70. The non-adhesive tape tear handle 72 is not connected to the electronic product 60 after welding. For example, adhesive can be omitted from the tape tear handle 72. Since the tape tear handle 72 is located at one end of the adhesive part 71, one end of the tape 70 can be blown up by the air outlet 13, and the air intake 14 can easily absorb it. The tape tear handle 72 and the adhesive part 71 are integrated, preventing the tape from separating when tearing, thus avoiding the tape being unable to be removed.

[0074] In one embodiment, the movable structure 20 includes:

[0075] A first moving mechanism 21 is used to control the left and right movement of the tape-tearing gripper 10;

[0076] A second moving mechanism 22 is used to control the forward and backward movement of the tape-tearing gripper 10.

[0077] In this embodiment of the application, the moving structure 20 drives the tape-tearing gripper 10 to move horizontally through the first moving mechanism 21 and the second moving mechanism 22.

[0078] In another embodiment, the movable structure 20 includes:

[0079] A first moving mechanism 21 is used to control the left and right movement of the tape-tearing gripper 10;

[0080] A second moving mechanism 22 is used to control the back-and-forth movement of the tape-tearing gripper 10;

[0081] A third moving mechanism for controlling the up-and-down movement of the tape-tearing gripper.

[0082] In this embodiment, the movable structure 20 drives the tape-tearing gripper 10 to move in multiple directions through the first movable mechanism 21, the second movable mechanism 22, and the third movable mechanism.

[0083] The specific settings for the moving structure 20 can be configured according to actual needs.

[0084] refer to Figure 5 and Figure 6 It also includes: a conveyor device 30 for conveying the electronic product 60 to be torn tape 70. For example, a conveyor belt.

[0085] The transmission device 30 is provided with a blocking structure 31;

[0086] The blocking structure 31 includes:

[0087] A blocking baffle used to stop the electronic product 60 being transmitted by the transmission device 30;

[0088] A blocking cylinder for driving the blocking baffle.

[0089] A sensor is installed at a designated position in the transmission device 30. After the transmission device 30 transports the electronic product 60 to the designated position, the sensor senses the movement and the blocking cylinder drives the blocking baffle to block the electronic product 60, preventing the electronic product 60 from moving horizontally.

[0090] Furthermore, the transmission device 30 is provided with a clamping structure 32;

[0091] The clamping structure 32 includes:

[0092] A clamping block for pressing the electronic product 60 after the product is stopped by the blocking baffle;

[0093] A clamping cylinder for driving the clamping block.

[0094] After the electronic product 60 reaches the designated position, the clamping cylinder drives the clamping block to clamp the electronic product 60, preventing the electronic product 60 from moving vertically.

[0095] The blocking structure 31 and the clamping structure 32 ensure that the electronic product 60 is stable when the tape 70 is torn. The tape-tearing claw 10 facilitates the tearing of the tape 70.

[0096] As a preferred implementation of this application, a collection device 40 is also included for collecting the tape 70 torn off by the tape-tearing claw 10. That is, after the tape-tearing claw 10 tears off the tape 70, the moving structure 20 moves the tape-tearing claw 10 above the collection device 40, and then the first claw 11 and the second claw 12 separate, the suction port 14 no longer holds the tape 70, and the tape 70 falls into the collection device 40.

[0097] The tape-tearing device provided in this application includes tape-tearing jaws and a moving structure. The moving structure drives the tape-tearing jaws to move. The first jaw of the tape-tearing jaws is provided with an air inlet for blowing up one end of the tape pasted on the electronic product, and the second jaw is provided with an air inlet for absorbing the blown tape. After the air inlet absorbs the tape, the first and second jaws close together to clamp the tape, and then the moving structure drives the tape-tearing jaws to move and tear off the tape. The entire process is achieved by the tape-tearing jaws and the moving structure working together to tear the tape, eliminating the need for manual operation, reducing labor costs, improving production efficiency, and because air is used to blow the tape, tweezers are not needed, eliminating the problem of scratching the product.

[0098] To more clearly illustrate the implementation of this application, the following uses a PCB board as an example to explain the specific working process of the tape-tearing device.

[0099] (1) Apply easy-tear high-temperature tape with a tear handle to the areas of the PCB board that need to be shielded by soldering. After the high temperature of wave soldering, the tear handle of the tape will be slightly deformed (i.e., the tear handle of the tape and the adhesive part can be made of materials with different coefficients of thermal expansion), ensuring that the tear handle of the tape will not be completely stuck to the PCB board by the flux.

[0100] (2) The PCB board with high-temperature tape is conveyed by the conveyor belt of the transmission device and flows into the automatic tape removal device. After the PCB reaches the designated position, it is detected by the sensor of the detection mechanism, and the blocking structure extends the blocking baffle to stop the PCB board.

[0101] The blocking structure here includes a detection sensing mechanism, a blocking cylinder, a blocking baffle, and a control mechanism. The detection mechanism and the control mechanism are electrically connected. When the detection mechanism detects that the PCB board has moved to a predetermined position, it transmits a signal to the control mechanism. The control mechanism sends a control signal to the blocking cylinder, which drives the baffle to block the PCB board outward, thus restricting its horizontal movement.

[0102] Simultaneously, the control mechanism sends a control signal to the clamping structure, which includes a clamping cylinder and a clamping block. The clamping cylinder drives the clamping block downwards to the top surface of the PCB board, thereby restricting its vertical movement and preventing the PCB board from shaking during the tape removal process.

[0103] (3) By moving the structure, the gripper structure is moved to the tape tearing area. The gripper structure includes a movable cylinder and grippers. The movable cylinder opens, so that the grippers are in the open state. At this time, the grippers are close to the tape tearing area.

[0104] (4) Figure 2 The right gripper blows air out through the air hole to lift the tape tearer, while the left gripper is connected to a vacuum generator. The air hole of the left gripper generates negative pressure to attract the tape tearer onto the gripper.

[0105] (5) The movable cylinder on the tape tearing claw drives the claw to close. The claw is designed with a toothed anti-slip structure to prevent the tape from slipping during the tearing process.

[0106] (6) After the tape tearing claw successfully clamps the tape tearing hand, the moving structure drives the tape tearing claw to move to one side, thereby completely tearing the tape off the PCB board.

[0107] (7) The tape is picked up by the moving structure and the tape-tearing claw and moved to the waste recycling port. The moving cylinder opens and drives the claw to release. The vacuum generator opens the valve and disconnects the vacuum adsorption of the tape by the claw. The tape falls into the waste box (i.e. the collection device).

[0108] The implementation steps are as follows:

[0109] (1) PCB boards with easy-tear high-temperature adhesive tape are conveyed by the mechanism's transmission device.

[0110] (2) The PCB board is stopped by the blocking cylinder driving the blocking baffle, so as to achieve precise positioning of the PCB board. The PCB board is pressed by the pressing structure to prevent the PCB board from shaking during the adhesive removal process.

[0111] (3) The automatic high-temperature tape tearing gripper is moved to the designated position by the X-axis moving module (first moving mechanism) and the Y-axis moving module (second moving mechanism);

[0112] (4) The air blowing hole in the automatic high-temperature tape tearing claw blows air to lift the easy-tear high-temperature tape tearing hand.

[0113] (5) The suction hole in the automatic high-temperature tape tearing claw sucks in air and adsorbs the easy-tear high-temperature tape tearing hand onto the claw.

[0114] (6) The automatic high-temperature tape tearing jaws close and clamp the easy-tear high-temperature tape, and move to one side to tear the easy-tear high-temperature tape off the PCB board.

[0115] (7) The automatic high-temperature tape tearing claw moves the torn-off easy-tear high-temperature tape to the waste collection device;

[0116] (8) After the automatic high-temperature tape tearing process is completed, the PCB board is conveyed out by the transmission device and flows to the next process.

[0117] This application proposes an easy-tear high-temperature tape suitable for automatic tearing. A layer of material with a different coefficient of thermal expansion than the tape is adhered to the adhesive side of one end of the tape to serve as the tape tearing handle. After the high temperature of welding, the tearing handle will undergo slight deformation, preventing it from sticking tightly to the PCB board and facilitating the automatic tape tearing structure. Furthermore, an automatic tape-tearing gripper structure with blowing and suction holes is used. During tearing, the high-temperature tape tearing handle is blown up by the blowing function on one side of the gripper, while the other side of the gripper uses suction to adhere the tearing handle, ensuring effective gripping of the tape. The tape is then successfully torn off via a transmission mechanism. By simultaneously blowing up and gripping the tearing handle, the high-temperature tape is automatically and efficiently removed, replacing manual tearing, improving production efficiency, achieving automation and manpower reduction, and enhancing the automation level and quality consistency of the production line.

[0118] Based on the same concept, this application provides a circuit board manufacturing system, including: a tape-tearing device as provided in any of the above embodiments. It also includes preceding soldering equipment and equipment for subsequent processes.

[0119] The circuit board provided in this application embodiment includes the tape-tearing device provided in any of the above embodiments. The tape-tearing device includes tape-tearing jaws and a moving structure; the moving structure drives the tape-tearing jaws to move; the first jaw of the tape-tearing jaws is provided with an air inlet for blowing up one end of the tape pasted on the electronic product, and the second jaw is provided with an air inlet for adsorbing the blown tape. After the air inlet adsorbs the tape, the first and second jaws close to clamp the tape, and then the moving structure drives the tape-tearing jaws to move, tearing off the tape. The entire process is achieved by the tape-tearing jaws and the moving structure working together to tear the tape, eliminating the need for manual operation, reducing labor intensity, improving production efficiency, and because air is used to blow the tape, tweezers are not needed, eliminating the problem of scratching the product.

[0120] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0121] It should be noted that in the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means at least two.

[0122] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this application pertain.

[0123] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0124] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0125] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0126] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0127] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0128] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A tape-tearing device, characterized in that, include: Tape-tearing grippers and moving structure; The movable structure drives the tape-tearing gripper to move; The first claw of the tape-tearing gripper is provided with an air blowing port for blowing up one end of the tape pasted on the electronic product, and the second claw is provided with an air suction port for adsorbing the blown tape. The first and second claws of the tape-tearing gripper can close together.

2. The tape-tearing device according to claim 1, characterized in that: The first and / or second claws of the tape-tearing gripper are provided with a friction structure for anti-slip.

3. The tape-tearing device according to claim 1, characterized in that: The moving structure includes at least one of the following: A first moving mechanism for controlling the left and right movement of the tape-tearing gripper; A second moving mechanism for controlling the back-and-forth movement of the tape-tearing gripper; A third moving mechanism for controlling the up-and-down movement of the tape-tearing gripper.

4. The tape-tearing device according to claim 1, characterized in that, Also includes: Gripper connection structure; The tape-tearing gripper is connected to the movable structure via the gripper connection structure; The gripper connection structure includes: The mounting side plate of the movable structure; A movable cylinder for driving the tape-tearing gripper; The movable cylinder is fixed to the mounting side plate.

5. The tape-tearing device according to claim 1, characterized in that, Also includes: A transport device used to convey electronic products with tape to be torn.

6. The tape-tearing device according to claim 5, characterized in that: The transmission device is equipped with a blocking structure; The blocking structure includes: A blocking baffle used to stop the electronic products being transported by the transmission device; A blocking cylinder for driving the blocking baffle.

7. The tape-tearing device according to claim 6, characterized in that: The transmission device is equipped with a clamping structure; The clamping structure includes: A clamping block used to press the electronic product after the product is stopped by the blocking baffle; A clamping cylinder for driving the clamping block.

8. The tape-tearing device according to claim 1, characterized in that: The tape includes: Used to cover the adhesive portion of the product; Tape tearing hands; The tape tear handle is located at one end of the adhesive part; The air inlet of the tape tearing claw blows the tape tearer, and the air inlet of the tape tearing claw absorbs the tape tearer.

9. The tape-tearing device according to claim 1, characterized in that, Also includes: A collection device for collecting the tape torn off by the tape-tearing claw.

10. A circuit board manufacturing system, characterized in that, include: The tape-tearing device as described in any one of claims 1-9.