A power amplifier assembly, a radio frequency thawing device and an electrical appliance

Abstract

The application discloses a power amplifier assembly, a radio frequency thawing device and an electrical appliance, and belongs to the technical field of electrical appliances. The power amplifier assembly comprises a shell, a power amplifier, a heat dissipation piece and a heat dissipation fan, the shell has a mounting cavity, the power amplifier is arranged in the mounting cavity, the heat dissipation piece is mounted on the shell and arranged outside the mounting cavity, the heat dissipation fan is connected with at least one of the shell and the heat dissipation piece, and the heat dissipation fan is arranged outside the mounting cavity; in the thickness direction of the shell, the projection of the heat dissipation fan on the shell at least partially overlaps the projection of the heat dissipation piece on the shell. The heat dissipation piece and the heat dissipation fan are both arranged outside the mounting cavity, and in the thickness direction of the shell, the heat dissipation fan and the heat dissipation piece are arranged in overlap, so that a large amount of gas can directly gather on the heat dissipation piece, the gas for heat exchange with the heat dissipation piece is increased, and through the cooperation of the heat dissipation piece and the heat dissipation fan, the heat dissipation effect is improved.

Description

Technical Field

[0001] This application belongs to the field of electrical equipment technology, and in particular relates to a power amplifier component, a radio frequency defrosting device, and electrical equipment. Background Technology

[0002] Radio frequency (RF) defrosting devices, which utilize RF defrosting technology, are a common application of power amplifier circuits. RF defrosting technology uses electromagnetic waves to penetrate food, enabling the food to thaw evenly and quickly. Therefore, refrigerators equipped with RF defrosting devices are widely popular with consumers.

[0003] Power amplifier circuits operate at high temperatures and require heat dissipation. Current technology typically uses large DC fans to directly blow air onto the power amplifier circuit for forced cooling. However, the shielding enclosure obstructs the convection of heat within the enclosure, causing heat buildup on internal components (such as inductors and circuit boards). This results in excessive heat on the internal power amplifier board and other components, affecting their lifespan. Utility Model Content

[0004] This application aims to at least partially solve the technical problem of poor heat dissipation in power amplifier components. To this end, this application provides a power amplifier component, an RF defrosting device, and an electrical appliance.

[0005] In a first aspect, an embodiment of this application provides a power amplifier component, comprising:

[0006] The housing has a mounting cavity;

[0007] The power amplifier component is disposed within the mounting cavity;

[0008] A heat sink is installed on the housing, and the heat sink is disposed outside the mounting cavity;

[0009] A cooling fan is connected to at least one of the housing and the heat sink, and the cooling fan is disposed outside the mounting cavity;

[0010] Wherein, along the thickness direction of the housing, the projection of the cooling fan on the housing at least partially overlaps with the projection of the heat sink on the housing.

[0011] Both the heat sink and the cooling fan are located outside the mounting cavity, and the cooling fan overlaps with the heat sink in the thickness direction of the housing. This allows a large amount of gas to directly converge on the heat sink, increasing the amount of gas that exchanges heat with the heat sink. Through the combined action of the heat sink and the cooling fan, the heat dissipation effect is improved.

[0012] In an optional embodiment of this application, the heat sink includes a first heat sink and a second heat sink, and along the thickness direction of the housing, the projection of the heat sink fan onto the housing at least partially overlaps with the projection of the first heat sink onto the housing.

[0013] In an optional embodiment of this application, the first heat dissipation part includes a first base plate and a plurality of first heat dissipation fins, the plurality of first heat dissipation fins being spaced apart on the first base plate, the first base plate being connected to the second heat dissipation part, and the first heat dissipation fins being disposed between the cooling fan and the first base plate.

[0014] In an optional embodiment of this application, the cooling fan covers at least a portion of the plurality of the first heat sinks.

[0015] In an optional embodiment of this application, the first base plate and the plurality of first heat sinks are integrally formed.

[0016] In an optional embodiment of this application, a plurality of first heat sinks are spaced apart along the width direction of the housing, and a plurality of first heat sinks are spaced apart along the height direction of the housing, wherein the width direction and the height direction of the housing are arranged at an angle.

[0017] In optional embodiments of this application, the first base plate is integrally formed with the housing or is detachably connected.

[0018] In an optional embodiment of this application, the first heat dissipation part includes a plurality of first heat dissipation fins, a plurality of second heat dissipation fins are spaced apart along the height direction of the housing, and the plurality of first heat dissipation fins are integrally formed with the housing.

[0019] In an optional embodiment of this application, the second heat dissipation part includes a plurality of second heat dissipation fins, which are disposed on at least one side of the first heat dissipation part along the width direction of the housing.

[0020] In an optional embodiment of this application, the second heat dissipation part further includes a plurality of third heat dissipation fins, which are disposed on at least one side of the first heat dissipation part along the height direction of the housing.

[0021] In an optional embodiment of this application, a first fixing part is provided on the housing and / or the heat sink, and a second fixing part is provided on the heat sink fan, wherein the first fixing part and the second fixing part are connected.

[0022] Secondly, embodiments of this application provide a radio frequency defrosting device, including a housing assembly and the power amplifier assembly provided in the first aspect, wherein the housing is connected to the housing assembly.

[0023] The beneficial effects of the radio frequency defrosting device provided in the second aspect are the same as those of the power amplifier component provided in the first aspect, and will not be repeated here.

[0024] Thirdly, embodiments of this application provide an electrical device, including a main body and the radio frequency defrosting device described in the second aspect, wherein the radio frequency defrosting device is installed on the main body.

[0025] The beneficial effects of the electrical equipment provided in the third aspect are the same as those of the radio frequency defrosting device provided in the second aspect, and will not be repeated here. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A first-view structural schematic diagram of the power amplifier assembly is shown.

[0028] Figure 2 An exploded view of the power amplifier assembly from a second perspective is shown.

[0029] Figure 3 An exploded view of the power amplifier assembly from a third-person perspective is shown.

[0030] Figure 4 It shows Figure 1 A first-view structural diagram of the housing and heat sink of the power amplifier component.

[0031] Figure 5 It shows Figure 1 A second-view structural diagram of the housing and heat sink of the power amplifier component.

[0032] Figure 6 A schematic diagram of the structure of the first heat dissipation unit from a first-view perspective is shown.

[0033] Figure 7 A schematic diagram of the first heat dissipation unit from a second perspective is shown.

[0034] Figure 8 It shows Figure 1 An exploded view from a second perspective of the housing and heat sink of the power amplifier components.

[0035] Figure 9 A schematic diagram of the internal structure of the shell is shown.

[0036] Figure 10A first-view structural schematic diagram of some other embodiments of the power amplifier assembly is shown.

[0037] Figure 11 It shows Figure 10 A schematic diagram of the middle power amplifier component from a second perspective.

[0038] Figure 12 It shows Figure 11 Exploded view.

[0039] Figure 13 It shows Figure 10 The diagram shows the structure of the housing and heat sink of the power amplifier assembly provided in the document.

[0040] Figure 14 It shows Figure 11 The diagram shows the structure of the housing and heat sink of the power amplifier assembly provided in the document.

[0041] Figure 15 A schematic diagram of the radio frequency defrosting device from a first-view perspective is shown.

[0042] Figure 16 A schematic diagram of the radio frequency defrosting device from a second perspective is shown.

[0043] Figure 17 A partial structural diagram of the electrical equipment is shown.

[0044] Reference numerals: 100-Amplifier assembly, 110-Housing shell, 112-Mounting cavity, 113-Box body, 114-Box cover, 115-Mounting port, 116-Baffle, 117-Limiting groove, 118-First fixing part, 120-Amplifier component, 122-Amplifier board, 124-Main control board;

[0045] 130 - Heat sink, 131 - Heat sink, 132 - Heat dissipation channel, 134 - First heat dissipation unit, 1342 - First base plate, 1344 - First heat sink, 1345 - Mounting plate, 1346 - First heat dissipation channel, 1348 - Second heat dissipation channel, 136 - Second heat dissipation unit, 1362 - Second heat sink, 1364 - Third heat sink, 1366 - First heat exchange channel, 1367 - Second heat exchange channel, 1368 - Third heat exchange channel;

[0046] 140-Cooling fan, 142-Second fixing part, 150-Fixing component, 10-RF defrosting device, 200-Box assembly, 1-Electrical equipment, 20-Main body, X-Width direction, Y-Thickness direction, Z-Height direction. Detailed Implementation

[0047] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0048] It should be noted that all directional indications in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0049] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0050] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0051] A power amplifier circuit (also known as a power amplifier, power amplifier board, power amplifier module, etc.) is an amplifier circuit designed to output a large amount of power. Power amplifier circuits are usually used as the output stage of a multi-stage amplifier circuit, and the output stage is required to drive a certain load.

[0052] Power amplifier circuits are used in many electronic devices, such as driving instruments to deflect pointers, driving speakers to produce sound, and driving electrodes to transmit radio frequency signals. When installing a power amplifier circuit, a shielding enclosure is used to prevent electromagnetic interference to other electronic components.

[0053] Radio frequency (RF) defrosting devices, which utilize RF defrosting technology, are a common application of power amplifier circuits. RF defrosting technology uses electromagnetic waves to penetrate food, enabling the food to thaw evenly and quickly. Therefore, refrigerators equipped with RF defrosting devices are widely popular with consumers.

[0054] Power amplifier circuits operate at high temperatures and require heat dissipation. Existing technologies typically use large DC fans to directly blow air onto the power amplifier circuit for forced cooling. However, the shielding enclosure obstructs heat convection within the enclosure, causing heat buildup on internal components (such as inductors and circuit boards). This results in excessive heat on the internal power amplifier board and other components, affecting their lifespan. The power amplifier assembly, RF defrosting device, and electrical equipment provided in this application address these issues. These components effectively dissipate heat from the power amplifier board and other internal components, reducing heat loss and extending the power amplifier assembly's lifespan.

[0055] This application is described below with reference to the accompanying drawings and specific embodiments:

[0056] Figure 1 This shows a first-view structural schematic diagram of the power amplifier assembly 100. Figure 2 An exploded view of the power amplifier assembly 100 from a second perspective is shown. Figure 3 An exploded view of the power amplifier assembly 100 from a third-person perspective is shown, as follows: Figure 1 , Figure 2 and Figure 3 As shown, this application embodiment provides a power amplifier component 100. The power amplifier component 100 provided in this application embodiment can be applied to the radio frequency defrosting device 10. When the power amplifier component 100 is applied to the radio frequency defrosting device 10, the power amplifier component 100 can be connected with a plate, so that the plate can radiate radio frequency defrosting energy to the item to be defrosted, thereby defrosting the item to be defrosted.

[0057] The power amplifier assembly 100 is prone to generating heat during operation. If the heat is not dissipated in time, it will affect the service life of the components of the power amplifier assembly 100. The power amplifier assembly 100 provided in this application embodiment can improve the heat dissipation speed and can quickly dissipate the heat inside the housing 110 to the outside of the housing 110, so that the power amplifier 120 can be kept within a suitable temperature, ensuring that the power amplifier 120 can work normally, thereby improving the service life of the power amplifier 120.

[0058] In this embodiment of the application, the power amplifier assembly 100 includes: a housing 110, a power amplifier component 120, and a heat sink 130. The housing 110 has a mounting cavity 112; the power amplifier component 120 is disposed in the mounting cavity 112; and the heat sink 130 is connected to the housing 110 and disposed outside the mounting cavity 112.

[0059] Among them, the housing 110 is the basic component of the entire power amplifier assembly 100. The housing 110 can provide a base for the installation of components such as the power amplifier 120 and the heat sink 130. The power amplifier 120 is located inside the housing 110. The housing 110 can protect the power amplifier 120 and reduce the impact of dust and other impurities on the power amplifier 120.

[0060] The power amplifier 120 amplifies the radio frequency (RF) signal, enabling it to output with greater energy. This allows the electrode plates to radiate RF defrosting energy to defrost the items. During operation, the power amplifier 120 generates heat due to the amplification of the RF signal. Failure to dissipate this heat promptly can shorten its lifespan. A heat sink 130 is mounted on the housing 110. Heat generated inside the housing 110 radiates to the housing, and the heat sink 130 dissipates this radiated heat, preventing heat buildup and maintaining the power amplifier 120 within a suitable temperature range. This ensures proper operation and extends the lifespan of the power amplifier 120. This timely heat dissipation also ensures the amplification of the RF defrosting signal, allowing the electrode plates to radiate sufficient RF defrosting energy and improving the defrosting effect.

[0061] Since the heat sink 130 is mounted on the housing 110, the heat radiated to the housing 110 can be directly transferred to the heat sink 130, which reduces the thermal resistance between the housing 110 and the heat sink 130. This allows the heat to be quickly transferred to the heat sink 130 and dissipated through it. This arrangement improves the heat dissipation speed and quickly dissipates the heat inside the housing 110 to the outside of the housing 110, keeping the power amplifier 120 within a suitable temperature range, ensuring that the power amplifier 120 can work normally, and thus extending the service life of the power amplifier 120.

[0062] In some embodiments, the housing 110 includes a box body 113 and a box cover 114, which are connected to form a mounting cavity 112. A heat sink 130 is disposed on the side of the box body 113 away from the box cover 114. The heat sink 130 is disposed on the box body 113 and can be separately formed from or integrally formed with the box body 113. In both the box body 113 and the box cover 114, the power amplifier 120 is disposed close to the box body 113, so that the distance between the power amplifier 120 and the box body 113 is relatively small. By placing the heat sink 130 on the box body 113, the distance between the heat sink 130 and the power amplifier 120 can be minimized, thereby accelerating heat conduction and improving heat dissipation speed.

[0063] In some embodiments, the power amplifier assembly 100 further includes a cooling fan 140, which is disposed outside the mounting cavity 112 and along the thickness direction Y of the housing 110. The projection of the cooling fan 140 on the housing 110 at least partially overlaps with the projection of the heat sink 130 on the housing 110.

[0064] In the application of the power amplifier component 100 in the radio frequency defrosting device 10, since the radio frequency defrosting device 10 is generally small in size, the power amplifier component 100 is also set to be small in size. If only the natural flow of gas is relied upon, the gas flow rate entering the heat dissipation channel 132 will be relatively small. In order to increase the gas flow rate in the heat dissipation channel 132, a heat dissipation fan 140 can be set. The heat dissipation fan 140 increases the gas flow rate entering the heat dissipation channel 132, thereby improving the heat dissipation effect.

[0065] Both the heat sink 130 and the cooling fan 140 are located outside the mounting cavity 112 and are arranged in the thickness direction Y of the housing 110. The cooling fan 140 overlaps with the heat sink 130, allowing a large amount of gas to directly converge on the heat sink 130, thus increasing the amount of gas that exchanges heat with the heat sink 130. Through the combined action of the heat sink 130 and the cooling fan 140, the heat dissipation effect is improved.

[0066] In some embodiments, the cooling fan 140 is configured to correspond to the power amplifier board 122. Since the power amplifier circuit is integrated on the power amplifier board 122, the power amplifier board 122 generates a lot of heat during the operation of the power amplifier 120. The cooling fan 140 is configured to correspond to the power amplifier board 122, so that the air flow at the corresponding location on the power amplifier board 122 can be increased, allowing more air to enter the heat dissipation channel 132 of the power amplifier board 122, which can carry away more heat and improve the heat dissipation effect of the power amplifier board 122.

[0067] The cooling fan 140 is located outside the mounting cavity 112. Compared to placing the cooling fan 140 inside the mounting cavity 112, this reduces the space required within the mounting cavity 112, resulting in a smaller internal space for the housing 110. This allows the heat generated by the power amplifier board 122, main control board 124, etc., of the power amplifier assembly 120 to be quickly transferred to the housing 110 and dissipated through the heat sink 130 on the housing 110, thus improving the overall heat dissipation of the power amplifier assembly 100. The power amplifier board 122 and the main control board 124 can be integrated onto the same circuit board or designed on separate circuit boards.

[0068] In some embodiments, the cooling fan 140 is mounted on the heat sink 130 and / or the housing 110. Since the cooling fan 140 is also located outside the mounting cavity 112, the closer the cooling fan 140 is to the heat sink 130, the more gas will accumulate in the heat dissipation channel 132. Mounting the cooling fan 140 on the heat sink 130 and / or the housing 110 allows the cooling fan 140 to be as close as possible to the heat dissipation channel 132, enabling more gas to flow into the heat dissipation channel 132 and increasing the gas flow rate in the heat dissipation channel 132.

[0069] It should be noted that the cooling fan 140 being installed on the heat sink 130 and / or the housing 110 means that the cooling fan 140 can be installed only on the heat sink 130, that is, the cooling fan 140 is connected to the heat sink 130; or the cooling fan 140 can be installed only on the housing 110, that is, the cooling fan 140 is only connected to the housing 110; or the cooling fan 140 can be installed on both the heat sink 130 and the housing 110, that is, the cooling fan 140 is connected to both the housing 110 and the heat sink 130.

[0070] Since the heat sink 130 is mounted on the housing 110, and the cooling fan 140 is also mounted on the housing 110, it can be said that the cooling fan 140 is close to the heat sink 130, that is, the cooling fan 140 is close to the heat dissipation channel 132, which allows more gas to flow to the heat dissipation channel 132 and increases the gas flow rate in the heat dissipation channel 132.

[0071] The cooling fan 140 is detachably mounted on the housing 110 and / or the heat sink 130. A first fixing part 118 can be provided on the housing 110 and / or the first base plate 1342, and a second fixing part 142 can be provided on the cooling fan 140. The first fixing part 118 and the second fixing part 142 are detachably connected. The first fixing part 118 and the second fixing part 142 can be snapped together, or a first fixing hole can be provided on the first fixing part 118, and a second fixing hole can be provided on the second fixing part 142. A fixing member 150 passes through the first fixing hole and the second fixing hole, thereby fixing the cooling fan 140 to the housing 110 and / or the first heat sink 1342.

[0072] In some embodiments, the heat sink 130 includes a plurality of heat sinks 131, which are spaced apart on the housing 110.

[0073] Multiple heat sinks 131 are spaced apart on the housing 110, forming a heat dissipation channel 132 between adjacent heat sinks 131 (e.g., Figure 1 As shown, when the gas passes through the heat dissipation channel 132, it can carry away the heat on the heat sink 131, which can improve the heat dissipation speed to a certain extent.

[0074] The extension direction of multiple heat sinks 131 can be the same, so that the direction of the multiple heat dissipation channels 132 formed is also the same, thereby making the airflow of the multiple heat dissipation channels 132 approximately the same, and making the heat dissipation of heat sinks 131 located in different heat dissipation channels 132 approximately the same, thereby enabling the entire heat dissipation component 130 to dissipate heat evenly within the housing 110, minimizing the situation of excessive local heat in the power amplifier component 120 due to uneven heat dissipation.

[0075] For example, the housing 110 can be roughly rectangular, and the housing 110 can have three different directions: length direction, width direction X, and height direction Z. Among them, the width direction X is the direction of the longest side of the housing 110. The heat sink 131 can be set along the width direction X of the housing 110, so that the heat dissipation channel 132 is as long as possible, which can increase the residence time of the gas in the heat dissipation channel 132, thereby extending the heat exchange time between the gas and the heat sink 131, so that the gas can carry away more heat from the heat sink 130, thereby improving the heat dissipation effect.

[0076] Since the heat sink 131 is arranged along the width direction X of the housing 110, the width of the heat dissipation channel 132 refers to the width along the height direction Z of the housing 110. If the width of the heat dissipation channel 132 is too narrow, the heat from the heat sink 131 on both sides of the heat dissipation channel 132 cannot be dissipated in time, and the gas cannot carry away the heat from the heat sink 131 in time. If the width of the heat dissipation channel 132 is too wide, the gas volume will be too large, and the gas utilization rate will be low. Furthermore, since the height direction Z dimension of the housing 110 is fixed, a wider heat dissipation channel 132 will reduce the number of heat sinks 131, which will also lead to heat accumulation and hinder heat dissipation. The width of the heat dissipation channel 132 (the distance between two adjacent heat sinks 131) needs to be moderate, neither too large nor too small, and can be set according to the overall height dimension of the housing 110.

[0077] Specifically, in some embodiments, the spacing between two adjacent heat sinks 131 is 8mm to 12mm. The spacing between two adjacent heat sinks 131 is the width of the heat dissipation channel 132. The width of the heat dissipation channel 132 is 8mm to 12mm. This layout not only ensures a moderate number of heat sinks 131 but also provides sufficient airflow, which can promptly remove the heat from the heat sinks 131 and maximize the heat dissipation efficiency of the heat sink 130.

[0078] In some embodiments, the plurality of heat sinks 131 are integrally formed with the housing 110. That is, the housing 110 and the heat sinks 131 are an integral structure, which can reduce the assembly process of the heat sink 130 and the housing 110, save the assembly time of the heat sink 130 and the housing 110, and improve the assembly efficiency of the heat sink 130 and the housing 110.

[0079] Since the heat sink 131 and the housing 110 are integrally formed, the heat sink 131 is directly connected to the housing 110, so that the heat radiated from the inside of the mounting cavity 112 to the housing 110 can be quickly transferred to the heat sink 130. The heat sink 130 dissipates heat, which can also improve the heat dissipation effect to a certain extent.

[0080] In some embodiments, the housing 110 and the heat sink 131 may be supported by a metal material with high thermal conductivity. For example, the housing 110 and the heat sink 131 may be made of at least one of aluminum, copper, and aluminum alloy.

[0081] Specifically, in some embodiments, the housing 110 and the heat sink 131 may both be made of aluminum or aluminum alloy, or the housing 110 and some of the heat sink 131 may be made of aluminum or aluminum alloy, while some of the heat sink 131 may be made of copper. The specific materials are not limited.

[0082] Figure 4 It shows Figure 1 A first-view structural schematic diagram of the housing 110 and heat sink 130 of the power amplifier assembly 100. Figure 5 It shows Figure 1 A second-view structural schematic diagram of the housing 110 and heat sink 130 of the power amplifier assembly 100, as shown in the figure. Figure 4 , Figure 5 As shown, regarding the specific structure of the heat sink 130, in some embodiments, the heat sink 130 includes a first heat sink 134 and a second heat sink 136. The first heat sink 134 is disposed corresponding to the power amplifier board 122. Along the thickness direction Y of the housing 110, the projection of the cooling fan 140 on the housing 110 at least partially overlaps with the projection of the first heat sink 134 on the housing 110.

[0083] The first heat dissipation part 134 is disposed corresponding to the power amplifier board 122. Specifically, the first heat dissipation part 134 is disposed corresponding to the power amplifier board 122 in that the projection of the first heat dissipation part 134 on the housing 110 along the thickness direction Y of the housing 110 at least partially overlaps with the projection of the power amplifier board 122 on the housing 110. Since the projection of the cooling fan 140 on the housing 110 at least partially overlaps with the projection of the first heat dissipation part 134 on the housing 110, the projection of the cooling fan 140 on the housing 110 along the thickness direction Y of the housing 110 at least partially overlaps with the projection of the power amplifier board 122 on the housing 110.

[0084] During the entire operation of the power amplifier 120, the power amplifier board 122 generates the most heat. Along the thickness direction Y of the housing 110, the projection of the cooling fan 140 on the housing 110 and the projection of the power amplifier board 122 on the housing 110 at least partially overlap. This allows more gas to gather at the first heat dissipation part 134 during the operation of the cooling fan 140, increasing the gas flow around the power amplifier board 122 and allowing more gas to come into contact with the first heat dissipation part 134. This improves the heat dissipation effect around the power amplifier board 122 and reduces the possibility of the power amplifier board 122 overheating.

[0085] In some embodiments, the height of the first heat dissipation part 134 protruding from the housing 110 is less than the height of the second heat dissipation part 136 protruding from the housing 110. Specifically, along the thickness direction Y of the housing 110, the width of the first heat dissipation part 134 is less than the width of the second heat dissipation part 136. Because the width of the first heat dissipation part 134 in the thickness direction Y of the housing 110 is smaller, the heat difference between the two ends of the first heat dissipation part 134 in the thickness direction Y of the housing 110 is larger (the heat at the end of the first heat dissipation part 134 closer to the housing 110 is greater than the heat at the end of the first heat dissipation part 134 farther from the housing 110). This allows the heat around the power amplifier board 122 to flow as far away from the housing 110 as possible from the first heat dissipation part 134, thereby accelerating the heat dissipation around the power amplifier board 122 and improving the heat dissipation effect around the power amplifier board 122.

[0086] The space formed by the first heat dissipation part 134 protruding from the housing 110 at a height less than that formed by the second heat dissipation part 136 protruding from the housing 110 is convenient for placing the cooling fan 140. This makes the appearance of the power amplifier assembly 100 look neat and beautiful, and also avoids the cooling fan 140 from being easily scratched due to its protruding design.

[0087] The first heat dissipation part 134 can be detachably connected to the housing 110, or it can be integrally formed. The first heat dissipation part 134 can be detachably connected by means of embedding, snap-fit, screw connection, etc.

[0088] In some embodiments, the first heat dissipation part 134 is disposed between the heat dissipation fan 140 and the power amplifier 120.

[0089] The cooling fan 140 is disposed outside the mounting cavity 112, and the first heat dissipation part 134 is disposed between the cooling fan 140 and the power amplifier 120. This allows the heat generated by the power amplifier 120 during operation to be transferred to the outside of the mounting cavity 112 through the first heat dissipation part 134. The cooling fan 140 increases the air flow around the first heat dissipation part 134, thereby increasing the heat exchange with the first heat dissipation part 134. This allows the heat transferred from the power amplifier 120 to the first heat dissipation part 134 to exchange with the air around the first heat dissipation part 134, thereby improving the heat dissipation effect of the power amplifier 120.

[0090] Since the heat dissipation speed of the first heat dissipation part 134 is greater than that of the power amplifier component 120, the first heat dissipation part 134 is located between the cooling fan 140 and the power amplifier component 120. It can accelerate the heat conduction around the power amplifier component 120, thereby accelerating the heat dissipation of the power amplifier component 120. It can minimize the accumulation of heat on the power amplifier board 122, so that the power amplifier board 122 can always maintain a suitable operating temperature, thereby reducing the possibility of the power amplifier board 122 failing to work properly due to excessive temperature.

[0091] In some embodiments, the heat conduction of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136. Since the first heat dissipation part 134 is correspondingly arranged with the power amplifier board 122, the greater heat conduction of the first heat dissipation part 134 than that of the second heat dissipation part 136 can also accelerate the heat conduction around the power amplifier board 122, so that the heat generated by the power amplifier board 122 can be quickly dissipated to the outside of the mounting cavity 112 through the first heat dissipation part 134, which can also improve the heat dissipation effect to a certain extent.

[0092] In some embodiments, the heat conduction of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136, and a heat dissipation fan 140 is provided at the first heat dissipation part 134 to accelerate heat conduction and increase the gas flow rate of the first heat dissipation part 134, so that more gas can exchange heat with the first heat dissipation part 134, thereby improving the heat dissipation effect.

[0093] In some embodiments, the thermal conductivity of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136. Since the first heat dissipation part 134 is provided corresponding to the power amplifier board 122, the power amplifier board 122 generates a lot of heat during the operation of the entire power amplifier assembly 100. The thermal conductivity of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136, so that under the same gas flow rate, the heat conduction of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136. This allows the heat generated by the power amplifier board 122 to be transferred to the outside of the housing 110 as quickly as possible, and can avoid heat accumulation on the power amplifier board 122 as much as possible. This allows the power amplifier board 122 to always maintain a suitable operating temperature, thereby reducing the possibility that the power amplifier board 122 will not be able to work properly due to excessive temperature.

[0094] In some embodiments, the first heat sink 134 is made of copper, and the second heat sink 136 is made of aluminum alloy. Copper has a high thermal conductivity, which allows the heat generated by the power amplifier board 122 to be quickly conducted away. The second heat sink 136 is made of aluminum alloy, which also has a certain thermal conductivity. The second heat sink 136 is located opposite the main control board 124. The main control board 124 also generates heat, but not as much as the power amplifier board 122. In addition to ensuring a certain heat conduction speed, the aluminum alloy material has a lower manufacturing cost than copper. Using aluminum alloy for the second heat sink 136 can reduce the manufacturing cost of the entire power amplifier assembly 100 to a certain extent.

[0095] Figure 6 This shows a structural schematic diagram of the first heat dissipation unit 134 from a first-view perspective. Figure 7 A structural schematic diagram of the first heat dissipation unit 134 from a second perspective is shown, as follows. Figure 6 and Figure 7 As shown, in some embodiments, the first heat dissipation part 134 includes a first base plate 1342 and a plurality of first heat dissipation fins 1344, the plurality of first heat dissipation fins 1344 being spaced apart on the first base plate 1342, the first base plate 1342 being connected to the second heat dissipation part 136, and the heat dissipation fan 140 being mounted on the first base plate 1342 (first heat dissipation part 134) and / or the housing 110.

[0096] The first base plate 1342 is detachably connected to the housing 110 and / or the second heat dissipation part 136. Specifically, the first base plate 1342 can be detachably connected to the second heat dissipation part 136, or detachably connected to the housing 110, or the first base plate 1342 can be detachably connected to both the second heat dissipation part 136 and the housing 110. The specific connection method is not limited.

[0097] Figure 8 It shows Figure 1 An exploded view from a second perspective of the housing 110 and heat sink 130 of the power amplifier assembly 100. Figure 9 A schematic diagram of the internal structure of the housing 110 is shown, as follows: Figure 7 , Figure 8 and Figure 9 As shown, in some embodiments, the housing 110 is provided with a mounting port 115, and the first base plate 1342 is installed in the mounting port 115, such that the side of the first base plate 1342 away from the first heat sink 1344 and the housing 110 together form the inner wall of the mounting cavity 112. Since the thermal conductivity of the first heat sink 134 is relatively high, the first base plate 1342 is set close to the power amplifier board 122, so that the heat generated by the power amplifier board 122 during operation can be directly transferred to the first base plate 1342 with high thermal conductivity, and the heat is dissipated by the first base plate 1342 and the first heat sink 1344. This arrangement can improve the heat dissipation effect of the power amplifier board 122.

[0098] like Figure 7 and Figure 8 As shown, in some embodiments, in order to facilitate the installation of the first heat dissipation part 134, the first heat dissipation part 134 further includes a mounting plate 1345. The mounting plate 1345 is connected to the first base plate 1342. The mounting plate 1345 is disposed in the mounting cavity 112 and fits against the inner wall of the housing 110, thereby fixing the entire first heat dissipation part 134 onto the housing 110.

[0099] The mounting plate 1345 can be arranged around the edge of the first base plate 1342, so that the surface of the first base plate 1342 can form the inner wall of the mounting cavity 112 together with the housing 110, so that the first base plate 1342 can directly conduct the heat generated by the power amplifier board 122. This arrangement can improve the heat dissipation effect of the power amplifier board 122.

[0100] like Figure 9 As shown, in order to facilitate the positioning of the mounting plate 1345 and the housing 110, a baffle 116 can be provided on the inner wall of the housing 110. A limiting groove 117 is provided on the baffle 116. The mounting plate 1345 can be installed in the limiting groove 117. Of course, the limiting groove 117 is connected to the mounting port 115, so that the first base plate 1342 and the first heat sink 1344 are located outside the mounting cavity 112.

[0101] As for the connection method between the mounting plate 1345 and the housing 110, a first connection hole can be provided on the mounting plate 1345 and a second connection hole can be provided on the housing 110. Screws, bolts and other fixing structures are inserted into the first connection hole and the second connection hole to fix the mounting plate 1345.

[0102] Of course, in some other embodiments, the mounting opening 115 may not be provided on the housing 110, and the first base plate 1342 is attached to the side of the housing 110 away from the power amplifier board 122, and the housing 110 alone forms the inner wall of the mounting cavity 112.

[0103] The first heat sink 1344 is disposed between the cooling fan 140 and the first base plate 1342. Since the first base plate 1342 is the inner wall of the mounting cavity 112, the placement of the first heat sink 1344 between the cooling fan 140 and the first base plate 1342 allows the base plate to transfer heat from the mounting cavity 112 to the first heat sink 1344. Under the action of the cooling fan 140, a large amount of gas gathers around the first heat sink 1344, thereby improving the heat dissipation effect.

[0104] In some embodiments, the cooling fan 140 covers at least a portion of the plurality of first heat sinks 1344. In the thickness direction Y of the housing 110, the cooling fan 140 overlaps with at least a portion of the first heat sinks 1344, allowing gas to first converge on the first heat sinks 1344 for heat exchange, thereby improving the heat dissipation effect.

[0105] In some other embodiments, the first heat dissipation part 134 may not include the first base plate 1342, or the first heat dissipation part 134 may only include a plurality of first heat dissipation fins 1344, which are directly mounted on the housing 110. The specific arrangement is not limited.

[0106] The installation of the cooling fan 140 on the first base plate 1342 and / or the housing 110 means that the cooling fan 140 can be installed on at least one of the first base plate 1342 and the housing 110. That is, the cooling fan 140 can be installed only on the first base plate 1342, or only on the housing 110, or the cooling fan 140 can be installed on both the first base plate 1342 and the housing 110. The installation method of the cooling fan 140 is not specifically limited.

[0107] Multiple first heat sinks 1344 are spaced apart on the first base plate 1342, so that a heat dissipation channel 132 is formed between two adjacent first heat sinks 1344. Gas can enter into the heat dissipation channel 132 between two adjacent first heat sinks 1344 and exchange heat with the first heat sinks 1344 on both sides of the same heat dissipation channel 132, thereby accelerating the heat dissipation of the first heat dissipation part 134 and improving the heat dissipation effect of the power amplifier board 122.

[0108] like Figure 6 and Figure 7 As shown, in some embodiments, the first base plate 1342 and the plurality of first heat sinks 1344 are integrally formed. The integral forming of the first base plate 1342 and the plurality of first heat sinks 1344 can reduce the assembly process of the plurality of first heat sinks 1344 and the first base plate 1342, so that the entire first heat sink 134 can be integrated as a whole, and the entire first heat sink 134 can be directly assembled onto the housing 110, which facilitates the assembly of the entire power amplifier assembly 100.

[0109] In addition, since the first heat sink 1344 and the first base plate 1342 are integrally formed, the first heat sink 1344 can directly contact the first base plate 1342. There is basically no gap between the first heat sink 1344 and the first base plate 1342, so that the heat on the first base plate 1342 can be directly transferred to the first heat sink 1344, which can also improve the heat dissipation effect to a certain extent.

[0110] In some embodiments, a plurality of first heat sinks 1344 are spaced apart along the width direction X of the housing 110, and a plurality of first heat sinks 1344 are spaced apart along the height direction Z of the housing 110, wherein the width direction X and the height direction Z of the housing 110 are arranged at an angle.

[0111] The first heat sink 1344 has a relatively small width along the width direction X of the housing 110, so that multiple first heat sinks 1344 are spaced apart along the width direction X of the housing 110 and also arranged along the height direction Z of the housing 110. For ease of description, multiple first heat sinks 1344 are defined as forming multiple rows along the width direction X of the housing 110 and multiple columns along the height direction Z of the housing 110. That is, multiple first heat sinks 1344 are arranged in multiple rows and multiple columns. Specifically, multiple first heat sinks 1344 can be arranged in a matrix.

[0112] The first heat sink 1344 is arranged in multiple rows and columns, which allows the first heat sink 134 to form multiple heat dissipation channels 132 in different directions. This allows the air blown out by the cooling fan 140 to be blown out in different directions. Compared with the cooling fan 140 blowing out air in the same direction, this method can reduce the wind resistance of the cooling fan 140, increase the air flow through the first heat sink 1344, and improve the heat dissipation effect to a certain extent.

[0113] Specifically, for ease of description, the heat dissipation channel 132 formed by the first heat sink 1344 in adjacent rows is defined as the first heat dissipation channel 1346, and the heat dissipation channel 132 formed by the first heat sink 1344 in adjacent columns is defined as the second heat dissipation channel 1348. That is, the first heat dissipation channel 1346 is set along the width direction X of the housing 110, and the second heat dissipation channel 1348 is set along the height direction Z of the housing 110.

[0114] In some embodiments, the first heat dissipation part 134 is detachably connected to the second heat dissipation part 136 and / or the housing 110 or integrally formed. The first heat dissipation part 134, the second heat dissipation part 136, and the housing 110 can be integrally formed; alternatively, the first heat dissipation part 134 and the housing 110 can be integrally formed, and the second heat dissipation part 136 can be detachably connected to the housing 110; or the second heat dissipation part 136 and the housing 110 can be integrally formed, and the first heat dissipation part 134 can be detachably connected to the housing 110. The specific method is not limited.

[0115] In some embodiments, the second heat dissipation portion 136 includes a plurality of second heat dissipation fins 1362 and a plurality of third heat dissipation fins 1364. Along the width direction X of the housing 110, the second heat dissipation fins 1362 are disposed on at least one side of the first heat dissipation portion 134; along the height direction Z of the housing 110, the third heat dissipation fins 1364 are disposed on at least one side of the first heat dissipation portion 134.

[0116] Along the width direction X of the housing 110, the second heat sink 1362 is disposed on at least one side of the first heat sink 134. This can be either the second heat sink 1362 being disposed on only one side of the first heat sink 134 (either the left or right side), or the second heat sink 1362 being disposed on both sides of the first heat sink 134, meaning the first heat sink 1362 is disposed on both the left and right sides. Similarly, along the height direction of the housing 110, the third heat sink 1364 is disposed on at least one side of the first heat sink 134. This can be either the third heat sink 1364 being disposed only above or below the first heat sink 134, or the third heat sink 1364 being disposed above or below the first heat sink 134.

[0117] A second heat sink 1362 and a third heat sink 1364 are arranged around the first heat sink 134, so that after the first heat sink 1344 of the first heat sink 134 transfers the heat generated by the power amplifier board 122 out of the mounting cavity 112, it can continue to be conducted through the second heat sink 1362 and the third heat sink 1364, thereby accelerating the heat dissipation speed.

[0118] Of course, in some other embodiments, the second heat dissipation part 136 may only include the second heat dissipation fin 1362 and not the third heat dissipation fin 1364. The second heat dissipation fin 1362 is disposed on one side of the first heat dissipation fin 1344 along the width direction X of the housing 110. When the second heat dissipation part 136 only includes the second heat dissipation fin 1362, the first heat dissipation fin 1344 may be mounted on the housing 110, that is, the first heat dissipation part 134 may not include the first base plate 1342.

[0119] In some embodiments, a plurality of second heat sinks 1362 are arranged at intervals along the height direction Z of the housing 110, and two adjacent second heat sinks 1362 are arranged at intervals to form a first heat exchange channel 1366.

[0120] The second heat sink 1362 is elongated and extends along the width direction X of the housing 110. Multiple second heat sinks 1362 are spaced apart along the height direction Z of the housing 110, and the distance between adjacent second heat sinks 1362 forms a first heat exchange channel 1366. Since there are multiple second heat sinks 1362, there are also multiple first heat exchange channels 1366. The first heat exchange channels 1366 are also arranged along the width direction X of the housing 110. This allows gas to enter the first heat exchange channel 1366 under the action of the cooling fan 140, and to contact the first heat sinks 1344 on both sides of the same first heat exchange channel 1366, thereby dissipating heat from the housing 110 and improving the heat dissipation effect.

[0121] In some embodiments, since the first heat dissipation channel 1346 extends along the width direction X of the housing 110, and there are multiple first heat dissipation channels 1346, one first heat dissipation channel 1346 can be connected to one first heat exchange channel 1366, so that the air blown out by the cooling fan 140 can flow directly to the first heat exchange channel 1366 through the first heat dissipation channel 1346, which can reduce the wind resistance of the gas during the flow process, increase the gas flow rate entering the first heat exchange channel 1366, and thus improve the heat dissipation effect of the second heat sink 1362.

[0122] In some embodiments, a plurality of third heat sinks 1364 are spaced apart along the width direction X of the housing 110, and a plurality of third heat sinks 1364 are spaced apart along the height direction Z of the housing 110, wherein the width direction X and the height direction Z of the housing 110 are arranged at an angle.

[0123] The third heat sink 1364 is disposed above and / or below the first heat sink 1344. The third heat sink 1364 has a smaller dimension along the width direction X of the housing 110, so that multiple third heat sinks 1364 are spaced apart along the width direction X of the housing 110 and also spaced apart along the height direction Z of the housing 110. For ease of description, multiple third heat sinks 1364 are defined as forming multiple rows along the width of the housing 110 and multiple columns along the height direction Z of the housing 110, that is, multiple third heat sinks 1364 are arranged in a multi-row and multi-column manner. Specifically, the third heat sinks 1364 can be arranged in a matrix.

[0124] Since the third heat sink 1364 is located above and / or below the first heat sink 1344 and is relatively close to the first heat sink 1344, and the third heat sink 1364 is spaced apart in different directions, the air blown out by the cooling fan 140 can be blown out in different directions. Compared with the cooling fan 140 blowing air in the same direction, this method can reduce the wind resistance of the cooling fan 140, increase the air flow through the third heat sink 1364, and also improve the heat dissipation effect to a certain extent.

[0125] For ease of description, the heat dissipation channel 132 formed by the third heat sink 1364 in adjacent rows is defined as the second heat exchange channel 1367, and the heat dissipation channel 132 formed by the third heat sink 1364 in adjacent columns is defined as the third heat exchange channel 1368. A second heat exchange channel 1367 can be connected to a first heat exchange channel 1366, and a third heat exchange channel 1368 can be connected to a second heat dissipation channel 1348, so that the air blown by the fan can be blown out in different directions of the casing 110, which can increase the air flow and improve the heat dissipation effect.

[0126] Specifically, it can be assumed that the third heat sink 1364 and the first heat sink 1344 have the same structure and arrangement. The difference lies in the material of the third heat sink 1364 and the first heat sink 1344. Everything else is the same.

[0127] In some embodiments, the second heat sink 1362 and the third heat sink 1364 are integrally formed with the housing 110. The second heat sink 1362 and the third heat sink 1364 are disposed in other areas of the housing 110 where the power amplifier board 122 is not located. The heat generated in other areas is smaller than that generated by the power amplifier board 122. The second heat sink 1362 and the third heat sink 1364 can be directly integrally formed with the housing 110, that is, the second heat sink 1362, the third heat sink 1364 and the housing 110 are all made of aluminum alloy.

[0128] Figure 10 A first-view structural schematic diagram of some other embodiments of the power amplifier assembly 100 is shown. Figure 11 It shows Figure 10 A second-view structural schematic diagram of the intermediate power amplifier component 100. Figure 12 It shows Figure 11 Explosion diagram, Figure 13 It shows Figure 10 The schematic diagram of the housing 110 and heat sink 130 of the power amplifier assembly 100 provided in the diagram is shown below. Figure 14 It shows Figure 11 The structural diagram of the housing 110 and heat sink 130 of the power amplifier assembly 100 provided in the diagram is as follows: Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 As shown, it should be noted that in some other embodiments, the second heat dissipation part 136 may not include the third heat dissipation fin 1364, and the first heat dissipation part 134 may not include the first base plate 1342. The first heat dissipation fin 1344 is directly disposed on the housing 110. In this case, the first heat dissipation fin 1344 may be elongated, so that multiple first heat dissipation fins 1344 form only the first heat dissipation channel 1346. In these embodiments, the first heat dissipation fin 1344, the second heat dissipation fin 1362, and the housing 110 are integrally formed and are all made of aluminum alloy.

[0129] Figure 15 A first-view structural schematic diagram of the radio frequency defrosting device 10 is shown. Figure 16 A structural schematic diagram of the radio frequency defrosting device 10 from a second perspective is shown, as follows. Figure 15 and Figure 16 As shown, based on the same inventive concept, this application embodiment also provides a radio frequency defrosting device 10, which includes a housing assembly 200 and the aforementioned power amplifier assembly 100, with the housing 110 connected to the housing assembly 200.

[0130] Figure 17 A partial structural schematic diagram of electrical device 1 is shown, such as... Figure 17 As shown, based on the same inventive concept, this application also provides an electrical device 1, which includes a main body 20 and the aforementioned radio frequency defrosting device 10, with the radio frequency defrosting device 10 installed on the main body 20. The electrical device 1 can be a refrigerator, freezer, or other refrigeration equipment.

[0131] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0132] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0133] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A power amplifier component, characterized in that, include: The housing (110) has a mounting cavity (112); A power amplifier component (120) is disposed within the mounting cavity (112); A heat sink (130) is installed on the housing (110), and the heat sink (130) is disposed outside the mounting cavity (112); A cooling fan (140) is connected to at least one of the housing (110) and the heat sink (130), and the cooling fan (140) is disposed outside the mounting cavity (112); Wherein, along the thickness direction (Y) of the housing (110), the projection of the cooling fan (140) on the housing (110) at least partially overlaps with the projection of the heat sink (130) on the housing (110).

2. The power amplifier component according to claim 1, characterized in that, The heat sink (130) includes a first heat sink (134) and a second heat sink (136). Along the thickness direction (Y) of the housing (110), the projection of the heat sink fan (140) on the housing (110) at least partially overlaps with the projection of the first heat sink (134) on the housing (110).

3. The power amplifier component according to claim 2, characterized in that, The first heat dissipation part (134) includes a first base plate (1342) and a plurality of first heat dissipation fins (1344). The plurality of first heat dissipation fins (1344) are spaced apart on the first base plate (1342). The first base plate (1342) is connected to the second heat dissipation part (136). The first heat dissipation fins (1344) are disposed between the heat dissipation fan (140) and the first base plate (1342).

4. The power amplifier component according to claim 3, characterized in that, The cooling fan (140) covers at least a portion of the plurality of the first heat sinks (1344).

5. The power amplifier component according to claim 3, characterized in that, The first base plate (1342) and the plurality of first heat sinks (1344) are integrally formed.

6. The power amplifier component according to claim 3, characterized in that, Multiple first heat sinks (1344) are spaced apart along the width direction (X) of the housing (110), and multiple first heat sinks (1344) are spaced apart along the height direction (Z) of the housing (110). The width direction (X) and the height direction (Z) of the housing (110) are arranged at an angle.

7. The power amplifier component according to claim 3, characterized in that, The first base plate (1342) is integrally formed with the housing (110) or can be detachably connected.

8. The power amplifier component according to claim 2, characterized in that, The first heat dissipation part (134) includes a plurality of first heat dissipation fins (1344), which are spaced apart along the height direction (Z) of the housing (110), and the plurality of first heat dissipation fins (1344) are integrally formed with the housing (110).

9. The power amplifier component according to claim 2, characterized in that, The second heat dissipation part (136) includes a plurality of second heat dissipation fins (1362), which are disposed on at least one side of the first heat dissipation part (134) along the width direction (X) of the housing (110).

10. The power amplifier assembly according to claim 9, characterized in that, The second heat dissipation part (136) further includes a plurality of third heat dissipation fins (1364), which are disposed on at least one side of the first heat dissipation part (134) along the height direction (Z) of the housing (110).

11. The power amplifier assembly according to any one of claims 1-10, characterized in that, The housing (110) and / or the heat sink (130) are provided with a first fixing part (118), and the heat sink fan (140) is provided with a second fixing part (142). The first fixing part (118) and the second fixing part (142) are connected.

12. A radio frequency defrosting device, comprising a housing assembly (200) and a power amplifier assembly (100) as claimed in any one of claims 1-11, wherein the housing (110) is connected to the housing assembly (200).

13. An electrical appliance, characterized in that, It includes a main body (20) and a radio frequency defrosting device (10) as described in claim 12, wherein the radio frequency defrosting device (10) is mounted on the main body (20).

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