A power amplifier assembly, a radio frequency thawing device and an electrical appliance

Abstract

The application discloses a power amplifier assembly, a radio frequency thawing device and an electrical appliance, and belongs to the technical field of electrical appliances. The power amplifier assembly comprises a shell, a power amplifier and a heat dissipation piece. The shell has a mounting cavity, and the power amplifier is mounted in the mounting cavity. The heat dissipation piece is mounted on the shell and arranged outside the mounting cavity. The heat dissipation piece comprises a first heat dissipation part and a second heat dissipation part. The first heat dissipation part and the second heat dissipation part are arranged along the width direction of the shell. The first heat dissipation part is arranged corresponding to the power amplifier. The heat conduction amount of the first heat dissipation part is greater than that of the second heat dissipation part. Since the heat conduction amount of the first heat dissipation part is greater than that of the second heat dissipation part, and the first heat dissipation part is arranged corresponding to the power amplifier, the first heat dissipation part with a greater heat conduction amount can quickly transfer the heat around the power amplifier, accelerate the heat transfer around the power amplifier, and keep the power amplifier in a suitable temperature, so that the power amplifier can work normally, and the service life of the power amplifier is prolonged.

Description

Technical Field

[0001] This application belongs to the field of electrical equipment technology, and in particular relates to a power amplifier component, a radio frequency defrosting device, and electrical equipment. Background Technology

[0002] Radio frequency (RF) defrosting devices, which utilize RF defrosting technology, are a common application of power amplifier circuits. RF defrosting technology uses electromagnetic waves to penetrate food, enabling the food to thaw evenly and quickly. Therefore, refrigerators equipped with RF defrosting devices are widely popular with consumers.

[0003] Power amplifier circuits operate at high temperatures and require heat dissipation. Current technology typically uses large DC fans to directly blow air onto the power amplifier circuit for forced cooling. However, the shielding enclosure obstructs the convection of heat within the enclosure, causing heat buildup on internal components (such as inductors and circuit boards). This results in excessive heat on the internal power amplifier board and other components, affecting their lifespan. Utility Model Content

[0004] This application aims to at least partially solve the technical problem of poor heat dissipation in power amplifier components. To this end, this application provides a power amplifier component, an RF defrosting device, and an electrical appliance.

[0005] In a first aspect, an embodiment of this application provides a power amplifier component, comprising:

[0006] The housing has a mounting cavity.

[0007] The power amplifier component is installed inside the mounting cavity;

[0008] A heat sink is installed on the housing and disposed outside the mounting cavity. The heat sink includes a first heat sink and a second heat sink. Both the first heat sink and the second heat sink are disposed along the width direction of the housing. The first heat sink is disposed corresponding to the power amplifier component. The heat conduction of the first heat sink is greater than that of the second heat sink.

[0009] During the operation of the power amplifier, the heat generated by the amplifier accumulates around it. A first heat sink is positioned corresponding to the power amplifier. Because the thermal conductivity of the first heat sink is greater than that of the second heat sink, its higher thermal conductivity allows it to quickly transfer the heat around the amplifier, accelerating heat transfer and maintaining the amplifier within a suitable temperature range. This ensures the power amplifier can operate normally and extends its lifespan. This timely heat dissipation also ensures the amplifier maintains the amplification factor of the radio frequency defrosting signal, allowing the electrode plates to radiate sufficient radio frequency defrosting energy, thus improving the defrosting effect to a certain extent.

[0010] In an optional embodiment of this application, the power amplifier includes a main control board and a power amplifier board, the power amplifier board and the main control board are arranged side by side along the width direction of the housing, and the first heat dissipation part is provided corresponding to the main control board and the power amplifier board.

[0011] In an optional embodiment of this application, the second heat dissipation part includes a plurality of heat dissipation fins, which are respectively disposed on both sides of the first heat dissipation part along the height direction of the housing.

[0012] In an optional embodiment of this application, the power amplifier assembly further includes a cooling fan, which is disposed corresponding to the power amplifier board, and the first heat dissipation part is disposed between the housing and the cooling fan.

[0013] In an optional embodiment of this application, the second heat dissipation part includes a plurality of heat sinks, which are mounted on the housing. Two adjacent heat sinks form a mounting groove, and the first heat dissipation part is disposed in the mounting groove.

[0014] In an optional embodiment of this application, the two heat sinks forming the mounting groove are attached to the first heat dissipation portion.

[0015] In an optional embodiment of this application, a plurality of heat sinks are arranged along the width direction of the housing, and a heat dissipation channel is formed between two adjacent heat sinks.

[0016] In an optional embodiment of this application, the width of the first heat dissipation portion is greater than the width of the heat sink along the height direction of the housing.

[0017] In an optional embodiment of this application, the thermal conductivity of the first heat dissipation part is greater than that of the second heat dissipation part.

[0018] In an optional embodiment of this application, at least a portion of the first heat dissipation portion is attached to the housing.

[0019] Secondly, embodiments of this application provide a radio frequency defrosting device, including a housing assembly and the power amplifier assembly described in the first aspect, wherein the power amplifier assembly is installed on the housing assembly.

[0020] The beneficial effects of the radio frequency defrosting device provided in the second aspect are the same as those of the power amplifier component provided in the first aspect, and will not be repeated here.

[0021] Thirdly, embodiments of this application provide an electrical device, which includes a main body and the radio frequency defrosting device described in the second aspect, wherein the radio frequency defrosting device is installed on the main body.

[0022] The beneficial effects of the electrical equipment provided in the third aspect are the same as those of the radio frequency defrosting device provided in the second aspect, and will not be repeated here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the power amplifier component provided in an embodiment of this application is shown.

[0025] Figure 2 An exploded view from a first perspective of the power amplifier assembly provided in an embodiment of this application is shown.

[0026] Figure 3 An exploded view from a second perspective of the power amplifier assembly provided in an embodiment of this application is shown.

[0027] Figure 4 This shows a structural schematic diagram of the power amplifier assembly from another perspective.

[0028] Figure 5 A schematic diagram of the structure of the radio frequency defrosting device provided in an embodiment of this application is shown.

[0029] Figure 6 A schematic diagram of the structure of the electrical equipment provided in the embodiments of this application is shown.

[0030] Reference numerals: 100-Amplifier assembly, 110-Housing, 112-Mounting cavity, 113-Box body, 114-Box cover, 118-First fixing part, 120-Amplifier component, 122-Amplifier board, 124-Main control board;

[0031] 130 - Heat sink, 134 - First heat sink, 136 - Second heat sink, 1362 - Heat sink fin, 1366 - Heat dissipation channel; 138 - Mounting slot;

[0032] 140-Cooling fan, 142-Second fixing part, 150-Fixing component, 10-RF defrosting device, 200-Box assembly, 1-Electrical equipment, 20-Main body, X-Width direction, Y-Thickness direction, Z-Height direction. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be noted that all directional indications in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0035] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0037] A power amplifier circuit (also known as a power amplifier, power amplifier board, power amplifier module, etc.) is an amplifier circuit designed to output a large amount of power. Power amplifier circuits are usually used as the output stage of a multi-stage amplifier circuit, and the output stage is required to drive a certain load.

[0038] Power amplifier circuits are used in many electronic devices, such as driving instruments to deflect pointers, driving speakers to produce sound, and driving electrodes to transmit radio frequency signals. When installing a power amplifier circuit, a shielding enclosure is used to prevent electromagnetic interference to other electronic components.

[0039] Radio frequency (RF) defrosting devices, which utilize RF defrosting technology, are a common application of power amplifier circuits. RF defrosting technology uses electromagnetic waves to penetrate food, enabling the food to thaw evenly and quickly. Therefore, refrigerators equipped with RF defrosting devices are widely popular with consumers.

[0040] Power amplifier circuits operate at high temperatures and require heat dissipation. Existing technologies typically use large DC fans to directly blow air onto the power amplifier circuit for forced cooling. However, the shielding enclosure obstructs heat convection within the enclosure, causing heat buildup on internal components (such as inductors and circuit boards). This results in excessive heat on the internal power amplifier board and other components, affecting their lifespan. The power amplifier assembly, RF defrosting device, and electrical equipment provided in this application address these issues. These components effectively dissipate heat from the power amplifier board and other internal components, reducing heat loss and extending the power amplifier assembly's lifespan.

[0041] This application is described below with reference to the accompanying drawings and specific embodiments:

[0042] Figure 1 This paper shows a schematic diagram of the structure of the power amplifier assembly 100 provided in an embodiment of this application. Figure 2 An exploded view from a first perspective of the power amplifier assembly 100 provided in an embodiment of this application is shown. Figure 3 An exploded view of the power amplifier assembly 100 provided in an embodiment of this application is shown, from a second perspective. Figure 1 , Figure 2 and Figure 3 As shown, this application embodiment provides a power amplifier component 100. The power amplifier component 100 provided in this application embodiment can be applied to the radio frequency defrosting device 10. When the power amplifier component 100 is applied to the radio frequency defrosting device 10, the power amplifier component 100 can be connected to the electrode plate, so that the electrode plate can radiate radio frequency defrosting energy to the item to be defrosted, thereby defrosting the item to be defrosted.

[0043] The power amplifier assembly 100 is prone to generating heat during operation. If the heat is not dissipated in time, it will affect the service life of the components of the power amplifier assembly 100. The power amplifier assembly 100 provided in this application embodiment can improve the heat dissipation speed and can quickly dissipate the heat inside the housing 110 to the outside of the housing 110, so that the power amplifier 120 can be kept within a suitable temperature, ensuring that the power amplifier 120 can work normally, thereby improving the service life of the power amplifier 120.

[0044] In this embodiment, the power amplifier assembly 100 includes: a housing 110, a power amplifier component 120, and a heat sink 130. The housing 110 has a mounting cavity 112, and the power amplifier component 120 is installed in the mounting cavity 112. The heat sink 130 is installed on the housing 110 and disposed outside the mounting cavity 112. The heat sink 130 includes a first heat sink 134 and a second heat sink 136. Both the first heat sink 134 and the second heat sink 136 are disposed along the width direction X of the housing 110. The first heat sink 134 is disposed corresponding to the power amplifier component 120, and the heat conduction of the first heat sink 134 is greater than that of the second heat sink 136.

[0045] Among them, the housing 110 is the basic component of the entire power amplifier assembly 100. The housing 110 can provide a base for the installation of components such as the power amplifier 120 and the heat sink 130. The power amplifier 120 is located inside the housing 110. The housing 110 can protect the power amplifier 120 and reduce the impact of dust and other impurities on the power amplifier 120.

[0046] The power amplifier 120 amplifies the radio frequency (RF) signal, enabling it to output with greater energy. This allows the electrode plates to radiate RF defrosting energy to defrost the items. During operation, the power amplifier 120 generates heat due to the amplification of the RF signal. Failure to dissipate this heat promptly can shorten its lifespan. A heat sink 130 is mounted on the housing 110. Heat generated inside the housing 110 radiates to the housing, and the heat sink 130 dissipates this radiated heat, preventing heat buildup and maintaining the power amplifier 120 within a suitable temperature range. This ensures proper operation and extends the lifespan of the power amplifier 120. This timely heat dissipation also ensures the amplification of the RF defrosting signal, allowing the electrode plates to radiate sufficient RF defrosting energy and improving the defrosting effect.

[0047] The first heat dissipation part 134 and the power amplifier 120 are respectively arranged to correspond to each other. This means that along the thickness direction Y of the housing 110, the projection of the first heat dissipation part 134 on the housing 110 and the projection of the power amplifier 120 on the housing 110 are at least partially overlapped. That is, the first heat dissipation part 134 and the power amplifier 120 are arranged at the same position on the housing 110.

[0048] During the operation of the power amplifier 120, the heat generated by the power amplifier 120 accumulates around it. A first heat sink 134 is positioned corresponding to the power amplifier 120. Since the heat conduction of the first heat sink 134 is greater than that of the second heat sink 136, its higher heat conduction allows it to quickly dissipate the heat around the power amplifier 120. This accelerates heat transfer, keeping the power amplifier 120 within a suitable temperature range, ensuring its normal operation, and thus extending its lifespan. Timely heat dissipation also ensures that the power amplifier 120 maintains the amplification factor of the radio frequency defrosting signal, allowing the electrode plate to radiate sufficient radio frequency defrosting energy, thereby improving the defrosting effect to a certain extent.

[0049] Since the heat sink 130 is mounted on the housing 110, the heat radiated to the housing 110 can be directly transferred to the heat sink 130, which reduces the thermal resistance between the housing 110 and the heat sink 130. This allows the heat to be quickly transferred to the heat sink 130 and dissipated through it. This arrangement improves the heat dissipation speed and quickly dissipates the heat inside the housing 110 to the outside of the housing 110, keeping the power amplifier 120 within a suitable temperature range, ensuring that the power amplifier 120 can work normally, and thus extending the service life of the power amplifier 120.

[0050] In some embodiments, the housing 110 includes a box body 113 and a box cover 114. A base plate and a box cover 114 are connected to form a mounting cavity 112. A heat sink 130 is disposed on the side of the box body 113 away from the box cover 114. The heat sink 130 is disposed on the box body 113 and can be separately formed from or integrally formed with the box body 113. In both the box body 113 and the box cover 114, the power amplifier 120 is disposed close to the box body 113, making the distance between the power amplifier 120 and the box body 113 relatively small. By placing the heat sink 130 on the box body 113, the distance between the heat sink 130 and the power amplifier 120 can be minimized, thereby accelerating heat conduction and improving heat dissipation speed.

[0051] In some embodiments, the power amplifier 120 includes a main control board 124 and a power amplifier board 122, which are arranged side by side along the width direction X of the housing 110, and a first heat dissipation part 134 is provided corresponding to the main control board 124 and the power amplifier board 122.

[0052] The power amplifier board 122 is equipped with a power amplifier circuit, and the main control board 124 is electrically connected to the power amplifier board 122. During the operation of the entire power amplifier assembly 100, the power amplifier board 122 and the main control board 124 are the main components that generate heat, that is, the area around the power amplifier board 122 and the main control board 124 is the core heat generation area. Since the power amplifier board 122 and the main control board 124 are arranged side by side along the width direction X of the housing 110, and the first heat dissipation part 134 is also arranged along the width direction X of the housing 110, the first heat dissipation part 134 can be arranged to correspond to the main control board 124 and the power amplifier board 122. The first heat dissipation part 134 can be arranged to correspond to the core heat-generating area of ​​the power amplifier component 120, so that the first heat dissipation part 134 with a large heat conduction can quickly conduct heat around the power amplifier board 122 and the main control board 124, accelerate the heat dissipation around the power amplifier component 120, and avoid heat accumulation inside the housing 110 as much as possible. This allows the power amplifier component 120 to be kept within a suitable temperature range, ensuring that the power amplifier component 120 can work normally, thereby improving the service life of the power amplifier component 120.

[0053] In some embodiments, the second heat dissipation part 136 includes a plurality of heat dissipation fins 1362, which are mounted on the housing 110 and disposed on both sides of the first heat dissipation part 134 along the height direction Z of the housing 110.

[0054] For ease of description, the housing 110 is defined to have a width direction X, a thickness direction Y, and a height direction Z. The width direction X is the direction of the longest side of the housing 110, the height direction Z is the vertical direction of the power amplifier assembly 100 in its operating state, and the thickness direction Y is the direction from the power amplifier assembly 120 to the heat sink 130. The width direction X, thickness direction Y, and height direction Z are approximately perpendicular to each other.

[0055] There are multiple heat sinks 1362, which are arranged along the width direction X of the housing 110. The multiple heat sinks 1362 are respectively arranged on both sides of the first heat dissipation part 134, that is, the multiple heat sinks 1362 are respectively arranged above and below the first heat dissipation part 134. The multiple heat sinks 1362 can be arranged around the first heat dissipation part 134, so that the multiple heat sinks 1362 can assist the first heat dissipation part 134 in dissipating heat and improve the heat dissipation effect of the entire heat sink 130.

[0056] Figure 4 A structural schematic diagram of the power amplifier assembly 100 from another perspective is shown, such as... Figure 4 As shown, in some embodiments, a plurality of heat sinks 1362 are arranged along the width direction X of the housing 110, and a heat dissipation channel 1366 is formed between two adjacent heat sinks 1362.

[0057] Multiple heat sinks 1362 are spaced apart on the housing 110, forming a heat dissipation channel 1366 between two adjacent heat sinks 1362. When gas passes through the heat dissipation channel 1366, it can carry away the heat on the heat sinks 1362, which can improve the heat dissipation speed to a certain extent.

[0058] The extension direction of multiple heat sinks 1362 can be the same, so that the direction of the multiple heat dissipation channels 1366 formed is also the same, thereby making the airflow of the multiple heat dissipation channels 1366 approximately the same, and making the heat dissipation of heat sinks 1362 located in different heat dissipation channels 1366 approximately the same, thereby enabling the entire heat sink 130 to dissipate heat evenly within the housing 110, minimizing the situation of excessive local heat in the power amplifier 120 due to uneven heat dissipation.

[0059] The heat sink 1362 can be arranged along the width direction X of the housing 110, so that the heat dissipation channel 1366 is as long as possible, which can increase the residence time of the gas in the heat dissipation channel 1366, thereby extending the heat exchange time between the gas and the heat sink 1362, so that the gas can carry away more heat from the heat sink 130, thereby improving the heat dissipation effect.

[0060] Since the heat sink 1362 is arranged along the width direction X of the housing 110, the width of the heat dissipation channel 1366 refers to the width along the height direction Z of the housing 110. If the width of the heat dissipation channel 1366 is too narrow, the heat from the heat sink 1362 on both sides of the heat dissipation channel 1366 cannot be dissipated in time, and the gas cannot carry away the heat from the heat sink 1362 in time. If the width of the heat dissipation channel 1366 is too wide, the gas volume will be too large, and the gas utilization rate will be low. Furthermore, since the height direction Z dimension of the housing 110 is fixed, a wider heat dissipation channel 1366 will reduce the number of heat sinks 1362, which will also lead to heat accumulation and hinder heat dissipation. The width of the heat dissipation channel 1366 (the distance between two adjacent heat sinks 1362) needs to be moderate, neither too large nor too small, and can be set according to the overall height dimension of the housing 110.

[0061] Specifically, in some embodiments, the spacing between two adjacent heat sinks 1362 is 8mm to 12mm. The spacing between two adjacent heat sinks 1362 is the width of the heat dissipation channel 1366, which is 8mm to 12mm wide. This layout ensures that the number of heat sinks 1362 is moderate and that sufficient airflow is provided to remove heat from the heat sinks 1362 in a timely manner, thereby maximizing the heat dissipation efficiency of the heat sink 130.

[0062] In some embodiments, the plurality of heat sinks 1362 are integrally formed with the housing 110. That is, the housing 110 and the heat sinks 1362 are an integral structure, which can reduce the assembly process of the heat sink 130 and the housing 110, save the assembly time of the heat sink 130 and the housing 110, and improve the assembly efficiency of the heat sink 130 and the housing 110.

[0063] Since the heat sink 1362 and the housing 110 are integrally formed, the heat sink 1362 is directly connected to the housing 110, so that the heat radiated from the inside of the mounting cavity 112 to the housing 110 can be quickly transferred to the heat sink 130. The heat sink 130 dissipates heat, which can also improve the heat dissipation effect to a certain extent.

[0064] In some embodiments, the housing 110 and the heat sink 1362 may be supported by a metal material with a high thermal conductivity. For example, the housing 110 and the heat sink 1362 may be made of at least one of aluminum, copper, and aluminum alloy.

[0065] Specifically, in some embodiments, the housing 110 and the heat sink 1362 may both be made of aluminum or aluminum alloy, or the housing 110 and part of the heat sink 1362 may be made of aluminum or aluminum alloy, and part of the heat sink 1362 may be made of copper. The specific materials are not limited.

[0066] In some embodiments, two adjacent heat sinks 1362 form a mounting groove 138, and a first heat dissipation part 134 is disposed in the mounting groove 138. The first heat dissipation part 134 is disposed in the mounting groove 138, so that the first heat dissipation part 134 can fit both the housing 110 and the heat sink 1362. This arrangement can improve the heat dissipation efficiency of the entire heat sink 130.

[0067] In some embodiments, the two heat sinks 1362 forming the mounting groove 138 are attached to the first heat dissipation part 134. Since the heat conduction of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136, the two heat sinks 1362 adjacent to the first heat dissipation part 134 are attached to the first heat dissipation part 134, so that the heat of the heat sinks 1362 can be transferred to the first heat dissipation part 134. This can quickly transfer the heat around the power amplifier board 122 and the main control board 124, accelerate the heat transfer around the power amplifier board 122 and the main control board 124, and minimize the accumulation of heat inside the housing 110. This allows the power amplifier component 120 to be kept within a suitable temperature range, ensuring that the power amplifier component 120 can work normally, thereby improving the service life of the power amplifier component 120.

[0068] In some embodiments, along the height direction Z of the housing 110, the width of the first heat dissipation portion 134 is greater than the width of the heat sink 1362. This allows the first heat dissipation portion 134 to cover as much of the core heat-generating area of ​​the power amplifier board 122 and the main control board 124 as possible, thereby accelerating and minimizing heat accumulation inside the housing 110. This ensures that the power amplifier component 120 can be maintained within a suitable temperature range, guaranteeing its normal operation and thus extending its service life.

[0069] In some embodiments, the power amplifier assembly 100 further includes a cooling fan 140, which is disposed corresponding to the power amplifier board 122, and the first heat dissipation part 134 is disposed between the housing 110 and the cooling fan 140.

[0070] In the application of the power amplifier component 100 in the radio frequency defrosting device 10, since the radio frequency defrosting device 10 is generally small in size, the power amplifier component 100 is also set to be small in size. If only the natural flow of gas is relied upon, the gas flow rate through the first heat dissipation part 134 and the second heat dissipation part 136 will be relatively small. In order to increase the gas flow rate through the first heat dissipation part 134 and the second heat dissipation part 136, a cooling fan 140 can be provided. The cooling fan 140 increases the gas flow rate through the first heat dissipation part 134 and the second heat dissipation part 136, thereby improving the heat dissipation effect.

[0071] The cooling fan 140 is positioned corresponding to the power amplifier board 122 such that, along the thickness direction Y of the housing 110, the projection of the cooling fan 140 on the housing 110 at least partially overlaps with the projection of the heat sink 130 on the housing 110. Since the power amplifier circuit is integrated on the power amplifier board 122, the power amplifier board 122 generates a significant amount of heat during operation. The corresponding placement of the cooling fan 140 on the power amplifier board 122 increases the airflow at the corresponding location on the power amplifier board 122, allowing more air to pass through the first heat dissipation section 134, thus carrying away more heat and improving the heat dissipation effect of the power amplifier board 122.

[0072] The cooling fan 140 is located outside the mounting cavity 112. Compared with placing the cooling fan 140 inside the mounting cavity 112, it can reduce the space inside the mounting cavity 112 to a certain extent, making the internal space of the housing 110 smaller. The heat generated by the power amplifier board 122, the main control board 124, etc. can be quickly transferred to the housing 110 and dissipated through the heat sink 130 on the housing 110. It can also improve the heat dissipation effect of the entire power amplifier assembly 100 to a certain extent.

[0073] Both the heat sink 130 and the cooling fan 140 are located outside the mounting cavity 112 and are arranged in the thickness direction Y of the housing 110. The cooling fan 140 overlaps with the heat sink 130, allowing a large amount of gas to directly converge on the heat sink 130, thus increasing the amount of gas that exchanges heat with the heat sink 130. Through the combined action of the heat sink 130 and the cooling fan 140, the heat dissipation effect is improved.

[0074] In some embodiments, the cooling fan 140 is mounted on the heat sink 130 and / or the housing 110. Since the cooling fan 140 is also located outside the mounting cavity 112, the closer the cooling fan 140 is to the heat sink 130, the more gas will accumulate in the heat dissipation channel 1366. Mounting the cooling fan 140 on the heat sink 130 and / or the cooling fan 140 allows the cooling fan 140 to be as close as possible to the heat dissipation channel 1366, enabling more gas to flow into the heat dissipation channel 1366 and increasing the gas flow rate in the heat dissipation channel 1366.

[0075] It should be noted that the cooling fan 140 being installed on the heat sink 130 and / or the housing 110 means that the cooling fan 140 can be installed only on the heat sink 130, that is, the cooling fan 140 is connected to the heat sink 130; or the cooling fan 140 can be installed only on the housing 110, that is, the cooling fan 140 is only connected to the housing 110; or the cooling fan 140 can be installed on both the heat sink 130 and the housing 110, that is, the cooling fan 140 is connected to both the housing 110 and the heat sink 130.

[0076] Since the heat sink 130 is mounted on the housing 110, and the cooling fan 140 is also mounted on the housing 110, it can be said that the cooling fan 140 is close to the heat sink 130. That is, the cooling fan 140 is close to the heat dissipation channel 1366, which allows more gas to flow to the heat dissipation channel 1366 and increases the gas flow rate in the heat dissipation channel 1366.

[0077] Regarding the specific detachable installation method, a first fixing part 118 can be provided on the housing 110 and / or the heat sink 130, and a second fixing part 142 can be provided on the cooling fan 140. The first fixing part 118 and the second fixing part 142 can be detachably connected. The first fixing part 118 and the second fixing part 142 can be snapped together, or a first fixing hole can be provided on the first fixing part 118, and a second fixing hole can be provided on the second fixing part 142. A fixing member 150 can be passed through the first fixing hole and the second fixing hole to fix the cooling fan 140 to the housing 110 and / or the first heat sink 134.

[0078] In some embodiments, the height of the first heat dissipation part 134 protruding from the housing 110 is less than the height of the second heat dissipation part 136 protruding from the housing 110. Specifically, along the thickness direction Y of the housing 110, the width of the first heat dissipation part 134 is less than the width of the second heat dissipation part 136. The space formed by the height of the first heat dissipation part 134 protruding from the housing 110 being less than the height of the second heat dissipation part 136 protruding from the housing 110 facilitates the placement of the cooling fan 140. This makes the appearance of the power amplifier assembly 100 look neat and aesthetically pleasing, and also avoids the cooling fan 140 being easily scratched due to its protruding design.

[0079] In some embodiments, the thermal conductivity of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136. Since the first heat dissipation part 134 is provided for both the power amplifier board 122 and the main control board 124, the power amplifier board 122 generates a significant amount of heat during the operation of the entire power amplifier assembly 100. The greater thermal conductivity of the first heat dissipation part 134 compared to the second heat dissipation part 136, under the same gas flow rate, results in greater heat conduction of the first heat dissipation part 134 than the second heat dissipation part 136. This allows the heat generated by the power amplifier board 122 to be transferred to the outside of the housing 110 as quickly as possible, minimizing heat accumulation on the power amplifier board 122 and ensuring that the power amplifier board 122 maintains a suitable operating temperature. This reduces the likelihood of the power amplifier board 122 failing to operate normally due to excessively high temperatures.

[0080] In some embodiments, the first heat dissipation part 134 is made of copper, and the second heat dissipation part 136 is made of aluminum alloy. Copper has a high thermal conductivity, which allows the heat generated by the power amplifier board 122 and the main control board 124 to be quickly conducted. The third heat dissipation part is made of aluminum alloy, which also has a certain thermal conductivity. The second heat dissipation part 136 is set corresponding to the main control board 124. The main control board 124 also generates heat, but not as much as the power amplifier board 122. In addition to ensuring a certain heat conduction speed, the aluminum alloy material has a lower manufacturing cost than copper. The use of aluminum alloy material for the second heat dissipation part 136 can reduce the manufacturing cost of the entire power amplifier assembly 100 to a certain extent.

[0081] Of course, in other embodiments, when the thermal conductivity of the first heat dissipation part 134 and the second heat dissipation part 136 is the same, the gas flow rate of the first heat dissipation part 134 can be increased, so that the gas flow rate of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136, and the heat conduction of the first heat dissipation part 134 is also greater than that of the second heat dissipation part 136.

[0082] In some embodiments, at least a portion of the first heat dissipation portion 134 is in contact with the housing 110. The first heat dissipation portion 134 is elongated and is disposed along the width direction X of the housing 110. Since the width direction X of the housing 110 is the direction in which the housing 110 is the longest, this arrangement of the first heat dissipation portion 134 can increase the contact area between the first heat dissipation portion 134 and the housing 110, thereby improving the heat transfer speed and allowing the heat inside the housing 110 to be quickly conducted to the first heat dissipation portion 134 for heat dissipation.

[0083] The first heat dissipation part 134 can be attached to the housing 110 in a manner that is entirely attached to the housing 110, or in a manner that is partially attached to the housing 110 while the other part is not attached. The specific method is not limited. The attachment of the first heat dissipation part 134 to the housing 110 can reduce the thermal resistance between the housing 110 and the first heat dissipation part 134, so that the heat inside the housing 110 can be quickly transferred to the first heat dissipation part 134 and dissipated through the first heat dissipation part 134.

[0084] In summary, the power amplifier assembly 100 provided in this application embodiment allows heat generated by the power amplifier 120 to accumulate around it during operation. A first heat dissipation part 134 is positioned corresponding to the power amplifier 120. Since the heat conduction of the first heat dissipation part 134 is greater than that of the second heat dissipation part 136, its higher heat conduction allows for rapid heat transfer around the power amplifier 120, ensuring the power amplifier 120 remains within a suitable temperature range and operates normally, thereby extending its lifespan. This timely heat dissipation also ensures the amplification factor of the radio frequency defrosting signal, allowing the electrode plate to radiate sufficient radio frequency defrosting energy, thus improving the defrosting effect to a certain extent.

[0085] Figure 5 A schematic diagram of the structure of the radio frequency defrosting device 10 provided in an embodiment of this application is shown, as follows: Figure 5 As shown, based on the same inventive concept, this application embodiment also provides a radio frequency defrosting device 10, including a housing assembly 200 and the aforementioned power amplifier assembly 100, wherein the power amplifier assembly 100 is mounted on the housing assembly 200.

[0086] Figure 6 A schematic diagram of the structure of the electrical device 1 provided in an embodiment of this application is shown, as follows: Figure 6As shown, based on the same inventive concept, this application also provides an electrical device 1, characterized in that the electrical device 1 includes a main body 20 and the aforementioned radio frequency defrosting device 10, the radio frequency defrosting device 10 being installed on the main body 20. The electrical device 1 can be a refrigeration device such as a refrigerator or freezer.

[0087] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0088] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0089] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A power amplifier component, characterized in that, include: The housing (110) has a mounting cavity (112); A power amplifier component (120) is installed inside the mounting cavity (112); A heat sink (130) is installed on the housing (110) and disposed outside the mounting cavity (112). The heat sink (130) includes a first heat sink (134) and a second heat sink (136). The first heat sink (134) and the second heat sink (136) are both disposed along the width direction (X) of the housing (110). The first heat sink (134) is disposed corresponding to the power amplifier (120). The heat conduction of the first heat sink (134) is greater than that of the second heat sink (136).

2. The power amplifier component according to claim 1, characterized in that, The power amplifier component (120) includes a main control board (124) and a power amplifier board (122). The power amplifier board (122) and the main control board (124) are arranged side by side along the width direction (X) of the housing (110). The first heat dissipation part (134) is provided corresponding to the main control board (124) and the power amplifier board (122).

3. The power amplifier component according to claim 2, characterized in that, The second heat dissipation part (136) includes a plurality of heat dissipation fins (1362), which are respectively disposed on both sides of the first heat dissipation part (134) along the height direction (Z) of the housing (110).

4. The power amplifier component according to claim 2, characterized in that, The power amplifier assembly (100) further includes a cooling fan (140), which is disposed corresponding to the power amplifier board (122), and the first heat dissipation part (134) is disposed between the housing (110) and the cooling fan (140).

5. The power amplifier component according to claim 1, characterized in that, The second heat dissipation part (136) includes a plurality of heat dissipation fins (1362), which are mounted on the housing (110). Two adjacent heat dissipation fins (1362) form a mounting groove (138), and the first heat dissipation part (134) is disposed in the mounting groove (138).

6. The power amplifier component according to claim 5, characterized in that, The two heat sinks (1362) forming the mounting groove (138) are attached to the first heat sink (134).

7. The power amplifier component according to claim 5, characterized in that, Multiple heat sinks (1362) are arranged along the width direction (X) of the housing (110), and a heat dissipation channel (1366) is formed between two adjacent heat sinks (1362).

8. The power amplifier component according to claim 5, characterized in that, Along the height direction (Z) of the housing (110), the width of the first heat dissipation part (134) is greater than the width of the heat sink (1362).

9. The power amplifier component according to any one of claims 1-8, characterized in that, The thermal conductivity of the first heat dissipation part (134) is greater than that of the second heat dissipation part (136).

10. The power amplifier component according to any one of claims 1-8, characterized in that, At least a portion of the first heat dissipation part (134) is in contact with the housing (110).

11. A radio frequency defrosting device, characterized in that, It includes a housing assembly (200) and a power amplifier assembly (100) as described in any one of claims 1-10, the power amplifier assembly (100) being mounted on the housing assembly (200).

12. An electrical appliance, characterized in that, The electrical device (1) includes a main body (20) and a radio frequency defrosting device (10) as described in claim 11, wherein the radio frequency defrosting device (10) is mounted on the main body (20).

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