Semiconductor waste gas treatment power supply water cooling heat dissipation mechanism
By designing a loop-shaped flow channel within the main body of a water-cooled heat sink in a semiconductor power supply and fabricating it using cold drawing technology, the problems of low efficiency, large size, and high cost of traditional heat dissipation methods have been solved, achieving the effects of high-efficiency heat dissipation, temperature reduction, and cost reduction.
Patent Information
- Application Number
- CN202521683530.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-08
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-08-08
AI Technical Summary
Traditional heat dissipation methods are difficult to effectively dissipate the heat generated by semiconductor power supplies, resulting in high temperatures that affect component lifespan and equipment failure. Furthermore, existing heat dissipation structures are large in size, expensive, and inefficient, failing to meet the demands of high loads and miniaturization.
Design a water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply. The heat sink body has a loop flow channel inside, which can efficiently circulate cooling water for heat dissipation. It is also made using cold drawing technology to reduce cost and volume.
It achieves efficient heat dissipation, reduces power supply temperature, extends component life, reduces costs, reduces size and power loss, and meets the needs of miniaturization and high efficiency.
Smart Images
Figure CN224684566U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor plasma exhaust gas treatment technology, and more specifically, to a water-cooled heat dissipation mechanism for semiconductor exhaust gas treatment power supply. Background Technology
[0002] In the field of semiconductor power supplies, with the continuous development of technology and the increasing complexity of application scenarios, power supplies generate a large amount of heat during operation. Traditional heat dissipation methods are insufficient to effectively dissipate the heat generated during operation, leading to excessively high operating temperatures, typically reaching around 70°C. Such high operating temperatures severely impact the lifespan of electrical components and increase the risk of equipment failure.
[0003] Current heat dissipation structures have many limitations in design. On the one hand, there are many air-cooled power supplies on the market, which are large in size and have a small heat dissipation coefficient, and cannot meet the heat dissipation requirements of semiconductor power supplies under high load operation. When the power is above 15KW, the air-cooled size is not suitable for the semiconductor industry, which requires small size and high efficiency. On the other hand, many heat dissipation structures are relatively complex, have high manufacturing costs, and perform poorly in terms of size and power loss, and cannot well meet the requirements of modern electronic devices for miniaturization and high efficiency.
[0004] The above problems urgently need to be solved, so this utility model provides a water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide a power supply for semiconductor plasma waste gas treatment with a water-cooled heat dissipation mechanism that has high heat dissipation efficiency.
[0006] The technical solution adopted by this utility model to solve its technical problem is: a water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply, including a heat sink, the heat sink including a main body, a first sealing plate encapsulated on one side of the main body and a second sealing plate encapsulated on the other side of the main body, an inlet and an outlet are provided on one side of the main body, and a loop flow channel connecting the inlet and the outlet is provided inside the main body.
[0007] In this embodiment, it is further configured such that: the main body has a through hole inside, and the two ends of the through hole have through grooves, and the through hole and the through grooves form a loop-shaped flow channel in the main body.
[0008] In this embodiment, it is further configured such that: a first step portion is provided on one side of the main body, and a second step portion is provided on the other side of the main body, the first sealing plate is fitted on the first step portion, and the second sealing plate is fitted on the second step portion.
[0009] In this embodiment, it is further configured that: the first sealing plate is provided with a first sealing plate fixing hole, a first fitting groove and a third step portion, and the second sealing plate is provided with a second sealing plate fixing hole, a second fitting groove and a fourth step portion.
[0010] In this embodiment, it is further configured such that the third step portion is fitted into the through groove, and the fourth step portion is fitted into the through groove.
[0011] In this embodiment, it is further configured such that: a main body fixing hole is also provided on the main body, a screw passes through the first sealing plate fixing hole and the main body fixing hole to fix the first sealing plate on the main body, and a screw passes through the second sealing plate fixing hole and the main body fixing hole to fix the second sealing plate on the main body.
[0012] In this embodiment, the heat dissipation mechanism is further configured to include electrical components fixed on the heat sink.
[0013] In this embodiment, it is further configured that: a fast recovery resistor, a fast recovery resistor, and a copper busbar are fixed on one surface of the heat sink, and the fast recovery resistors are connected to each other through the copper busbar.
[0014] In this embodiment, it is further configured that a capacitor, a transistor, a rectifier bridge, and a temperature relay are fixed on the other surface of the heat sink.
[0015] In this embodiment, the capacitor is further configured to be 25uF, the transistor is an IGBT200, and the rectifier bridge has a maximum operating current of 200A.
[0016] The beneficial effects of this utility model are as follows: The heat dissipation mechanism of this utility model has through holes and through slots in the heat sink body. The through holes and through slots form a loop-shaped passage in the body, and the cooling water circulates efficiently in the loop-shaped passage to dissipate heat, which can quickly remove the heat generated during the operation of the power supply. Attached Figure Description
[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0018] In the picture: Figure 1 This is a schematic diagram of the structure of a water-cooled heat dissipation mechanism for a semiconductor waste gas treatment power supply according to the present invention. Figure 2 for Figure 1 Exploded view of the radiator; Figure 3 for Figure 2 An exploded view of the radiator from another angle; Figure 4 for Figure 2 Schematic diagram of the internal structure of the radiator body; Figure 5 for Figure 1 A front view of a water-cooled heat dissipation mechanism for a semiconductor waste gas treatment power supply; Figure 6 for Figure 1 Rear view of a water-cooled heat dissipation mechanism for a semiconductor waste gas treatment power supply.
[0019] 100. Heat dissipation mechanism; 1. Radiator; 11. Main body; 111. Inlet; 112. Outlet; 113. Through hole; 114. Through groove; 115. First step; 116. Second step; 117. Main body fixing hole; 12. First sealing plate; 121. First sealing plate fixing hole; 122. First fitting groove; 123. Third step; 13. Second sealing plate; 131. Second sealing plate fixing hole; 132. Second fitting groove; 133. Fourth step; 2. Electrical components; 21. Fast recovery resistor; 22. Fast recovery resistor; 23. Copper busbar; 24. Capacitor; 25. Transistor; 26. Rectifier bridge; 27. Temperature relay. Detailed Implementation
[0020] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the present utility model, and therefore only shows the components relevant to the present utility model. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0021] like Figure 1-6 As shown, this utility model provides a water-cooled heat dissipation mechanism 100 for semiconductor waste gas treatment power supply, including a heat sink 1. The heat sink 1 includes a main body 11, a first sealing plate 12 encapsulated on one side of the main body 11 and a second sealing plate 13 encapsulated on the other side of the main body 11. The main body 11 has an inlet 111 and an outlet 112 on its side, and a loop flow channel connecting the inlet 111 and the outlet 112 is provided inside the main body 11.
[0022] In this embodiment, specifically: the main body 11 is provided with a through hole 113 inside, and through grooves 114 are provided at both ends of the through hole 113. The through hole 113 and the through grooves 114 form a loop-shaped passage in the main body 11. The diameter of the through hole 113 is smaller than the diameter of the through groove 114, and the through groove 114 connects the two through holes 113.
[0023] In this embodiment, specifically: the main body 11 is provided with eight through holes 113, four through slots 114 are provided on one side of the main body 11, and three through slots 114 are provided on the other side of the main body 11.
[0024] In this embodiment, specifically: cooling water enters the through hole 113 through the inlet 111, flows from the through groove 114 to the next layer of through hole 113, and finally exits the main body 11 from the outlet 112.
[0025] In another embodiment, specifically: the inlet 111 and the outlet 112 are respectively located on both sides of the main body 11.
[0026] In this embodiment, specifically: a first step portion 115 is provided on one side of the main body 11, and a second step portion 116 is provided on the other side of the main body 11.
[0027] In this embodiment, specifically: the first sealing plate 12 is fitted onto the first step portion 115, and the second sealing plate 13 is fitted onto the second step portion 116.
[0028] In this embodiment, specifically: the first sealing plate 12 is provided with a first sealing plate fixing hole 121, a first fitting groove 122 and a third step portion 123, and the second sealing plate 13 is provided with a second sealing plate fixing hole 131, a second fitting groove 132 and a fourth step portion 133.
[0029] In this embodiment, specifically: the third step portion 123 is fitted into the through groove 114, and the fourth step portion 133 is fitted into the through groove 114.
[0030] In this embodiment, specifically: the main body 11 is also provided with a main body fixing hole 117, and the screw passes through the first sealing plate fixing hole 121 and the main body fixing hole 117 to fix the first sealing plate 12 to the main body 11, and the screw passes through the second sealing plate fixing hole 131 and the main body fixing hole 117 to fix the second sealing plate 13 to the main body 11.
[0031] In this embodiment, specifically: the heat dissipation mechanism 100 also includes electrical components 2 fixed on the heat sink 1. Fast recovery resistors 21, fast recovery resistors 22 and copper busbars 23 are fixed on one surface of the heat sink 1. The fast recovery resistors 21 are connected to each other through the copper busbars 23. A capacitor 24, a transistor 25, a rectifier bridge 26 and a temperature relay 27 are fixed on the other surface of the heat sink 1.
[0032] In this embodiment, specifically: capacitor 24 is 25uF, transistor 25 is IGBT200, and rectifier bridge 26 has a maximum operating current of 200A.
[0033] In this embodiment, specifically: the heat dissipation mechanism 100 can reduce the power supply operating temperature from 70°C to 25°C of the transistor, thereby extending the service life of the electrical component 2. In this embodiment, specifically: the heat sink 1 is manufactured using cold drawing technology, which is low in cost and has good consistency. It can be cut to the required length to achieve the desired size, which greatly reduces the power supply volume and power loss.
[0034] The beneficial effects of this utility model on the water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply are as follows: 1. By providing a loop-shaped flow channel inside the heat sink 1, efficient heat dissipation is achieved, which can quickly remove the heat generated during the operation of the power supply.
[0035] 2. The heat sink 1 is manufactured using cold drawing technology, which significantly reduces its cost while ensuring product consistency. Good consistency is beneficial for large-scale production and application, ensuring that each heat dissipation mechanism 100 can achieve the expected heat dissipation effect.
[0036] 3. The heat dissipation mechanism 100 can be cut to the required length, which is highly flexible and adaptable, greatly reducing the power supply size and power loss, improving equipment performance while reducing energy consumption.
[0037] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0038] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.
[0039] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the scope of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A water-cooled heat dissipation mechanism for a semiconductor waste gas treatment power supply, characterized in that: The device includes a radiator (1), which includes a main body (11), a first sealing plate (12) encapsulated on one side of the main body (11), and a second sealing plate (13) encapsulated on the other side of the main body (11). The main body (11) has an inlet (111) and an outlet (112) on its side. The main body (11) has a loop-shaped flow channel connecting the inlet (111) and the outlet (112). The main body (11) has a through hole (113) inside, and through grooves (114) are provided at both ends of the through hole (113). The through hole (113) and the through groove (114) form a loop flow channel in the main body (11). The first sealing plate (12) is provided with a first sealing plate fixing hole (121), a first fitting groove (122) and a third step (123). The second sealing plate (13) is provided with a second sealing plate fixing hole (131), a second fitting groove (132) and a fourth step (133). The third step (123) is fitted into the through groove (114) and the fourth step (133) is fitted into the through groove (114).
2. The water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply according to claim 1, characterized in that: The main body (11) has a first step (115) on one side and a second step (116) on the other side. The first sealing plate (12) is fitted onto the first step (115) and the second sealing plate (13) is fitted onto the second step (116).
3. The water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply according to claim 1, characterized in that: The main body (11) is also provided with a main body fixing hole (117). The screw passes through the first sealing plate fixing hole (121) and the main body fixing hole (117) to fix the first sealing plate (12) on the main body (11). The screw passes through the second sealing plate fixing hole (131) and the main body fixing hole (117) to fix the second sealing plate (13) on the main body (11).
4. The water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply according to claim 1, characterized in that: The heat dissipation mechanism (100) also includes electrical components (2) fixed on the radiator (1).
5. The water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply according to claim 4, characterized in that: The heat sink (1) has a fast recovery resistor (21), a fast recovery resistor (22) and a copper busbar (23) fixed on one surface, and the fast recovery resistors (21) are connected to each other through the copper busbar (23).
6. The water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply according to claim 5, characterized in that: A capacitor (24), a transistor (25), a rectifier bridge (26), and a temperature relay (27) are fixed on the other surface of the heat sink (1).
7. The water-cooled heat dissipation mechanism for semiconductor waste gas treatment power supply according to claim 6, characterized in that: The capacitor (24) is 25UF, the transistor (25) is an IGBT200, and the rectifier bridge (26) has a maximum operating current of 200A.