Power conversion device and power supply apparatus

Abstract

The embodiment of the present application provides a power conversion device and a power supply device comprising the power conversion device, and relates to the technical field of power supply. The power conversion device comprises a circuit board, a heat sink, an insulating piece, a plurality of electronic components and one or more heat conductive pieces, one of the board surfaces of the circuit board faces the heat sink; the plurality of electronic components are fixed to one of the board surfaces of the circuit board; and the one or more heat conductive pieces are fixed to the circuit board, and each of the heat conductive pieces is connected with the heat sink through the insulating piece.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to a power conversion device and power supply equipment. Background Technology

[0002] Power conversion devices are a core component of power supply equipment (e.g., charging piles). With the development of power supply equipment (e.g., the development of supercharging and fast charging technologies in charging piles), the power density of power conversion devices is gradually evolving towards higher power levels. Therefore, during the operation of power supply equipment, the power conversion device generates significant internal heat. If efficient heat dissipation cannot be achieved, it will affect the normal operation of both the power conversion device and the power supply equipment.

[0003] In related technologies, heat sinks are used to dissipate heat from the electronic components inside the power converter, thereby controlling the temperature of the power converter. However, the circuit boards inside the power converter are usually far from the heat sink, so the heat sink cannot dissipate heat from the circuit boards. The heat on the circuit boards can only be exchanged with the air inside the power converter through natural heat dissipation, resulting in poor heat dissipation of the circuit boards. The circuit boards remain at a high temperature for a long time, which is not conducive to the overall heat dissipation of the power converter. Utility Model Content

[0004] This application provides a power conversion device and a power supply device including the power conversion device, which can dissipate heat from the circuit board inside the power conversion device, reduce the internal temperature of the power conversion device, and enable the power conversion device to operate stably.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] In a first aspect, this application provides a power conversion device for converting input electrical energy into power and outputting it. The power conversion device includes a circuit board, a heat sink, an insulating component, multiple electronic components, and one or more thermal conductive components. One side of the circuit board faces the heat sink. Multiple electronic components are fixed to one side of the circuit board. One or more thermal conductive components are fixed to the circuit board. Each thermal conductive component is connected to the heat sink through an insulating component.

[0007] During the operation of the power conversion device, multiple electronic components on the circuit board generate significant heat, which is then transferred to a heat sink. The heat sink can be a liquid-cooled or air-cooled heat sink, which helps dissipate heat from the electronic components. Furthermore, during operation, the heat generated by these electronic components also transfers heat to the circuit board, and the heat generated by the metal traces (trace layers) on the circuit board itself also contributes to the high temperature of the circuit board.

[0008] A heat-conducting component is fixed on the circuit board and connected to the heat sink via an insulating component. Heat is transferred from the circuit board to the heat sink through the heat-conducting component and the insulating component, and then the heat sink dissipates heat from the circuit board. In other words, the heat sink not only dissipates heat from multiple electronic components, but also, through the heat-conducting component, dissipates heat from the circuit board itself. This controls the temperature of the circuit board and multiple electronic components, reducing the internal temperature of the power conversion device and enabling stable operation.

[0009] In one embodiment, the power conversion device further includes a frame fixed to the surface of the heat sink facing the circuit board, an insulating component comprising potting compound and filled within the frame, and a portion of each thermally conductive component located within the potting compound and connected to the heat sink via the potting compound.

[0010] Potting compound serves both as insulation and thermal conductivity. By filling the enclosure with potting compound and extending thermally conductive components into it, heat from the circuit board is transferred to the heat sink via the components and the compound. The heat sink then dissipates heat from the circuit board, thus controlling its temperature.

[0011] In one embodiment, at least one of the one or more thermal conductive elements is electrically conductive, and at least two portions of each thermal conductive element are electrically connected to traces on a circuit board. A section of the traces connected between any two adjacent portions of the at least two portions is not electrically connected to any one of the plurality of electronic components.

[0012] The thermally conductive component is capable of conducting electricity and allowing current to flow. For example, the thermally conductive component has two parts (e.g., a first end and a second end) that are electrically connected to traces (trace layers) on the circuit board. The location where the trace connects to the first end is called the first position, and the location where the trace connects to the second end is called the second position. The trace between the first and second positions is connected in parallel with the thermally conductive component, achieving current shunting through the thermally conductive component and reducing trace losses on the circuit board. The section of the trace where current is shunted does not have any electrical connection to any electronic component, ensuring that the thermally conductive component, while shunting current, does not affect the normal operation of any electronic component.

[0013] In one embodiment, at least one of the one or more heat-conducting elements is fixed at both ends to a circuit board, and the portion of each heat-conducting element between its two ends arches toward the heat sink.

[0014] The heat-conducting component resembles an arched structure, or a "U"-shaped structure, and is inverted onto the circuit board, so that both ends (the first end and the second end) of the heat-conducting component are connected to the circuit board. This shape of the heat-conducting component can span a long distance on the circuit board, facilitating the flow of heat through the component.

[0015] In one embodiment, at least one of a plurality of electronic components is disposed in the area enclosed by the at least one thermal conductive component and the circuit board.

[0016] The heat-conducting component spans over at least one electronic component. This means a portion of the heat-conducting component (called the beam portion) is located on the side of the electronic component it spans that faces the heat sink. In other words, the beam portion of the heat-conducting component lies between the electronic component it spans and the heat sink. The beam is connected to the heat sink via an insulator. The longer the beam portion, the more of the heat-conducting component is connected to the heat sink via the insulator, which is more effective in transferring heat from the heat-conducting component to the heat sink. Furthermore, a longer distance across the circuit board by the heat-conducting component can also shunt longer traces on the circuit board, further reducing trace losses.

[0017] In one embodiment, at least two of the multiple electronic components are arranged perpendicular to the thickness direction of the circuit board; at least one of the one or more heat-conducting components is located between two adjacent electronic components.

[0018] Circuit board temperatures often vary; for example, areas where electronic components are concentrated tend to be warmer. In these concentrated areas, at least two electronic components are arranged perpendicular to the thickness of the circuit board. One or more heat-conducting components are placed between adjacent components. After the heat from these components is transferred to the circuit board, it is then transferred through these components to a heat sink, thus dissipating heat from the hotter areas on the circuit board.

[0019] In one embodiment, a plurality of heat-conducting elements are provided, and the arrangement direction of at least two of the plurality of heat-conducting elements is perpendicular to the thickness direction of the circuit board; at least one of the plurality of electronic components is located between two adjacent heat-conducting elements.

[0020] The heat from one or more electronic components located between two adjacent heat-conducting components is transferred to the circuit board, and then transferred to the heat sink through the heat-conducting components on both sides, thus achieving heat dissipation of the circuit board.

[0021] In one embodiment, at least one of the one or more heat-conducting components includes a heat-conducting strip and one or more heat-conducting sheets. The heat-conducting strip is elongated and its length direction is perpendicular to the thickness direction of the circuit board. The one or more heat-conducting sheets are fixed to the side of the heat-conducting strip facing the heat sink. In the length direction of the heat-conducting strip, the size of each heat-conducting sheet is smaller than the size of the heat-conducting strip, and each heat-conducting sheet is connected to the heat sink through an insulating member.

[0022] The heat-conducting strip is relatively long, allowing heat from the area near it on the circuit board to be transferred to it. The heat from the strip is then transferred to the heat-conducting plate, which in turn transfers the heat to the heat sink, achieving heat dissipation over a large area of ​​the circuit board. Furthermore, smaller heat-conducting plates are connected to the heat sink via insulating components, while larger heat-conducting components do not require connection. This design not only effectively dissipates heat over a large area of ​​the circuit board but also reduces the space occupied by the heat-conducting components, for example, minimizing their impact on the internal space of the enclosure.

[0023] In one embodiment, at least two of the multiple electronic components are arranged along the length of the heat-conducting strip, and the at least two electronic components are located on the side of the heat-conducting strip and are arranged adjacent to the heat-conducting strip; in the length direction of the heat-conducting strip, the size of the heat-conducting strip is greater than the distance between the first and last two electronic components.

[0024] By placing multiple electronic components on the side of the heatsink, the heat transferred from these components to the circuit board can be transferred through the same heatsink to the heatsink plate, and then to the heat sink. In this way, the heatsink plate can effectively dissipate heat from the areas containing multiple electronic components, thus reducing the temperature of the circuit board.

[0025] In one embodiment, at least one of the one or more heat-conducting elements is in the form of a sheet, and the thickness direction of the at least one heat-conducting element is perpendicular to the thickness direction of the circuit board; the end of the at least one heat-conducting element facing the circuit board is fixed to the circuit board, and the end of the at least one heat-conducting element away from the circuit board is connected to the heat sink through an insulating member.

[0026] The small size and ease of installation of sheet-shaped thermal conductive elements allow them to be adapted to smaller installation environments. For example, they can be easily installed between two adjacent electronic components. These sheet-shaped thermal conductive elements connect both to the circuit board and, through insulation, to the heat sink, transferring heat from the circuit board to the heat sink and thus dissipating heat from the circuit board.

[0027] In one embodiment, a portion of each of at least one of the heat-conducting elements is located on the side of the circuit board away from the heat sink and is connected to the circuit board, while another portion of each of the at least one heat-conducting elements is located on the side of the circuit board facing the heat sink and is connected to the heat sink through an insulating element.

[0028] By connecting the thermal conductive component to the side of the circuit board facing away from the heat sink (e.g., the bottom side of the circuit board), the mounting position of the thermal conductive component does not occupy the side of the circuit board facing the heat sink (e.g., the top side of the circuit board). This reduces the space occupied by the thermal conductive component on the side of the circuit board facing the heat sink, allowing more electronic components to be mounted on the side of the circuit board facing the heat sink. This brings more electronic components closer to the heat sink, which is beneficial for the heat dissipation of electronic components and further reduces the temperature of the power conversion device.

[0029] In one embodiment, at least one of the multiple electronic components includes a connected device housing and pins, the device housing being located between a circuit board and a heat sink, and the pins being fixed to the circuit board; in the thickness direction of the circuit board, the portion of the heat-conducting element located on the side of the circuit board away from the heat sink is disposed opposite to the device housing.

[0030] When electronic components generate heat, the temperature of the area where the electronic components are located becomes high. For specific electronic components (e.g., those that generate significant heat), a portion of a heat-conducting component is positioned on a different side of the circuit board from the component's housing, with this portion of the heat-conducting component facing the housing. This brings the connection point between the heat-conducting component and the circuit board closer to the area where the electronic components are located. Heat from the electronic components can be transferred sequentially along the thickness of the circuit board to both the circuit board and the heat-conducting component. This allows the heat-conducting component to target specific areas (e.g., localized hot spots) on the circuit board, effectively controlling the circuit board's temperature.

[0031] In one embodiment, the power conversion device further includes a flexible thermal pad, with the portion of the thermally conductive element located on the side of the circuit board away from the heat sink having a thermal pad between it and the circuit board.

[0032] Both the thermal conductive component and the circuit board are rigid structures. If the thermal conductive component is in direct contact with the circuit board surface, dimensional errors in either component or unevenness in the contact surface will create gaps, preventing heat transfer from the circuit board to the thermal conductive component effectively. However, by placing a flexible thermal pad between the thermal conductive component and the circuit board, the pad can deform and adhere to both surfaces. This allows heat from the circuit board to be transferred to the thermal conductive component, improving thermal conductivity and further enhancing the circuit board's heat dissipation efficiency.

[0033] A second aspect of this application provides a power supply device, which includes an equipment cabinet and a plurality of power conversion devices, the plurality of power conversion devices being electrically connected and all located within the equipment cabinet.

[0034] The power conversion device of a power supply device can convert input electrical energy into power through power devices and then output it. For example, when the power supply device is a charging device, the power conversion device can output the converted electrical energy to a charging gun, which then charges the device to be charged (e.g., an electric vehicle). The power supply device provided in this application includes the aforementioned power conversion device. Therefore, the power supply device provided in this application and the power conversion device of the above-mentioned technical solutions can solve the same technical problems and have the same technical effects, which will not be elaborated further here. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of a power supply device provided in an embodiment of this application;

[0036] Figure 2 This is a schematic diagram of another power supply device provided in an embodiment of this application;

[0037] Figure 3 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0038] Figure 4 A schematic diagram of a circuit board structure provided in an embodiment of this application;

[0039] Figure 5 This application provides a schematic diagram of the structure of a frame.

[0040] Figure 6 This is a schematic diagram of the structure of a heat-conducting component provided in an embodiment of this application;

[0041] Figure 7 This is a schematic diagram of the structure of an insulating component provided in an embodiment of this application;

[0042] Figure 8 This is a schematic diagram of a wiring structure provided in an embodiment of this application;

[0043] Figure 9 This is a schematic diagram of another heat-conducting component provided in an embodiment of this application;

[0044] Figure 10 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0045] Figure 11 This is a schematic diagram of another heat-conducting component provided in an embodiment of this application;

[0046] Figure 12 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0047] Figure 13 This is a schematic diagram of another heat-conducting component provided in an embodiment of this application;

[0048] Figure 14 This is a schematic diagram of the structure of a heat-conducting strip provided in an embodiment of this application;

[0049] Figure 15 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0050] Figure 16 This is a schematic diagram of another heat-conducting strip provided in an embodiment of this application;

[0051] Figure 17 This is a schematic diagram of another heat-conducting component provided in an embodiment of this application;

[0052] Figure 18 This is a schematic diagram of another heat-conducting component provided in an embodiment of this application.

[0053] Figure label:

[0054] 100-Power supply equipment; 10-Equipment cabinet; 20-AC power distribution device; 30-DC power distribution device; 40-Power conversion device; 50-Charging gun; 60-First cable; 70-Second cable; 80-Terminal cabinet; 90-Cooling assembly; 1-Radiator; 11-Cooling channel; 12-Liquid inlet; 13-Liquid outlet; 2-Equipment housing; 3-Circuit board; 31-Wiring; 311-First position; 312-Second position; 4-Electricity Sub-component; 41-First end face; 42-Second end face; 43-Component housing; 44-Pin; 5-Frame; 51-Receiving cavity; 52-Potent; 6-Heat-conducting component; 61-First end; 62-Second end; 63-Bend; 64-First section; 65-Second section; 66-Third section; 67-Heat-conducting strip; 68-Heat-conducting sheet; 69-First part; 610-Second part; 7-Fastener; 8-Heat-conducting pad; 9-Insulating component. Detailed Implementation

[0055] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0056] In this application, the terms "first," "second," etc., are used for descriptive purposes only to distinguish one element from another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0057] In this application, unless otherwise expressly stated and limited, "multiple" means two or more.

[0058] Furthermore, in this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0059] In the accompanying drawings of the embodiments of this application, solid structures such as components and assemblies are represented by guide lines; structures composed of multiple components are represented by guide lines with parentheses or solid arrows; and hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with hollow arrows.

[0060] This application provides a power supply device 100, Figure 1 An exemplary structure of a power supply device 100 is shown, with reference to Figure 1 The power supply equipment 100 is an integrated charging pile, which includes an equipment cabinet 10, an AC power distribution device 20, a DC power distribution device 30, and multiple electrically connected power conversion devices 40. The AC power distribution device 20, the DC power distribution device 30, and the multiple power conversion devices 40 are all installed inside the equipment cabinet 10.

[0061] The input terminal of the AC power distribution unit 20 is used to connect to a power source, which can be the power grid. The output terminal of the AC power distribution unit 20 is connected to the input terminals of multiple power conversion devices 40. The AC power distribution unit 20 is used to control the on / off state of the circuit between the power source and the multiple power conversion devices 40. Each power conversion device 40 is used to perform power conversion; for example, some power conversion devices 40 are used to convert AC to DC, and some power conversion devices 40 are used for voltage boosting or bucking; for example, each power conversion device 40 is used to convert AC to DC; for example, each power conversion device 40 is used for voltage boosting or bucking. The output terminals of the multiple power conversion devices 40 are connected to the input terminal of the DC power distribution unit 30.

[0062] In addition, refer to Figure 1 The power supply device 100 also includes at least one charging gun 50 and at least one first cable 60, in Figure 1In the illustrated embodiment, two charging guns 50 and two first cables 60 are provided. The charging guns 50 are located outside the equipment cabinet 10 and are used to connect to the device to be charged (e.g., an electric vehicle). The charging guns 50 are connected to the DC power distribution device 30 via corresponding first cables 60. The DC power distribution device 30 controls the on / off state of the circuit between the multiple power conversion devices 40 and the first cables 60. When the DC power distribution device 30 conducts the circuit between the first cables 60 and the multiple power conversion devices 40, the charging guns 50 can output the current after power conversion by the multiple power conversion devices 40.

[0063] In another embodiment, when the power supply device 100 is an integrated charging pile, the power supply device 100 has one or three charging guns 50 and first cables 60, etc.

[0064] Figure 2 An exemplary diagram shows the structure of another power supply device 100, with reference to Figure 2 The power supply equipment 100 is a split-type charging pile, comprising a main unit and multiple terminal units. The main unit of the power supply equipment 100 includes an equipment cabinet 10, an AC power distribution device 20, a DC power distribution device 30 (also referred to as a power allocation device), and multiple power conversion devices 40, all installed within the equipment cabinet 10. The input terminal of the AC power distribution device 20 is used to connect to a power source (e.g., the power grid). Each power conversion device 40 performs power conversion. The DC power distribution device 30 is connected to multiple terminal units of the power supply equipment 100 via multiple second cables 70 to distribute the DC power output from the multiple power conversion devices 40 to one or more of the terminal units.

[0065] Reference Figure 2 Each terminal section of the power supply equipment 100 includes a terminal cabinet 80, a charging gun 50, and a first cable 60, wherein a portion of a second cable 70 extends into the terminal cabinet 80. Figure 2 In the illustrated embodiment, each terminal section has two charging guns 50 and two first cables 60. Each charging gun 50 is connected to the terminal cabinet 80 via the corresponding first cable 60. When the circuit between the first cable 60 and the second cable 70 is connected, the charging gun 50 can output the current after power conversion by multiple power conversion devices 40.

[0066] In another embodiment, in each terminal portion of the power supply device 100, there are one, three, etc., charging guns 50 and first cables 60.

[0067] In another embodiment, the power supply device 100 is a power cabinet, for example, a cabinet-type uninterruptible power supply (UPS).

[0068] Among them, many power conversion devices 40 generate significant heat during operation, thus requiring cooling of the power conversion devices 40. Figure 3 An exemplary structure of a power conversion device 40 is shown, with reference to Figure 3 The power conversion device 40 includes a heat sink 1, which is used to control the temperature of the power conversion device 40.

[0069] exist Figure 3 In the illustrated embodiment, the radiator 1 is a liquid-cooled radiator and includes a cold plate with cooling channels 11 for coolant flow. Figure 3 The cooling channel 11 is shielded by the outer shell of the cold plate, which has an inlet 12 and an outlet 13 communicating with the cooling channel 11. (Auxiliary reference) Figure 1 and Figure 2 The power conversion device 40 also includes a cooling assembly 90, which is located inside the equipment cabinet 10. In another embodiment, the cooling assembly 90 may also be located outside the equipment cabinet 10. The cooling assembly 90 can be connected to the liquid inlet 12 and liquid outlet 13 of each cold plate in any suitable manner. For example, the power supply device 100 also includes a connecting pipe, through which the cooling assembly 90 is connected to the liquid inlet 12 and liquid outlet 13 of each cold plate, so that the cold plates of multiple power conversion devices 40 are connected in parallel or in series.

[0070] The cooling component 90 can cool the coolant and drive the coolant to flow in the cooling channel 11. That is, the cooling component 90 can cool the coolant flowing out of the cooling channel 11 and transport the cooled coolant back to the cooling channel 11 to drive the coolant to circulate in the cooling channel 11, thereby continuously cooling the power conversion device 40.

[0071] For example, the cooling assembly 90 includes a drive element (e.g., a liquid pump) and a heat exchanger (e.g., a plate heat exchanger). The internal channels of the heat exchanger include a first heat exchange channel and a second heat exchange channel. The cooling channel 11 communicates with the first heat exchange channel of the heat exchanger, and the second heat exchange channel of the heat exchanger communicates with a cold source. The drive element drives the coolant to flow. After entering the cooling channel 11 of the cold plate, the coolant absorbs heat from inside the power conversion device 40. The cooled coolant, after absorbing heat, flows out from the cooling channel 11 and enters the heat exchanger to exchange heat with the cold source. After heat exchange, the temperature of the coolant decreases and it returns to the cooling channel 11 to continue cooling the power conversion device 40. This cycle repeats, achieving cyclic cooling of the power conversion device 40. In one embodiment, the cold source includes a compressor, a condenser (or a cooling tower), a throttling valve, etc.

[0072] For example, the cooling assembly 90 includes a drive unit and a heat exchanger. The cooling channel 11 of each cold plate is connected to the internal channel of the heat exchanger. In this embodiment, the heat exchanger exchanges heat with the air. For example, the cooling assembly 90 also includes a fan for blowing air towards the heat exchanger, or the fan draws air from outside the equipment cabinet 10 into the equipment cabinet 10 and passes the air through the heat exchanger. The drive unit drives the coolant to flow. After entering the cooling channel 11, the coolant absorbs heat from inside the power conversion device 40. The cooled coolant then flows out of the cooling channel 11 and enters the heat exchanger to exchange heat with the air. After heat exchange, the temperature of the cooled coolant decreases and it returns to the cooling channel 11 of the cold plate to continue cooling the power conversion device 40, and the cycle repeats.

[0073] In another embodiment, the radiator 1 is an air-cooled radiator and includes heat dissipation fins or fins.

[0074] In another embodiment, the radiator 1 is a two-phase working fluid heat exchanger, and the interior of the radiator 1 has a cooling working fluid capable of gas-liquid conversion.

[0075] In one embodiment, the heat sink 1 is part of the housing of the power conversion device 40, for example, referring to... Figure 3 The power conversion device 40 includes a housing 2, and a heat sink 1 (including a cold plate) is part of the housing 2. In another embodiment, the power conversion device 40 includes a housing 2, the heat sink 1 and the housing 2 are two independent structures, and the heat sink 1 is fixed to the housing 2.

[0076] The housing 2 is used to house the devices and structures inside the power conversion device 40. For example, the power conversion device 40 also includes a circuit board 3 and multiple electronic components 4. Figure 4 An exemplary structure of a circuit board 3 is shown, with reference to Figure 4There is a gap between the circuit board 3 and the heat sink 1, and the surface of the circuit board 3 faces the heat sink 1. Multiple electronic components 4 are fixed to the circuit board 3. The circuit board 3 and the multiple electronic components 4 are all located inside the device housing 2.

[0077] The power conversion device 40 contains a large number of electronic components 4. If only a heat sink 1 is provided for cooling the power conversion device 40, the heat from the numerous electronic components 4 cannot be effectively transferred to the heat sink 1, resulting in poor heat dissipation from the heat sink 1 for the power conversion device 40. Therefore, in some embodiments, the power conversion device 40 also includes a frame 5. Figure 5 An exemplary structure of a frame 5 is shown, with reference to Figure 4 and Figure 5 The frame 5 is located between the circuit board 3 and the heat sink 1, and the frame 5 is fixed to the surface of the heat sink 1 facing the circuit board 3. For example, the frame 5 is integrally formed with the heat sink 1. In this embodiment, the frame 5 is similar to the rib on the heat sink 1. Or, for example, the frame 5 and the heat sink 1 are two independent structures. That is, the frame 5 needs to be manufactured separately and then fixedly connected to the heat sink 1.

[0078] Reference Figure 5 The frame 5 has multiple receiving cavities 51; in another embodiment, the frame 5 encloses only one receiving cavity 51. To allow the heat from the electronic component 4 to be transferred to the heat sink 1 through the frame 5, refer to... Figure 4 The frame 5 is filled with potting compound 52. Figure 4 In the illustrated embodiment, the frame 5 has a plurality of receiving cavities 51, each of which is filled with potting compound 52 (the shading indicates the potting compound 52). In another embodiment, when the frame 5 has a plurality of receiving cavities 51, a portion of the receiving cavities 51 of the frame 5 are filled with potting compound 52. Wherein, when the receiving cavities 51 are filled with potting compound 52, the potting compound 52 may fill the entire receiving cavity 51 or only a portion of the receiving cavity 51.

[0079] At least one electronic component 4, with a portion thereof, is located within the potting compound 52. That is, at least one electronic component 4 extends into the potting compound 52, with a portion of the component 4 inserted into the potting compound 52 being submerged. The potting compound 52 serves to connect the frame 5 and the multiple electronic components 4, preventing the multiple electronic components 4 from contacting the frame 5. When the frame 5 is made of metal, this reduces the risk of short circuits through the frame 5.

[0080] During the operation of the power conversion device 40, multiple electronic components 4 will generate heat. At least one electronic component 4 extends into the potting compound 52, so that the heat of at least one electronic component 4 can be quickly transferred to the heat sink 1 through the potting compound 52, and the heat sink 1 can better cool down the multiple electronic components 4.

[0081] Furthermore, during the operation of the power conversion device 40, the multiple heat-generating electronic components 4 also transfer heat to the circuit board 3. Additionally, the heat generated by the metal traces on the circuit board 3 itself also contributes to its high temperature. Since the circuit board 3 is typically far from the heat sink 1, the heat sink 1 cannot effectively dissipate heat from the circuit board 3. The heat on the circuit board 3 can only be dissipated through natural heat exchange with the air inside the power conversion device 40, resulting in poor heat dissipation. The circuit board 3 remains at a high temperature for an extended period, which is detrimental to the overall heat dissipation of the power conversion device 40.

[0082] To address the issue of poor heat dissipation in circuit board 3, the power conversion device 40 also includes one or more heat-conducting components 6. Figure 6 An exemplary structure of a heat-conducting element 6 is shown, and it can be understood that... Figure 6 The image shown is a portion of circuit board 3, which has a heat-conducting component 6. Figure 6 This is not intended to limit the circuit board 3 to having only one heat-conducting element 6. In one embodiment, the circuit board 3 has one heat-conducting element 6, while in another embodiment, the circuit board 3 has multiple heat-conducting elements 6, and the structures of the multiple heat-conducting elements 6 may be the same or different.

[0083] Regardless of whether there is one or more heat-conducting components 6, each heat-conducting component 6 is fixed to the circuit board 3. Furthermore, in order to transfer the heat from the heat-conducting component 6 to the heat sink 1, the power conversion device 40 of this application also includes an insulating component 9. Each heat-conducting component 6 is connected to the heat sink 1 through the insulating component 9. Figure 7 An exemplary structure of an insulating element 9 is shown, and it can be understood that... Figure 7 The heat-conducting component 6 in the middle and Figure 6 The heat-conducting component 6 is the same. (Refer to...) Figure 7 The insulating component 9 includes potting compound 52. Each heat-conducting component 6 has a portion located within the potting compound 52 and connected to the heat sink 1 through the potting compound 52. The potting compound 52 immerses a portion of the heat-conducting component 6. The heat on the circuit board 3 is transferred to the heat sink 1 through the heat-conducting component 6 and the potting compound 52, and the heat sink 1 dissipates heat from the circuit board 3.

[0084] In another embodiment, the insulating element 9 can also be a rubber sheet, ceramic sheet, etc., which fixes the insulating element 9 between the heat-conducting element 6 and the heat sink 1, so that the heat of the heat-conducting element 6 can be transferred to the heat sink 1 through the insulating element 9. In addition, the heat-conducting element 6 can also achieve insulation between the heat-conducting element 6 and the heat sink 1 while achieving heat conduction.

[0085] The heat sink 1 can dissipate heat from multiple electronic components 4, and it can also dissipate heat from the circuit board 3 through the heat-conducting component 6, thereby controlling the temperature of the circuit board 3 and multiple electronic components 4, reducing the internal temperature of the power conversion device 40, and enabling the power conversion device 40 to operate stably.

[0086] The heat-conducting element 6 can be any structure capable of conducting heat. In one embodiment, at least one heat-conducting element 6 is also capable of conducting electricity. For example, at least one heat-conducting element 6 is a metal structure, and at least two portions of the conductive heat-conducting element 6 are electrically connected to the traces 31 (trace layer of the circuit board) of the circuit board 3. Figure 8 An exemplary structure of trace 31 is shown, with reference to Figure 8 The two ends (first end 61 and second end 62) of the heat-conducting component 6 are electrically connected to the trace 31, allowing current to flow through the heat-conducting component 6. The position where the trace 31 connects to the first end 61 is the first position 311, and the position where the trace 31 connects to the second end 62 is the second position 312. The trace 31 between the first position 311 and the second position 312 is connected in parallel with the heat-conducting component 6, and the current is shunted through the heat-conducting component, reducing the loss of the trace 31 on the circuit board 3.

[0087] The portion of the heat-conducting component 6 used for electrically connecting the trace 31 can be designated as a "connection portion." The heat-conducting component 6 has at least two "connection portions" electrically connected to the trace. A section of the trace 31 electrically connected between any two adjacent "connection portions" does not electrically connect to any electronic component. For example, refer to... Figure 8 The first end 61 and the second end 62 are two adjacent "connection parts". The section of the trace 31 between the first end 61 and the second end 62 is not electrically connected to any electronic component 4. That is, the section of the trace 31 between the first position 311 and the second position 312 is not electrically connected to any electronic component 4. This means that the section of the trace 31 that is shunted is not electrically connected to any electronic component 4, and the heat-conducting component 6 will not affect the normal operation of any electronic component 4 while achieving current shunting.

[0088] In some other embodiments, three or more portions of the heat-conducting element 6 are electrically connected to the traces 31 of the circuit board 3.

[0089] Furthermore, the shape of the heat-conducting component 6 can be designed according to requirements, for example, taking into account various factors such as space and safety distances. (Return to reference) Figure 6 and Figure 7 In one embodiment, the two ends (first end 61 and second end 62) of the heat-conducting element 6 are fixed to the circuit board 3, and the portion of the heat-conducting element 6 between the two ends arches towards the heat sink 1, forming an arched structure, or a "U"-shaped structure, so that the heat-conducting element 6 is upside down on the circuit board 3, so that the heat-conducting element 6 and the circuit board 3 enclose a region. This shape of the heat-conducting element 6 can span a long distance on the circuit board 3. When it is necessary for the heat-conducting element 6 to shunt the trace 31, this shape of the heat-conducting element 6 facilitates electrical connection with the circuit board 3 to allow the current to flow through the heat-conducting element 6. For example, it is only necessary to electrically connect the two ends of the heat-conducting element 6 to the trace 31 of the circuit board 3.

[0090] In addition, Figure 6 and Figure 7 In the illustrated embodiment, because the heat-conducting element 6 arches away from the circuit board 3, the heat-conducting element 6 and the circuit board 3 form an area in which multiple electronic components 4 are disposed. In another embodiment, one electronic component 4 is disposed within the area formed by the heat-conducting element 6 and the circuit board 3. The heat-conducting element 6 is positioned across at least one electronic component 4, such that a portion of the heat-conducting element 6 is located on the side of the at least one electronic component 4 it crosses, facing the heat sink 1. This portion is connected to the heat sink 1 via an insulating member 9. For example, if the insulating member 9 includes potting compound 52, this portion is immersed in the potting compound 52 and connected to the heat sink 1 via the potting compound 52. The longer this portion, the more of the heat-conducting element 6 is connected to the heat sink 1 via the insulating member 9, that is, the more of the heat-conducting element 6 is located within the potting compound 52, which is more conducive to the conduction of heat from the heat-conducting element 6 to the heat sink 1. In addition, the heat-conducting component 6 spans a long distance on the circuit board 3, which can also divert the longer traces 31 on the circuit board 3, further reducing the loss of the traces 31 on the circuit board 3.

[0091] Continue to refer to Figure 6 and Figure 7 Multiple electronic components 4 located within the area enclosed by the heat-conducting component 6 and the circuit board 3 along... Figure 6 The X1 direction is perpendicular to the thickness direction (Y direction) of circuit board 3.

[0092] exist Figure 6 and Figure 7In the illustrated embodiment, the heat-conducting component 6 has two bends 63. The heat-conducting component 6 includes a first segment 64, a second segment 65, and a third segment 66 separated by the two bends 63. The first segment 64, second segment 65, and third segment 66 are connected sequentially. The first segment 64 and third segment 66 are arranged along the X1 direction and are both fixed to the circuit board 3 and extend along the thickness direction of the circuit board 3. The second segment 65 extends along the X1 direction and is located on the side of the plurality of electronic components 4 facing away from the circuit board 3. A portion of each of the first segment 64 and the second segment 65 extends into the potting compound 52. The portions of the two bends 63 and the second segment 65 are entirely within the potting compound 52. The longer the second segment 65, the more of the heat-conducting component 6 is contained within the potting compound 52, which is more conducive to conducting heat from the heat-conducting component 6 to the heat sink 1. Furthermore, the longer second segment 65 can also divert heat from the longer traces 31 on the circuit board 3, further reducing the loss of the traces 31 on the circuit board 3.

[0093] In another embodiment, the two ends of the heat conductor 6 are fixed to the circuit board 3, and the portion of the heat conductor 6 between the two ends arches toward the heat sink 1, but the heat conductor 6 is located to the side of the electronic component 4.

[0094] For example, at least one heat-conducting element 6 is provided between two adjacent electronic components 4. Figure 9 An exemplary embodiment shows another structure of the heat-conducting component 6, with reference to Figure 9 At least two of the multiple electronic components 4 are arranged perpendicular to the thickness direction of the circuit board 3. Figure 9 In the illustrated embodiment, three heat-conducting elements 6 are along Figure 9 The components are arranged in the X2 direction, which is perpendicular to the thickness direction (Y direction) of the circuit board 3. At least one heat-conducting element 6 is located between two adjacent electronic components 4, for example, Figure 9 The heat-conducting component 6(a) is located between electronic component 4(a) and electronic component 4(b). For example, multiple heat-conducting components 6 are provided between two adjacent electronic components 4.

[0095] For example, at least one electronic component 4 is disposed between two adjacent heat-conducting components 6. (Refer to...) Figure 9 Multiple heat-conducting components 6 are provided, with at least two heat-conducting components 6 arranged perpendicular to the thickness direction of the circuit board 3. Figure 9 In the illustrated embodiment, three heat-conducting elements 6 are along Figure 9 Arranged in the X2 direction. At least one electronic component 4 is located between two adjacent heat-conducting components 6, for example, Figure 9 Electronic component 4(a) is located between heat-conducting component 6(a) and heat-conducting component 6(b). For example, Figure 9Electronic components 4(b) and 4(c) are located between heat-conducting components 6(a) and 6(c).

[0096] If adopted Figure 9 The heat-conducting component 6 in the circuit board 3 has its end facing away from the circuit board 3 connected to the heat sink 1 via an insulating component 9. For example, if the insulating component 9 includes potting compound 52, the end of the heat-conducting component 6 facing away from the circuit board 3 is located within the potting compound 52 and connected to the heat sink 1 via the potting compound 52. Figure 10 An exemplary diagram shows another structure of the insulating element 9, which will be understood to be... Figure 10 Multiple heat-generating components 6 and Figure 9 The multiple heat-conducting components 6 are identical. (Refer to...) Figure 10 A portion of the heat-conducting component 6 (the end facing away from the circuit board 3) is located within the potting compound 52.

[0097] It should be noted that, Figure 9 and Figure 10 Only a portion of the circuit board 3 is shown. In one embodiment, other portions of the circuit board 3 are provided with other heat-conducting elements 6, for example, the shape of the other heat-conducting elements 6 is similar to... Figure 9 and Figure 10 The shape of the heat-conducting element 6 shown is different; for example, the shape of other heat-conducting elements 6 is different. Figure 9 and Figure 10 The shape of the heat-conducting element 6 shown is different. In another embodiment, no other heat-conducting elements 6 are provided on other parts of the circuit board 3.

[0098] In another embodiment, at least one heat-conducting element 6 on the circuit board 3 is in the form of a sheet. Figure 11 An exemplary embodiment shows the structure of another heat-conducting element 6. Figure 11 The heat-conducting element 6 shown is in the form of a sheet. The length, width, and thickness directions of the sheet-shaped heat-conducting element 6 are mutually perpendicular. Furthermore, the dimensions of the sheet-shaped heat-conducting element 6 in its length and width directions are both greater than its thickness direction; that is, the dimension in the thickness direction is the smallest. The thickness direction of the sheet-shaped heat-conducting element 6 is perpendicular to the thickness direction of the circuit board 3. In this context... Figure 11 In the illustrated embodiment, the thickness directions of the multiple sheet-like heat-conducting elements 6 are not exactly the same. For example, the thickness directions of heat-conducting elements 6(d) and 6(g) are both parallel to the X3 direction, which is perpendicular to the thickness direction (Y direction) of the circuit board 3. As another example, the thickness directions of heat-conducting elements 6(f) and 6(e) are both parallel to the X4 direction, which is perpendicular to the thickness direction of the circuit board 3. Furthermore, the X4 direction is also perpendicular to the X3 direction.

[0099] In another embodiment, the thickness direction of the plurality of sheet-like heat-conducting elements 6 is the same.

[0100] In one embodiment, where the heat-conducting element 6 is in the form of a sheet, at least one heat-conducting element 6 is located on the circuit board 3 between two adjacent electronic components 4. For example, in Figure 11 In the illustrated embodiment, three electronic components 4 are arranged along the X3 direction, and at least one heat-conducting element 6 is located between two adjacent electronic components 4, for example, Figure 11 The heat-conducting component 6(d) is located between electronic component 4(d) and electronic component 4(e); for example, Figure 11 The heat-conducting components 6(e) and 6(f) are located between electronic components 4(e) and 4(f).

[0101] In another embodiment, at least one electronic component 4 is located on the circuit board 3 between two adjacent heat-conducting elements 6. For example, in Figure 11 In the illustrated embodiment, at least two heat-conducting elements 6 are arranged perpendicular to the thickness direction of the circuit board 3, wherein, Figure 11 There are four heat-conducting components along the 6 edges. Figure 11 Arranged in the X3 direction. At least one electronic component 4 is located between two adjacent heat-conducting components 6, for example, Figure 11 The electronic component 4(e) is located between the heat-conducting component 6(e) and the heat-conducting component 6(d). For example, multiple electronic components 4 are disposed between two adjacent heat-conducting components 6.

[0102] If adopted Figure 11 The heat-conducting component 6 in the circuit board 3 has its end facing away from the circuit board 3 connected to the heat sink 1 via an insulating component 9. For example, if the insulating component 9 includes potting compound 52, the end of the heat-conducting component 6 facing away from the circuit board 3 is located within the potting compound 52 and connected to the heat sink 1 via the potting compound 52. Figure 12 An exemplary diagram illustrates the structure of another insulating element 9, which will be understood to be... Figure 12 Multiple heat-conducting components 6 in Figure 11 The multiple heat-conducting components 6 are identical. (Refer to...) Figure 12 The end of the heat-conducting component 6 facing the circuit board 3 is fixed to the circuit board 3, and the end of the heat-conducting component 6 away from the circuit board 3 is located in the potting compound 52.

[0103] The sheet-shaped heat-conducting component 6 is small in size and easy to install, allowing it to adapt to smaller installation environments. For example, it can be easily installed between two adjacent electronic components 4. The sheet-shaped heat-conducting component 6 is connected to the circuit board 3 and also to the heat sink 1 through the insulating component 9, transferring heat from the circuit board 3 to the heat sink 1, thus achieving heat dissipation for the circuit board 3.

[0104] Understandable, Figure 11 and Figure 12Only a portion of circuit board 3 is shown.

[0105] The temperature of circuit board 3 typically varies; for example, the area where electronic components 4 are concentrated on circuit board 3 has a higher temperature. In this area, if at least two electronic components 4 are arranged perpendicular to the thickness direction of circuit board 3, for example… Figures 9 to 12 As shown, one or more heat-conducting elements 6 are placed between two adjacent electronic components 4. After the heat from the two adjacent electronic components 4 is transferred to the circuit board 3, the heat will be transferred to the heat sink 1 through the one or more heat-conducting elements 6 between the two adjacent electronic components 4, thereby dissipating heat from the high-heat areas on the circuit board 3. For example, refer to... Figure 11 After the heat from electronic components 4(e) and 4(f) is transferred to the circuit board 3, the heat will be transferred to the heat sink 1 through the heat conductors 6(e) and 6(f).

[0106] Furthermore, when one or more electronic components 4 are disposed between two adjacent heat-conducting elements 6, for example, refer to Figures 9 to 12 In the illustrated scenario, heat from one or more electronic components 4 located between two adjacent heat-conducting elements 6 is transferred to the circuit board 3, and then transferred to the heat sink 1 via the heat-conducting elements 6 on both sides, thus achieving heat dissipation for the circuit board 3. For example, refer to... Figure 11 After the heat from electronic component 4(e) is transferred to circuit board 3, it will be transferred to heat sink 1 through heat-conducting components 6(e) and 6(d) on both sides.

[0107] In some cases, the heat-conducting component 6 is positioned to the side of the electronic component 4 without crossing over it. Figure 6 and Figure 7 (This shows the case where the heat-conducting component 6 crosses the electronic component 4), which can reduce the volume of the heat-conducting component 6. In the case where the power conversion device 40 also includes a frame 5, it also reduces the risk of the heat-conducting component 6 and the frame 5 being too close and conducting electricity, so that the heat-conducting component 6 meets the safety distance requirements after extending into the potting compound 52.

[0108] In some embodiments, Figure 13 An exemplary embodiment shows the structure of another heat-conducting component 6. At least one heat-conducting component 6 on the circuit board 3 includes a heat-conducting strip 67 and a heat-conducting sheet 68. The heat-conducting strip 67 is elongated and its length direction is perpendicular to the thickness direction of the circuit board 3. Figure 13 In the illustrated embodiment, the length direction of the heat-conducting element 6 is the X5 direction, which is perpendicular to the thickness direction (Y direction) of the circuit board 3. The heat-conducting sheet 68 is fixed to the side of the heat-conducting strip 67 facing the heat sink 1, that is, the heat-conducting sheet 68 is fixed to the side of the heat-conducting strip 67 away from the circuit board 3. Figure 14An exemplary structure of a heat-conducting strip 67 is shown, wherein the size (L1) of the heat-conducting strip 67 is larger than the size (L2) of the heat-conducting sheet 68 in the length direction (X5 direction), that is, the heat-conducting sheet 68 is shorter than the heat-conducting strip 67.

[0109] Figure 15 An exemplary diagram illustrates the structure of another insulating element 9, which will be understood to be... Figure 15 The heat-conducting component 6 in the middle and Figure 13 and Figure 14 The heat-conducting component 6 is the same. (Refer to...) Figure 15 The insulating component 9 includes potting compound 52, and a portion of the heat-conducting sheet 68 is located within the potting compound 52 and connected to the heat sink 1 through the potting compound 52. In another embodiment, the entire heat-conducting sheet 68 is located within the potting compound 52.

[0110] The heat-conducting strip 67 is relatively long, allowing heat from the area of ​​the circuit board 3 near it to be transferred to it. The heat from the strip is then transferred to the heat-conducting sheet 68, which in turn transfers the heat to the heat sink 1, thus dissipating heat from a larger area of ​​the circuit board 3. Furthermore, the smaller heat-conducting sheet 68 is connected to the heat sink 1 via an insulating member 9 (e.g., extending into the potting compound 52), while the larger heat-conducting member 6 does not need to extend into the potting compound 52. This design not only allows for heat dissipation from a larger area of ​​the circuit board 3 but also reduces the space occupied by the heat-conducting member. For example, in the case where the power conversion device 40 also includes a frame 5, this reduces the space occupied by the heat-conducting member 6 within the frame 5.

[0111] The structure of the heat-conducting sheet 68 can be designed according to requirements. For example, the heat-conducting sheet 68 can be a bent structure; or the heat-conducting sheet 68 can be a long strip that extends along the thickness direction of the circuit board 3, and so on.

[0112] In one embodiment, reference is made to... Figure 15 One or more electronic components 4 are disposed on the side of the heat-conducting strip 67, and in order to enable the heat transferred from the electronic components 4 to the circuit board 3 to be quickly dissipated by the heat-conducting component 6, the electronic components 4 on the side of the heat-conducting strip 67 are close to the heat-conducting strip 67.

[0113] Furthermore, in the case where multiple electronic components 4 are provided on the side of the heat-conducting strip 67, in one embodiment, at least two electronic components 4 are arranged along the length direction (X5 direction) of the heat-conducting strip 67. Figure 16 An exemplary embodiment shows another structure of the heat-conducting strip 67, in which multiple electronic components 4 arranged along the X5 direction are located on the side of the heat-conducting strip 67, and the aforementioned electronic components 4 located on the side of the heat-conducting strip 67 are arranged adjacent to the heat-conducting strip 67, that is, no other electronic components 4 are arranged between the aforementioned electronic components 4 located on the side of the heat-conducting strip 67 and the heat-conducting strip 67.

[0114] Reference Figure 16 Along the length direction (X5 direction) of the heat-conducting strip 67, the dimension (L1) of the heat-conducting strip 67 is greater than the distance (L3) between the first and last electronic components 4 among the multiple electronic components 4 on the side. Specifically, the distance between the first and last electronic components 4 among the multiple electronic components 4 on the side of the heat-conducting strip 67 is the distance between the end face (first end face 41) of the first electronic component 4 facing away from the other electronic components 4 and the end face (second end face 42) of the last electronic component 4 facing away from the other electronic components 4.

[0115] It should be noted that, in this application, the electronic components 4 on the side of the heat-conducting strip 67 do not need to be completely located on one side of the heat-conducting component 6; only a portion of them need to be located on the side of the heat-conducting component 6. For example, Figure 16 Electronic component 4(g) also belongs to electronic component 4 located on the side of heat-conducting strip 67.

[0116] Multiple electronic components 4 are positioned on the side of the heat-conducting strip 67. The heat transferred from these electronic components 4 to the circuit board 3 can be transferred through the same heat-conducting strip 67 to the heat-conducting plate 68, and then through the heat-conducting plate 68 to the heat sink 1. In this way, the heat-conducting component 6 can effectively dissipate heat from the area where multiple electronic components 4 are located, thereby reducing the temperature of the circuit board 3.

[0117] In some embodiments, a plurality of heat-conducting plates 68 are fixed on the heat-conducting component 6, as shown in the figure. Figure 16 Along the length (X5 direction) of the heat-conducting strip 67, the size of each heat-conducting fin 68 is smaller than the size of the heat-conducting strip 67. Additionally, auxiliary references... Figure 15 Each heat-conducting plate 68 is at least partially (partially or entirely) connected to the heat sink 1 via an insulating member 9, for example, each heat-conducting plate 68 is at least partially located within the potting compound 52.

[0118] In some embodiments, at least one portion of a heat-conducting element 6 on the circuit board 3 is located on the side of the circuit board 3 away from the heat sink 1 and connected to the circuit board 3, while another portion is located on the side of the circuit board 3 facing the heat sink 1 and connected to the heat sink 1 through an insulating element 9. For example, Figure 17 An exemplary embodiment shows the structure of another heat-conducting component 6, with reference to Figure 17 Circuit board 3 has through holes. Figure 17 The heat-conducting component 6 passes through a through-hole on the circuit board 3, such that a portion of the heat-conducting component 6 is located on the side of the circuit board 3 away from the heat sink 1, and another portion is located on the side of the circuit board 3 facing the heat sink 1. For example, Figure 18 An exemplary embodiment shows the structure of another heat-conducting component 6, with reference to Figure 18 , Figure 18The heat-conducting component 6 extends from the outer edge of the circuit board 3, so that a portion of the heat-conducting component 6 is located on the side of the circuit board 3 away from the heat sink 1, and another portion is located on the side of the circuit board 3 facing the heat sink 1.

[0119] In this design, the heat-conducting component 6 is connected to the side of the circuit board 3 facing away from the heat sink 1 (e.g., the bottom side of the circuit board 3). This ensures that the installation position of the heat-conducting component 6 does not occupy the side of the circuit board 3 facing the heat sink 1 (e.g., the top side of the circuit board 3). This reduces the space occupied by the heat-conducting component 6 on the side of the circuit board 3 facing the heat sink 1, allowing more electronic components 4 to be installed on the side of the circuit board 3 facing the heat sink 1. More electronic components 4 are closer to the heat sink 1, which is beneficial for the heat dissipation of the electronic components 4. For example, more electronic components 4 can extend into the potting compound 52, further reducing the temperature of the power conversion device 40.

[0120] by Figure 17 Taking the heat-conducting component 6 shown as an example, the heat-conducting component 6 is L-shaped and includes a first portion 69 and a second portion 610. The first portion 69 is located on the side of the circuit board 3 opposite to the heat sink 1 and is connected to the circuit board 3. For example, the first portion 69 can be connected to the circuit board 3 by a fastener 7 consisting of bolts and nuts. The second portion 610 passes through a through hole on the circuit board 3 and is connected to the heat sink 1 by an insulating component 9. For example, if the insulating component 9 includes potting compound 52, a portion of the second portion 610 is located within the potting compound 52 and is connected to the heat sink 1 by the potting compound 52. In one embodiment, both the first portion 69 and the second portion 610 are metal plates; in another embodiment, both the first portion 69 and the second portion 610 are metal strips; in yet another embodiment, the first portion 69 is a metal plate and the second portion 610 is a metal strip.

[0121] Reference Figure 17 At least one electronic component 4 ( Figure 17 The electronic component 4) includes a connected housing 43 and pins 44. The housing 43 is located between the circuit board 3 and the heat sink 1, and the pins 44 are fixed to the circuit board 3. In the thickness direction of the circuit board 3, the portion of the heat-conducting element 6 located on the side of the circuit board 3 away from the heat sink 1 (e.g., the first portion 69) is disposed opposite to the housing 43. That is, the orthographic projection of the first portion 69 on the surface of the circuit board 3 away from the heat sink 1 overlaps with the orthographic projection of the housing 43 on the surface of the circuit board 3 away from the heat sink 1.

[0122] exist Figure 17In the illustrated embodiment, a thermally conductive element 6 is located on the portion of the circuit board 3 facing away from the heat sink 1 (e.g., the first portion 69) opposite to a device housing 43. In another embodiment, a thermally conductive element 6 is located on the portion of the circuit board 3 facing away from the heat sink 1 (e.g., the first portion 69) opposite to multiple device housings 43.

[0123] By employing this type of heat-conducting component 6, for one or more electronic components 4 (e.g., electronic components 4 that generate significant heat), a portion of the heat-conducting component 6 (e.g., the first portion 69) and the device housing 43 of such electronic components 4 are disposed on different sides of the circuit board 3, and the portion of the heat-conducting component 6 (e.g., the first portion 69) is disposed opposite to the device housing 43. In this way, the first portion 69 is closer to the area where the electronic components 4 are located. The heat on the electronic components 4 can be transferred sequentially along the thickness direction of the circuit board 3 to the circuit board 3 and the first portion 69 of the heat-conducting component 6. After the heat from the first portion 69 of the heat-conducting component 6 is transferred to the second portion 610, it is then transferred to the heat sink 1 through the insulating component 9. This allows the heat-conducting component 6 to specifically dissipate heat from the area (e.g., local hot spots) where one or more electronic components 4 are located on the circuit board 3, effectively controlling the temperature of the circuit board 3.

[0124] by Figure 18 Taking the heat-conducting component 6 shown as an example, the heat-conducting component 6 is L-shaped and includes a first portion 69 and a second portion 610. The first portion 69 is located on the side of the circuit board 3 away from the heat sink 1 and is connected to the circuit board 3. The second portion 610 is located on the outer side of the edge of the circuit board 3 and is connected to the heat sink 1 through an insulating member 9. For example, if the insulating member 9 includes potting compound 52, a portion of the second portion 610 is located within the potting compound 52. Furthermore, the portion of the heat-conducting component 6 located on the side of the circuit board 3 away from the heat sink 1 (e.g., the first portion 69) is disposed opposite to the device housing 43.

[0125] In one embodiment, the portion of the heat-conducting element 6 located on the side of the circuit board 3 away from the heat sink 1 (e.g., the first portion 69) contacts the circuit board 3, for example... Figure 17 The situation is illustrated. However, both the heat-conducting component 6 and the circuit board 3 are rigid structures. If the first part 69 of the heat-conducting component 6 is in direct contact with the surface of the circuit board 3, dimensional errors of the heat-conducting component 6 and the circuit board 3 or unevenness of the contact surface will cause gaps between the heat-conducting component 6 and the circuit board 3, resulting in the heat on the circuit board 3 not being able to be transferred to the heat-conducting component 6 effectively.

[0126] Therefore, in another embodiment, the power conversion device 40 further includes a flexible thermal pad 8, so as to... Figure 18In the illustrated example, a thermal pad 8 is provided between the portion of the heat-conducting component 6 located on the side of the circuit board 3 away from the heat sink 1 (e.g., the first portion 69) and the circuit board 3. The flexible thermal pad 8, which can deform and adhere to both the heat-conducting component 6 and the circuit board 3, allows heat from the circuit board 3 to be transferred to the heat-conducting component 6 via the thermal pad 8, improving the thermal conductivity between the circuit board 3 and the heat-conducting component 6 and further enhancing the heat dissipation efficiency of the circuit board 3.

[0127] In one embodiment, one or more electronic components 4 may extend into the receiving cavity 51 into which the heat-conducting element 6 extends. In another embodiment, no electronic components 4 may extend into the receiving cavity 51 into which the heat-conducting element 6 extends; that is, the receiving cavity 51 is specifically designed for the heat-conducting element 6 to extend into.

[0128] In one embodiment, the circuit board 3 has multiple heat-conducting elements 6, and the multiple heat-conducting elements 6 include one, more or all of the shapes of heat-conducting elements 6 listed above.

[0129] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device for converting input electrical energy into power and then outputting it, characterized in that, include: Circuit board; A heat sink, with one side of the circuit board facing the heat sink; Multiple electronic components are fixed to one of the surfaces of the circuit board; One or more thermally conductive components, wherein the one or more thermally conductive components are fixed to the circuit board; An insulating element, through which each of the thermally conductive elements is connected to the heat sink.

2. The power conversion device according to claim 1, characterized in that, The power conversion device further includes a frame fixed to the surface of the heat sink facing the circuit board. The insulating component includes potting compound and is filled within the frame. A portion of each of the thermally conductive components is located within the potting compound and connected to the heat sink via the potting compound.

3. The power conversion device according to claim 1 or 2, characterized in that, At least one of the one or more thermal conductive elements is electrically conductive, and at least two portions of each of the at least one thermal conductive element are electrically connected to the traces of the circuit board. A section of the traces electrically connected between any two adjacent portions of the at least two portions is not electrically connected to any one of the plurality of electronic components.

4. The power conversion device according to any one of claims 1-3, characterized in that, At least one of the one or more heat-conducting elements is fixed at both ends to the circuit board, and the portion of each heat-conducting element between its two ends arches toward the heat sink.

5. The power conversion device according to claim 4, characterized in that, At least one of the plurality of electronic components is disposed in the area enclosed by the at least one heat-conducting component and the circuit board.

6. The power conversion device according to any one of claims 1-4, characterized in that, At least two of the multiple electronic components are arranged perpendicular to the thickness direction of the circuit board; at least one of the one or more heat-conducting components is located between two adjacent electronic components.

7. The power conversion device according to any one of claims 1-4, characterized in that, The heat-conducting components are provided in multiple ways, and the arrangement direction of at least two of the multiple heat-conducting components is perpendicular to the thickness direction of the circuit board; at least one of the multiple electronic components is located between two adjacent heat-conducting components.

8. The power conversion device according to any one of claims 1-3, characterized in that, At least one of the one or more thermal conductive components includes a thermal conductive strip and one or more thermal conductive sheets. The thermal conductive strip is elongated and its length direction is perpendicular to the thickness direction of the circuit board. The one or more thermal conductive sheets are fixed to the side of the thermal conductive strip facing the heat sink. Along the length of the heat-conducting strip, the size of each heat-conducting sheet is smaller than the size of the heat-conducting strip, and each heat-conducting sheet is connected to the heat sink through the insulating member.

9. The power conversion device according to claim 8, characterized in that, At least two of the plurality of electronic components are arranged along the length of the heat-conducting strip, and the at least two electronic components are located on the side of the heat-conducting strip and are adjacent to the heat-conducting strip. Along the length of the heat-conducting strip, the size of the heat-conducting strip is greater than the distance between the first and last two electronic components in the at least two electronic components.

10. The power conversion device according to any one of claims 1-3, characterized in that, At least one of the one or more thermal conductive elements is in the form of a sheet, and the thickness direction of the at least one thermal conductive element is perpendicular to the thickness direction of the circuit board. The end of the at least one heat-conducting element facing the circuit board is fixed to the circuit board, and the end of the at least one heat-conducting element away from the circuit board is connected to the heat sink through the insulating element.

11. The power conversion device according to any one of claims 1-3, characterized in that, At least one of the one or more thermal conductive elements, a portion of each thermal conductive element is located on the side of the circuit board away from the heat sink and is connected to the circuit board, and another portion of each thermal conductive element is located on the side of the circuit board facing the heat sink and is connected to the heat sink through the insulating element.

12. The power conversion device according to claim 11, characterized in that, At least one of the plurality of electronic components includes a connected device housing and pins, the device housing being located between the circuit board and the heat sink, and the pins being fixed to the circuit board; in the thickness direction of the circuit board, the portion of the thermally conductive element located on the side of the circuit board away from the heat sink is disposed opposite to the device housing.

13. The power conversion device according to claim 11 or 12, characterized in that, The power conversion device further includes a flexible thermal pad, and the portion of the thermal conductive element located on the side of the circuit board away from the heat sink has the thermal pad between it and the circuit board.

14. A power supply device, characterized in that, It includes an equipment cabinet and a plurality of power conversion devices according to any one of claims 1-13, wherein the plurality of power conversion devices are electrically connected and are all located within the equipment cabinet.

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