A micro-inverter

Abstract

The application discloses a micro inverter, which comprises a shell and a heat dissipation structure arranged on the shell, the shell comprises a bottom plate and a plurality of side plates connected to the bottom plate along the periphery of the bottom plate, and the bottom plate and the plurality of side plates enclose a containing cavity; the heat dissipation structure is arranged on the shell, and the heat dissipation structure comprises a first heat dissipation part and a second heat dissipation part; the first heat dissipation part is arranged on the side surface of the bottom plate away from the containing cavity, the first heat dissipation part comprises a plurality of heat dissipation protrusions, the heat dissipation protrusions protrude towards the direction away from the containing cavity, and the adjacent heat dissipation protrusions are arranged at intervals; the second heat dissipation part is arranged on the side surface of the plurality of side plates away from the containing cavity, the second heat dissipation part comprises a plurality of heat dissipation ribs, and the adjacent heat dissipation ribs are arranged at intervals; by arranging the plurality of heat dissipation protrusions on the bottom plate of the shell, the contact area between the bottom plate and the external environment is increased, the heat dissipation capacity of the bottom plate is improved to a certain extent, and heat radiation is more favorable.

Description

Technical Field

[0001] This application relates to the field of new energy technology, specifically to a micro inverter. Background Technology

[0002] Microinverters are used in photovoltaic grid-connected systems. One microinverter is installed for each photovoltaic module, so that each photovoltaic module is matched with a microinverter with independent DC / AC conversion function and MPPT function.

[0003] Microinverters contain a voltage conversion circuit, which includes major electronic components such as transformers and electrolytic capacitors. This circuit generates a significant amount of heat during operation, necessitating a structural design that ensures efficient heat dissipation for long-term reliable operation. Existing microinverters often employ a straight-slat heatsink structure. However, this type of heatsink has insufficient heat dissipation area, resulting in limited natural heat radiation and airflow that can only effectively dissipate heat from one direction. Utility Model Content

[0004] To overcome the above-mentioned shortcomings, the purpose of this application is to provide a micro inverter with a simple structure and good heat dissipation.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A micro inverter comprising:

[0007] The housing includes a bottom plate and a plurality of side plates, the plurality of side plates being connected to the bottom plate along the periphery of the bottom plate, the bottom plate and the plurality of side plates forming a receiving cavity;

[0008] A heat dissipation structure is disposed on the housing. The heat dissipation structure includes a first heat dissipation part and a second heat dissipation part. The first heat dissipation part is disposed on the side surface of the bottom plate away from the receiving cavity. The first heat dissipation part includes a plurality of heat dissipation protrusions, which protrude in the direction away from the receiving cavity and are spaced apart from each other. The second heat dissipation part is disposed on the side surface of the plurality of side plates away from the receiving cavity. The second heat dissipation part includes a plurality of heat dissipation ribs, which are spaced apart from each other.

[0009] In one embodiment, the plurality of heat dissipation protrusions include a plurality of protrusion rows arranged along a first direction, the protrusion rows including a plurality of heat dissipation protrusions arranged along a second direction, adjacent protrusion rows being staggered, and the first direction and the second direction intersecting each other;

[0010] The plurality of heat dissipation protrusions include a plurality of protrusion columns arranged along the second direction, and the protrusion columns include a plurality of heat dissipation protrusions arranged along the first direction, with adjacent protrusion columns being staggered.

[0011] In one embodiment, the plurality of raised rows include a first raised row and a second raised row, the first raised row and the second raised row being arranged alternately along the first direction, and each of the heat dissipation raised rows in the second raised row corresponding to the gap between two adjacent heat dissipation raised rows in the first raised row;

[0012] The plurality of protrusion columns include a first protrusion column and a second protrusion column, the first protrusion column and the second protrusion column are arranged alternately along the second direction, and each of the heat dissipation protrusions in the second protrusion column corresponds to the gap between two adjacent heat dissipation protrusions in the first protrusion column.

[0013] In one embodiment, the orthographic projection of the heat dissipation protrusion on the base plate is elliptical.

[0014] In one embodiment, the heat dissipation protrusion is integrally formed with the base plate, and the heat dissipation ribs are integrally formed with the side plate; the surface of the housing facing away from the receiving cavity is provided with a heat dissipation coating.

[0015] In one embodiment, the plurality of heat dissipation ribs include a first heat dissipation rib arranged along the first direction and a second heat dissipation rib arranged along the second direction, wherein the first heat dissipation rib corresponds to the first row of protrusions and the second heat dissipation rib corresponds to the first column of protrusions.

[0016] In one embodiment, the housing is provided with a connector on one side in the first direction, and the micro inverter is fixed to the connecting frame by the connector.

[0017] In one embodiment, the microinverter further includes a top cover located on the side of the plurality of side plates opposite to the base plate.

[0018] In one embodiment, the microinverter further includes a circuit board and electronic components, both of which are located within the receiving cavity, with the electronic components disposed on the side of the circuit board facing away from the base plate.

[0019] In one embodiment, the microinverter further includes connection terminals disposed on opposite sides of the housing in the second direction.

[0020] Beneficial effects

[0021] In this application, by setting multiple heat dissipation protrusions on the bottom plate of the shell, the contact area between the bottom plate and the external environment is increased, which can improve the heat dissipation capacity of the bottom plate to a certain extent. That is, multiple heat dissipation protrusions distributed in a dotted manner are more conducive to heat radiation. At the same time, multiple heat dissipation ribs are set on the side plate of the shell, which can be used to dissipate heat from the side plate of the shell, thereby improving the heat dissipation performance of the entire shell. Attached Figure Description

[0022] The accompanying drawings are provided to illustrate the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure. The shapes and sizes of the components in the drawings do not reflect actual proportions and are only intended to illustrate the content of this application.

[0023] Figure 1 Schematic diagram of the micro inverter structure provided in the embodiments of this application Figure 1 ;

[0024] Figure 2 Schematic diagram of the micro inverter structure provided in the embodiments of this application Figure 2 ;

[0025] Figure 3 This is a schematic diagram of the internal structure of a micro inverter provided in an embodiment of this application;

[0026] Figure 4 This is a schematic diagram of the heat dissipation structure of a micro inverter provided in an embodiment of this application;

[0027] Figure 5 This is a partial cross-sectional schematic diagram of a micro inverter provided in an embodiment of this application. Detailed Implementation

[0028] The above-described solution will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of this application. The implementation conditions used in the embodiments may be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are generally those in routine experiments.

[0029] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. In this document, "electrical connection" includes the situation where constituent elements are connected together by an element having some electrical function. There is no particular limitation on the "electrically functioning element," as long as it enables the transmission and reception of electrical signals between the connected constituent elements. An "electrically functioning element" can be, for example, an electrode or wiring, a switching element such as a transistor, or other functional elements such as a resistor, inductor, or capacitor. "Up," "down," "left," and "right" are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0030] In this application, the terms "upper," "lower," "inner," "middle," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0031] This application discloses a micro inverter, which includes a housing 10 and a heat dissipation structure 20 disposed on the housing 10. The housing 10 includes a base plate 11 and a plurality of side plates 12. The plurality of side plates 12 are connected to the base plate 11 along the periphery of the base plate 11, and the base plate 11 and the plurality of side plates 12 enclose a receiving cavity 13. The heat dissipation structure 20 is disposed on the housing 10 and includes a first heat dissipation part 21 and a second heat dissipation part 22. The first heat dissipation part 21 is disposed on the side surface of the base plate 11 away from the receiving cavity 13 and includes a plurality of heat dissipation protrusions 211, which protrude in the direction away from the receiving cavity 13 and are spaced apart from each other. The second heat dissipation part 22 is disposed on the side surface of the plurality of side plates 12 away from the receiving cavity 13 and includes a plurality of heat dissipation ribs 221, which are spaced apart from each other. In this application, by providing multiple heat dissipation protrusions 211 on the bottom plate 11 of the housing 10, the contact area between the bottom plate 11 and the external environment is increased, which can improve the heat dissipation capacity of the bottom plate 11 to a certain extent. That is, the multiple heat dissipation protrusions 211 distributed in a dotted manner are more conducive to heat radiation. At the same time, multiple heat dissipation ribs 221 are provided on the side plate 12 of the housing 10, which can be used to dissipate heat from the side plate 12 of the housing 10, thereby improving the heat dissipation performance of the entire housing.

[0032] Next, combine Figures 1-5 The micro inverter provided in this embodiment includes a housing 10, a heat dissipation structure 20, a top cover 30, a connector 40, a connection terminal 70, a circuit board 50, and electronic components 60.

[0033] The housing 10 of the microinverter includes a base plate 11 and multiple side plates 12. The side plates 12 are connected to the base plate 11 along its periphery. The base plate 11 and the multiple side plates 12 enclose a receiving cavity 13, which can be used to accommodate a circuit board 50 and electronic components 60. It should be noted that in this embodiment, the base plate and the multiple side plates are integrally formed, that is, the housing is a one-piece structure.

[0034] In one embodiment, a heat dissipation structure 20 is disposed on the housing 10 of the microinverter, specifically on the outer surface of the housing 10. The heat dissipation structure 20 conducts heat generated by the circuit board 50 and electronic components 60 inside the housing cavity 13 away from the housing. Specifically, the heat dissipation structure 20 includes a first heat dissipation section 21 and a second heat dissipation section 22. The first heat dissipation section 21 is disposed on the side surface of the base plate 11 opposite to the housing cavity 13, and includes multiple heat dissipation protrusions 211 that protrude in the direction opposite to the housing cavity 13, with adjacent protrusions spaced apart. The second heat dissipation section 22 is disposed on the side surface of multiple side plates 12 opposite to the housing cavity 13, and includes multiple heat dissipation ribs 221 that are spaced apart from adjacent ribs. In this embodiment, by providing multiple heat dissipation protrusions 211 on the base plate 11, the contact area between the base plate 11 and the external environment is increased, thereby improving the heat exchange efficiency of the airflow and enhancing the heat dissipation effect of the base plate 11. At the same time, multiple heat dissipation ribs 221 are provided on the side plate 12 of the housing 10, which can be used to dissipate heat from the side plate 12 of the housing 10, thereby improving the heat dissipation performance of the entire housing.

[0035] In one specific embodiment, the plurality of heat dissipation protrusions 211 include a plurality of protrusion rows 212 arranged along a first direction (Y direction), each protrusion row 212 including a plurality of heat dissipation protrusions 211 arranged along a second direction (X direction), adjacent protrusion rows 212 are staggered, and the first direction (Y direction) and the second direction (X direction) intersect each other; wherein the staggered arrangement of adjacent protrusion rows 212 can be understood as each heat dissipation protrusion 211 in an even-numbered row of heat dissipation protrusions 211 corresponds to the gap between two adjacent first heat dissipation protrusions 211 in an odd-numbered row of heat dissipation protrusions 211; wherein the plurality of heat dissipation protrusions 211 include a plurality of protrusion columns 213 arranged along the second direction (X direction), each protrusion column 213 including a plurality of heat dissipation protrusions 211 arranged along the first direction (Y direction), adjacent protrusion columns 213 are staggered, wherein the staggered arrangement of adjacent protrusion columns 213 can be understood as even-numbered columns Each heat dissipation protrusion 211 in the heat dissipation protrusions 211 corresponds to the gap between two adjacent first heat dissipation protrusions 211 in the odd-numbered column of heat dissipation protrusions 211. In this embodiment, adjacent protrusion rows 212 or adjacent protrusion columns 213 are staggered. During the flow of air in the multiple heat dissipation protrusions 211, the airflow changes its flow direction every time it encounters a heat dissipation protrusion 211 due to the obstruction of the staggered array of heat dissipation protrusions 211. This causes the airflow to form a wave-shaped heat dissipation airflow trajectory after passing through multiple heat dissipation protrusions 211. The airflow trajectory is relatively long, which prolongs the time the airflow stays on the base plate 11. This allows the airflow to fully exchange heat with the heat dissipation protrusions 211 and the base plate 11 when it flows through the heat dissipation protrusions 211, carrying away the heat from the heat dissipation protrusions 211 and the base plate 11, thereby dissipating heat from the micro inverter, improving heat dissipation efficiency, preventing the micro inverter from overheating, and extending the service life of the micro inverter.

[0036] Furthermore, the plurality of raised rows 212 include a first raised row 212a and a second raised row 212b, wherein each heat dissipation protrusion 211 in the second raised row 212b corresponds to the gap between two adjacent heat dissipation protrusions 211 in the first raised row 212a, and the plurality of raised columns 213 include a first raised column 213a and a second raised column 213b, wherein each heat dissipation protrusion 211 in the second raised column 213b corresponds to the gap between two adjacent heat dissipation protrusions 211 in the first raised column 213a.

[0037] For example, the orthographic projection of the heat dissipation protrusion 211 on the base plate 11 is elliptical. Compared with the heat dissipation protrusion 211 with a circular or square cross section, the heat dissipation protrusion 211 with an elliptical cross section can reduce airflow resistance, which is conducive to the airflow passing through the teeth. The airflow will generate a more uniform flow distribution around the heat dissipation protrusion 211.

[0038] For example, the heat dissipation protrusion 211 is integrally formed with the base plate 11, and the heat dissipation rib 221 is integrally formed with the side plate 12.

[0039] In one specific embodiment, the plurality of heat dissipation ribs 221 include a first heat dissipation rib 221a arranged along a first direction (Y direction) and a second heat dissipation rib 221b arranged along a second direction (X direction), wherein the first heat dissipation rib 221a corresponds to the first protrusion row 212a and the second heat dissipation rib 221b corresponds to the first protrusion column 213a.

[0040] In one embodiment, the heat dissipation protrusion 211 is integrally formed with the base plate 11, and the heat dissipation ribs 221 are integrally formed with the side plates 12. Since the base plate 11 and the multiple side plates 12 of the housing 10 are also integrally formed structures, the housing 10 and the heat dissipation structures 20 (such as the heat dissipation protrusion 211 and the heat dissipation ribs 221) on the housing 10 are also integrally formed structures. Furthermore, a heat dissipation coating is provided on the surface of the housing 10 facing away from the receiving cavity 13. The purpose of providing the heat dissipation coating is to improve the surface emissivity of the housing 10, thereby improving the radiative heat dissipation performance of the housing 10, so that the housing 10 can quickly exchange heat with the external environment.

[0041] In one embodiment, a connector 40 is provided on one side of the housing 10 in the first direction (Y direction), through which the micro-inverter is fixed to the connecting frame. In one specific embodiment, the connector 40 has mounting holes, through which bolts or screws are passed and fixed to the connecting frame, achieving a stable and reliable connection between the micro-inverter and the connecting frame. In another specific embodiment, the connector 40 can be configured as a hook structure, directly hooking onto the connecting frame for easy installation and disassembly. Preferably, the surface of the connector 40 is provided with fins for heat dissipation or coated with a thermally conductive layer. Preferably, the material of the connector 40 is the same as that of the housing 10.

[0042] In one embodiment, the top cover 30 is located on the side of the plurality of side plates 12 opposite to the bottom plate 11, which can be understood as the top cover 30 sealing the receiving cavity 13.

[0043] In one embodiment, the circuit board 50 and the electronic components 60 are both located in the receiving cavity 13, wherein the electronic components 60 are disposed on the side of the circuit board 50 away from the base plate 11, and the electronic components 60 may include major electronic components 60 such as transformers and electrolytic capacitors.

[0044] In one embodiment, the housing 10 is provided with connecting terminals 70 on opposite sides in the second direction (X direction), wherein the connecting terminals 70 are used for inputting DC power and outputting AC power.

[0045] The above embodiments are only for illustrating the technical concept and features of this application, and are intended to enable those skilled in the art to understand the content of this application and implement it accordingly. They should not be used to limit the scope of protection of this application. All equivalent changes or modifications made in accordance with the spirit and essence of this application should be included within the scope of protection of this application.

Claims

1. A micro inverter, characterized in that, include: The housing includes a bottom plate and a plurality of side plates, the plurality of side plates being connected to the bottom plate along the periphery of the bottom plate, the bottom plate and the plurality of side plates forming a receiving cavity; A heat dissipation structure is disposed on the housing. The heat dissipation structure includes a first heat dissipation part and a second heat dissipation part. The first heat dissipation part is disposed on the side surface of the bottom plate away from the receiving cavity. The first heat dissipation part includes a plurality of heat dissipation protrusions, which protrude in the direction away from the receiving cavity and are spaced apart from each other. The second heat dissipation part is disposed on the side surface of the plurality of side plates away from the receiving cavity. The second heat dissipation part includes a plurality of heat dissipation ribs, which are spaced apart from each other.

2. The micro inverter as described in claim 1, characterized in that, The plurality of heat dissipation protrusions include a plurality of protrusion rows arranged along a first direction, and the protrusion rows include a plurality of heat dissipation protrusions arranged along a second direction. Adjacent protrusion rows are staggered, and the first direction and the second direction intersect each other. The plurality of heat dissipation protrusions include a plurality of protrusion columns arranged along the second direction, and the protrusion columns include a plurality of heat dissipation protrusions arranged along the first direction, with adjacent protrusion columns being staggered.

3. The micro inverter as described in claim 2, characterized in that, The plurality of raised rows include a first raised row and a second raised row, the first raised row and the second raised row are arranged alternately along the first direction, and each of the heat dissipation raised rows in the second raised row corresponds to the gap between two adjacent heat dissipation raised rows in the first raised row; The plurality of protrusion columns include a first protrusion column and a second protrusion column, the first protrusion column and the second protrusion column are arranged alternately along the second direction, and each of the heat dissipation protrusions in the second protrusion column corresponds to the gap between two adjacent heat dissipation protrusions in the first protrusion column.

4. The micro inverter as described in claim 1, characterized in that, The orthographic projection of the heat dissipation protrusion on the base plate is elliptical.

5. The micro inverter as described in claim 1, characterized in that, The heat dissipation protrusion is integrally formed with the base plate, and the heat dissipation ribs are integrally formed with the side plate; The surface of the housing facing away from the receiving cavity is provided with a heat dissipation coating.

6. The micro inverter as described in claim 3, characterized in that, The plurality of heat dissipation ribs include a first heat dissipation rib arranged along the first direction and a second heat dissipation rib arranged along the second direction, wherein the first heat dissipation rib corresponds to the first row of protrusions and the second heat dissipation rib corresponds to the first column of protrusions.

7. The micro inverter as described in claim 2, characterized in that, The housing has a connector on one side in the first direction, through which the micro inverter is fixed to the connecting frame.

8. The micro inverter as described in claim 1, characterized in that, The microinverter also includes a top cover located on the side of the plurality of side plates opposite to the bottom plate.

9. The micro inverter as described in claim 1, characterized in that, The micro inverter also includes a circuit board and electronic components, both of which are located within the receiving cavity. The electronic components are disposed on the side of the circuit board facing away from the base plate.

10. The micro inverter as described in claim 2, characterized in that, The microinverter also includes connection terminals disposed on opposite sides of the housing in the second direction.

Images