A reaction chamber structure and a processing apparatus for semiconductor devices

Abstract

The utility model relates to a kind of reaction chamber structure and the processing equipment of semiconductor device, the reaction chamber structure includes: reaction chamber, vacuum valve and embedded box, the embedded box is fixed on the reaction chamber;The vacuum valve includes valve body and sealing valve plate, wherein, the sealing valve plate is connected with the valve body, the valve body can be detachably installed on the embedded box, the sealing valve plate is inserted into the embedded box and forms sealing surface with the reaction chamber.The reaction chamber structure can be applied to the processing equipment of semiconductor device, connected with transmission chamber, so as to protect the sealing rubber ring between the reaction chamber structure and transmission chamber from being corroded, so that the process module and plant auxiliary can not be disconnected when replacing the sealing rubber ring, avoid affecting equipment running time, improve maintenance efficiency.

Description

Technical Field

[0001] This utility model mainly relates to the field of semiconductor process technology, and in particular to a reaction chamber structure and a semiconductor device processing equipment. Background Technology

[0002] Semiconductor thin-film equipment typically includes an EFEM (Equipment Front-End Module), LL (Vacuum and Atmosphere Switching Chamber), TM (Transfer Module), and PM (Process Module). Different modules are isolated by pneumatically or electrically controlled vacuum transfer valves (SLVs). A vacuum transfer valve (SLV) generally consists of a drive mechanism, a sealing valve plate, and a sealing valve housing. The valve located between the transfer module (TM) and the process module (PM) is directly exposed to the process reaction and is subject to high temperatures, plasma, and corrosion from certain special gases. Leakage is common in the valve housing seal on the PM side, contaminating the wafer and affecting product yield. Furthermore, dead zones near the valve plate are difficult to clean thoroughly, shortening the lifespan of the valve plate seal. Additionally, because the valves are often bottom-mounted with the fastening screws located on the valve mounting flange side, the confined space below the chamber makes valve maintenance difficult and poses certain risks of impact and safety hazards.

[0003] To ensure normal equipment operation, the sealing valve plates (or rubber rings) and sealing rubber rings on the vacuum transfer valves and valve boxes need to be replaced regularly. The cost of sealing valve plates (or rubber rings) ranges from several thousand to tens of thousands of yuan, and a short service life will result in high maintenance costs. Replacing the sealing rings on the valve box requires disconnecting the process module (PM) from the valve box. Before disconnecting the PM, the equipment needs to be cooled, purged, and other plant connections disconnected, such as special gas pipelines and extraction pipelines. After replacing the rubber rings, restoring the machine takes the same amount of time. The entire process takes at least 7 to 10 days, seriously affecting the machine's uptime and incurring considerable costs. Due to differences in film thickness, chamber cleaning time, reactant gas types, and chamber temperature, the service life of the sealing rings on the valve box varies, ranging from as short as 6 months to as long as 18 to 36 months. When the equipment is running, leakage due to rubber ring corrosion can cause wafer contamination, affecting product yield. In addition, when maintaining valve plates or drive mechanisms, it is necessary to remove the mounting flange fastening screws. Due to the limited maintenance space of the machine, it is difficult for a single person to complete the valve lifting, docking and fastening work. During the process, there is a risk of scratches, bumps or accidental injury. Utility Model Content

[0004] One objective of this invention is to provide a reaction chamber structure and a semiconductor device processing equipment, which solves the problems in the prior art of vacuum transmission valves in semiconductor thin film equipment, such as easy corrosion of the valve box rubber ring causing leakage, inconvenient valve maintenance, and incomplete cleaning near the valve plate.

[0005] According to one aspect of the present invention, a reaction chamber structure is provided, the reaction chamber structure comprising: a reaction chamber, a vacuum valve and an embedded box, wherein the embedded box is fixed on the reaction chamber;

[0006] The vacuum valve includes a valve body and a sealing valve plate, wherein the sealing valve plate is connected to the valve body, the valve body is detachably mounted on the embedding box, and the sealing valve plate is inserted into the embedding box to form a sealing surface with the reaction chamber.

[0007] Optionally, the reaction chamber includes a cover plate for covering the reaction chamber and forming a reaction cavity with the reaction chamber.

[0008] Optionally, when the cover plate covers the reaction chamber by lifting up and down, the valve body can be detachably installed above the embedding box.

[0009] Optionally, when the cover is fixed to the reaction chamber in a flip-top manner, the valve body can be detachably installed below the embedding box.

[0010] Optionally, the vacuum valve includes a valve plate maintenance cover, which is detachably fixed to the insert box.

[0011] Optionally, the reaction chamber structure includes removable fasteners and mounting holes are provided on the valve plate maintenance cover and the valve body;

[0012] The valve plate maintenance cover and the valve body use the same or different sets of detachable fasteners and are connected to the embedding box by being installed in the mounting hole.

[0013] Optionally, a first sealing element is provided between the valve plate maintenance cover and the embedded box to form a sealed cavity between the valve plate maintenance cover and the embedded box.

[0014] Optionally, the vacuum valve includes a flange, which is used to connect and fix the sealing valve plate to the mounting surface when the sealing valve plate is inserted into the embedding box.

[0015] Optionally, the reaction chamber structure includes a bushing fitted onto the reaction chamber, with vents arranged circumferentially on the upper part of the bushing and on the side facing the sealing valve plate, the vents being used to adjust the flow field distribution.

[0016] According to another aspect of the present invention, a semiconductor device processing apparatus is also provided. The processing apparatus includes a transfer chamber and the aforementioned reaction chamber structure, wherein the embedding box is disposed between the reaction chamber and the transfer chamber.

[0017] Optionally, when the sealing valve plate is inserted into the embedding box, a second seal is provided between the embedding box and the transmission chamber.

[0018] Compared with existing technologies, the reaction chamber structure of this utility model includes: a reaction chamber, a vacuum valve, and an insert box, wherein the insert box is fixed on the reaction chamber; the vacuum valve includes a valve body and a sealing valve plate, wherein the sealing valve plate is connected to the valve body, the valve body is detachably installed on the insert box, and the sealing valve plate is inserted into the insert box to form a sealing surface with the reaction chamber. This allows for the replacement of the sealing ring without disconnecting the process module and plant accessories, avoiding impact on equipment operating time and avoiding additional high costs.

[0019] This invention can also be installed on fasteners or on the sealing valve, which improves maintenance efficiency and reduces the probability of the sealing valve being bumped, scratched, or causing safety hazards. In addition, by setting a bushing, the number of pores on the front sealing valve plate is increased, preventing the condensation of process gas, making purging more thorough, extending the service life of the sealing valve plate, and reducing maintenance costs. Attached Figure Description

[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings, wherein:

[0021] Figure 1 A schematic diagram of a vertically lifting reaction chamber structure according to one aspect of the present invention is shown.

[0022] Figure 2 This diagram shows a structural schematic of a flip-top reaction chamber structure according to an embodiment of the present invention.

[0023] Figure 3 This is a cross-sectional schematic diagram showing the connection between the reaction chamber structure and the transmission chamber in one embodiment of the present invention;

[0024] Figure 4 This diagram shows a structural schematic of the bushing in one embodiment of the present invention;

[0025] Figure 5 A schematic diagram showing the flow field distribution inside the cavity in one embodiment of the present invention is shown;

[0026] Figure 6(a) shows a schematic diagram of the gas flow direction in a view of the bushing in direction A of an embodiment of the present invention;

[0027] Figure 6(b) shows a schematic diagram of the gas flow direction in a B-direction view of the bushing in one embodiment of the present invention;

[0028] Figure 7A schematic diagram of the cross-sectional shape of the pores in one embodiment of the present invention is shown;

[0029] Figure 8 This diagram illustrates the structure of a semiconductor device processing equipment according to an embodiment of the present invention.

[0030] Figure 9 This diagram shows another structural schematic of a semiconductor device processing apparatus according to an embodiment of the present invention.

[0031] The same or similar reference numerals in the accompanying drawings represent the same or similar parts. Detailed Implementation

[0032] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0033] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein, and therefore the present invention is not limited to the specific embodiments disclosed below.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0035] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation; therefore, they should not be construed as limiting the scope of this invention.

[0036] It is understood that although terms such as “first,” “second,” “third,” etc., may be used here to describe various pipes, channels, components, areas, layers, and / or parts, these components, areas, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different pipes, channels, components, areas, layers, and / or parts.

[0037] Figure 1The diagram shows a structural schematic of a vertically lifting reaction chamber structure according to one aspect of the present invention. The reaction chamber structure includes a reaction chamber 10, a vacuum valve 20, and an insert box 30. The insert box 30 is fixed on the reaction chamber 10. The vacuum valve 20 includes a valve body 201 and a sealing valve plate 202, wherein the sealing valve plate 202 is connected to the valve body 201, the valve body 201 is detachably mounted on the insert box 30, and the sealing valve plate 202 is inserted into the insert box 30 to form a sealing surface with the reaction chamber 10.

[0038] When the embedded box 30 is fixed on the reaction chamber 10, it can be a continuous, integral structure, or the embedded box 30 can be detachably fixed on the reaction chamber 10 as a similar integral structure, eliminating the need for a seal between the valve box and the chamber. A limiting part can be provided on the embedded box 30 to fit the sealing valve plate 202, allowing the sealing valve plate 202 of the vacuum valve 20 to be directly inserted, thus achieving an insert-type valve design. The sealing valve plate 202 of the vacuum valve acts directly on the reaction chamber 10. The size of the sealing valve plate 202 needs to cover the size of the reaction chamber opening, allowing the sealing valve plate to seal the reaction chamber. The sealing valve plate and the reaction chamber form a sealing surface, eliminating the need for a sealing ring between the reaction chamber and the valve box. Therefore, when this reaction chamber structure is applied to semiconductor device processing equipment and connected to a transfer chamber, it protects the sealing ring between the reaction chamber and the transfer chamber from corrosion by process reaction gases, greatly extending the service life of the sealing ring between the two vacuum chambers and achieving a permanent or semi-permanent connection between the reaction chambers.

[0039] It should be noted that the vacuum valve 20 can be a heating valve, and heating wires or heating rods can be arranged at the sealing valve plate of the reaction chamber to ensure uniform temperature in the reaction chamber and prevent condensation in the wafer transport channel of the chamber.

[0040] The reaction chamber includes a cover plate 40, which covers the reaction chamber 10 and forms a reaction cavity with the reaction chamber 10. Here, the cover plate 40 of the reaction chamber can have different opening and closing forms, namely, a flip-top design or a lifting mechanism that allows it to be raised and lowered. The vacuum valve 20 can be designed to be installed at the bottom or at the top depending on the different opening and closing forms of the cover plate 40.

[0041] In one embodiment of this utility model, when the cover plate 40 is fixed to the reaction chamber 10 in a flip-top manner, the valve body 201 is detachably installed below the embedding box 30. (Reference) Figure 2When the cover plate 40 of the reaction chamber 10 is a flip-top design, the vacuum valve 20 is installed from the bottom, that is, the valve body 201 is inserted into the embedding box 30 from the bottom upward. When maintenance is performed, one maintenance personnel is responsible for supporting the valve and connecting the mounting surface from the bottom of the chamber, while another maintenance personnel performs the vacuum valve fastening work from the outside of the machine, that is, fastening the vacuum valve to the embedding box.

[0042] In another embodiment of this utility model, when the cover plate 40 covers the reaction chamber 10 by lifting up and down, the valve body 201 is detachably installed above the embedding box 30. For example... Figure 1 As shown, when the cover plate 40 of the reaction chamber 10 covers the reaction chamber 10 in an up-and-down lifting manner, the vacuum valve 20 adopts an upward installation method, that is, the valve body 201 is inserted downward from the top of the embedded box 30. At this time, when maintenance is performed, the valve plate can be replaced simply and quickly through the maintenance top cover or the equipment cavity. Only one maintenance personnel is needed on the outside of the machine to complete the lifting of the vacuum valve, the mating of the installation face, and the tightening of the vacuum valve.

[0043] In one embodiment of this utility model, the vacuum valve 20 includes a valve plate maintenance cover 203, which is detachably fixed to the embedded box 30. Considering that the sealing valve plate 202 is a consumable part that requires frequent replacement and maintenance, the valve plate maintenance cover 203 is detachably fixed to the embedded box 30. Especially in the top mounting method, the valve plate maintenance cover 203 can be fastened to the embedded box 30 alone. At this time, only the valve plate maintenance cover 203 needs to be removed to maintain the sealing valve plate 202 alone, without disassembling the drive mechanism of the vacuum valve. This can improve the maintenance efficiency of operators and reduce the probability of parts being bumped, scratched, and causing personnel safety accidents.

[0044] In one embodiment of this utility model, the reaction chamber structure includes detachable fasteners 302, and mounting holes 301 are provided on the valve plate maintenance cover 203 and the valve body 201; the valve plate maintenance cover 203 and the valve body 201 use the same or different sets of detachable fasteners 302, and are connected to the embedding box 30 by being installed in the mounting holes. Here, the detachable fasteners 302 can be screws, and mounting holes are provided on the valve plate maintenance cover 203, the valve body 201, and the embedding box 30, such as... Figure 2 As shown, the valve plate maintenance cover 203 can be fixed with a separate set of screws, or with the same set of screws as the valve body.

[0045] In one embodiment of this utility model, a first sealing member 204 is provided between the valve plate maintenance cover 203 and the embedded box 30 to form a sealed cavity between the valve plate maintenance cover 203 and the embedded box 30. Figure 3As shown, the first sealing element 204 can be a sealing ring, which is disposed between the valve plate maintenance cover 203 and the embedded box 30, and can achieve sealing of the valve and the reaction chamber.

[0046] Continue to refer to Figure 3 The vacuum valve 20 includes a flange 205. When the sealing valve plate 202 is inserted into the insert box 30, the flange 205 is used for connection and fixation on the mounting surface. Here, a flange sealing ring is installed on the mounting surface of the vacuum valve, and the flange sealing ring is used to seal the insert box, thereby achieving a sealing effect on the reaction chamber and the transfer chamber.

[0047] In one embodiment of this utility model, the reaction chamber structure includes a bushing 50 fitted onto the reaction chamber 10. The bushing 50 has circumferentially arranged vents 501 on its upper surface and on the side facing the sealing valve plate 202. The vents 501 are used to adjust the flow field distribution. (Reference) Figure 4 A bushing 50 is provided on the reaction chamber 10. A vent 501 is provided circumferentially above the bushing 50 and on the side facing the sealing valve plate. For ease of explanation in subsequent descriptions of the gas flow distribution after entering the reaction chamber through the vents, [details omitted]. Figure 4 The diagram shows directions A and B. Direction A represents the view from the side facing the sealing valve plate, and direction B represents the view from the side of the bushing. The flow field distribution when gas enters through vent 501 is shown in the diagram. Figure 5 As shown, with Figure 4 In the view from direction A in Figure 6(a), the gas flow direction is as shown. Figure 4 The gas flow direction is shown in Figure 6(b) in the B-direction view. The arrows indicate the direction of gas flow, thus the gas flow field distribution in the reaction chamber can be adjusted by the vents distributed on the bushing. When the equipment is running, when the reaction chamber 10 is undergoing the deposition process, the sealing valve plate 202 acts on the sealing surface of the reaction chamber 10. Inert gas is injected downward through the vents arranged above the bushing 50 to form an air curtain, which isolates the process reaction gas. At the same time, the vents around the bushing 50 spray gas onto the sealing valve plate to purge residual reaction gas and prevent condensation and particle generation. When the deposition in the reaction chamber 10 is completed and the chamber is cleaned, the gas injected from the vents around the bushing 50 thoroughly blows away the dead corners near the sealing valve plate 202, preventing residual gas from condensing and generating particles during the deposition process. The dead zone near the valve plate is effectively purged, avoiding residual particles from polluting the environment, improving equipment cleanliness, extending the service life of the valve plate and rubber ring, and reducing maintenance costs.

[0048] Specifically, the cross-sectional shape of the pores is as follows: Figure 7As shown, the vents include, but are not limited to, straight holes (a), flared holes (b), conical holes (c), stepped holes (d), or other irregularly shaped holes. The diameter of the vents can be various sizes, such as 0.5mm, 1mm, 1.5mm, etc. The vents can be evenly spaced, evenly spaced but not evenly spaced, or not evenly spaced but not evenly spaced. For example, in the four corners of the valve plate where dead zones are prone to occur, the bushing uses a dense distribution of small holes, conical or stepped holes, to increase the pressure of the ejected gas and achieve a more thorough purging. In other locations, larger spacing and flared holes can be used to purge a larger area, resulting in a better overall purging effect. The bushing material can be aluminum, stainless steel, ceramic, Hastelloy, etc., and the metal surface can be treated with atomic layer coating, anodizing, nickel plating, etc.

[0049] According to another aspect of this utility model, a semiconductor device processing apparatus is also provided. This processing apparatus includes a transfer chamber 100 and the aforementioned reaction chamber structure, with an insert cassette 30 disposed between the reaction chamber 100 and the transfer chamber 100. When the sealing valve plate 202 is inserted into the insert cassette 30, a second sealing member 101 is provided between the insert cassette 30 and the transfer chamber 100. Here, as... Figure 8 As shown, the reaction chamber structure is connected to the transmission chamber 100 via the embedded box 30. A cross-sectional view of the connection between the reaction chamber structure and the transmission chamber is shown below. Figure 3 As shown, the reaction chamber structure described in this utility model can protect the sealing ring between the reaction chamber and the transmission chamber from corrosion, extend its service life, avoid disconnecting the reaction chamber, and shorten the equipment downtime.

[0050] like Figure 9 As shown, a second sealing element 101 is used between the transfer chamber 100 and the reaction chamber structure. This second sealing element 101 can be a sealing ring. In a specific embodiment, two sealing rings can be used to fix the reaction chamber and the transfer chamber. The sealing ring can be a single-layer design or a double-layer design. The sealing ring can be ordinary fluororubber or perfluoroether rubber. The diameter of the sealing ring can be a standard size, such as 3.53mm or 5.33mm, or a non-standard size. When the above-mentioned reaction chamber structure is used, the vacuum valve is inserted into the embedding box. At this time, the embedding box and the reaction chamber are as a whole. The fixing of the transfer chamber and the reaction chamber is equivalent to the embedding box and the transfer chamber being sealed together. When the sealing valve plate is sealed, the sealing ring between the reaction chamber and the transfer chamber will not come into contact with the reaction gas in the reaction chamber, thus avoiding corrosion. This avoids the need to disconnect the process module and plant accessories for replacement, which would affect equipment operating time and incur additional high costs.

[0051] The design of this utility model eliminates the two sealing rings between the reaction chamber and the vacuum valve, and adopts an embedded reaction chamber structure. The sealing valve plate of the vacuum valve is inserted into the embedded box to maintain a sealed state. Since the sealing valve plate 202 remains sealed throughout the process deposition, the sealing ring 101 between the reaction chamber 10 and the transmission chamber 100 will not come into contact with corrosive gases and will not be corroded. This greatly improves the service life of the sealing ring, reduces the risk of leakage between the vacuum chambers, and achieves semi-permanent use of the sealing ring. As a result, the long downtime and considerable costs caused by disconnecting the reaction chamber and replacing the sealing ring are avoided.

[0052] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this utility model. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this utility model. Such modifications, improvements, and corrections are suggested in this utility model, and therefore remain within the spirit and scope of the exemplary embodiments of this utility model.

[0053] Meanwhile, specific terms are used to describe embodiments of this utility model. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of this utility model. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics in one or more embodiments of this utility model can be appropriately combined.

[0054] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed according to the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this invention are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

Claims

1. A reaction chamber structure, characterized in that, The reaction chamber structure includes: a reaction chamber, a vacuum valve, and an embedded box, wherein the embedded box is fixed on the reaction chamber; The vacuum valve includes a valve body and a sealing valve plate, wherein the sealing valve plate is connected to the valve body, the valve body is detachably mounted on the embedding box, and the sealing valve plate is inserted into the embedding box to form a sealing surface with the reaction chamber.

2. The reaction chamber structure according to claim 1, characterized in that, The reaction chamber includes a cover plate for covering the top of the reaction chamber, forming a reaction cavity with the reaction chamber.

3. The reaction chamber structure according to claim 2, characterized in that, When the cover plate is lifted up and down over the reaction chamber, the valve body can be detachably installed above the embedded box.

4. The reaction chamber structure according to claim 2, characterized in that, When the cover plate is fixed to the reaction chamber in a flip-top manner, the valve body can be detachably installed below the embedded box.

5. The reaction chamber structure according to claim 1, characterized in that, The vacuum valve includes a valve plate maintenance cover, which is detachably fixed to the embedded box.

6. The reaction chamber structure according to claim 5, characterized in that, The reaction chamber structure includes removable fasteners, and mounting holes are provided on the valve plate maintenance cover and the valve body; The valve plate maintenance cover and the valve body use the same or different sets of detachable fasteners and are connected to the embedding box by being installed in the mounting hole.

7. The reaction chamber structure according to claim 5, characterized in that, A first sealing element is provided between the valve plate maintenance cover and the embedded box to form a sealed cavity between the valve plate maintenance cover and the embedded box.

8. The reaction chamber structure according to claim 1, characterized in that, The vacuum valve includes a flange, which is used to connect and fix the sealing valve plate to the mounting surface when the sealing valve plate is inserted into the embedding box.

9. The reaction chamber structure according to claim 1, characterized in that, The reaction chamber structure includes a bushing fitted onto the reaction chamber. The bushing has vent holes arranged circumferentially on its upper surface and on the side facing the sealing valve plate. These vent holes are used to adjust the flow field distribution.

10. A semiconductor device processing apparatus, characterized in that, It includes a transmission chamber and a reaction chamber structure as described in any one of claims 1 to 9, wherein the insert is disposed between the reaction chamber and the transmission chamber.

11. The processing equipment according to claim 10, characterized in that, When the sealing valve plate is inserted into the embedding box, a second seal is provided between the embedding box and the transmission chamber.

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