Butterfly-shaped ceramic capacitor chip fixture

Abstract

The application provides a ceramic capacitor chip jig, and belongs to the technical field of capacitor jigs. The ceramic capacitor chip jig comprises a bottom plate, a first supporting plate, a second supporting plate and a circumferential limiting structure. The top of the bottom plate is provided with a first area and a second area. The first supporting plate is connected to the first area of the bottom plate. The first supporting plate is provided with a welding position for placing a ceramic capacitor chip. The welding position of the first supporting plate is provided with an avoiding groove for placing a pin. The depth of the avoiding groove is greater than the diameter of the pin. The second supporting plate is connected to the second area of the bottom plate. The top of the second supporting plate is provided with a placing groove corresponding to the avoiding groove. The circumferential limiting structure is connected to the welding position of the first supporting plate to circumferentially limit the ceramic capacitor chip. Since the depth of the avoiding groove is greater than the diameter of the pin, after the ceramic capacitor chip is turned over, the pin is placed into the avoiding groove, the ceramic capacitor chip can be in contact with the first supporting plate, and the situation that the ceramic capacitor chip is not flat can be reduced.

Description

Technical Field

[0001] This application belongs to the field of capacitor fixture technology, specifically relating to a butterfly-shaped ceramic capacitor chip fixture. Background Technology

[0002] Ceramic capacitor chips are key passive components in electronic circuits. They are made by alternating stacking and sintering of multiple layers of ceramic dielectric and metal electrodes, with metal terminals covering both ends to achieve pin connection. When voltage is applied, the charge displacement inside the ceramic dielectric forms polarization, storing electrical energy. After the power supply is disconnected, the charge is released to supply the circuit.

[0003] When soldering pins to the metal terminals of a ceramic capacitor chip, the operator needs to place the ceramic capacitor chip on the soldering worktable, then place one end of the pin on top of the ceramic capacitor chip, and solder the pin to the top of the ceramic capacitor chip using the soldering end of the soldering equipment; then flip the ceramic capacitor chip so that the bottom of the ceramic capacitor chip is flipped to the top, and then solder the other pin to the ceramic capacitor chip.

[0004] In the above welding method, when welding the pins at the bottom position, the bottom of the ceramic capacitor chip is flipped to the top, and the top is flipped to the bottom after welding. Since the top of the ceramic capacitor chip has already been welded, after flipping the top to the bottom, the pins come into contact with the welding worktable, which will cause the ceramic capacitor chip to be placed unevenly, affecting subsequent welding. Utility Model Content

[0005] This application provides a butterfly-shaped ceramic capacitor chip fixture, which aims to solve the problem of uneven placement of ceramic capacitor chips in the existing welding process.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: A butterfly-shaped ceramic capacitor chip fixture is provided, comprising: The base plate has a first area and a second area on the top; the first area is used to place ceramic capacitor chips, and the second area is used to place the free ends of the pins. A first support plate is connected to a first region of the base plate; the first support plate has a soldering position for placing a ceramic capacitor chip, and the soldering position of the first support plate is provided with a relief groove for placing a pin, the depth of the relief groove being greater than the diameter of the pin. A second support plate is connected to a second region of the base plate; the top of the second support plate has a placement slot corresponding to the clearance slot, the placement slot being able to place the free end of the pin; A circumferential limiting structure is connected to the welding position of the first support plate to circumferentially limit the ceramic capacitor chip.

[0007] In one possible implementation, the circumferential limiting structure includes an annular plate connected to the welding position of the first support plate, the inner circumferential wall of the annular plate being able to contact the outer circumferential wall of the ceramic capacitor chip; wherein, the annular plate has a notch at the position of the clearance groove.

[0008] In one possible implementation, the bottom of the annular plate is connected to a plurality of positioning posts, and the first support plate has through holes for insertion and engagement with the positioning posts; after the positioning posts are inserted and engaged with the annular plate, the annular plate is welded and fixed to the first support plate.

[0009] In one possible implementation, the circumferential limiting structure includes at least three limiting posts, and the first support plate is provided with a plurality of insertion holes at circumferential intervals at the welding position, the number of insertion holes corresponding to the number of limiting posts; wherein, the outer peripheral wall of each limiting post can contact the outer peripheral wall of the ceramic capacitor chip.

[0010] In one possible implementation, the height of the second support plate is higher than that of the first support plate, and the second support plate has two placement slots for placing the pins at the top and bottom positions of the ceramic capacitor chip.

[0011] In one possible implementation, one placement slot is configured to correspond to the clearance slot, and the other placement slot is configured to be offset from the clearance slot; the end of the placement slot that is offset from the clearance slot can contact the free end of the pin to restrict the placement position of the pin.

[0012] In one possible implementation, the base plate has limiting plates at both ends, the top of the limiting plates is bent, and the bent end of the limiting plates contacts the top of the first support plate; the limiting plates are connected to the welding worktable.

[0013] In one possible implementation, the welding position of the first support plate has a first through hole, and the base plate has a second through hole aligned with the first through hole; the welding portion of the pin is located within the first through hole; Aligned welding ends can be provided above and below the base plate to simultaneously weld the pins at the top and bottom of the ceramic capacitor chip.

[0014] In one possible implementation, the welding worktable has a strip-shaped hole, and when the base plate is placed on the welding worktable, the second through hole is located within the strip-shaped hole.

[0015] In one possible implementation, both the first and second regions of the base plate are provided with a plurality of threaded holes, and both the first and second support plates have through holes aligned with the threaded holes. The first and second support plates are connected to the base plate by bolts.

[0016] This application provides a butterfly-shaped ceramic capacitor chip fixture. Compared with the prior art, the base plate is fixed on the welding worktable, and then the ceramic capacitor chip is placed on the welding position of the first support plate. The operator places the welding position of one of the pins on the top of the ceramic capacitor chip and places the free end of the pin on the second support plate. Then, the welding end of the welding equipment is used to weld the pin to the top of the ceramic capacitor chip. The ceramic capacitor chip is flipped over, and the top pin can be placed into the clearance groove and the placement groove. Since the depth of the clearance groove is greater than the diameter of the pin, the ceramic capacitor chip can contact the first support plate after the pin is placed in the clearance groove, reducing the possibility of unevenness of the ceramic capacitor chip. After the above settings, the operator can weld the other pin to the ceramic capacitor chip. At this point, the metal electrodes at both ends of the ceramic capacitor chip are welded with pins. Attached Figure Description

[0017] Figure 1 A schematic diagram of a butterfly-shaped ceramic capacitor chip fixture provided in an embodiment of this application; Figure 2 for Figure 1 Enlarged diagram of section A in the middle; Figure 3 A schematic diagram of the strip-shaped hole portion of a butterfly-shaped ceramic capacitor chip fixture provided in an embodiment of this application; Figure 4 A schematic diagram of the second support plate portion of a butterfly-shaped ceramic capacitor chip fixture provided in an embodiment of this application; Figure 5 for Figure 4 Enlarged diagram of section B in the middle; Figure 6 A schematic diagram of the first support plate portion of a butterfly-shaped ceramic capacitor chip fixture provided in an embodiment of this application; Figure 7 for Figure 6 Enlarged diagram of section C.

[0018] Explanation of reference numerals in the attached drawings: 1. Base plate; 2. First support plate; 21. Clearance groove; 3. Second support plate; 31. Placement groove; 4. Ceramic capacitor chip; 5. Pin; 6. Welding workbench; 61. Strip hole; 7. Annular plate; 71. Notch; 72. Positioning post; 8. Limiting post; 9. Limiting plate. Detailed Implementation

[0019] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0020] Please refer to the following: Figures 1 to 7 This application describes a butterfly-shaped ceramic capacitor chip fixture. The butterfly-shaped ceramic capacitor chip fixture includes a base plate 1, a first support plate 2, a second support plate 3, and a circumferential limiting structure. The top of the base plate 1 has a first region and a second region. The first region is used to place the ceramic capacitor chip 4, and the second region is used to place the free end of the pin 5. The first support plate 2 is connected to the first region of the base plate 1. The first support plate 2 has a welding position for placing the ceramic capacitor chip 4, and the welding position of the first support plate 2 has a relief groove 21 for placing the pin 5, the depth of which is greater than the diameter of the pin 5. The second support plate 3 is connected to the second region of the base plate 1. The top of the second support plate 3 has a placement groove 31 corresponding to the relief groove 21, which can place the free end of the pin 5. The circumferential limiting structure is connected to the welding position of the first support plate 2 to circumferentially limit the ceramic capacitor chip 4.

[0021] This application provides a butterfly-shaped ceramic capacitor chip fixture. Compared with the prior art, the base plate 1 is fixed on the welding worktable 6, and then the ceramic capacitor chip 4 is placed on the welding position of the first support plate 2. The operator places the welding position of one of the pins 5 on the top of the ceramic capacitor chip 4 and places the free end of the pin 5 on the second support plate 3. Then, the welding position of the pin 5 is welded to the top of the ceramic capacitor chip 4 through the welding end of the welding equipment.

[0022] Flip the ceramic capacitor chip 4 so that the top pin 5 can be placed into the clearance groove 21 and the placement groove 31. Since the depth of the clearance groove 21 is greater than the diameter of the pin 5, the ceramic capacitor chip 4 can contact the first support plate 2 after the pin 5 is placed in the clearance groove 21, reducing the possibility of the ceramic capacitor chip 4 being uneven. After the above settings, the operator can solder the other pin 5 to the ceramic capacitor chip 4. At this point, the metal electrodes at both ends of the ceramic capacitor chip 4 are soldered with pin 5.

[0023] The circumferential limiting structure can limit the position of the ceramic capacitor chip 4. After the ceramic capacitor chip 4 is flipped, it can also be placed in the welding position of the first support plate 2.

[0024] With the above-mentioned configuration of this application, the clearance groove 21 on the first support plate 2 can provide clearance space, so that the pins 5 after the top of the ceramic capacitor chip 4 is soldered can be placed in the clearance groove 21 after being flipped. At this time, the bottom of the ceramic capacitor chip 4 can contact the first support plate 2, reducing the possibility of uneven placement.

[0025] In some embodiments, such as Figures 1 to 7As shown, the circumferential limiting structure includes an annular plate 7, which is connected to the welding position of the first support plate 2. The inner circumferential wall of the annular plate 7 can contact the outer circumferential wall of the ceramic capacitor chip 4. The annular plate 7 has a notch 71 at the position of the clearance groove 21.

[0026] By setting an annular plate 7 on the first support plate 2, the ceramic capacitor chip 4 can be circumferentially limited to ensure the positioning accuracy of the ceramic capacitor chip 4 after flipping.

[0027] By setting a notch 71 on the annular plate 7, and setting the notch 71 at a position corresponding to the clearance groove 21, it is convenient for the pin 5 on the ceramic capacitor chip 4 to be inserted into the clearance groove 21 from the notch 71 position; after the welding is completed, the pin 5 on the ceramic capacitor chip 4 can be taken out from the clearance groove 21, and the annular plate 7 will not interfere with the pin 5.

[0028] In some embodiments, such as Figures 1 to 7 As shown, the bottom of the annular plate 7 is connected to several positioning posts 72, and the first support plate 2 has through holes that can be inserted and matched with the positioning posts 72; after the positioning posts 72 are inserted and matched with the annular plate 7, the annular plate 7 is welded and fixed to the first support plate 2.

[0029] By setting a positioning post 72 at the bottom of the annular plate 7 and setting a through hole on the first support plate 2, the position of the annular plate 7 on the first support plate 2 can be initially positioned by inserting the positioning post 72 into the first support plate 2 before welding the annular plate 7 onto the first support plate 2. Then the annular plate 7 is welded onto the first support plate 2.

[0030] The above-described configuration method of this application enables rapid pre-positioning followed by overall welding, which improves assembly accuracy and reduces displacement of the annular plate 7 at the start of welding.

[0031] In some embodiments, such as Figures 1 to 7 As shown, the circumferential limiting structure includes at least three limiting posts 8. The first support plate 2 is provided with a number of insertion holes at circumferential intervals at the welding position, and the number of insertion holes corresponds to the number of limiting posts 8. The outer peripheral wall of each limiting post 8 can contact the outer peripheral wall of the ceramic capacitor chip 4.

[0032] This embodiment uses four limiting posts 8 as an example for explanation. The four limiting posts 8 are evenly arranged around the welding position. After the ceramic capacitor chip 4 is placed in the welding position, the four limiting posts 8 are in contact with the outer peripheral wall of the ceramic capacitor chip 4, which can limit the ceramic capacitor chip 4 in the circumference. After flipping the ceramic capacitor chip 4, the positioning accuracy can be guaranteed.

[0033] In some embodiments, such as Figures 1 to 7As shown, the height of the second support plate 3 is higher than that of the first support plate 2. There are two placement slots 31 on the second support plate 3 to place the pins 5 at the top and bottom positions of the ceramic capacitor chip 4. One placement slot 31 is set to correspond with the clearance slot 21, and the other placement slot 31 is set to be offset from the clearance slot 21. The end of the placement slot 31 that is offset from the clearance slot 21 can contact the free end of the pin 5 to restrict the placement position of the pin 5.

[0034] Since the pins 5 at both ends of the ceramic capacitor chip 4 are not on the same plane, while the free ends of the two pins 5 are basically on the same plane, the welding position and the free end of the pins 5 are no longer on the same plane. By setting the height of the second support plate 3 to be higher than the height of the first support plate 2, the free end and the welding position of the pins 5 can be accommodated respectively. That is, the welding position of the pins 5 can be placed in the clearance groove 21, and the free end of the pins 5 can be placed in the placement groove 31.

[0035] By setting two placement slots 31 on the second support plate 3, and the ends of the placement slots 31 that are offset from the avoidance slot 21 can contact the free end of the pin 5, the above method can limit the pin 5 and ensure the welding consistency after the pin 5 is welded.

[0036] It should be noted that there can be multiple welding positions on the first support plate 2, that is, multiple ceramic capacitor chips 4 can be placed on the first support plate 2, and there can be multiple welding ends of the welding equipment, which correspond one-to-one with the ceramic capacitor chips 4.

[0037] In some embodiments, such as Figures 1 to 7 As shown, both ends of the base plate 1 are provided with limiting plates 9. The top of the limiting plate 9 is bent and the bent end of the limiting plate 9 contacts the top of the first support plate 2. The limiting plate 9 is connected to the welding workbench 6.

[0038] By setting a limiting plate 9 on the welding workbench 6, the installation position of the base plate 1 can be limited; when the base plate 1 is placed on the welding workbench 6, the position of the first support plate 2 is inserted between the two limiting plates 9, and when the side of the second support plate 3 contacts the bent end of the limiting plate 9, the base plate 1 is installed in place; through the above setting, the bent end of the limiting plate 9 can play the role of limiting the height of the base plate 1.

[0039] In some embodiments, such as Figures 1 to 7As shown, the welding position of the first support plate 2 has a first through hole, and the base plate 1 has a second through hole aligned with the first through hole; the welding portion of the pin 5 is located inside the first through hole; wherein, welding ends aligned with each other can be provided above and below the base plate 1 to simultaneously weld the pins 5 at the top and bottom positions of the ceramic capacitor chip 4; the welding worktable 6 has a strip hole 61, and when the base plate 1 is placed on the welding worktable 6, the second through hole is located inside the strip hole 61.

[0040] This embodiment uses a two-end welding method. Compared to the top welding method, two-end welding does not require flipping the ceramic capacitor chip 4. The pins 5 at both ends of the ceramic capacitor chip 4 are welded simultaneously.

[0041] The welding equipment has welding ends both above and below the base plate 1. The welding ends correspond to the ceramic capacitor chip 4 and have the freedom to move closer to or further away from the ceramic capacitor chip 4. The up-and-down movement of the welding ends is existing technology and will not be described in detail here.

[0042] Before soldering, place the soldering portion of one of the pins 5 in the clearance groove 21 and place the free end of the pin 5 in the placement groove 31; then place the ceramic capacitor chip 4 on the first support plate 2, with the ceramic capacitor chip 4 in contact with the first support plate 2 and the soldering portion of the pin 5 in contact with the bottom of the ceramic capacitor chip 4; finally, place the free end of the other pin 5 in another placement groove 31 and place the soldering portion of the pin 5 on top of the ceramic capacitor chip 4.

[0043] The soldering ends above and below the base plate 1 are simultaneously close to pin 5 and can simultaneously abut against pin 5 to solder pin 5 onto ceramic capacitor chip 4; after soldering, the soldering ends above and below the base plate 1 are simultaneously moved away from pin 5.

[0044] It should be noted that the soldering method between pin 5 and ceramic capacitor chip 4 is existing technology. Pin 5 can be subjected to other operations that facilitate soldering before soldering, such as tinning.

[0045] In some embodiments, such as Figures 1 to 7 As shown, the first and second regions of the base plate 1 are provided with several threaded holes, and the first support plate 2 and the second support plate 3 are both provided with through holes aligned with the threaded holes. The first support plate 2 and the second support plate 3 are connected to the base plate 1 by bolts.

[0046] The above configuration facilitates the installation of the first support plate 2 and the second support plate 3 on the base plate 1. The first support plate 2 and the second support plate 3 are used together. The first support plate 2 and the second support plate 3 have various models. When using them, select one model and fix the corresponding model of the first support plate 2 and the second support plate 3 on the base plate 1.

[0047] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A butterfly-shaped ceramic capacitor chip fixture, characterized in that, include: The base plate has a first area and a second area on the top; the first area is used to place ceramic capacitor chips, and the second area is used to place the free ends of the pins. A first support plate is connected to a first region of the base plate; the first support plate has a soldering position for placing a ceramic capacitor chip, and the soldering position of the first support plate is provided with a relief groove for placing a pin, the depth of the relief groove being greater than the diameter of the pin. A second support plate is connected to a second region of the base plate; the top of the second support plate has a placement slot corresponding to the clearance slot, the placement slot being able to place the free end of the pin; A circumferential limiting structure is connected to the welding position of the first support plate to circumferentially limit the ceramic capacitor chip.

2. The butterfly-shaped ceramic capacitor chip fixture as described in claim 1, characterized in that, The circumferential limiting structure includes an annular plate connected to the welding position of the first support plate, and the inner circumferential wall of the annular plate can contact the outer circumferential wall of the ceramic capacitor chip; wherein, the annular plate is provided with a notch at the position of the clearance groove.

3. The butterfly-shaped ceramic capacitor chip fixture as described in claim 2, characterized in that, The bottom of the annular plate is connected to several positioning posts, and the first support plate has through holes that are inserted into the positioning posts; after the positioning posts are inserted into the annular plate, the annular plate is welded and fixed to the first support plate.

4. The butterfly-shaped ceramic capacitor chip fixture as described in claim 1, characterized in that, The circumferential limiting structure includes at least three limiting posts. The first support plate is provided with a number of insertion holes at circumferential intervals at the welding position, and the number of insertion holes corresponds to the number of limiting posts. The outer peripheral wall of each limiting post can contact the outer peripheral wall of the ceramic capacitor chip.

5. A butterfly-shaped ceramic capacitor chip fixture as described in claim 1, characterized in that, The second support plate is higher than the first support plate, and there are two placement slots on the second support plate to place the pins at the top and bottom positions of the ceramic capacitor chip.

6. The butterfly-shaped ceramic capacitor chip fixture as described in claim 5, characterized in that, One placement slot is set to correspond with the clearance slot, and the other placement slot is set to be offset from the clearance slot; the end of the placement slot that is offset from the clearance slot can contact the free end of the pin to restrict the placement position of the pin.

7. A butterfly-shaped ceramic capacitor chip fixture as described in claim 6, characterized in that, Both ends of the base plate are provided with limiting plates, the top of the limiting plates are bent, and the bent end of the limiting plates contacts the top of the first support plate; the limiting plates are connected to the welding worktable.

8. A butterfly-shaped ceramic capacitor chip fixture as described in claim 1, characterized in that, The first support plate has a first through hole at the welding position, and the base plate has a second through hole aligned with the first through hole; the welding portion of the pin is located inside the first through hole; Aligned welding ends can be provided above and below the base plate to simultaneously weld the pins at the top and bottom of the ceramic capacitor chip.

9. A butterfly-shaped ceramic capacitor chip fixture as described in claim 8, characterized in that, The welding worktable has a strip-shaped hole, and when the base plate is placed on the welding worktable, the second through hole is located inside the strip-shaped hole.

10. A butterfly-shaped ceramic capacitor chip fixture as described in claim 1, characterized in that, The first and second regions of the base plate are each provided with a plurality of threaded holes. The first and second support plates are each provided with through holes aligned with the threaded holes. The first and second support plates are connected to the base plate by bolts.

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