Chip heat dissipation structure of high-speed connector

Abstract

The utility model relates to a chip heat dissipation structure of high speed connector, including shell, the PCB of fixed in shell and the chip fixed on PCB, its characterized in that the chip surface is equipped with heat dissipation copper sheet, the upper surface of this heat dissipation copper sheet is fixed with the array distribution a plurality of convex column, and the inner top of shell distribution is equipped with the recess for the convex column - - - corresponding embedding, and the upper surface between heat dissipation copper sheet and the inner top surface of shell, and the clearance of the outer wall surface of convex column and the inner wall surface of recess all fills with heat dissipation paste. This heat dissipation structure can increase the contact area of chip surface heat dissipation copper sheet and the inner top of shell, to improve the heat dissipation effect, further satisfy the heat dissipation demand of chip power consumption promotion time of high speed connector.

Description

Technical Field

[0001] This utility model relates to a chip heat dissipation structure for high-speed connectors. Background Technology

[0002] Known multi-channel high-speed connectors in the communications industry all have a housing to encapsulate the internal PCB and its chip. One end of the PCB has gold fingers for insertion, while the other end typically has multiple rows of pads along its width for connecting the cables of each channel. Because the chips in these high-speed connectors generate significant heat during continuous operation in practical applications, the lack of heat dissipation would affect their operational stability; therefore, a heat dissipation structure needs to be added inside the housing.

[0003] Conventional chip heat dissipation structures primarily involve filling the gap between the inner wall of the casing and the chip surface with thermal paste to enhance heat dissipation. However, with the widespread application of AI technology and the advent of the Internet of Things era, data center scale is experiencing explosive growth. To meet the diverse application scenarios of next-generation data centers, metropolitan area networks, and edge computing, high-speed copper cables or optical modules of 400G, 800G, and even 1.6T and above have become mainstream products for handling large-scale data interaction. With the application of these products, the chip computing density and power consumption of their accompanying high-speed connectors also increase, significantly boosting heat generation. The traditional heat dissipation structures described above are no longer sufficient to meet these needs and urgently require improvement. Summary of the Invention

[0004] The purpose of this invention is to provide a chip heat dissipation structure for a high-speed connector, which has a better heat dissipation effect and further meets the heat dissipation requirements when the chip power consumption of the high-speed connector increases.

[0005] The technical solution of this utility model is: a chip heat dissipation structure for a high-speed connector, including a shell, a PCB fixed inside the shell, and a chip fixed on the PCB. The chip surface is provided with a heat dissipation copper sheet, and the upper surface of the heat dissipation copper sheet is fixed with a plurality of protrusions arranged in an array. The inner top wall of the shell is provided with grooves for the protrusions to be inserted one-to-one. The gap between the upper surface of the heat dissipation copper sheet and the surface of the inner top wall of the shell, as well as the gap between the outer wall surface of the protrusion and the inner wall surface of the groove, are filled with heat dissipation paste.

[0006] Furthermore, in this invention, a boss is fixed on the inner top wall of the outer casing, opposite to the heat dissipation copper fin below. The surface of the boss is provided with the grooves, and the gap between the upper surface of the heat dissipation copper fin and the surface of the boss, as well as the gap between the outer wall of the boss and the inner wall of the groove, are filled with the heat dissipation paste. The boss is introduced to enhance the strength of the inner top wall of the outer casing.

[0007] Furthermore, the contour shape of the groove in this invention perfectly matches the contour shape of the protrusion.

[0008] Furthermore, the protruding post described in this utility model is a cylindrical protruding post, or a conical protruding post, or a frustum-shaped protruding post, or a prism.

[0009] Furthermore, in this invention, the protruding post is welded or integrally formed on the surface of the boss.

[0010] Furthermore, the outer shell of this utility model includes an upper shell and a lower shell, the PCB is clamped and fixed between the upper shell and the lower shell, the boss is formed on the inner top wall of the upper shell, and the heat dissipation copper sheet is pressed by the boss onto the upper surface of the PCB.

[0011] The advantages of adopting the technical solution of this utility model are as follows: 1. In this utility model, the chip surface contacts the outer shell through a heat dissipation copper sheet, and the protrusions distributed in an array on the heat dissipation copper sheet cooperate with the grooves provided on the inner top wall of the outer shell, thereby greatly increasing the contact heat dissipation area between the heat dissipation copper sheet and the outer shell, thus effectively improving the heat dissipation effect and further meeting the heat dissipation requirements when the chip power consumption of high-speed connectors increases.

[0012] 2. In this utility model, the heat dissipation copper sheet is pressed against the chip surface by the protrusion on the upper shell to achieve longitudinal positioning, while the array of protrusions on the heat dissipation copper sheet and the groove on the protrusion cooperate to complete the lateral positioning of the heat dissipation copper sheet. Therefore, there is no need to install an additional positioning mechanism in the shell to fix the heat dissipation copper sheet, which saves the internal space of the shell, simplifies the production process and saves production costs.

[0013] The objectives, advantages, and features of this utility model will be illustrated and explained through the following non-limiting description of preferred embodiments, which are given by way of example only with reference to the accompanying drawings. Attached Figure Description

[0014] Figure 1 This is a main sectional view of the present invention; Figure 2 This is a separate three-dimensional structural diagram of the PCB and the chip on it in this utility model; Figure 3 for Figure 2 A separate 3D structural diagram of the chip after a copper heat sink has been added; Figure 4 This is a three-dimensional structural diagram of the upper shell that constitutes the outer shell in this utility model (with the inner top wall facing upwards).

[0015] In the diagram: 1. Outer shell; 101. Upper shell; 102. Lower shell; 2. PCB; 3. Chip; 4. Copper heat sink; 5. Protrusion; 6. Groove; 7. Thermal paste; 8. Boss. Detailed Implementation

[0016] Example: The following is combined with Figures 1-4 The specific implementation of the chip heat dissipation structure of the high-speed connector provided by this utility model is described below: This high-speed connector product of the present embodiment is used in high-speed copper cables with transmission rates of 400G, 800G and above 1.6T. Its structure is the same as that of conventional technology, with a housing 1, a PCB2 fixed inside the housing 1 and a chip 3 fixed on the PCB2. One end of the PCB2 is for inserting gold fingers, while the other end usually has multiple rows of solder pads distributed along its width for connecting the cables of each channel respectively.

[0017] Still combined Figures 1-4 As shown, the core improvement of this utility model lies in the fact that the surface of the chip 3 is provided with a heat dissipation copper plate 4. The upper surface of the heat dissipation copper plate 4 is fixed with a plurality of protrusions 5 arranged in a rectangular array (specifically, a square array of five columns and five rows, totaling 25 protrusions 5). The inner top wall of the outer casing 1 is fixed with a boss 8 opposite to the heat dissipation copper plate 4 below. The surface of the boss 8 is provided with grooves 6 for the protrusions 5 to be inserted one-to-one. Furthermore, the gap between the upper surface of the heat dissipation copper plate 4 and the surface of the boss 8, as well as the gap between the outer wall of the protrusion 5 and the inner wall of the groove 6, are all filled with the heat dissipation paste 7, specifically as follows: Figure 1 As shown.

[0018] In this embodiment, the protrusion 5 is a frustum-shaped protrusion and is integrally formed on the surface of the protrusion 8. The contour shape of the groove 6 is completely matched with the contour shape of the protrusion 5.

[0019] like Figure 1 As shown, in this embodiment, the outer shell 1 includes an upper shell 101 and a lower shell 102. The PCB2 is clamped and fixed between the upper shell 101 and the lower shell 102. The boss 8 is formed on the inner top wall of the upper shell 101, and the heat dissipation copper sheet 4 is pressed by the boss 8 onto the upper surface of the PCB2. Compared to conventional chip heat dissipation structures, the chip 3 in this invention contacts the outer shell 1 via a heat dissipation copper sheet 4. Furthermore, protrusions 5 are arrayed on the heat dissipation copper sheet 4 to cooperate with grooves 6 provided on the inner top wall of the outer shell 1, thereby greatly increasing the contact heat dissipation area between the heat dissipation copper sheet 4 and the outer shell 1, thus effectively improving the heat dissipation effect and further meeting the heat dissipation requirements when the chip power consumption of high-speed connectors increases.

[0020] Furthermore, the heat sink copper sheet 4 is pressed against the surface of the chip 3 by the protrusion 8 on the upper shell 101 for vertical positioning, while the array of protrusions 5 on the heat sink copper sheet 4 and the grooves 6 on the protrusion 8 cooperate to complete the lateral positioning of the heat sink copper sheet 4. Therefore, there is no need to install an additional positioning mechanism inside the shell 1 to fix the heat sink copper sheet 4, which saves the internal space of the shell 1, simplifies the production process and saves production costs.

[0021] Of course, the above are merely specific application examples of this utility model and do not constitute any limitation on the scope of protection of this utility model. In addition to the above embodiments, this utility model may have other implementation methods. All technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of protection claimed by this utility model.

Claims

1. A chip heat dissipation structure for a high-speed connector, comprising a housing (1), a PCB (2) fixed inside the housing (1), and a chip (3) fixed on the PCB (2), characterized in that... The chip (3) has a heat dissipation copper sheet (4) on its surface. The upper surface of the heat dissipation copper sheet (4) is fixed with a plurality of protrusions (5) arranged in an array. The inner top wall of the outer shell (1) is provided with grooves (6) for the protrusions (5) to be inserted one by one. The gap between the upper surface of the heat dissipation copper sheet (4) and the inner top wall of the outer shell (1), as well as the gap between the outer wall of the protrusion (5) and the inner wall of the groove (6), is filled with heat dissipation paste (7).

2. The chip heat dissipation structure of the high-speed connector according to claim 1, characterized in that... The inner top wall of the outer shell (1) is fixed with a boss (8) opposite to the heat dissipation copper plate (4) below. The surface of the boss (8) is provided with the groove (6). The heat dissipation paste (7) is filled between the upper surface of the heat dissipation copper plate (4) and the surface of the boss (8), as well as between the outer wall of the protrusion (5) and the inner wall of the groove (6).

3. The chip heat dissipation structure of the high-speed connector according to claim 1, characterized in that: The contour shape of the groove (6) perfectly matches the contour shape of the protrusion (5).

4. The chip heat dissipation structure of the high-speed connector according to claim 3, characterized in that: The protruding post (5) is a cylindrical protruding post, or a conical protruding post, or a frustum-shaped protruding post, or a prism.

5. The chip heat dissipation structure of the high-speed connector according to claim 2, characterized in that: The protruding post (5) is welded or integrally formed on the surface of the boss (8).

6. The chip heat dissipation structure of the high-speed connector according to claim 2 or 5, characterized in that: The outer shell (1) includes an upper shell (101) and a lower shell (102). The PCB (2) is clamped and fixed between the upper shell (101) and the lower shell (102). The boss (8) is formed on the inner top wall of the upper shell (101), and the heat dissipation copper sheet (4) is pressed by the boss (8) onto the upper surface of the PCB (2).

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