Spray device and thin film deposition system

Abstract

The utility model discloses a kind of spraying device and thin film deposition system, first surface of first plate body is equipped with air inlet and multiple interval arrangement air outlet, air inlet and air outlet interval arrangement. Second plate body is detachably connected with first plate body, and interlayer space is formed between the two, air inlet and air outlet are all communicated in interlayer space, air inlet is configured to be supplied into interlayer space for reaction medium, and air outlet is configured to be supplied out of interlayer space for reaction medium. Through the interlayer space formed between first plate body and second plate body, first plate body and second plate body are detachably connected. In this way, after the spraying device is used for a period of time, the first plate body can be disassembled, the air outlet of the first plate body and the interior of the second plate body can be cleaned, thereby improving the cleaning effect of the air outlet, and preventing the interior of the second plate body from being blocked, thereby ensuring the normal use of the spraying device.

Description

Technical Field

[0001] This application relates to the field of solar cell production, and more particularly to a spraying device and a thin film deposition system. Background Technology

[0002] In thin film deposition systems, the performance and reliability of the spray device are crucial to the normal operation of the entire system. It needs to maintain a stable operating state during long deposition processes to ensure the uniformity and stability of the deposition.

[0003] In related technologies, multiple vents are typically provided on the spray device to introduce the reaction medium into the reaction chamber of the thin film deposition equipment. However, after prolonged use, the vents on the spray device may become clogged, requiring cleaning or unclogging to avoid affecting the quality of the thin film deposition. However, cleaning the spray device usually involves unclogging the vents from one side. Due to the small vent diameter, this unclogging method has limited effectiveness and may consequently affect the normal operation of the thin film deposition equipment. Utility Model Content

[0004] This utility model discloses a spraying device and a thin film deposition system, which makes the spraying device detachable, thereby facilitating cleaning of the spraying device.

[0005] To achieve the above objectives, the first aspect of this utility model discloses a spraying device, comprising:

[0006] A first plate has a first surface, on which an air inlet hole and a plurality of spaced-apart air outlet holes are provided, the air inlet hole and the air outlet holes being spaced apart.

[0007] The second plate is detachably connected to the first plate, and a sandwich space is formed between the second plate and the first plate. The air inlet and the air outlet are both connected to the sandwich space.

[0008] The air inlet is configured to allow the reaction medium to enter the interlayer space, and the air outlet is configured to allow the reaction medium to exit from the interlayer space.

[0009] As an optional implementation, the first plate also has a second surface opposite to the first surface, the second surface having a first recess, the second plate having a third surface having a second recess, the first plate being supported in the second recess, the first recess and the second recess communicating with each other to jointly form the interlayer space.

[0010] As an optional implementation, the bottom surface of the first recess is provided with a groove, and the bottom surface of the second recess is provided with a protrusion, the protrusion engaging with the groove.

[0011] As an optional implementation, the protrusion is an annular protrusion, and the interlayer space is formed between the bottom surface of the first recess, the bottom surface of the second recess, and the surface of the protrusion.

[0012] As an optional implementation, when the protrusion engages with the groove, the surface of the protrusion and the inner wall of the groove are in contact.

[0013] As an optional implementation, the air inlet is closer to the edge of the first surface than the air outlet, the projection of the groove on the first surface is closer to the edge of the first surface than the air inlet, and the projection of the groove on the first surface is outside the projection range of the interlayer space on the first surface.

[0014] As an optional implementation, the first surface is further provided with a first mounting hole, which penetrates the first plate along the thickness direction of the first plate. The second plate is provided with a second mounting hole corresponding to the first mounting hole. The first mounting hole and the second mounting hole are configured to allow fasteners to pass through to connect the first plate and the second plate.

[0015] As an optional implementation, the second mounting hole is a blind hole, which penetrates the surface of the second plate near the first plate.

[0016] As an optional implementation, the first mounting hole is spaced apart from the air inlet and the air outlet, and the first mounting hole is closer to the edge of the first surface than the air inlet. The first mounting hole, the air inlet and the air outlet are arranged sequentially in the direction from the edge of the first surface to the center of the first surface. The first mounting hole is located outside the projection range of the interlayer space on the first surface.

[0017] Secondly, this utility model also discloses a thin film deposition system, including a thin film deposition apparatus and a spraying device as described in the first aspect above. The thin film deposition apparatus has an opening, and the spraying device is configured to cover the opening so that the vent is connected to the thin film deposition apparatus to allow the reaction medium to pass through the thin film deposition apparatus.

[0018] Compared with the prior art, the beneficial effects of this application are:

[0019] This utility model provides a spraying device and a thin film deposition system. The spraying device includes a first plate and a second plate, which are separately arranged. The first plate has an air inlet and a plurality of spaced-apart air outlets on its first surface. The second plate is detachably connected to the first plate, and a space is formed between them. Both the air inlet and the air outlets are connected to the space. The air inlet is configured to allow the reaction medium to enter the space, and the air outlets are configured to allow the reaction medium to exit from the space. Therefore, the spraying device of this application, through the space formed between the first and second plates and the detachable connection between them, allows the first plate to be disassembled after a period of use to clean the air outlets, thereby improving the cleaning effect and ensuring the normal operation of the spraying device. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the spraying device disclosed in the embodiments of this application;

[0022] Figure 2 yes Figure 1 Cross-sectional view at point AA;

[0023] Figure 3 This is a schematic diagram of the structure of the first plate body disclosed in the embodiments of this application;

[0024] Figure 4 yes Figure 3 Cross-sectional view at point BB;

[0025] Figure 5 This is a schematic diagram of the structure of the second plate body disclosed in the embodiments of this application;

[0026] Figure 6 yes Figure 5 Cross-sectional view at point CC;

[0027] Figure 7 yes Figure 5 Another cross-sectional view at point CC;

[0028] Figure 8 yes Figure 1 Cross-sectional view at point DD;

[0029] Figure 9 This is a schematic diagram of the structure of the thin film deposition system disclosed in the embodiments of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100 - Spraying device; 1 - First plate; 11 - First surface; 111 - Air inlet; 112 - Air outlet; 113 - First mounting hole; 12 - Second surface; 121 - First recess; 121a - Groove; 2 - Second plate; 21 - Third surface; 211 - Second recess; 211a - Protrusion; 211b - Third recess; 212 - Second mounting hole; 3 - Interlayer space; 200 - Thin film deposition system; 201 - Thin film deposition equipment. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In this application, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated equipment, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0034] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0035] Furthermore, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection via an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0037] Thin-film deposition (TFT-DP) is a crucial technology for uniformly coating functional thin-film materials onto substrates (such as silicon wafers, glass, or flexible substrates) in solar cells, directly impacting the cell's photoelectric conversion efficiency and stability. Atomic-layer deposition (ALD) is one such TFT-DP process. ALD is a chemically reaction-based deposition process that utilizes a gaseous precursor to react chemically with the substrate surface, forming a film only one atomic or molecular layer thick at a time. By alternately introducing different reactive gases, a self-limiting reaction occurs on the substrate surface, allowing for precise control of the film thickness at the atomic level.

[0038] Atomic layer deposition (ALD) equipment includes a reaction chamber and a spray system. Reactive gases are introduced into the reaction chamber through vents in the spray system, thereby uniformly coating functional thin film materials onto a substrate. However, after prolonged use, the vents in the spray system may become clogged, requiring cleaning or unclogging to avoid affecting the quality of the film deposition.

[0039] In related technologies, when cleaning a spray device, the pores are usually cleared from one side of the spray device. However, since the pore diameter is small, this clearing method has limited effectiveness and may affect the normal use of the thin film deposition equipment.

[0040] In view of this, this application discloses a spraying device and a thin film deposition system, including a first plate and a second plate that are detachably connected. The first plate has an air inlet and a plurality of spaced-apart air outlets on its first surface. A space is formed between the second plate and the first plate, and both the air inlet and air outlets are connected to this space. The air inlet allows the reaction medium to enter the space, and the air outlets allow the reaction medium to exit from the space. Because the first and second plates are detachably connected, when the spraying device needs cleaning after a period of use, the first and second plates can be disassembled to clean the air outlets of the first plate and the interior of the second plate. This improves the cleaning effect of the air outlets and prevents blockage inside the second plate, thus ensuring the normal operation of the spraying device.

[0041] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0042] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the spraying device disclosed in the embodiments of this application. Figure 2 yes Figure 1A cross-sectional view at point AA. The spray device 100 includes a first plate 1 and a second plate 2. The first plate 1 has a first surface 11, on which air inlets 111 and a plurality of spaced-apart outlets 112 are provided. The second plate 2 is detachably connected to the first plate 1, and a space 3 is formed between the second plate 2 and the first plate 1. Both the air inlets 111 and the outlets 112 are connected to the space 3. The air inlets 111 are configured to allow the reaction medium to enter the space 3, and the outlets 112 are configured to allow the reaction medium to exit from the space 3.

[0043] The spray device 100 disclosed in this application is detachably connected to the first plate 1 via a second plate 2. This allows the first plate 1 and the second plate 2 to be disassembled when the air inlet 111 and air outlet 112 become clogged after a period of use, enabling direct cleaning of the first plate 1 from both sides. This improves the cleaning effect on the air inlet 111 and air outlet 112, ensuring the normal operation of the spray device 100.

[0044] Secondly, an interlayer space 3 is formed between the first plate 1 and the second plate 2. The existence of this interlayer space 3 acts as a buffer and distribution area, allowing the reaction medium to first enter the interlayer space 3 through the air inlet 111 and then be uniformly sprayed out from each air outlet 112. This design can effectively reduce the situation where the reaction medium enters directly through the air inlet 111 and causes local spraying that is too strong or too weak due to pressure concentration, thereby improving the uniformity of the reaction medium sprayed by the spraying device 100.

[0045] It is understood that the first plate 1 and the second plate 2 mentioned above can be stainless steel plates or ceramic plates, etc., and this embodiment does not make specific limitations on them.

[0046] It is understood that the first plate 1 and the second plate 2 mentioned above can be square plates or circular plates, etc., and this embodiment does not make specific limitations on this.

[0047] It is understood that the reaction medium can be trimethylaluminum (TMA) and water vapor to generate alumina (Al2O3) film, or it can be tetraisopropoxytitanium (TTIP) and O2 or O3 to generate titanium dioxide (TiO2) film. The specific choice can be made according to the process requirements, and this embodiment does not make specific limitations.

[0048] It is understood that the first plate 1 and the second plate 2 can be, for example, square plates or circular plates, and can be specifically set according to the shape of the reaction chamber. This embodiment will be described using square plates as an example. Of course, in other embodiments, the first plate 1 and the second plate 2 can also be irregularly shaped plates.

[0049] Please see Figures 3 to 6 , Figure 3 This is a schematic diagram of the structure of the first plate body disclosed in the embodiments of this application. Figure 4 yes Figure 3 Cross-sectional view at point BB. Figure 5 This is a schematic diagram of the structure of the second plate body disclosed in the embodiments of this application. Figure 6 yes Figure 5 Cross-sectional view at point CC.

[0050] In some embodiments, the first plate 1 further has a second surface 12 opposite to the first surface 11, and the second surface 12 has a first recess 121. The second plate 2 has a third surface 21, and the third surface 21 has a second recess 211, in which the first plate 1 is disposed. The first recess 121 and the second recess 211 are in communication with each other to jointly form the aforementioned interlayer space 3.

[0051] First, by placing the first plate 1 within the second recess 211 of the second plate 2, the first plate 1 and the second plate 2 form a nested relationship. This allows the first plate 1 and the second plate 2 to restrain each other in the horizontal direction, effectively preventing relative displacement or shaking. Furthermore, the edge of the first plate 1 forms a circumferential contact with the sidewall of the second recess 211, which increases the path length for sealing the interlayer space 3, thereby reducing the risk of leakage of the reaction medium from the plate edges.

[0052] It is understandable that the size of the second recess 211 should be adapted to the size of the first plate 1 so that when the first plate 1 is placed in the second recess 211, the two can fit together tightly, thereby reducing the risk of leakage of the reaction medium in the interlayer space 3.

[0053] It is understandable that when the first plate 1 is placed in the second recess 211 of the second plate 2, the first surface 11 of the first plate 1 can be flush with the third surface 21 of the second plate 2 or slightly lower than the third surface 21 of the second plate 2, so that the first plate 1 and the second plate 2 can be roughly formed as an integral structure in appearance.

[0054] It is understandable that, as mentioned above, the first plate 1 and the second plate 2 can be square plates, so the second recess 211 can also be a square recess, thus being able to accommodate the first plate 1.

[0055] Optionally, the bottom surface of the first recessed portion 121 is provided with a groove portion 121a, and the bottom surface of the second recessed portion 211 is provided with a protrusion portion 211a, which engages with the groove portion 121a.

[0056] First, by engaging the groove 121a with the protrusion 211a, a mechanical interlock can be formed between the protrusion 211a and the groove 121a, thereby providing constraints in both the horizontal and vertical directions. This allows the first plate 1 and the second plate 2 to better resist displacement caused by external forces (such as airflow impact or equipment vibration) when they are installed together.

[0057] Secondly, the engaging connection between the recessed portion 121a and the protruding portion 211a can also form a shape such as Figure 4 The sealing of the paper surface in the left and right directions further prevents leakage of the reaction medium in the interlayer space 3.

[0058] It is understood that the groove 121a and the protrusion 211a can be made into a centrally symmetrical structure, such as a cylindrical groove 121a and a cylindrical protrusion 211a. Of course, in order to prevent the assembly direction of the first plate 1 and the second plate 2 from being incorrect, the groove 121a and the protrusion 211a can also be made into a non-centrally symmetrical structure, such as an eccentric circle. This embodiment does not make specific limitations on this.

[0059] In some embodiments, please refer to... Figures 3 to 6 The aforementioned protrusion 211a is an annular protrusion 211a, and the aforementioned interlayer space 3 is formed between the bottom surface of the first recess 121, the bottom surface of the second recess 211, and the surface of the protrusion 211a. Since the protrusion 211a is an annular protrusion 211a, the corresponding groove 121a should also be an annular groove 121a. In this way, the annular protrusion 211a and the groove 121a can cooperate to form an annular sealing surface, and this annular seal can provide a stronger sealing effect.

[0060] In addition, the annular protrusion 211a and the groove 121a can evenly distribute the pressure in the interlayer space 3. When the reaction medium is introduced into the interlayer space 3 and pressure fluctuations are generated, the annular protrusion 211a can make the force on each part balanced, and it is not easy to cause sealing failure due to local stress concentration, thus maintaining stable sealing performance.

[0061] It is understood that the aforementioned annular protrusion 211a can be a square annular protrusion 211a or a circular annular protrusion 211a, etc., and the corresponding groove 121a can be a square annular groove 121a or a circular annular groove 121a, etc. This embodiment does not make specific limitations in this regard.

[0062] Please see Figure 7 , Figure 7 yes Figure 5 Another cross-sectional view at CC. It is understood that a third recess 211b can also be formed on the bottom surface of the second recess 211, and the third recess 211b is located inside the annular protrusion 211a. In this way, the bottom surface of the first recess 121, the bottom surface of the third recess 211b and the surface of the protrusion 211a are arranged to form the above-mentioned interlayer space 3. This can increase the height of the interlayer space 3, thereby increasing the size of the interlayer space 3, and thus helping to reduce the flow resistance of the reaction medium in the interlayer space 3.

[0063] Optionally, when the protrusion 211a and the recess 121a are engaged, the surface of the protrusion 211a and the inner wall of the recess are in contact. This ensures that when the first plate 1 and the second plate 2 are connected, the protrusion 211a and the recess 121a can be tightly joined without gaps, thereby reducing the probability of leakage of the reaction medium within the interlayer space 3 from the engagement point of the protrusion 211a and the recess 121a.

[0064] Please continue reading. Figures 3 to 6 In some embodiments, the air inlet 111 is closer to the edge of the first surface 11 than the air outlet 112, the projection of the groove 121a on the first surface 11 is closer to the edge of the first surface 11 than the air outlet 112, and the projection of the groove 121a on the first surface 11 is outside the projection range of the interlayer space 3 on the first surface 11.

[0065] First, by placing the air inlet 111 close to the edge of the first surface 11, the reaction medium can enter from the edge of the interlayer space 3. The air outlet 112 is closer to the center of the interlayer structure than the air inlet 111, which enables the reaction medium to diffuse from the edge to the center. This helps to reduce the flow deviation caused by improper air inlet position, which results in poor uniformity of the deposition effect.

[0066] Secondly, the projection of the groove 121a onto the first surface 11 is closer to the edge of the first surface 11 than the air inlet 111, and the projection of the groove 121a onto the first surface 11 is located outside the projection of the interlayer space 3 onto the first surface 11. This allows the groove 121a to be located closest to the edge, which on the one hand can better seal the interlayer space 3, and on the other hand can prevent the groove 121a from obstructing or disturbing the airflow in the interlayer space 3, thereby allowing the reaction medium to flow more smoothly in the interlayer space 3.

[0067] It is understood that the detachable connection between the first plate 1 and the second plate 2 can be a snap-fit ​​connection, a magnetic connection, or a connection made by fasteners (such as screws, bolts, etc.). This application will describe the first plate 1 and the second plate 2 as being detachably connected by fasteners.

[0068] In some embodiments, please refer to Figure 8 , Figure 8 yes Figure 1 A cross-sectional view at point DD. A first mounting hole 113 is provided on the first surface 11, which penetrates the first plate 1 along the thickness direction. A second mounting hole 212 is provided on the second plate 2 corresponding to the first mounting hole 113. The first mounting hole 113 and the second mounting hole 212 are configured to allow fasteners (not shown in the figure) to pass through to connect the first plate 1 and the second plate 2.

[0069] A first mounting hole 113 is provided on the first surface 11, and a second mounting hole 212 is provided on the second surface 12. Fasteners can pass through the first mounting hole 113 and the second mounting hole 212 to connect the first plate 1 and the second plate 2. When the reaction medium is introduced into the interlayer space 3, pressure is generated in the interlayer space 3. The first mounting hole 113 and the second mounting hole 212, together with the fasteners, can firmly connect the first plate 1 and the second plate 2, allowing the spray device 100 to withstand higher pressure. This prevents the spray device 100 from loosening and leaking air, ensuring the normal use of the spray device 100.

[0070] It is understood that the first mounting hole 113 and the second mounting hole 212 can be threaded holes, in which case the fastener is a bolt or screw. Alternatively, the first mounting hole 113 and the second mounting hole 212 can be plain holes, in which case the fastener is a bolt or nut. This embodiment does not specifically limit this.

[0071] Optionally, the second mounting hole 212 is a blind hole, which penetrates the surface of the second plate 2 closest to the first plate 1, i.e., the third surface 21. By using a blind hole to penetrate only the surface of the second plate 2 closest to the first plate 1 and not the entire second plate 2, the possibility of leakage of the reaction medium in the interlayer space 3 can be reduced.

[0072] Optionally, the first mounting hole 113, the air inlet 111, and the air outlet 112 are all spaced apart, and the first mounting hole 113 is closer to the edge of the first surface 11 than the air inlet 111. The first mounting hole 113, the air inlet 111, and the air outlet 112 are sequentially arranged from the edge of the first surface 11 towards its center. The first mounting hole 113 is located outside the projection range of the interlayer space 3 on the first surface 11.

[0073] The first mounting hole 113 is located outside the projection range of the interlayer space 3 on the first surface 11, and the first mounting hole 113 is spaced apart from the edge of the air inlet hole 111 closer to the first surface 11. This ensures that the area where the fastener is connected does not directly contact the interlayer space 3, thereby avoiding affecting the sealing performance of the interlayer space 3.

[0074] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of the thin film deposition system disclosed in the embodiments of this application. In a second aspect, this application also discloses a thin film deposition system 200, including a thin film deposition apparatus 201 and a spray device 100 as described in the first aspect above. The thin film deposition apparatus 201 has an opening, and the spray device 100 is configured to cover the opening so that an outlet 112 communicates with the thin film deposition apparatus 201 to allow the reaction medium to pass through into the thin film deposition apparatus 201. The spray device 100, acting as a cover for the opening of the thin film deposition apparatus 201, communicates with the interior of the apparatus through the outlet 112, thereby enabling the reaction medium to be directly introduced into the thin film deposition apparatus 201 through the outlet 112 of the spray device 100. In addition, the first plate 1 and the second plate 2 in the spray device 100 are detachably connected. After a period of deposition reaction in the thin film deposition equipment 201, the first plate 1 and the second plate 2 can be disassembled to clean the air inlet 111 and air outlet 112 on the first plate 1, thereby ensuring the cleaning effect and ensuring the normal use of the thin film deposition equipment 201.

[0075] It is understandable that when the spray device 100 is covered over the opening of the thin film deposition equipment 201, the air inlet 111 is connected to the thin film deposition equipment 201, and the air outlet 112 needs to be outside the thin film deposition equipment 201 to avoid affecting the gas flow in the interlayer space 3.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A spraying device, characterized in that, include: A first plate has a first surface, on which an air inlet hole and a plurality of spaced-apart air outlet holes are provided, the air inlet hole and the air outlet holes being spaced apart. The second plate is detachably connected to the first plate, and a sandwich space is formed between the second plate and the first plate. The air inlet and the air outlet are both connected to the sandwich space. The air inlet is configured to allow the reaction medium to enter the interlayer space, and the air outlet is configured to allow the reaction medium to exit from the interlayer space.

2. The spraying device according to claim 1, characterized in that, The first plate also has a second surface opposite to the first surface, and a first recess is provided on the second surface. The second plate has a third surface, and a second recess is provided on the third surface. The first plate is supported in the second recess, and the first recess and the second recess are in communication with each other to form the interlayer space.

3. The spraying device according to claim 2, characterized in that, The bottom surface of the first recessed portion is provided with a groove, and the bottom surface of the second recessed portion is provided with a protrusion, the protrusion being engaged with the groove.

4. The spraying device according to claim 3, characterized in that, The protrusion is an annular protrusion, and the interlayer space is formed between the bottom surface of the first recess, the bottom surface of the second recess, and the surface of the protrusion.

5. The spraying device according to claim 3, characterized in that, When the protrusion engages with the groove, the surface of the protrusion and the inner wall of the groove are in contact.

6. The spraying device according to claim 3, characterized in that, The air inlet is closer to the edge of the first surface than the air outlet, the projection of the groove on the first surface is closer to the edge of the first surface than the air inlet, and the projection of the groove on the first surface is outside the projection range of the interlayer space on the first surface.

7. The spraying device according to claim 1, characterized in that, The first surface is also provided with a first mounting hole, which penetrates the first plate along the thickness direction of the first plate. The second plate is provided with a second mounting hole corresponding to the first mounting hole. The first mounting hole and the second mounting hole are configured to allow fasteners to pass through to connect the first plate and the second plate.

8. The spraying device according to claim 7, characterized in that, The second mounting hole is a blind hole, and it penetrates the surface of the second plate near the first plate.

9. The spraying device according to claim 7, characterized in that, The first mounting hole is spaced apart from the air inlet and the air outlet, and the first mounting hole is closer to the edge of the first surface than the air inlet. The first mounting hole, the air inlet and the air outlet are arranged sequentially from the edge of the first surface to the center of the first surface. The first mounting hole is located outside the projection range of the interlayer space on the first surface.

10. A thin film deposition system, characterized in that, The invention includes a thin film deposition apparatus and a spraying device as described in any one of claims 1-9, wherein the thin film deposition apparatus has an opening and the spraying device is configured to cover the opening so that the vent is in communication with the thin film deposition apparatus to allow the reaction medium to pass through the thin film deposition apparatus.

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