A new energy automobile PCB copper plating device

CN224692269UActive Publication Date: 2026-08-28TIANJIN MINNING ELECTRONICS
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Patent Information

Application Number
CN202522133944.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-10
Publication Date
2026-08-28
Estimated Expiration
2035-10-10

AI Technical Summary

Technical Problem

[0006]为了解决现有PCB电路板镀铜过程中,电镀池内杂质较多,影响电镀平整度,且传统人工或定量泵添加主盐、酸碱试剂时分散不均,易造成局部浓度过高,进而影响镀层均匀性、光亮度及结合力问题;本实用新型的目的在于提供一种新能源汽车PCB电路板镀铜装置

Benefits of technology

1.本申请抽水泵将电镀池内的电镀液持续抽送至除渣筒内,经折叠滤芯过滤后,大颗粒杂质被截留,净化后的电镀液通过多导管回流至电镀池内,在此过程中,导管的止回阀防止逆流,而高速回流的电镀液通过多通道等间距分布的设计形成均匀扰动,同时与搅拌叶的旋转作用配合,有效避免杂质沉淀并促进电镀液离子均匀分布,进而显著提升了电镀液的清洁度与稳定性,延长了电镀液使用寿命,同时减少了因杂质导致的PCB镀层缺陷。

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Abstract

The utility model discloses a new energy automobile PCB copper plating device relates to circuit board copper plating technical field, and the utility model discloses a plating bath is equipped with adjusting mechanism in the upper portion of plating bath for adjusting the electroplating solution in plating bath, and adjusting mechanism includes: cleaning subassembly includes fixed mounting the deslagging cylinder of both sides of plating bath, and the electroplating solution in plating bath is continuously pumped to the deslagging cylinder in the water pump of the application, after the filtration of folding filter core, the large -sized particle impurity is intercepted, and the electroplating solution after purification is returned to plating bath through multiple catheter, in this process, the check valve of catheter prevents the reflux, and the electroplating solution of high -speed return is formed even disturbance through the design of multiple -channel equidistance distribution, and under the cooperation of the rotation effect of stirring vane, effectively avoid the impurity deposition and promote the even distribution of electroplating solution ion, and then the cleanliness and stability of electroplating solution have been improved significantly, and the service life of electroplating solution has been prolonged, and PCB plating layer defect caused by impurity has been reduced simultaneously.
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Citation Information

Patent Citations

  • Copper plating device for PCB (Printed Circuit Board)

    CN222893283U