An optical fingerprint identification device

Abstract

The utility model discloses an optical fingerprint identification device, including transparent back base plate, the transparent back base plate upper portion has light -proof guide layer, capacitance polar plate layer one, organic back light board, capacitance polar plate layer two, light -proof empty layer and encapsulation surface layer in proper order, the black circle array ring is embedded distribution with in the organic back light board matrix, and the black circle array ring is through the top surface and the bottom surface of organic back light board, the inside of black circle array ring has transparent boss, can effectively shield the transistor group in the optical sensor in the interference of the entrance of ambient environment light and cause some intermingled interference light information when receiving fingerprint reflection light through the black circle array ring, and in the mutual cooperation of transparent boss and light -conducting micropore makes the optical sensor can accurately receive the fingerprint line series identification signal, improves the precision of fingerprint information identification to the application of fingerprint identification device also brings the convenience.

Description

Technical Field

[0001] This utility model relates to the field of fingerprint recognition technology, specifically to an optical fingerprint recognition device. Background Technology

[0002] Optical fingerprint recognition is a technology that collects fingerprint information based on the principle of light reflection, primarily used for under-display unlocking in electronic devices such as mobile phones and tablets. Its core principle is to use an optical sensor beneath the screen to capture the ridges and valleys of a fingerprint, forming a digital image which is then compared with a stored fingerprint template to verify identity. In summary, the optical fingerprint recognition module uses an optical sensor (such as CMOS) beneath the screen to emit light. When a finger presses on the screen, the ridges (raised) and valleys (recessed) of the fingerprint change the reflection path of the light. The sensor analyzes the changes in reflected light to generate a 3D image of the fingerprint's ridges, thus achieving contactless unlocking. However, in practical implementation and applications, optical fingerprint recognition occasionally encounters interference from ambient light. This interference can cause some stray light information to be introduced into the transistor array of the optical sensor when receiving reflected fingerprint light. This affects the accuracy of fingerprint recognition, limits detection capabilities, and also causes inconvenience to the application of fingerprint recognition devices.

[0003] Therefore, this utility model provides a fingerprint recognition lens module device for reducing interference signals in optical fingerprint recognition. Utility Model Content

[0004] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0005] Therefore, the purpose of this utility model is to provide an optical fingerprint recognition device to solve the problem mentioned in the background art that existing optical fingerprint recognition devices occasionally encounter interference from ambient light, which causes some mixed interference light information in the transistor group of the optical sensor when receiving fingerprint reflected light. This affects the accuracy of fingerprint information recognition and limits detection, while also causing inconvenience to the application of fingerprint recognition devices.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an optical fingerprint recognition device, comprising a transparent back substrate, wherein the upper part of the transparent back substrate has, in sequence, a light-shielding guiding layer, a capacitor plate layer one, an organic backlight plate, a capacitor plate layer two, a light-guiding and air-shielding layer and an encapsulation surface layer; the organic backlight plate has black ring array rings embedded in a matrix, the black ring array rings penetrating the top and bottom surfaces of the organic backlight plate, and the inner side of the black ring array rings has transparent protrusions.

[0007] In a preferred embodiment of the optical fingerprint recognition device described in this utility model, the light-shielding guiding layer has light-guiding micro-holes arranged in a matrix and corresponding to the transparent protrusions above and below.

[0008] In a preferred embodiment of the optical fingerprint recognition device described in this utility model, the top view cross-section of the light-guiding micro-hole and the transparent protrusion is circular, and the diameter of the light-guiding micro-hole is less than or equal to the diameter of the transparent protrusion.

[0009] In a preferred embodiment of the optical fingerprint recognition device described in this utility model, the longitudinal height of the black ring array is the same as the thickness of the organic backlight panel, and the top surface height of the transparent bump is less than the top surface height of the black ring array.

[0010] In a preferred embodiment of the optical fingerprint recognition device described in this utility model, the inner diameter of the black ring array is set to 100um to 300um, and the distance between two adjacent black ring arrays is 20um to 50um.

[0011] In a preferred embodiment of the optical fingerprint recognition device described in this utility model, the thickness of the light-guiding and anti-cavity layer is set to 50um to 100um.

[0012] In a preferred embodiment of the optical fingerprint recognition device described in this utility model, the thickness of the first capacitor plate layer is greater than the thickness of the second capacitor plate layer.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This optical fingerprint recognition device, by setting a backlight plate composed of transparent bumps and black ring array rings on the bottom surface of the second capacitor plate layer, with the transparent bumps and black ring array rings densely distributed in a matrix, and by setting a light-shielding guiding layer on the top surface of the first capacitor plate layer in conjunction with the backlight plate, has light-guiding micro-holes corresponding to the black ring array rings and transparent bumps and with a diameter smaller than the transparent bumps, the black ring array rings can effectively shield the transistor group in the optical sensor from some mixed interference light information caused by the interference of ambient light. Furthermore, the cooperation between the transparent bumps and the light-guiding micro-holes enables the optical sensor to accurately receive the fingerprint line serial recognition signal, thereby improving the accuracy of fingerprint information recognition and making the application of fingerprint recognition devices more convenient. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall cross-sectional structure of the fingerprint recognition lens module of this utility model; Figure 2 This utility model Figure 1 A magnified schematic diagram of the structure at point A in the middle.

[0015] In the figure: 100, transparent back substrate; 200, light-shielding guide layer; 2001, light-guiding micro-hole; 300, capacitor electrode layer one; 400, organic backlight panel; 500, transparent bump; 510, black ring array ring; 600, capacitor electrode layer two; 700, light-guiding and hole-shielding layer; 800, encapsulation surface layer. Detailed Implementation

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0017] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views showing the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0019] Figures 1-2 The diagram shown is a complete structural schematic of an optical fingerprint recognition device according to this utility model. Please refer to [link / reference]. Figures 1-2An optical fingerprint recognition device according to this embodiment includes a transparent back substrate 100. The upper part of the transparent back substrate 100 has a light-shielding guiding layer 200, a capacitor plate layer 300, an organic backlight plate 400, a capacitor plate layer 600, a light-guiding and air-shielding layer 700, and an encapsulation surface layer 800 arranged in a matrix in the organic backlight plate 400. The black ring array ring 510 penetrates the top and bottom surfaces of the organic backlight plate 400. The inner side of the black ring array ring 510 has transparent bumps 500.

[0020] The light-shielding guiding layer 200 has light-guiding micro-holes 2001 arranged in a matrix and corresponding vertically to the transparent bumps 500. The top view cross-section of the light-guiding micro-holes 2001 and the transparent bumps 500 is circular, and the diameter of the light-guiding micro-holes 2001 is less than or equal to the diameter of the transparent bumps 500. Here, the transparent bumps 500 can be made of materials including, but not limited to, acrylic resin, polyimide (PI), and polypropylene (PF), possessing high and low temperature resistance, good transparency, and good mechanical strength. The longitudinal height of the black ring array 510 is the same as the thickness of the organic backlight panel 400, and the top surface height of the transparent bumps 500 is less than the top surface height of the black ring array 510. The inner diameter of the black ring array 510 is set to 100µm to 300µm, and the distance between two adjacent black ring array rings 510 is 20µm to 50µm. Here, the black ring array 510 can be made of materials including, but not limited to, polymer composite resins. The thickness of the light-guiding and anti-cavity layer 700 is set to 50um to 100um. The thickness of capacitor plate layer one 300 is greater than the thickness of capacitor plate layer two 600.

[0021] Specifically, in this embodiment, a backlight plate 400 composed of transparent bumps 500 and black ring array rings 510 is provided on the bottom surface of the capacitor plate layer 2 600. The transparent bumps 500 and black ring array rings 510 are densely distributed in a matrix. On the top surface of the capacitor plate layer 1 300, a light-shielding guiding layer 200 that cooperates with the backlight plate 400 is also provided. The light-shielding guiding layer 200 has light-guiding micro-holes 2001 that correspond to the black ring array rings 510 and the transparent bumps 500 and have a diameter smaller than that of the transparent bumps 500. The black ring array rings 510 can effectively shield the transistor group in the optical sensor from some mixed interference light information caused by the interference of ambient light. Furthermore, the cooperation between the transparent bumps 500 and the light-guiding micro-holes 2001 enables the optical sensor to accurately receive the fingerprint line serial recognition signal. This improves the accuracy of fingerprint information recognition and also facilitates the application of fingerprint recognition devices.

[0022] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An optical fingerprint recognition device, characterized in that, The device includes a transparent back substrate (100), on the upper part of which are arranged in sequence a light-shielding guiding layer (200), a capacitor plate layer one (300), an organic backlight plate (400), a capacitor plate layer two (600), a light-guiding and air-shielding layer (700) and an encapsulation surface layer (800). The organic backlight plate (400) has black ring array rings (510) embedded in a matrix, and the black ring array rings (510) penetrate the top and bottom surfaces of the organic backlight plate (400). The inner side of the black ring array rings (510) has transparent bumps (500).

2. The optical fingerprint recognition device according to claim 1, characterized in that: The light-shielding guiding layer (200) has light-guiding micro-holes (2001) arranged in a matrix and corresponding to the transparent bumps (500) above and below.

3. The optical fingerprint recognition device according to claim 2, characterized in that: The top view cross-section of the light guide micro-hole (2001) and the transparent bump (500) is circular, and the diameter of the light guide micro-hole (2001) is less than or equal to the diameter of the transparent bump (500).

4. The optical fingerprint recognition device according to claim 1, characterized in that: The vertical height of the black ring array (510) is the same as the thickness of the organic backlight panel (400), and the top surface height of the transparent bump (500) is less than the top surface height of the black ring array (510).

5. The optical fingerprint recognition device according to claim 1, characterized in that: The inner diameter of the black ring array (510) is set to 100um to 300um, and the distance between two adjacent black ring arrays (510) is 20um to 50um.

6. The optical fingerprint recognition device according to claim 1, characterized in that: The thickness of the light-guiding and anti-cavity layer (700) is set to 50um to 100um.

7. The optical fingerprint recognition device according to claim 1, characterized in that: The thickness of the first capacitor plate layer (300) is greater than the thickness of the second capacitor plate layer (600).

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