Earphone socket connector with super-thin plate sinking structure

CN224697018UActive Publication Date: 2026-08-28LANGZHONG JIN SANXIN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202521861195.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-30
Publication Date
2026-08-28
Estimated Expiration
2035-08-30

AI Technical Summary

Technical Problem

[0004]本实用新型的目的在于克服现有的耳机插座连接器厚度较大且端子间互相干扰的问题,提供一种具有超薄沉板结构的耳机插座连接器

Benefits of technology

(1)通过在基座前/后/底部独立开设安装槽,使麦克风、声道、接地端子分区域沉板嵌合,最大化压缩Z向空间;同时,接地端子与右声道端子通过底部第四、第五安装槽下移布局,直接降低板下负中心高度,实现行业最大值的厚度优化。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an earphone socket connector with ultrathin sinking plate structure, including base, the one side of base is provided with the spout, the earphone plug is inserted to the spout, the earphone plug extends to the inside of base and electrically connected with terminal assembly, through installing groove of the independent establishment of base front / back / bottom, make microphone, sound channel, ground terminal subarea sinking plate inlay, the maximum compression Z direction space, simultaneously, ground terminal and right sound channel terminal are arranged down through the fourth, fifth installing groove of bottom, directly reduce the height of negative center under the board, realize the thickness optimization of industry maximum.
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Description

Technical Field

[0001] This utility model relates to the field of headphone connector technology, and in particular to a headphone socket connector with an ultra-thin recessed plate structure. Background Technology

[0002] With the trend of miniaturization of consumer electronic devices, the ultra-thin recessed structure design of headphone jack connectors has become a key industry requirement. In order to achieve multi-functional integration (audio transmission, microphone input, insertion and removal detection, etc.), traditional connectors often adopt a stacked terminal layout, which leads to the following inherent defects: (1) contradiction between thickness and function: the conventional terminal centralized arrangement method forces the base height to increase, which is difficult to meet the extreme compression requirements of the negative center height of mobile devices and cannot reach the industry's maximum thinness standard; (2) deterioration of signal integrity: the channel terminal, microphone terminal and detection terminal are set up adjacently, which can easily cause electromagnetic coupling interference in the ultra-thin space. In particular, the microphone signal is easily polluted by high-frequency audio noise, and a physical support structure for the true timing anti-noise mechanism circuit is urgently needed; (3) insufficient environmental tolerance: the mounting groove in the solder foot area lacks effective sealing, and solder processing residues and environmental dust can easily invade the terminal contact area, causing abnormal contact resistance or signal discontinuity.

[0003] Existing technologies attempt to improve these problems by partially shielding or simplifying terminals, but often at the expense of connection reliability. For example, reducing the thickness by cutting the Mylar protective layer leads to dustproof failure; using a single-layer terminal arrangement to reduce height sacrifices the isolation between the left and right channels. Utility Model Content

[0004] The purpose of this invention is to overcome the problems of existing headphone jack connectors being too thick and having mutual interference between terminals, and to provide a headphone jack connector with an ultra-thin recessed plate structure.

[0005] An earphone jack connector with an ultra-thin recessed plate structure includes a base, a socket is provided on one side of the base, an earphone plug is inserted into the socket, and the earphone plug extends into the interior of the base and is electrically connected to a terminal assembly. The upper surface of the front end of the base is provided with a first mounting groove and a sixth mounting groove, and a microphone terminal is fitted into the first mounting groove and the sixth mounting groove; a first microphone is provided on the outside of the first mounting groove. A second mounting groove is provided on the left rear surface of the base, and a left channel terminal is fitted into the second mounting groove; a third mounting groove is provided on the right rear surface of the base, and a detection terminal group is fitted into the third mounting groove; a second Mylar is provided on the outside of the second mounting groove and the third mounting groove. The base is also provided with a grounding terminal and a right channel terminal inside; the bottom of the base is provided with a fourth mounting groove, and the lower end of the grounding terminal is fitted into the fourth mounting groove; the bottom of the base is provided with a fifth mounting groove, and the lower end of the right channel terminal is fitted into the fourth mounting groove; the fourth and fifth mounting grooves are jointly provided with a third Mylar outside.

[0006] Furthermore, the detection terminal group includes a first detection switch terminal and a second detection switch terminal, with the second detection switch terminal located outside the first detection switch terminal.

[0007] Furthermore, the first detection switch terminal includes a first fixing frame with a central hollowed-out section, a first contact spring is provided in the middle of the first fixing frame, the first contact spring contacts the left side of the circumferential surface of the headphone plug, an insulating block is fixedly provided between the first contact spring and the headphone plug, a first welding foot is integrally extended and bent on one side of the first fixing frame, the first welding foot passes through the third mounting groove and extends to the outside of the base; a first folded edge protrusion is also provided on the upper edge of the first fixing frame.

[0008] Furthermore, the second detection switch terminal includes a second fixing frame with a hollowed-out center, a second contact spring fixedly disposed in the middle of the second fixing frame, a second protruding contact portion fixedly disposed on the second contact spring, the second protruding contact portion contacting the first contact spring, and a second welding foot integrally extending and bent on one side of the second fixing frame, the second welding foot passing through the third mounting groove and extending to the outside of the base.

[0009] Furthermore, the right channel terminal includes a third straight plate, one end of which is bent to form a third U-shaped portion and is provided with a third contact spring, and a third metal bulge is fixedly provided on the third contact spring; the third metal bulge contacts the left side of the circumferential surface of the headphone plug; the other end of the third straight plate is bent to form a third solder foot, which is fitted into a fifth mounting groove and extends out from the base.

[0010] Furthermore, the microphone terminal includes an integrally formed fourth straight plate and a fourth wide plate; the fourth straight plate and the fourth wide plate are arranged vertically; the front end of the fourth wide plate is provided with a fourth contact spring, which contacts the upper side of the circumferential surface of the headphone plug; the fourth straight plate is located in a sixth mounting groove, and its end is bent to form a fourth welding foot.

[0011] Furthermore, limit protrusions are provided on the front and rear sides of the fourth wide plate respectively.

[0012] Furthermore, the grounding terminal includes a fifth straight plate, the fifth straight plate having a strip-shaped through groove in the middle; the upper end of the fifth straight plate is bent to form a fifth U-shaped portion and is provided with a fifth contact spring, and a fifth metal bulge is fixedly provided on the fifth contact spring; the fifth metal bulge contacts the right side of the circumferential surface of the headphone plug; the lower end of the fifth straight plate passes through the fifth mounting groove and is bent to form a fifth solder foot.

[0013] Furthermore, the left channel terminal includes a sixth straight plate, the front side of which is bent to form a sixth U-shaped portion and is provided with a sixth contact spring, the rear side of which is provided with an extension plate, the lower end of which is bent to the rear to form a sixth solder foot; the upper edge of the sixth straight plate is also provided with a sixth folded edge protrusion; the middle part of the sixth straight plate is also provided with a reinforcing protrusion.

[0014] The beneficial effects of this utility model are: (1) By independently opening mounting slots at the front / back / bottom of the base, the microphone, channel and grounding terminal are recessed and fitted in separate areas, maximizing the compression of the Z-direction space; at the same time, the grounding terminal and the right channel terminal are moved down through the fourth and fifth mounting slots at the bottom, directly reducing the height of the negative center under the board, and achieving the industry's maximum thickness optimization.

[0015] (2) By independently encapsulating the microphone terminals in the first and sixth mounting slots, a spatial isolation barrier is formed with the rear left / right channel terminals, cutting off the coupling path of high-frequency audio to the microphone signal; at the same time, the grounding terminal and the right channel terminal are set in separate slots to avoid common ground interference, providing a low-noise transmission environment for the true timing noise reduction circuit. (3) The first Mylar seal on the front microphone terminal slot can prevent dust from entering the MIC signal contact; the second Mylar wrapping of the rear channel / detection terminal slot can isolate solder splash contamination; the third Mylar encapsulation of the bottom ground / right channel solder foot slot can block moisture corrosion. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the connector; Figure 2 This is a schematic diagram of the connector structure from another angle; Figure 3 This is a schematic diagram of the internal structure of the connector; Figure 4 This is a schematic diagram of the connector surface structure; Figure 5 This is a schematic diagram of the overall structure of the base; Figure 6 This is a schematic diagram of the base structure from another angle; Figure 7 This is a schematic diagram of the structure of the first detection switch terminal; Figure 8 This is a schematic diagram of the second detection switch terminal structure; Figure 9 This is a schematic diagram of the right channel terminal structure; Figure 10 This is a schematic diagram of the left channel terminal structure; Figure 11 This is a schematic diagram of the microphone terminal structure; Figure 12 This is a schematic diagram of the grounding terminal structure; In the diagram, 1-base, 11-fourth mounting slot, 12-socket, 13-second mounting slot, 14-third mounting slot, 15-first mounting slot, 16-sixth mounting slot, 17-fifth mounting slot, 2-headphone plug, 3-terminal assembly, 31-first detection switch terminal, 311-first fixing frame, 312-first contact spring, 313-insulating block, 314-first solder foot, 315-first folded protrusion, 32-second detection switch terminal, 321-second fixing frame, 322-second contact spring, 323-second protruding contact part, 324-second solder foot, 33-right channel terminal, 331-third straight plate, 332-third U-shaped part, 333-third contact spring, 334 - Third metal bump, 335 - Third solder foot, 34 - Left channel terminal, 341 - Sixth straight plate, 342 - Sixth U-shaped part, 343 - Extension plate, 344 - Sixth solder foot, 345 - Sixth contact spring, 346 - Reinforcing protrusion, 347 - Sixth folded edge protrusion, 35 - Microphone terminal, 351 - Fourth straight plate, 352 - Fourth wide plate, 353 - Fourth contact spring, 354 - Limiting protrusion, 355 - Fourth solder foot, 36 - Grounding terminal, 361 - Fifth straight plate, 362 - Fifth U-shaped part, 363 - Fifth contact spring, 364 - Fifth metal bump, 365 - Fifth solder foot, 366 - Strip groove, 41 - Third Mylar, 42 - Second Mylar, 43 - First Mylar. Detailed Implementation

[0017] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0018] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0019] Example 1 like Figures 1-12 As shown, a headphone jack connector with an ultra-thin recessed plate structure includes a base 1. Specifically, the base 1 is integrally injection molded from insulating engineering plastic, and its front end has a socket 12 for inserting a headphone plug 2. The headphone plug 2 extends into the interior of the base 1 and is electrically connected to a terminal assembly 3.

[0020] To ensure uninterrupted installation of the terminal assemblies, a first mounting slot 15 and a sixth mounting slot 16 are formed on the upper front surface of the base 1, which together accommodate the microphone terminal 35. The slots are covered with a first Mylar 43 insulating sheet. A second mounting slot 13 is formed on the left rear side of the base 1, accommodating the left channel terminal 34. A third mounting slot 14 is formed on the right rear side of the base 1, accommodating the detection terminal group. The slot shares a second Mylar 42 with the left channel terminal. A fourth mounting slot 11 is provided at the bottom of the base 1 to fix the grounding terminal 36, and a fifth mounting slot 17 to fix the right channel terminal 33. Both are covered with a third Mylar 41.

[0021] In this scheme, the detection terminal group includes a first detection switch terminal 31 and a second detection switch terminal 32, with the second detection switch terminal 32 located outside the first detection switch terminal 31.

[0022] Specifically, the first detection switch terminal 31 includes a first fixing frame 311 stamped with a central hollow section, a cantilevered first contact spring 312 disposed within the frame, and an insulating block 313 bonded between the first contact spring 312 and the left contact surface of the headphone plug 2; a first welding foot 314 extending laterally from the fixing frame protrudes from the base 1, and a first folded edge protrusion 315 limiting its movement at the upper edge. The second detection switch terminal 32 has a second contact spring 322 disposed within the second fixing frame 321 with a central hollow section, and a second protruding contact portion 323 stamped at its end, which normally contacts the first contact spring 312; a second welding foot 324 extending laterally protrudes from the base 1.

[0023] The right channel terminal 33 includes a third straight plate 331. One end of the third straight plate 331 is bent to form a third U-shaped portion 332 and is provided with a third contact spring 333. A third metal bulge 334 is fixedly provided on the third contact spring 333. The third metal bulge 334 contacts the left side of the circumferential surface of the headphone plug 2. The other end of the third straight plate 331 is bent to form a third solder foot 335. The third solder foot 335 is fitted into the fifth mounting groove 17 and extends out from the base 1.

[0024] The microphone terminal 35 includes an integrally formed fourth straight plate 351 and a fourth wide plate 352; the fourth straight plate 351 and the fourth wide plate 352 are arranged vertically; the front end of the fourth wide plate 352 is provided with a fourth contact spring 353, and the fourth contact spring 353 contacts the upper side of the circumferential surface of the headphone plug 2; the fourth straight plate 351 is located in the sixth mounting groove 16, and its end is bent to form a fourth solder foot 355.

[0025] The fourth wide plate 352 has limiting protrusions 354 on its front and rear sides respectively. The limiting protrusions 354 can effectively assist the microphone terminal 35 to be stably installed in the sixth mounting slot 16, and prevent the microphone terminal from moving.

[0026] The grounding terminal 36 includes a fifth straight plate 361. A strip-shaped through groove 366 is provided in the middle of the fifth straight plate 361, which can effectively reduce the weight of the fifth straight plate 361 without reducing performance. The upper end of the fifth straight plate 361 is bent to form a fifth U-shaped part 362 and is provided with a fifth contact spring 363. A fifth metal bulge 364 is fixedly provided on the fifth contact spring 363. The fifth metal bulge 364 contacts the right side of the circumferential surface of the headphone plug 2. The lower end of the fifth straight plate 361 passes through the fifth mounting groove 17 and is bent to form a fifth solder foot 365.

[0027] The left channel terminal 34 includes a sixth straight plate 341. The front side of the sixth straight plate 341 is bent to form a sixth U-shaped portion 342 and is provided with a sixth contact spring 345. An extension plate 343 is vertically provided on the rear side of the sixth straight plate 341. The lower end of the extension plate 343 is bent rearward to form a sixth solder foot 344. A sixth folded edge protrusion 347 is also provided on the upper edge of the sixth straight plate 341. A reinforcing protrusion 346 is also provided in the middle of the sixth straight plate 341. The provision of the reinforcing protrusion 346 can effectively increase the structural strength of the sixth straight plate 341.

[0028] Workflow Step 1: Insert the plug: Insert the headphone plug 2 into the base 1 along the socket 12, with its metal ring aligned with the contact area of ​​each end bullet piece.

[0029] Step 2: Channel and Grounding Connection: The right channel ring of the plug contacts the third metal bump 334 of the right channel terminal 33, and the signal is output through the third solder pin 335. The left channel ring of the plug contacts the sixth contact spring 345 of the left channel terminal 34, and the signal is output through the sixth solder pin 344. The grounding ring of the plug contacts the fifth metal bump 364 of the grounding terminal 36, and the signal is grounded through the fifth solder pin 365.

[0030] Step 3: Microphone signal transmission: The plug microphone loop contacts the fourth contact spring 353 of the microphone terminal 35, and the signal is output through the fourth solder pin 355; the limiting protrusion 354 ensures contact stability.

[0031] Step 4: Plug detection linkage: When not inserted: the first contact spring 312 of the first detection switch terminal 31 and the second protruding contact portion 323 of the second detection switch terminal 32 remain in contact, and the detection circuit is turned on.

[0032] After insertion: The left side of the plug pushes the first contact spring 312, causing the insulating block 313 to push the first contact spring away from the second protruding contact portion 323. The two detection terminals disconnect, triggering the external circuit to detect the plug insertion status.

[0033] Step 5: Insulation protection: Cover each mounting slot with Mylar sheet to prevent short circuits between terminals and improve arc resistance; the recessed solder foot design reduces the overall thickness to meet the requirements of ultra-thin equipment.

[0034] The embodiments described above merely illustrate specific implementations of this utility model, and while the descriptions are detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A headphone jack connector with an ultra-thin recessed plate structure, comprising a base (1), wherein a socket (12) is provided on one side of the base (1), a headphone plug (2) is inserted into the socket (12), and the headphone plug (2) extends into the interior of the base (1) and is electrically connected to a terminal assembly (3), characterized in that: The upper front surface of the base (1) is provided with a first mounting groove (15) and a sixth mounting groove (16), and a microphone terminal (35) is fitted into the first mounting groove (15) and the sixth mounting groove (16); a first microphone (43) is provided on the outside of the first mounting groove (15). A second mounting groove (13) is provided on the left rear end surface of the base (1), and a left channel terminal (34) is fitted in the second mounting groove (13); a third mounting groove (14) is provided on the right rear end surface of the base (1), and a detection terminal group is fitted in the third mounting groove (14); a second Mylar (42) is provided on the outside of the second mounting groove (13) and the third mounting groove (14); The base (1) is also provided with a grounding terminal (36) and a right channel terminal (33) inside; a fourth mounting groove (11) is provided at the bottom of the base (1), and the lower end of the grounding terminal (36) is fitted into the fourth mounting groove (11); a fifth mounting groove (17) is provided at the bottom of the base (1), and the lower end of the right channel terminal (33) is fitted into the fourth mounting groove (11); a third Mylar (41) is provided on the outside of the fourth mounting groove (11) and the fifth mounting groove (17).

2. The headphone jack connector with an ultra-thin recessed plate structure according to claim 1, characterized in that, The detection terminal group includes a first detection switch terminal (31) and a second detection switch terminal (32), with the second detection switch terminal (32) located outside the first detection switch terminal (31).

3. The headphone jack connector with an ultra-thin recessed plate structure according to claim 2, characterized in that, The first detection switch terminal (31) includes a first fixing frame (311) with a hollow center. A first contact spring (312) is provided in the center of the first fixing frame (311). The first contact spring (312) contacts the left side of the circumferential surface of the headphone plug (2). An insulating block (313) is fixedly provided between the first contact spring (312) and the headphone plug (2). A first welding foot (314) is integrally extended and bent on one side of the first fixing frame (311). The first welding foot (314) passes through the third mounting groove (14) and extends to the outside of the base (1). A first folded edge protrusion (315) is also provided on the upper edge of the first fixing frame (311).

4. The headphone jack connector with an ultra-thin recessed plate structure according to claim 3, characterized in that, The second detection switch terminal (32) includes a second fixing frame (321) with a hollow center. A second contact spring (322) is fixedly disposed in the center of the second fixing frame (321). A second protruding contact portion (323) is fixedly disposed in the second contact spring (322). The second protruding contact portion (323) contacts the first contact spring (312). A second welding foot (324) is integrally extended and bent on one side of the second fixing frame (321). The second welding foot (324) passes through the third mounting groove (14) and extends to the outside of the base (1).

5. The headphone jack connector with an ultra-thin recessed plate structure according to claim 1, characterized in that, The right channel terminal (33) includes a third straight plate (331), one end of which is bent to form a third U-shaped part (332) and provided with a third contact spring (333). A third metal bulge (334) is fixedly provided on the third contact spring (333). The third metal bulge (334) contacts the left side of the circumferential surface of the headphone plug (2). The other end of the third straight plate (331) is bent to form a third solder foot (335), which is fitted into the fifth mounting groove (17) and extends out from the base (1).

6. The headphone jack connector with an ultra-thin recessed plate structure according to claim 1, characterized in that, The microphone terminal (35) includes an integrally formed fourth straight plate (351) and a fourth wide plate (352); the fourth straight plate (351) and the fourth wide plate (352) are arranged vertically; the front end of the fourth wide plate (352) is provided with a fourth contact spring (353), and the fourth contact spring (353) contacts the upper side of the circumferential surface of the headphone plug (2); the fourth straight plate (351) is located in the sixth mounting groove (16), and its end is bent to form a fourth welding foot (355).

7. A headphone jack connector with an ultra-thin recessed plate structure according to claim 6, characterized in that, Limiting protrusions (354) are provided on the front and rear sides of the fourth wide plate (352).

8. The headphone jack connector with an ultra-thin recessed plate structure according to claim 1, characterized in that, The grounding terminal (36) includes a fifth straight plate (361), and a strip-shaped through groove (366) is provided in the middle of the fifth straight plate (361); the upper end of the fifth straight plate (361) is bent to form a fifth U-shaped part (362) and a fifth contact spring (363) is provided; a fifth metal bulge (364) is fixedly provided on the fifth contact spring (363); the fifth metal bulge (364) is in contact with the right side of the circumferential surface of the headphone plug (2); the lower end of the fifth straight plate (361) passes through the fifth mounting groove (17) and is bent to form a fifth welding foot (365).

9. A headphone jack connector with an ultra-thin recessed plate structure according to claim 1, characterized in that, The left channel terminal (34) includes a sixth straight plate (341), the front side of which is bent to form a sixth U-shaped part (342) and provided with a sixth contact spring (345), the rear side of which is provided with an extension plate (343), the lower end of which is bent to the rear to form a sixth solder foot (344); the upper edge of the sixth straight plate (341) is also provided with a sixth folded edge protrusion (347); the middle part of the sixth straight plate (341) is also provided with a reinforcing protrusion (346).