A cofferdam support type camera module

Abstract

The utility model relates to a cofferdam support type camera module, include: circuit board have bearing surface, install on the bearing surface have photosensitive chip, the photosensitive chip with between circuit board through many gold wires electric connection, and form several gold wire bonding area in the photosensitive chip's outer periphery, motor lens group, set up in the photosensitive chip's top, light -proof glue, encircle arrangement in the photosensitive chip's outer periphery, light -proof glue forms cofferdam structure for supporting motor lens group after solidification, and the bottom of light -proof glue and circuit board cement, top through optical alignment glue and motor lens group cement, optical filter, fix in the cofferdam structure, and be located on the light path of motor lens group, the utility model discloses through adopt solidified light -proof glue directly form cofferdam structure for supporting motor lens group, effectively reduced the planar dimension of camera module and reduced the overall height of camera module, be favorable to realize the miniaturization of camera module.

Description

Technical Field

[0001] This utility model relates to the field of camera modules, and more specifically, to a cofferdam-supported camera module. Background Technology

[0002] With the widespread adoption and development of mobile terminal devices (such as smartphones and tablets), increasingly higher demands are being placed on their built-in camera modules, especially in terms of high pixel count and high performance, while also meeting the growing trend of increasingly thinner and lighter devices. In traditional camera modules, the motor and lens assembly requires an independent support structure to fix it to the circuit board. This support structure is typically an injection-molded package, which also protects the gold wires from being damaged by the motor and lens assembly. However, in actual production, this structure not only requires mold making, leading to increased costs, but also results in a larger overall package size to ensure sufficient support, hindering the miniaturization of camera modules. Utility Model Content

[0003] In view of this, the present invention provides a cofferdam-supported camera module.

[0004] The objective of this utility model is achieved through the following technical solution: A cofferdam-supported camera module includes: A circuit board has a carrier surface on which a photosensitive chip is mounted. The photosensitive chip is electrically connected to the circuit board via multiple gold wires, and several gold wire bonding areas are formed on the outer periphery of the photosensitive chip. The motor-driven lens assembly is positioned above the photosensitive chip; A light-shielding adhesive is arranged around the outer periphery of the photosensitive chip; after curing, the light-shielding adhesive forms a dam structure to support the motor lens assembly; the bottom of the light-shielding adhesive is bonded to the circuit board, and the top of the light-shielding adhesive is bonded to the motor lens assembly by optical alignment adhesive. The filter is fixed to the cofferdam structure and located in the optical path of the motor lens assembly.

[0005] In the aforementioned technical solution, the cofferdam structure supporting the motor and lens assembly is directly formed using cured light-blocking adhesive, eliminating the need for traditional metal or plastic brackets. This significantly simplifies the module structure, reduces the number of components, and effectively reduces the planar dimensions and overall height of the camera module, facilitating miniaturization. Secondly, the light-blocking adhesive surrounding the image sensor effectively blocks stray light from entering the sensor, preventing light leakage from interfering with imaging. Simultaneously, it prevents crosstalk between different areas, improving image contrast and clarity.

[0006] In addition, the light-shielding adhesive is bonded to the circuit board and the motor lens assembly at the same time. While forming a dam structure to support the lens assembly, it also completes part of the assembly steps, reducing additional assembly parts and processes. This helps to simplify the assembly process of the camera module, improve production efficiency, and reduce manufacturing costs.

[0007] Optionally, in one possible implementation, the light-shielding adhesive has at least two layers, and the at least two layers of the light-shielding adhesive are stacked and cured in a direction perpendicular to the bearing surface to form the cofferdam structure.

[0008] In the aforementioned technical solution, the multi-layered structure constitutes multiple physical barriers, reducing the risk of dust intrusion due to the failure of a single coating. Secondly, the layered dispensing and curing process allows for easier control of morphology and position, resulting in an extremely high degree of flatness on the top surface of the final dam, ensuring uniformity and bonding strength when adhering to the motor lens assembly. Simultaneously, the dam structure formed by the layered curing of light-shielding adhesives, with each layer interlocking and working synergistically, greatly enhances the structural stability. Furthermore, the number of light-shielding adhesive layers can be flexibly set according to the height of electronic components on the circuit board.

[0009] Alternatively, in one possible implementation, the sidewalls of two adjacent layers of light-shielding adhesive are staggered to form a stepped dam sidewall, and the filter is fixed to the dam sidewall.

[0010] In the above technical solution, the stepped sidewalls create a stable and reliable support surface for the filter, providing a positioning reference for the filter and increasing the support surface, making the filter more evenly stressed in all directions, reducing problems such as filter displacement and tilting caused by loosening of a single fixing point or uneven stress, and improving the stability of the filter.

[0011] Optionally, in one possible implementation, the light-shielding adhesive is located on the side of the gold wire bonding area closer to the photosensitive chip, or on the side of the gold wire bonding area away from the photosensitive chip, or partially or completely covers the gold wire bonding area.

[0012] In the above technical solution, the camera module contains a variety of optical components, such as some electronic components on the circuit board. The variability of the cofferdam position can better adapt to the layout of these components. That is, the position of the light-shielding adhesive can be flexibly arranged according to the structure of the camera module, thereby improving its applicability.

[0013] Optionally, in one possible implementation, when the light-shielding adhesive partially or completely covers the gold wire bonding area, the light-shielding adhesive can flow between adjacent gold wires and form a coating and fixation on the gold wires.

[0014] In the above technical solution, the light-shielding adhesive flowing between the gold wires binds multiple independent, easily swaying gold wires into a unified and robust whole, greatly enhancing the gold wires' resistance to external impacts, vibrations, and bending stresses, and effectively preventing the gold wires from breaking due to external forces. At the same time, the adhesive physically isolates adjacent gold wires, preventing short circuits caused by contact between the gold wires.

[0015] Optionally, in one possible implementation, the light-shielding adhesive is any one or more of a polymer adhesive, a metal-coated ceramic adhesive, or a semiconductor encapsulation resin.

[0016] In the above technical solutions, all three light-shielding adhesive materials are compatible with common materials in camera modules such as metal, plastic, and glass. Furthermore, the combination of one or more of these materials can improve design flexibility. For example, different materials can be used to form different layers, or different materials can be mixed to prepare composite materials, so as to maximize the performance of the properties between different materials.

[0017] Optionally, in one possible implementation, the circuit board is further provided with a plurality of electronic components, which are disposed on the bearing surface of the circuit board or on the opposite side of the bearing surface.

[0018] In the above technical solution, by allowing electronic components to be distributed on the back of the circuit board instead of being confined to the mounting surface around the photosensitive chip, the space on the mounting surface is greatly freed up, making the camera module smaller in planar size. Furthermore, different types of electronic components have different requirements for space and layout; by using a double-sided arrangement, their positions can be arranged more flexibly according to their size, shape, and electrical characteristics.

[0019] Optionally, in one possible implementation, there is a clearance space between the motor lens assembly and the circuit board, and when the electronic component is located on the bearing surface of the circuit board, the height of the clearance space is not less than the maximum height of the electronic component.

[0020] In the above technical solution, the clearance space ensures that when the motor lens assembly is installed on the cofferdam structure, its bottom or internal structure will not collide with or squeeze any electronic components on the bearing surface. This avoids component breakage, desoldering, or short circuits due to vibration or impact during assembly or subsequent use, greatly improving product reliability and yield.

[0021] Alternatively, in one possible implementation, a sealant is arranged around the edge of the bearing surface of the circuit board, and the bottom and top of the sealant are bonded to the circuit board and the motor lens assembly, respectively.

[0022] In the above technical solution, the design of the light-shielding adhesive and sealant forms two independent sealing lines inside the module. The first line of defense, formed by the light-shielding adhesive, mainly protects the photosensitive chip and the gold wire bonding area; the second line of defense, formed by the sealant, provides comprehensive protection for the entire internal space of the module (including all electronic components and circuit traces). This dual-sealing structure greatly improves the sealing reliability of the module and can effectively resist the intrusion of external contaminants such as moisture, dust, and salt spray.

[0023] Alternatively, in one possible implementation, an enclosed space is formed between the sealant and the light-shielding adhesive, and the enclosed space is filled with adhesive.

[0024] In the above technical solution, the filling adhesive firmly combines the independent light-shielding adhesive dike and the outer sealant into a unified and solid composite wall, which greatly enhances the overall rigidity and strength of the entire support structure and forms a continuous, dense, gapless barrier that can further block the intrusion of water vapor, dust and corrosive gases. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is one of the overall structural schematic diagrams of an embodiment.

[0027] Figure 2 This is a partial top view of one embodiment.

[0028] Figure 3 This is a second schematic diagram of the overall structure of one embodiment.

[0029] Figure reference numerals: 1-Circuit board; 11-Electronic components; 2-Photosensitive chip; 3-Gold wire; 30-Gold wire bonding area; 4-Motor lens assembly; 5-Light-shielding adhesive; 6-Filter; 7-Sealant; 8-Glue. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] Please refer to Figure 1 This embodiment provides a dam-supported camera module, including: a circuit board 1, a motor lens assembly 4, a light-shielding adhesive 5, and a light filter 6; the circuit board 1 has a bearing surface, on which a photosensitive chip 2 is mounted, the photosensitive chip 2 and the circuit board 1 are electrically connected by multiple gold wires 3, and several gold wire bonding areas 30 are formed on the outer periphery of the photosensitive chip 2; the motor lens assembly 4 is disposed above the photosensitive chip 2; the light-shielding adhesive 5 is arranged around the outer periphery of the photosensitive chip 2; after curing, the light-shielding adhesive 5 forms a dam structure for supporting the motor lens assembly 4, the bottom of the light-shielding adhesive 5 is bonded to the circuit board 1, and the top of the light-shielding adhesive 5 is bonded to the motor lens assembly 4 by optical alignment adhesive; the light filter 6 is fixed to the dam structure and is located in the optical path of the motor lens assembly 4.

[0033] It should be noted that the light-shielding adhesive 5 can be bonded to the motor lens assembly 4 after curing using optical alignment adhesive. This avoids severe deformation caused by the motor lens assembly 4 squeezing the uncured light-shielding adhesive 5. The bottom of the light-shielding adhesive 5 can be bonded to the circuit board 1 after curing due to its own adhesiveness. Among them, the optical alignment adhesive is a special adhesive designed for the precise alignment of optical components. It achieves low shrinkage and high light transmittance bonding through a dual curing mechanism (such as UV + thermal curing). It is widely used in the assembly of precision optical systems such as sensors, optical fibers, and lenses, and can effectively solve the problem of optical path misalignment caused by manufacturing tolerances, thereby improving the efficiency of optical signal transmission.

[0034] In this embodiment, the cofferdam structure supporting the motor lens assembly 4 is directly formed using cured light-blocking adhesive 5, eliminating the need for traditional metal or plastic brackets. This greatly simplifies the module structure, reduces the number of parts, and effectively reduces the planar dimensions and overall height of the camera module, facilitating miniaturization. Secondly, the light-blocking adhesive 5 surrounding the photosensitive chip 2 effectively blocks stray light from entering the chip, preventing light leakage from interfering with imaging. Simultaneously, it prevents crosstalk between different areas, improving image contrast and clarity.

[0035] In addition, the light-shielding adhesive 5 is bonded to both the circuit board 1 and the motor lens assembly 4. While forming a dam structure to support the lens assembly, it also completes some assembly steps, reducing additional assembly parts and processes. This helps to simplify the assembly process of the camera module, improve production efficiency, and reduce manufacturing costs.

[0036] It should be noted that the cured light-shielding adhesive 5 possesses a certain structural strength and toughness, providing stable support for the motor lens assembly 4 and buffering external stress and impact, thereby improving the mechanical stability and drop resistance of the entire camera module. Simultaneously, this structure also protects the fragile gold wire bonding area 30, preventing damage during assembly or use.

[0037] In this embodiment, the light-shielding adhesive 5 has at least two layers, which are stacked and cured along a direction perpendicular to the bearing surface to form a dam structure. The dimensions of the different layers of light-shielding adhesive 5, such as width and thickness, can be different and can be flexibly set according to actual needs. Furthermore, the number of layers of light-shielding adhesive 5 can also be flexibly set according to the height of the electronic components 11 on the circuit board 1.

[0038] The multi-layered structure forms multiple physical barriers. Even if a layer has extremely minor defects (such as pinholes caused by bubbles or impurities) during dispensing or curing, these defects will be effectively covered and blocked by adjacent layers, reducing the risk of dust intrusion due to the failure of a single coating. Secondly, the layered dispensing and curing process makes it easier to control the morphology and position, resulting in an extremely high degree of flatness on the top surface of the final cofferdam, ensuring uniformity and bonding strength when bonded to the motor lens assembly 4. Simultaneously, the cofferdam structure formed by the multi-layered light-shielding adhesive 5, with its interlocking and synergistic effects, greatly enhances the stability of the structure.

[0039] In this embodiment, the sidewalls of two adjacent layers of light-shielding adhesive 5 are staggered to form a stepped dam sidewall, and the filter 6 is fixed to the dam sidewall. Specifically, taking two layers of light-shielding adhesive 5 as an example, the width of the bottom layer of light-shielding adhesive 5 is greater than the width of the top layer of light-shielding adhesive 5, thus forming a stepped structure. The light-shielding sheet can be placed on the stepped surface between the bottom and top layers of light-shielding adhesive 5, that is, it can be fixed by the adhesiveness of the light-shielding adhesive 5 before curing, or it can be fixed by an additional adhesive.

[0040] The stepped sidewalls create a stable and reliable support surface for the filter 6, providing a positioning reference and increasing the support surface. This makes the filter 6 more evenly stressed in all directions, reducing problems such as displacement and tilting of the filter 6 caused by loosening of a single fixing point or uneven stress, and improving the stability of the filter 6.

[0041] Furthermore, stray light incident from above is blocked and absorbed by the lower protruding light-shielding adhesive 5 sidewalls before reaching the edge of filter 6. This allows a small amount of light to reach the edge of filter 6 and be reflected. The stepped structure enables these reflected lights to undergo multiple reflections and absorptions between the multiple layers and staggered sidewalls, resulting in a sharp reduction in energy and greatly reducing the likelihood that they will eventually reach the imaging area of ​​the photosensitive chip 2.

[0042] Of course, as another implementation, the filter 6 can also be bonded to the motor lens assembly 4 with adhesive.

[0043] In this embodiment, the light-shielding adhesive 5 is located on the side of the gold wire bonding area 30 close to the photosensitive chip 2, or on the side of the gold wire bonding area 30 away from the photosensitive chip 2, or partially or completely covers the gold wire bonding area 30.

[0044] The camera module contains a variety of optical components, such as some electronic components 11 on the circuit board 1. The variability of the cofferdam position can better adapt to the layout of these components. That is, the position of the light-shielding adhesive 5 can be flexibly arranged according to the structure of the camera module, thereby improving its applicability.

[0045] Specifically, when the light-shielding adhesive 5 is located on the side of the gold wire bonding area 30 closest to the photosensitive chip 2: an extremely compact module size can be achieved. The light-shielding adhesive 5 is tightly attached to the photosensitive chip 2, completely placing the gold wire bonding area 30 outside the containment structure, minimizing the planar area occupied by the camera module on the circuit board 1. When the light-shielding adhesive 5 is located on the side of the gold wire bonding area 30 furthest from the photosensitive chip 2: all gold wires 3 are completely surrounded within the space formed by the circuit board 1, the containment structure of the light-shielding adhesive 5, and the motor lens assembly 4 (or filter 6), effectively preventing damage to the gold wires 3 due to external forces or collisions with foreign objects during production, transportation, or assembly, greatly improving the mechanical reliability of the module. Figure 2 As shown, when the light-shielding adhesive 5 partially or completely covers the gold wire bonding area 30, it can enhance the fixation and protection of the gold wire 3. The light-shielding adhesive 5 covering the gold wire 3 acts like a "fixing adhesive", which can further strengthen the adhesion of the gold wire 3. Especially at the bonding point, it can alleviate the impact of thermal stress or mechanical stress on the bonding point and further improve long-term reliability.

[0046] In this embodiment, when the light-shielding adhesive 5 partially or completely covers the gold wire bonding area 30, the light-shielding adhesive 5 can flow between adjacent gold wires 3 and form a coating and fixation on the gold wires 3.

[0047] The light-shielding adhesive 5 flowing between the gold wires 3 binds multiple independent, easily movable gold wires 3 into a unified and robust whole, greatly enhancing the gold wires 3's resistance to external impacts, vibrations, and bending stresses, effectively preventing the gold wires 3 from breaking due to external forces. Simultaneously, the adhesive physically isolates adjacent gold wires 3, preventing short circuits caused by contact between them. Furthermore, when the adhesive flows between the gold wires 3, it completely fills all gaps and surfaces that might reflect light, forming a comprehensive, all-encompassing light-shielding layer from top to side.

[0048] It should be noted that the light-shielding adhesive 5 can be any one or more of polymer adhesive, metal-coated ceramic adhesive, or semiconductor encapsulation resin. The polymer adhesive can be epoxy resin or silicone, and the metal-coated ceramic adhesive is a ceramic filler adhesive 8 containing metal particles (such as carbon black or silver powder).

[0049] All three light-shielding adhesives are highly compatible with common materials in camera modules, such as metals, plastics, and glass. Furthermore, combining one or more of these materials enhances design flexibility. For example, different materials can be used to form different layers; a semiconductor encapsulation resin can be used as the bottom layer to provide optimal chip protection, while a metal-coated ceramic adhesive can be used as the top layer to provide the strongest light shielding and support. Alternatively, different materials can be mixed to create composite materials, maximizing the combined properties of each material. For instance, adding specific proportions of metal and ceramic fillers to polymer adhesives can achieve the optimal balance between cost, mechanical strength, and light shielding.

[0050] In this embodiment, a plurality of electronic components 11 are also provided on the circuit board 1, and the plurality of electronic components 11 are provided on the bearing surface of the circuit board 1 or on the other side opposite to the bearing surface.

[0051] By allowing the electronic components 11 to be distributed on the back of the circuit board 1 instead of being confined to the mounting surface around the photosensitive chip 2, the space on the mounting surface is greatly freed up, making the camera module smaller in planar dimensions. Furthermore, different types of electronic components 11 have different requirements for space and layout. By arranging them on both sides, their positions can be arranged more flexibly according to the size, shape, and electrical characteristics of the components.

[0052] In this embodiment, there is a clearance space between the motor lens assembly 4 and the circuit board 1. When the electronic component 11 is located on the bearing surface of the circuit board 1, the height of the clearance space is not lower than the maximum height of the electronic component 11.

[0053] The clearance space ensures that when the motor-lens assembly 4 is installed on the cofferdam structure, its bottom or internal structure will not collide with or squeeze any electronic components 11 on the bearing surface. This avoids component breakage, desoldering, or short circuits due to vibration or impact during assembly or subsequent use, greatly improving product reliability and yield.

[0054] Please refer to Figure 3 In this embodiment, sealant 7 is arranged around the edge of the bearing surface of the circuit board 1, and the bottom and top of the sealant 7 are bonded to the circuit board 1 and the motor lens assembly 4, respectively. The sealant 7 is distributed in a ring shape, forming a continuous closed space.

[0055] The design of the light-shielding adhesive 5 and the sealant 7 forms two independent sealing lines inside the module. The first line of defense, formed by the light-shielding adhesive 5, mainly protects the photosensitive chip 2 and the gold wire bonding area 30. The second line of defense, formed by the sealant 7, provides comprehensive protection for the entire internal space of the module (including all electronic components 11 and circuit traces). This dual-sealing structure greatly improves the sealing reliability of the module and can effectively resist the intrusion of external contaminants such as moisture, dust, and salt spray.

[0056] Furthermore, the sealant 7 creates a larger, continuous bonding area between the motor lens assembly 4 and the circuit board 1. This is equivalent to adding a robust "peripheral frame" to the entire module, which can more effectively resist torsional and bending stresses, prevent optical performance degradation caused by deformation of the circuit board 1, and improve the module's mechanical shock and vibration resistance.

[0057] Specifically, a closed space is formed between the sealant 7 and the light-shielding adhesive 5, and this space is filled with adhesive 8. The adhesive 8 firmly bonds the independent light-shielding adhesive 5 and the outer sealant 7 into a unified and robust composite wall, greatly enhancing the overall rigidity and strength of the entire support structure. It also forms a continuous, dense, gapless barrier, further preventing the intrusion of moisture, dust, and corrosive gases. Furthermore, it effectively secures and protects the electronic components 11 arranged within this closed space.

[0058] It should be noted that during the assembly of the camera module, the light-shielding adhesive 5 and the sealant 7 can be formed and cured simultaneously. Then, the glue 8 is filled into the enclosed space and cured. At this time, the top surfaces of the light-shielding adhesive 5, the sealant 7, and the glue 8 are flush, or they can match the bottom surface of the actual motor lens assembly 4. Then, the motor lens assembly 4 is installed using optical alignment adhesive. That is, the motor lens assembly 4 can be bonded to the top surface of the light-shielding adhesive 5, the top surface of the sealant 7, or the top surface of the glue 8 simultaneously using optical alignment adhesive, or it can be bonded to one of the top surfaces.

[0059] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0061] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

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