A bone-voiceprint sensor
Patent Information
- Application Number
- CN202521225768.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-16
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-06-16
AI Technical Summary
[0021] 1. The bone acoustic signature sensor of this application can improve the compactness of the structure and increase the packaging integration by embedding the vibration system in the cavity between the first circuit board and the second circuit board; moreover, the provision of an exhaust channel and exhaust hole connecting the cavity is beneficial to improving the vibration performance of the vibration system, without the need to provide exhaust holes on its mass block and elastic membrane.
Smart Images
Figure CN224697889U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor technology and relates to a bone conduction sensor. Background Technology
[0002] A bone conduction sensor (VPU sensor) is a sensor that detects sound waves transmitted by vibrations in the human skeleton and converts the resulting vibration signals into electrical signals. It typically consists of a vibration system and a MEMS (Micro-Electro-Mechanical System) microphone assembly. The vibration system senses external vibrations, and the MEMS microphone assembly converts the resulting airflow changes into electrical signals to represent the vibration information. Both the vibration system and the MEMS microphone assembly are the core components of the bone conduction sensor.
[0003] Compared to traditional MEMS microphones, bone conduction sensors are unaffected by airborne noise, significantly improving speech recognition rates in noisy environments. Furthermore, because bone conduction sensors have no sound inlet, they are dustproof and waterproof, allowing them to be used in harsher environments. Utility Model Content
[0004] The main technical problem addressed by this application is to provide a bone conduction sensor with higher integration.
[0005] This application proposes a bone voiceprint sensor, comprising:
[0006] The first circuit board includes a first surface, a first cavity formed on the first surface, and an exhaust channel connecting the first cavity and the first surface;
[0007] The second circuit board includes a second surface for joining the first surface, the second surface having a second cavity and a sound hole communicating with the second cavity at a position corresponding to the cavity, and an exhaust hole at a position corresponding to the exhaust channel;
[0008] The vibration system is disposed within the vibration space formed by the first cavity and the second cavity, and includes an elastic membrane disposed on the first surface and covering the first cavity, and a mass block disposed on the elastic membrane.
[0009] A MEMS microphone assembly is disposed on a third surface of the second circuit board opposite to the second surface, and communicates with the cavity through the sound hole;
[0010] The housing is connected to the second circuit board and forms a cavity for accommodating the MEMS microphone assembly. The cavity is connected to the first cavity through the vent hole and the vent channel.
[0011] In some alternative embodiments, the width of the mass block in the cross-sectional direction is smaller than the width of the first cavity, and the width of the first cavity is smaller than the width of the second cavity.
[0012] In some alternative embodiments, the elastic membrane, when stretched, covers the first cavity, and the edges of the elastic membrane are bonded to the first surface by an adhesive.
[0013] In some alternative embodiments, the mass block is disposed on the upper or lower surface of the elastic membrane.
[0014] In some alternative implementations, the width of the first circuit board and the width of the second circuit board are the same in the cross-sectional view.
[0015] In some alternative implementations, the MEMS microphone assembly includes a microphone MEMS chip and a microphone ASIC chip, wherein the microphone MEMS chip is disposed at the sound hole.
[0016] In some alternative implementations, the microphone MEMS chip and the microphone ASIC chip, and the microphone ASIC chip and the second circuit board, are electrically connected by bonding wires.
[0017] In some alternative implementations, the microphone MEMS chip and the microphone ASIC chip are respectively fixed to the second circuit board by adhesive.
[0018] In some alternative implementations, the housing is connected to the second circuit board via solder paste.
[0019] In some alternative implementations, the first circuit board and the second circuit board are connected by solder paste.
[0020] As described above, this application proposes a bone voiceprint sensor, which has the following advantages by adopting the above technical solution:
[0021] 1. The bone acoustic signature sensor of this application can improve the compactness of the structure and increase the packaging integration by embedding the vibration system in the cavity between the first circuit board and the second circuit board; moreover, the provision of an exhaust channel and exhaust hole connecting the cavity is beneficial to improving the vibration performance of the vibration system, without the need to provide exhaust holes on its mass block and elastic membrane.
[0022] 2. The vibration system is located between the two circuit boards, closer to the vibration source, which can more efficiently capture external vibration signals and reduce the loss of vibration energy during transmission, thereby improving the sensitivity of the microphone and making applications such as voice recognition more accurate and clear.
[0023] 3. The vibration system, the first circuit board, and the second circuit board can be made into a subsystem, which can simplify the process and improve reliability.
[0024] 4. The casing can be a common structure casing, such as a casing made of metals like copper or aluminum, which is less expensive. Attached Figure Description
[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments and the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a cross-sectional structural schematic diagram of a bone voiceprint sensor according to an embodiment of this application;
[0027] Figure 2 This is a cross-sectional structural schematic diagram of a bone voiceprint sensor proposed in another embodiment of this application. Detailed Implementation
[0028] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.
[0029] The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.
[0030] The following detailed descriptions will be provided through specific embodiments.
[0031] refer to Figure 1 One embodiment of this application discloses a bone voiceprint sensor, which includes:
[0032] The first circuit board 1 has a first surface (i.e., a lower surface), a cavity 61 formed on the first surface, and an exhaust channel 12 connecting the first cavity 61 and the first surface.
[0033] The second circuit board 2 has a second surface (i.e. its upper surface) for joining the first surface of the first circuit board 1. The second surface has a second cavity 62 and a sound hole 5 communicating with the second cavity 62 at the position corresponding to the first cavity 61. The second surface also has an exhaust hole 7 at the position corresponding to the exhaust channel 12, and the exhaust hole 7 is connected to the exhaust channel 12.
[0034] The vibration system is set in the vibration space formed by the first cavity 61 and the second cavity 62, and includes: an elastic membrane 3 set on the first surface of the first circuit board 1, and a mass block 4 set on the elastic membrane 3.
[0035] The MEMS microphone assembly is disposed on the third surface (i.e. the upper surface) of the second circuit board opposite to its second surface, and is connected to the second cavity 62 through the sound hole 5;
[0036] The housing 11, together with the second circuit board 2, forms a cavity 63 for accommodating the MEMS microphone assembly. The cavity 63 is connected to the first cavity 61 through the exhaust port 7 and the exhaust channel 12.
[0037] Here, the first circuit board 1 and the second circuit board 2 can be circuit boards with a circuit layer and a dielectric layer.
[0038] Here, the receiving cavity 63 is connected to the first cavity 61 through the exhaust hole 7 and the exhaust channel 12. During the vibration of the vibration system, the gas volume in the first cavity 61 can be adjusted to improve the vibration performance.
[0039] In some alternative embodiments, the width of the mass block 4 in the cross-sectional direction is smaller than the width of the first cavity 61, and the width of the first cavity 61 is smaller than the width of the second cavity 62.
[0040] In some alternative embodiments, the elastic membrane 3 is stretched and covers the first cavity 61. The edge of the elastic membrane 3 is bonded to the first surface of the first circuit board 1 by an adhesive. In this way, the support (e.g., copper ring) can be eliminated, the manufacturing process and product structure can be simplified, and the product reliability can be improved.
[0041] In some alternative implementations, the mass block 4 may be disposed on the upper or lower surface of the elastic membrane 3.
[0042] In some alternative embodiments, the width of the first circuit board 1 and the width of the second circuit board 2 are substantially the same in the cross-sectional view.
[0043] In some alternative implementations, for example, the elastic membrane 7 may be an elastic plastic film, and the mass block 4 may be a metal block or a non-metal block.
[0044] In some alternative implementations, the MEMS microphone assembly includes a microphone MEMS chip 10 and a microphone ASIC (Application Specific Integrated Circuit) chip 9, wherein the microphone MEMS chip 10 is disposed at the sound hole 5 and covers the sound hole 5.
[0045] In some alternative implementations, the microphone MEMS chip 10 and the microphone ASIC chip 9 are electrically connected via bonding wires 8, and the microphone ASIC chip 9 and the second circuit board 2 are also electrically connected via bonding wires 8. The bonding wires 8 can be metal wires such as gold wire, silver wire, copper wire, or aluminum wire, also known as wire bonding.
[0046] In some alternative implementations, the microphone MEMS chip 10 and the microphone ASIC chip 9 are respectively fixed to the second circuit board 2 by adhesive.
[0047] In some alternative embodiments, the housing 11 and the second circuit board 2 are connected by solder, such as solder paste.
[0048] In some alternative implementations, the first circuit board 1 and the second circuit board 2 are connected by solder paste.
[0049] The present application discloses a bone voiceprint sensor, the working principle of which is as follows: the vibration system detects external vibration signals and generates corresponding vibrations, thereby stimulating the flow of gas in the vibration space formed by the first cavity 61 and the second cavity 62. The flowing gas causes the diaphragm of the microphone MEMS chip 10 to vibrate through the sound hole 5. The microphone MEMS chip 10 converts the variable vibration signal into a variable electrical signal, which is then amplified and output by the microphone ASIC chip 9.
[0050] refer to Figure 2 Another embodiment of this application proposes a bone voiceprint sensor. Figure 2 The bone voiceprint sensor shown is similar to Figure 1 The bone voiceprint sensor shown differs in that:
[0051] exist Figure 2 The bone conduction sensor shown does not have an exhaust channel 12 and an exhaust port 7.
[0052] The technical solution of this application has been described in detail above through specific embodiments. In the above embodiments, the descriptions of each embodiment have their own emphasis, and for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0053] It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and protection scope of the technical solutions of the embodiments of this application.
Claims
1. A bone conduction sensor, characterized in that, include: The first circuit board includes a first surface, a first cavity formed on the first surface, and an exhaust channel connecting the first cavity and the first surface; The second circuit board includes a second surface for joining the first surface, the second surface having a second cavity and a sound hole communicating with the second cavity at a position corresponding to the cavity, and an exhaust hole at a position corresponding to the exhaust channel; The vibration system is disposed within the vibration space formed by the first cavity and the second cavity, and includes an elastic membrane disposed on the first surface and covering the first cavity, and a mass block disposed on the elastic membrane. A MEMS microphone assembly is disposed on a third surface of the second circuit board opposite to the second surface, and communicates with the cavity through the sound hole; The housing is connected to the second circuit board and forms a cavity for accommodating the MEMS microphone assembly. The cavity is connected to the first cavity through the vent hole and the vent channel.
2. The bone conduction sensor according to claim 1, characterized in that, In the cross-sectional view, the width of the mass block is smaller than the width of the first cavity, and the width of the first cavity is smaller than the width of the second cavity.
3. The bone conduction sensor according to claim 1, characterized in that, The elastic membrane, when stretched, covers the first cavity, and the edges of the elastic membrane are bonded to the first surface with an adhesive.
4. The bone conduction sensor according to claim 1, characterized in that, The mass block is disposed on the upper or lower surface of the elastic membrane.
5. The bone conduction sensor according to claim 4, characterized in that, In cross-sectional view, the width of the first circuit board is the same as the width of the second circuit board.
6. The bone conduction sensor according to claim 1, characterized in that, The MEMS microphone assembly includes a microphone MEMS chip and a microphone ASIC chip, wherein the microphone MEMS chip is disposed at the sound hole.
7. The bone conduction sensor according to claim 6, characterized in that, The microphone MEMS chip and the microphone ASIC chip, and the microphone ASIC chip and the second circuit board are electrically connected by bonding wires.
8. The bone conduction sensor according to claim 6, characterized in that, The microphone MEMS chip and the microphone ASIC chip are respectively fixed to the second circuit board with adhesive.
9. The bone conduction sensor according to claim 1, characterized in that, The housing is connected to the second circuit board via solder paste.
10. The bone conduction sensor according to claim 1, characterized in that, The first circuit board and the second circuit board are connected by solder paste.