A ball placement device for PCB soldering

Abstract

The utility model relates to a ball planting device for PCB board welding belongs to PCB board welding technical field, this ball planting device for PCB board welding, include: the ball receiving board, the top end of ball receiving board is connected with the brush paste board, the top of ball receiving board is connected with the ball planting frame, one side of ball receiving board is provided with positioning mechanism, the multiple positioning rods of installation frame bottom are aligned with the ball planting, can adjust the position of fixed frame through the screw rod, drive positioning rod and ball planting position, prevent the ball planting from appearing the deviation when welding, the installation frame is the frame type structure and will not affect the use of heating welding machine, the positioning rod is stainless steel material, the chromium oxide layer of positioning rod will not stick together with the ball planting, the installation frame rotates on the ball receiving board with fixed bolt as the pivot through the fixed block, make the installation frame and ball receiving board vertical, the fixed bolt and the nut cooperation can clamp and fix the fixed block, can stably weld the ball planting on the PCB board, improve the welding effect of PCB board.

Description

Technical Field

[0001] This utility model relates to the field of PCB board welding technology, and in particular to a ball-planting device for PCB board welding. Background Technology

[0002] PCB, or Printed Circuit Board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical interconnections. Because it is manufactured using electronic printing techniques, it is called a "printed" circuit board. PCBs require soldering of ball bearings during use.

[0003] As shown in the reference case "A Fully Automatic Chip Packaging Whole Board Ball Placement Equipment" announcement number "CN218274522U", by setting up a first board, slide rail and worktable, and setting a positioning plate on the worktable that can adsorb the substrate, the X, Y and Z coordinates of the substrate can be automatically and accurately adjusted to realize automated production line production and improve production efficiency. By setting up a mesh plate that matches the substrate and working with a scraper, the entire board of chip packaging can be ball-placed in one operation. The ball placement efficiency is high and the influence of human factors on ball placement can be completely avoided, and the ball placement quality is stable.

[0004] According to the above reference materials, in the above device, the first driving device drives the first board to move along the Z direction, pushing the worktable on it to move the substrate synchronously upward and close to the stencil, so that the substrate is tightly attached to the stencil; the fifth driving device drives the scraper to scrape across the stencil and brush solder paste onto a specific area of ​​the substrate to complete the ball placement for the whole board chip packaging. However, when the device is soldering the ball placement, the ball placement on the substrate is prone to soldering displacement, which affects the packaging effect of the PCB board, makes it inconvenient to stably solder the ball placement on the PCB board, and reduces the use effect of the PCB board. Utility Model Content

[0005] Therefore, it is necessary to provide a ball-planting device for PCB board soldering to address the problem of inconvenience in stably soldering balls onto PCB boards.

[0006] The device includes a ball receiving plate, a paste application board attached to the top of the ball receiving plate, a ball planting frame attached above the ball receiving plate, and a positioning mechanism on one side of the ball receiving plate. The positioning mechanism includes a fixed block rotatably connected to one side of the ball receiving plate, a mounting frame slidably connected to the front end of the fixed block, and several evenly arranged positioning rods fixedly connected to the bottom end of the mounting frame. The inner wall of the ball planting frame is provided with a limit component.

[0007] In one embodiment, the positioning mechanism further includes a lead screw rotatably connected to the top of the fixed block, one end of which passes through the fixed block and is threadedly connected to one side of the mounting frame.

[0008] In one embodiment, a fixing bolt is rotatably connected to one side of the ball receiving plate, one end of the fixing bolt passing through the ball receiving plate and the fixing block in sequence, and the fixing block and the fixing bolt are rotatably connected.

[0009] In one embodiment, one end of the fixing bolt is threaded with a nut.

[0010] In one embodiment, the limiting component includes a mounting plate disposed on the inner wall of the ball-planting frame, and a plurality of evenly arranged limiting rods are fixed to the bottom of the mounting plate.

[0011] In one embodiment, the bottom end of the limiting rod is aligned with the through hole in the inner wall of the ball-planting frame.

[0012] In one embodiment, a connecting block is fixedly connected to one side of the top of the mounting plate, and one end of the connecting block is rotatably connected to the ball-planting frame.

[0013] In one embodiment, a fastening bolt is rotatably connected to the other side of the top of the mounting plate, one end of which passes through the mounting plate and is threadedly connected to the ball-planting frame.

[0014] Beneficial effects 1. The ball-planting device for PCB board soldering described above can be installed on the paste-applying plate and the ball-planting frame in sequence. The paste-applying plate can apply solder paste to the PCB board, and the ball-planting frame can install the balls on the PCB board and make them contact with the solder paste. Multiple positioning rods at the bottom of the mounting frame are aligned with the balls. The position of the frame can be adjusted by the screw rod, which drives the positioning rods to position the balls and prevents the balls from shifting during soldering. The mounting frame is a frame structure and will not affect the use of the heating soldering machine. The positioning rods are made of stainless steel and the chromium oxide layer of the positioning rods will not stick to the balls. The mounting frame rotates on the ball-applying plate with the fixing bolt as the axis through the fixing block, so that the mounting frame is perpendicular to the ball-applying plate. The fixing bolt and nut can clamp and fix the fixing block, which can stably solder the balls on the PCB board and improve the soldering effect of the PCB board. 2. When installing ball-planting on the PCB board, the mounting plate inside the ball-planting frame can rotate and open via the connecting block, aligning the limiting rod with the through hole inside the ball-planting frame and blocking the through hole to prevent the installed ball from falling off and affecting the soldering of the PCB board. The fastening bolts can fix the position of the mounting plate, clean up excess ball-planting in the ball-planting frame, and perform precise soldering of the ball-planting, improving the soldering effect of the ball-planting on the PCB board. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the external structure of the present utility model; Figure 2 This is a schematic diagram of the ball-planting installation structure of this utility model; Figure 3 This is a schematic diagram of the positioning mechanism structure of this utility model; Figure 4 This utility model Figure 3 Enlarged view of point A in the middle; Figure 5 This is a schematic diagram of the limiting component structure of this utility model.

[0017] Figure label: 100. Ball receiving plate; 200. Paste application board; 300. Ball planting frame; 400. Positioning mechanism; 410. Fixing block; 420. Mounting frame; 430. Positioning rod; 440. Screw rod; 450. Fixing bolt; 460. Nut; 470. Limiting assembly; 471. Mounting plate; 472. Limiting rod; 473. Connecting block; 474. Fastening bolt. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0019] The following is combined Figure 1 - Figure 5 This invention describes a ball-planting device for PCB board soldering.

[0020] In one embodiment, a ball-planting device for PCB board soldering includes a ball-receiving plate 100, a paste-applying plate 200 snapped onto the top of the ball-receiving plate 100, a ball-planting frame 300 snapped onto the top of the ball-receiving plate 100, and a positioning mechanism 400 provided on one side of the ball-receiving plate 100; wherein, the positioning mechanism 400 includes a fixing block 410 rotatably connected to one side of the ball-receiving plate 100, a mounting frame 420 slidably connected to the front end of the fixing block 410, a plurality of evenly arranged positioning rods 430 fixedly connected to the bottom end of the mounting frame 420, and a limit component 470 provided on the inner wall of the ball-planting frame 300.

[0021] It should be noted that the ball-planting device for PCB board soldering mainly consists of a steel mesh, a ball-planting frame 300, and a ball-receiving box; Stencil: Used for printing solder paste or solder balls, and the accuracy of its openings directly affects the accuracy of ball placement.

[0022] 300 solder ball frame: Used in conjunction with stencil, it guides solder balls into the pads through perforations. Perforations are evenly distributed on its lower end face, forming a gap with the stencil to facilitate the rolling of solder balls to the target position.

[0023] Ball receiving box: Located below the ball planting frame 300, it collects unused solder balls.

[0024] When performing ball placement soldering on the PCB board, the positioning mechanism 400 aligns with the ball placement on the ball receiving plate 100 via the mounting frame 420 and multiple positioning rods 430, thus positioning the ball. The fixing bolts 450 can adjust the position of the positioning rods 430, which can also position the ball. The limiting component 470 can limit the ball placement within the ball placement frame 300 via multiple limiting rods 472 at the bottom of the mounting plate 471, so that the ball is installed on the PCB board. The positioning mechanism 400 and the limiting component 470 work together to improve the ball placement soldering effect on the PCB board without affecting the normal use of the PCB board ball placement device.

[0025] like Figure 3 and Figure 4 As shown, the positioning mechanism 400 also includes a lead screw 440 rotatably connected to the top of the fixed block 410. One end of the lead screw 440 passes through the fixed block 410 and is threadedly connected to one side of the mounting frame 420. A fixing bolt 450 is rotatably connected to one side of the ball receiving plate 100. One end of the fixing bolt 450 passes through the ball receiving plate 100 and the fixed block 410 in sequence. The fixed block 410 and the fixing bolt 450 are rotatably connected. A nut 460 is threadedly connected to one end of the fixing bolt 450.

[0026] In this embodiment, the ball receiving plate 100 can apply solder paste to the solder joints of the PCB board through the paste application plate 200. The ball placement frame 300 can place the ball on the solder joints of the PCB board and make it contact with the solder paste. Rotating the fixing block 410 drives multiple positioning rods 430 at the bottom of the mounting frame 420 to move above the ball. By rotating the screw 440 and threadedly connecting it to the mounting frame 420, the positioning rods 430 at the bottom of the mounting frame 420 can be driven to contact the top of the ball, preventing displacement during ball placement welding. The mounting frame 420 will not affect the welding effect of the ball placement. The fixing bolts 450 and nuts 460 can fix the position of the fixing block 410, which can stably weld the ball on the PCB board and improve the welding effect of the PCB board.

[0027] like Figure 5 As shown, the limiting component 470 includes a mounting plate 471 disposed on the inner wall of the ball planting frame 300. Several evenly arranged limiting rods 472 are fixed at the bottom of the mounting plate 471. The bottom ends of the limiting rods 472 are aligned with the through holes in the inner wall of the ball planting frame 300. A connecting block 473 is fixedly connected to one side of the top of the mounting plate 471. One end of the connecting block 473 is rotatably connected to the ball planting frame 300. A fastening bolt 474 is rotatably connected to the other side of the top of the mounting plate 471. One end of the fastening bolt 474 passes through the mounting plate 471 and is threadedly connected to the ball planting frame 300.

[0028] In this embodiment, when installing the ball, the mounting plate 471 rotates and opens on the ball frame 300 via the connecting block 473, which can drive the limiting rod 472 to limit and block the through hole on the ball frame 300, preventing the ball from falling out of the through hole. The mounting plate 471 is threadedly connected to the ball frame 300 via the fastening bolt 474, which can fix the position of the limiting rod 472 and recycle excess balls, thereby improving the welding effect of the ball and improving the use of the PCB board.

[0029] Working principle: Place the PCB board in the groove on the ball receiving plate 100, install the solder paste application plate 200 on the ball receiving plate 100, apply solder paste to the PCB board, remove the solder paste application plate 200, install the ball placement frame 300 on the ball receiving plate 100, place the ball placement frame inside the ball placement frame 300, and install the ball placement frame on the PCB board through multiple through holes. Rotate the mounting plate 471 to align the limiting rod 472 with the through holes on the ball placement frame 300, which can limit the ball placement in the through holes. Manually rotate the fastening bolt 474, which is threaded into the ball placement frame 300, to fix the mounting plate 471. Excess balls can be recycled, and the ball-planting frame 300 can be removed. Rotating the fixing block 410 with the fixing bolt 450 as the axis drives the positioning rod 430 at the bottom of the mounting frame 420 to move above the ball. The mounting frame 420 is perpendicular to the ball-receiving plate 100. Manually rotating the fixing bolt 450 and the nut 460 threaded connection can move the nut 460 to one end to clamp and fix the fixing block 410. Manually rotating the screw 440 and the mounting frame 420 threaded connection can drive the positioning rod 430 to contact the top of the ball, positioning the ball and allowing the ball to be welded.

[0030] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A ball-planting device for PCB board soldering, characterized in that, include: A ball receiving plate (100) is provided with a paste brush plate (200) attached to its top end, a ball planting frame (300) is attached to the top of the ball receiving plate (100), and a positioning mechanism (400) is provided on one side of the ball receiving plate (100). The positioning mechanism (400) includes a fixed block (410) rotatably connected to one side of the ball receiving plate (100), a mounting frame (420) is slidably connected to the front end of the fixed block (410), and a number of evenly arranged positioning rods (430) are fixedly connected to the bottom end of the mounting frame (420). The inner wall of the ball planting frame (300) is provided with a limit component (470).

2. The ball-planting device for PCB board soldering according to claim 1, characterized in that, The positioning mechanism (400) further includes a lead screw (440) rotatably connected to the top of the fixed block (410), one end of the lead screw (440) passing through the fixed block (410) and threadedly connected to one side of the mounting frame (420).

3. The ball-planting device for PCB board soldering according to claim 1, characterized in that, A fixing bolt (450) is rotatably connected to one side of the ball receiving plate (100). One end of the fixing bolt (450) passes through the ball receiving plate (100) and the fixing block (410) in sequence. The fixing block (410) is rotatably connected to the fixing bolt (450).

4. The ball-planting device for PCB board soldering according to claim 3, characterized in that, One end of the fixing bolt (450) is threaded with a nut (460).

5. The ball-planting device for PCB board soldering according to claim 1, characterized in that, The limiting component (470) includes an installation plate (471) disposed on the inner wall of the ball planting frame (300), and a plurality of evenly arranged limiting rods (472) are fixed at the bottom of the installation plate (471).

6. The ball-planting device for PCB board soldering according to claim 5, characterized in that, The bottom end of the limiting rod (472) is aligned with the through hole on the inner wall of the ball planting frame (300).

7. The ball-planting device for PCB board soldering according to claim 5, characterized in that, A connecting block (473) is fixedly connected to one side of the top of the mounting plate (471), and one end of the connecting block (473) is rotatably connected to the ball planting frame (300).

8. The ball-planting device for PCB board soldering according to claim 5, characterized in that, A fastening bolt (474) is rotatably connected to the other side of the top of the mounting plate (471), one end of which passes through the mounting plate (471) and is threadedly connected to the ball-planting frame (300).

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