Modular test card shielding structure

Abstract

The utility model belongs to PXI measuring instrument technical field, concretely relates to a modular test card shielding structure, through the shielding piece of sub -card cover, through the recess part and the convex part cooperation of shielding bottom plate and shielding cover board, the close surrounding is formed to the sub -card week side, the electromagnetic radiation of sub -card internal circuit is effectively suppressed, in addition, the plug -in panel and the bottom card and sub -card are through the metal shielding strip of setting in the joint transition position, further reduce the electromagnetic leakage path, the back surface of shielding bottom plate and shielding cover plate of shielding piece is provided with the heat dissipation groove separately, increases the heat dissipation area, is favorable to the heat of sub -card in the high -speed test is promptly dissipated, guarantees the stability and reliability of test card under the long time high load working condition, through the structure of bottom card and sub -card, has realized the separation and cooperation of control, interface and power, signal processing function, the modular degree is high, is convenient for the upgrade and maintenance of software and hardware.

Description

Technical Field

[0001] This utility model belongs to the field of PXIe measuring instrument technology, specifically relating to a modular test card shielding structure. Background Technology

[0002] PXIe (PCI Express Extensions for Instrumentation) bus technology, with its advantages of high-speed data transmission, precise clock synchronization, and modularity, has been widely used in the field of automated testing and measurement. The modular test card shielding structure, as a core component of the PXI system, undertakes multiple key testing functions such as signal generation, acquisition, conditioning, and analysis.

[0003] With the rapid development of electronic technology, the complexity of devices under test (DUTs) is increasing, and the performance requirements for test systems are also rising, especially in the field of high-frequency signal testing such as radio frequency and microwave. Traditional modular test card shielding structures, while pursuing higher integration, wider test frequency ranges, and more flexible functional configurations, also face many challenges.

[0004] High-density, high-frequency signal processing circuits impose stringent requirements on electromagnetic compatibility (EMC). Electromagnetic interference (EMI) issues can arise between digital, analog, and RF circuits within the shielded structure of modular test cards, as well as between the test card and the external environment. Inadequate shielding design can severely impact signal integrity, leading to inaccurate test results. The risk of electromagnetic leakage is particularly prominent in critical areas such as the connection between daughter cards and base cards, input / output terminal leads, and heat dissipation structures. Existing shielding solutions may suffer from issues such as discontinuous shielding, insufficient shielding effectiveness, or complex structures and high costs.

[0005] Therefore, how to design a modular test card shielding structure that is compact, flexible in function, has excellent electromagnetic shielding performance, and is easy to operate and maintain has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide a modular test card shielding structure.

[0007] To achieve the above objectives, this utility model provides a modular test card shielding structure for use in a daughter card. The daughter card includes a power module and several signal processing modules. Each signal processing module has an input terminal and an output terminal electrically connected to its signal input terminal and output terminal, respectively. Several of the input terminals and output terminals are arrayed on the end side of the daughter card.

[0008] The modular test card shielding structure includes: a shielding component, which includes a shielding base plate and a shielding cover plate. The shielding base plate has a groove on its edge, and the shielding cover plate has a protrusion that cooperates with the groove to seal. The sub-card is accommodated between the shielding base plate and the shielding cover plate. After the shielding cover plate and the shielding base plate are engaged, the groove and the protrusion cooperate to close and surround the periphery of the sub-card. The shielding component has openings corresponding to the input terminals and the output terminals, which are exposed through the openings. The periphery of the openings is covered with an electromagnetic shielding layer.

[0009] In some embodiments, the shielding base plate is provided with shielding ribs on the periphery of the plurality of signal processing modules, and the shielding ribs respectively surround the periphery of the plurality of signal processing modules.

[0010] In some embodiments, the power module and several signal processing modules include several components, and the shielding base plate has several receiving slots for accommodating the components.

[0011] In some embodiments, the back of the shielding base plate includes a mounting surface and a first heat dissipation surface, and the back of the shielding cover plate includes a second heat dissipation surface. Heat dissipation grooves are formed on the first and second heat dissipation surfaces, and the shielding base plate, the sub-clamp, and the shielding cover plate are connected by mounting screws on the mounting surface.

[0012] In some embodiments, a base card is also included, which is connected to the sub-card via a board-to-board connector. The shielding cover has a clearance groove at the position corresponding to the board-to-board connector, and the periphery of the clearance groove is covered with an electromagnetic shielding layer.

[0013] In some embodiments, the plug-in panel includes a connector with a first mounting hole and a second mounting hole. The base is fastened to the connector through the first mounting hole, and the plug-in panel is fastened to the connector through the second mounting hole.

[0014] In some embodiments, the base card is in contact with the second heat dissipation surface, and a thermally conductive silicon pad is provided therebetween.

[0015] In some embodiments, a shielding strip is provided at the joint between the plug-in panel and the bottom card and the daughter card.

[0016] In some embodiments, a protective cover is also installed on the back of the base card.

[0017] In some embodiments, at least one side of the plug-in panel is provided with a plug-in aid.

[0018] This application provides a modular test card shielding structure. Through the shielding components fitted onto the daughter card, the grooves and protrusions of the shielding base plate and shielding cover plate cooperate to form a tight enclosure around the daughter card, effectively suppressing electromagnetic radiation generated by the internal circuitry of the daughter card. Furthermore, the plug-in panel, base card, and daughter card are connected by a metal shielding strip at the seam transition, further reducing electromagnetic leakage paths. The back of the shielding base plate and shielding cover plate of the shielding component are separately provided with heat dissipation grooves, increasing the heat dissipation area and facilitating the timely dissipation of heat generated by the daughter card during high-speed testing, ensuring the stability and reliability of the test card under long-term high-load operation. Through the structure of the base card and daughter card, the control, interface, power supply, and signal processing functions are separated and coordinated, resulting in a high degree of modularity and facilitating software and hardware upgrades and maintenance. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the sub-card and the base card provided in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the structure of a shielding component provided in an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of the structure of a shielding base plate provided in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the structure of a shielding cover provided in one embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the structure of a shielding base plate provided in one embodiment of this application;

[0024] Figure 6 This is a schematic diagram of the back structure of the shielding base plate provided in one embodiment of this application;

[0025] Figure 7 This is a schematic diagram of the back structure of a shielding cover provided in one embodiment of this application;

[0026] Figure 8 This is a schematic diagram of the modular test card shielding structure provided in one embodiment of this application;

[0027] Figure 9 This is a schematic diagram of the plug-in panel provided in one embodiment of this application;

[0028] Figure 10 This is a schematic diagram of the structure of a connector provided in an embodiment of this application;

[0029] Figure 11 This is a schematic diagram of the structure of a shielding cover provided in one embodiment of this application;

[0030] Figure 12 This is a schematic diagram of the modular test card shielding structure provided in one embodiment of this application;

[0031] In the picture: base card 1, protective shell 11;

[0032] Sub-card 2, power module 21, signal processing module 22, attenuation unit 221, amplification unit 222, filtering unit 223, channel selection module 23, input terminal 24, output terminal 25;

[0033] Plug-in panel 3, connector 31, first mounting hole 311, second mounting hole 312, shielding strip 32, pull-out aid 33;

[0034] Shielding component 4, shielding base plate 41, groove portion 411, mounting surface 412, first heat dissipation surface 413, shielding rib 414, receiving groove 415, shielding cover plate 42, protrusion portion 421, second heat dissipation surface 422, heat dissipation groove (413a, 422a), clearance groove 423, thermally conductive silicone pad 424, opening 43, electromagnetic shielding layer (423a, 431).

[0035] Board-to-board connector 5. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] This application provides a modular test card shielding structure.

[0038] Figure 1 This is a schematic diagram of the structure of the sub-card and the base card provided in an embodiment of this application.

[0039] Reference Figure 1 This application provides a modular test card shielding structure, which mainly includes at least one base card 1 and at least one sub-card 2 that is connected to the base card 1 through a board-to-board connector 5.

[0040] Daughter card 2 is the core component for implementing specific signal testing and functional processing. Daughter card 2 integrates a power module 21 and several signal processing modules 22.

[0041] The power module 21 is responsible for converting the power obtained from the PXI bus or external power supply into the stable operating voltage required by each module on the daughter card 2.

[0042] The signal input and output terminals of each signal processing module 22 are electrically connected to the input terminal 24 and output terminal 25 located on the end side of the daughter card 2 via internal wiring, respectively. A plurality of input terminals 24 and output terminals 25 are arranged in an array on the end side of the daughter card 2. Specifically, the input terminal 24 and output terminal 25 can be SMA connectors or SMP connectors.

[0043] Figure 2 This is a schematic diagram of the shielding component provided in one embodiment of this application.

[0044] Reference Figure 2 The daughter card 2 is also equipped with a shielding component 4, which is made of aluminum alloy, or copper alloy or other high thermal conductivity metals. It can be used to achieve electromagnetic shielding, while also taking into account the heat dissipation requirements of the daughter card 2 during signal processing.

[0045] Figure 3 This is a schematic diagram of the structure of a shielding base plate provided in an embodiment of this application.

[0046] Figure 4 This is a schematic diagram of the structure of a shielding cover provided in an embodiment of this application.

[0047] Please refer to the following at the same time Figures 2 to 4 Specifically, the shielding component 4 consists of a shielding base plate 41 and a shielding cover plate 42. The sub-card 2 is housed between the shielding base plate 41 and the shielding cover plate 42, forming a closed shielding cavity. A groove 411 is formed on the edge of the contact surface between the shielding base plate 41 and the sub-card 2. Correspondingly, a protrusion 421 matching the groove 411 is formed on the edge of the contact surface between the shielding cover plate 42 and the sub-card 2. When the shielding cover plate 42 and the shielding base plate 41 are closed, the protrusion 421 is embedded in the groove 411, forming a surrounding area around the entire periphery of the sub-card 2, effectively preventing electromagnetic signals from leaking from the side gaps.

[0048] Reference Figure 2 In some embodiments, the shielding member 4 has an opening 43 at a corresponding position for the input terminal 24 and the output terminal 25 to pass through. The periphery of the opening 43 is covered with an electromagnetic shielding layer 431 to ensure the integrity of the shielding.

[0049] Simultaneously refer to Figure 1 and Figure 2 The bottom card 1 and the daughter card 2 are connected via a board-to-board connector 5. The shielding cover 42 has a clearance groove 423 at a position corresponding to the board-to-board connector 5 for the board-to-board connector 5 to pass through. The periphery of the clearance groove 423 is also covered with an electromagnetic shielding layer 423a to reduce electromagnetic leakage at this location.

[0050] Figure 5 This is a schematic diagram of the structure of a shielding base plate provided in an embodiment of this application.

[0051] In some embodiments, the shielding base plate 41 is provided with shielding ribs 414 on the periphery of the plurality of signal processing modules 22. The shielding ribs 414 surround the periphery of the plurality of signal processing modules 22 respectively, so as to shield the electromagnetic signals of each signal processing module 22 and prevent electromagnetic crosstalk between the modules.

[0052] In some embodiments, the power module 21 and several signal processing modules 22 include several components, and the shielding base plate has several receiving slots 415 for accommodating the components.

[0053] Figure 6 This is a schematic diagram of the back structure of the shielding base plate provided in one embodiment of this application.

[0054] Figure 7 This is a schematic diagram of the back structure of a shielding cover provided in one embodiment of this application.

[0055] Please refer to the following at the same time Figure 6 and Figure 7 In some embodiments, the back side of the shielding base plate 41 (i.e., the side that does not contact the daughter card 2) includes a mounting surface 412 and a first heat dissipation surface 413, and the back side of the shielding cover plate 42 constitutes a second heat dissipation surface. The first heat dissipation surface 413 has a plurality of heat dissipation grooves 413a, and the second heat dissipation surface has a plurality of heat dissipation grooves 422a. Wave-shaped heat dissipation teeth are formed between each heat dissipation groove 413a and heat dissipation groove 422a to increase the contact surface area between the shielding base plate 41 and the shielding cover plate 42 and the air, so as to better conduct the heat generated by the daughter card 2 during operation to the shielding component 4 and dissipate it to the external environment. The shielding base plate 41, daughter card 2 and shielding cover plate 42 are connected and fixed by fastening screws on the mounting surface 412 to ensure the integrity of the structure and good thermal contact. Specifically, the fastening screws fasten the shielding base plate 41, daughter card 2 and shielding cover plate 42 through the shielding ribs 414, and the wall thickness at the shielding ribs 414 increases the connection strength.

[0056] Figure 8 This is a schematic diagram of the plug-in panel provided in one embodiment of this application.

[0057] Figure 9 This is a schematic diagram of the modular test card shielding structure provided in one embodiment of this application.

[0058] Figure 10 This is a schematic diagram of the structure of a connector provided in an embodiment of this application.

[0059] Reference Figure 8To facilitate user insertion and removal of the modular test card shielding structure and protect the input terminals 24 and output terminals 25, as well as to increase the connection strength between the base card 1 and the daughter card 2, a plug-in panel 3 is sleeved on the end side of the daughter card 2. Both the input terminals 24 and the output terminals 25 pass through the plug-in panel 3 and are exposed thereon for connection to external test cables.

[0060] Please refer to the following at the same time Figure 9 and Figure 10 In some embodiments, the plug-in panel 3 includes a connector 31, which has a first mounting hole 311 and a second mounting hole 312. The base card 1 is fastened to the connector 31 via the first mounting hole 311 using screws or other fasteners. The main body of the plug-in panel is fastened to the connector 31 via the second mounting hole 312 using screws or other fasteners. This ensures that the plug-in panel is firmly fixed to the base card 1 and the daughter card 2, improving the mechanical strength of the front end of the entire modular test card shielding structure.

[0061] Figure 11 This is a schematic diagram of the structure of a shielding cover provided in an embodiment of this application.

[0062] Reference Figure 11 In some embodiments, the base card 1 is in contact with the second heat dissipation surface 422. To ensure its heat dissipation efficiency, a thermally conductive silicon pad 424 is also provided between them so that the base card 2 and the second heat dissipation surface 422 are in close contact.

[0063] In some implementation methods, please refer to Figure 9 At the joint formed between the plug-in panel and the bottom card 1, a shielding strip 32 is provided on both sides to prevent electromagnetic leakage. The shielding strip 32 can be a glass copper spring or a conductive rubber strip.

[0064] Figure 12 This is a schematic diagram of the modular test card shielding structure provided in one embodiment of this application.

[0065] Reference Figure 12 In some embodiments, a protective shell 11 is also provided on the back of the base card 1 to protect the components on the back of the base card 1. Specifically, the protective shell can be made of metal or other high-strength structural materials.

[0066] In some embodiments, at least one side of the insert panel 3 is provided with an extraction aid 33.

[0067] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular test card shielding structure, characterized in that, The application is to a daughter card, which includes a power module and several signal processing modules. Each signal processing module has an input terminal and an output terminal electrically connected to its signal input terminal and output terminal, respectively. Several of the input terminals and output terminals are arranged in an array on the end side of the daughter card. The modular test card shielding structure includes: a shielding component, which includes a shielding base plate and a shielding cover plate. The shielding base plate has a groove on its edge, and the shielding cover plate has a protrusion that cooperates with the groove to seal. The sub-card is accommodated between the shielding base plate and the shielding cover plate. After the shielding cover plate and the shielding base plate are engaged, the groove and the protrusion cooperate to close and surround the periphery of the sub-card. The shielding component has openings corresponding to the input terminals and the output terminals, which are exposed through the openings. The periphery of the openings is covered with an electromagnetic shielding layer.

2. The modular test card shielding structure according to claim 1, characterized in that, The shielding base plate is provided with shielding ribs on the periphery of the signal processing modules, and the shielding ribs surround the periphery of the signal processing modules respectively.

3. The modular test card shielding structure according to claim 2, characterized in that, The power module and several signal processing modules each include several components, and the shielding base plate has several receiving slots for accommodating the components.

4. The modular test card shielding structure according to claim 3, characterized in that, The back of the shielding base plate includes a mounting surface and a first heat dissipation surface, and the back of the shielding cover plate includes a second heat dissipation surface. Heat dissipation grooves are formed on the first heat dissipation surface and the second heat dissipation surface. The shielding base plate, the sub-clamp, and the shielding cover plate are connected by mounting screws on the mounting surface.

5. The modular test card shielding structure according to claim 4, characterized in that, It also includes a base card, which is connected to the sub-card via a board-to-board connector. The shielding cover has a clearance groove at the position corresponding to the board-to-board connector, and the periphery of the clearance groove is covered with an electromagnetic shielding layer.

6. The modular test card shielding structure according to claim 5, characterized in that, The plug-in panel includes a connector, which includes a first mounting hole and a second mounting hole. The base is fastened to the connector through the first mounting hole, and the plug-in panel is fastened to the connector through the second mounting hole.

7. The modular test card shielding structure according to claim 5, characterized in that, The base plate is in contact with the second heat dissipation surface, and a thermally conductive silicon pad is provided therebetween.

8. The modular test card shielding structure according to claim 6, characterized in that, A shielding strip is provided at the joint between the plug-in panel and the bottom card and the daughter card.

9. The modular test card shielding structure according to claim 8, characterized in that, The back of the base card is also fitted with a protective cover.

10. The modular test card shielding structure according to claim 6, characterized in that, At least one side of the plug-in panel is provided with a plug-in aid.

Images