A high-cleanliness wafer coating device

Abstract

The utility model discloses a kind of high cleanness wafer coating devices, it is related to coating device technical field, and its technical solution main point is: film coating station is reciprocated below film and adherent membrane by linear module one, the inner wall of coating device ontology both sides is respectively provided with sliding slot one and sliding slot two, and the sliding slot one and sliding slot two are slidably connected with the contact roller in through transmission belt, any contact roller moves to the below of transmission belt, and drive film or adherent membrane and the top surface of film coating station, cutting device is located linear module one and is close to the upper side of conveying assembly one side.The utility model can contact adherent membrane and wafer surface after separating release layer two by conveying assembly one and the contact roller of circumferential sliding cooperation, adherent membrane is attached on the surface of wafer after separating release layer one by conveying assembly two and the contact roller of circumferential sliding cooperation, so as to improve the cleanness of film and wafer when film coating.

Images