A thin film etching apparatus

CN224698243UActive Publication Date: 2026-08-28SHENYANG JINGQI NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202521945862.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-10
Publication Date
2026-08-28
Estimated Expiration
2035-09-10

AI Technical Summary

Technical Problem

[0005]为了解决上述现有技术中存在的喷淋管无法在蚀刻槽内上下移动,从而无法调节喷淋管与薄膜之间的距离,进而无法确保蚀刻液能够喷射至薄膜本体上,并降低了蚀刻液利用率的问题,本实用新型提供一种薄膜蚀刻装置,采用调节喷淋管与薄膜本体之间的距离,从而实现既能增大喷淋管与薄膜本体之间的距离,以降低薄膜本体依次穿过两个通口的难度,还能通过缩小喷淋管与薄膜本体之间的距离,以确保蚀刻液能够喷射至薄膜本体上,以提升蚀刻液利用率的效果

Benefits of technology

1. 通过使第一升降机构带动第一升降架上下移动,并将喷淋管安装在第一升降架的底部,以实现调节喷淋管与薄膜本体之间的距离,从而实现既能增大喷淋管与薄膜本体之间的距离,以降低薄膜本体依次穿过两个通口的难度,还能通过缩小喷淋管与薄膜本体之间的距离,以确保蚀刻液能够喷射至薄膜本体上,以提升蚀刻液的利用率。通过将第二连通管嵌入第一连通管内,将密封圈套装在第二连通管一端的外侧,并使密封圈与第一连通管的内壁相贴合,以实现第二连通管能够在第一连接管内移动,从而适配第一升降架的高度,以确保蚀刻液能够从喷淋孔流出,以提升产品的使用体验。

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Abstract

The utility model provides a kind of film etching device, film etching device is etched to film body, film etching device includes: etching box, pass, first lifting mechanism, first lifting frame, spray pipe, water pump, first communication pipe, second communication pipe, sealing ring and support roller;By first lifting mechanism drives first lifting frame to move up and down, and spray pipe is installed in the bottom of first lifting frame, to realize the distance between spray pipe and film body is adjusted, to realize that the distance between spray pipe and film body can be increased, to reduce the difficulty that film body passes through two passings in turn, spray pipe and film body can also be reduced the distance between, to ensure that etching liquid can be sprayed to film body, to improve the utilization of etching liquid.
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Claims

1. A thin film etching apparatus, wherein the thin film etching apparatus performs etching processing on a thin film body, characterized in that, The thin film etching apparatus includes: An etching chamber, wherein the etching chamber is a hollow cavity; The two openings are respectively disposed on opposite side walls of the etching chamber, and the film body passes through the two openings in sequence; A first lifting mechanism is installed inside the etching box; A first lifting frame is located inside the etching chamber, and a first lifting mechanism is connected to the first lifting frame; A spray pipe with multiple spray holes at its bottom is installed at the bottom of the first lifting frame and is located above the film body. A water pump, which is mounted on top of the etching chamber; A first connecting pipe, one end of which is connected to the output end of the water pump, and the other end of which passes through the top of the etching box; The second connecting pipe has one end embedded in the other end of the first connecting pipe, and the other end of the second connecting pipe passes through the first lifting frame. The second connecting pipe is connected to the spray pipe. A sealing ring, which is an elastic body, is fitted onto the outside of one end of the second connecting pipe and is in contact with the inner wall of the first connecting pipe. Support rollers, two of which are respectively mounted on the two side walls of the etching chamber, and the film body is placed on the two support rollers at the same time.

2. The thin film etching apparatus according to claim 1, characterized in that, The first lifting mechanism includes: The first support plate, the two first support plates are respectively installed on the two inner walls of the etching box, and the two first support plates are located on both sides of the first lifting frame; The first lifting block has a first threaded hole and a first internal thread. The two first lifting blocks are respectively connected to the two sides of the first lifting frame. The first lead screw has a first external thread on its outer wall. One end of each of the two first lead screws is rotatably connected to the two first support plates. The two first lead screws pass through the first threaded holes of the two first lifting blocks. The other end of each of the two first lead screws passes through the top of the etching box and is rotatably connected to the etching box. The first internal thread is adapted to the first external thread.

3. The thin film etching apparatus according to claim 2, characterized in that, The first lifting mechanism also includes: Synchronous pulleys, two of which are respectively connected to two of the first lead screws, and the two synchronous pulleys are located above the etching box; A timing belt is fitted onto the outside of both timing pulleys.

4. The thin film etching apparatus according to claim 3, characterized in that, The first lifting mechanism also includes: A motor frame is mounted on top of the etching box and is arranged around the outside of one of the synchronous pulleys; A first motor is mounted on the motor frame and is connected to a first lead screw.

5. A thin film etching apparatus according to claim 1, characterized in that, The thin film etching apparatus includes: Second support plates, two of which are mounted on one side wall of the etching chamber; The second lead screw has a second external thread on its outer wall, and its two ends are rotatably connected to the two second support plates respectively. The second lifting block has a second threaded hole inside, and a second internal thread inside the second threaded hole. The second threaded hole of the second lifting block is fitted onto the outside of the second lead screw. The second lifting frame is connected to the second lifting block; A pressing roller is installed at the bottom of the second lifting frame and is in contact with the top of the film body; The second external thread is adapted to the second internal thread.

6. A thin film etching apparatus according to claim 5, characterized in that, The thin film etching apparatus further includes: The light bar has two ends connected to the two second support plates respectively, and the light bar passes through the second lifting block; The second motor is mounted on the side wall of the etching chamber and is connected to the second lead screw.

7. A thin film etching apparatus according to claim 6, characterized in that, The thin film etching apparatus further includes: A discharge port is provided on the side wall of the etching chamber; The bottom of the etching box is sloped, and the slope is set from low to high from the end near the discharge port to the end away from the discharge port.

Citation Information

Patent Citations

  • Etching device for thin film solar cell production

    CN213519863U