Wafer chuck ring for single wafer etcher

CN224698282UActive Publication Date: 2026-08-28CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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Patent Information

Application Number
CN202521946875.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-09
Publication Date
2026-08-28
Estimated Expiration
2035-09-09

AI Technical Summary

Benefits of technology

[0008]本实用新型的单片刻蚀机晶圆压环,避免了晶圆的有效区域的四个角内的芯片被刮除,保证了有效区域内的芯片完整。

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Abstract

The utility model discloses a single wafer etching machine wafer compression ring, including the middle part hollow compression ring body, the compression ring body includes the inner ring, the outer ring and sets up the connecting surface between the inner ring and the outer ring, the inner ring and the outer ring concentricity is arranged, the inner ring is equipped with four for avoiding the effective area of four corners of wafer and avoids the mouth of one -to -one correspondence with four corners. Single wafer etching machine wafer compression ring of the utility model guarantees the chip integrity in the effective area of wafer.
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Claims

1. A wafer clamping ring for a single-wafer etching machine, characterized in that, The device includes a pressure ring body with a hollow center. The pressure ring body includes an inner ring, an outer ring, and a connecting surface disposed between the inner ring and the outer ring. The inner ring and the outer ring are concentrically arranged. The inner ring has four avoidance openings at the four corners of the effective area of ​​the wafer, and each of the four corners corresponds to one of the four corners.

2. The wafer clamping ring for a single-wafer etching machine as described in claim 1, characterized in that, The outline of the clearance near the outer ring is an arc.

3. The wafer clamping ring for a single-wafer etching machine as described in claim 1 or 2, characterized in that, The distance between the intersection of the extension line from the center of the inner ring to each corner of the effective area of ​​the wafer and the common endpoint of the corresponding corner of the effective area of ​​the wafer is greater than or equal to 5 mm; the distance between the center of the inner ring and the intersection point is less than the radius of the outer ring.

4. The wafer clamping ring for a single-wafer etching machine as described in claim 1 or 2, characterized in that, The wafer includes an arc edge and a straight edge connected end to end, and the clearance is provided on the arc edge.