A semiconductor probe station
Patent Information
- Application Number
- CN202422956729.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2034-12-02
AI Technical Summary
[0006]本实用新型的目的在于提供一种半导体探针台,其能够解决探针台在不使用时长时间暴露在外部,不仅容易受到意外伤害,而且表面容易受到灰尘等杂质污染的问题
[0021] Compared with the prior art, the semiconductor probe station of this utility model provides comprehensive protection for the probe station body by sliding the protective plate above the probe station body and driving the inner shell to descend, so that the lower end face of the cleaning plate fits into the probe station body. At the same time, because the cleaning plate can elastically extend and retract, it can still rotate to wipe and clean the surface of the probe station body after it fits into the probe station body. No manual cleaning is required when using it again, making it very convenient to use.
Smart Images

Figure CN224708113U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor testing technology, specifically relating to a semiconductor probe station. Background Technology
[0002] Semiconductor probe stations are a key technological tool in the semiconductor manufacturing process, primarily used for high-precision measurement and testing on wafer surfaces. With the continuous development of semiconductor technology, the demands on device performance are increasing, driving advancements in probe station technology.
[0003] However, current probe stations are exposed to the outside for long periods of time when not in use, making them not only susceptible to accidental damage, but also prone to contamination by dust and other impurities. Every time they are used again, they need to be wiped manually, which brings great inconvenience to their use.
[0004] Therefore, in order to address the aforementioned technical problems, it is necessary to provide a semiconductor probe station.
[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0006] The purpose of this invention is to provide a semiconductor probe station that can solve the problem that when the probe station is not in use, it is exposed to the outside for a long time, which not only makes it susceptible to accidental damage, but also makes its surface susceptible to contamination by dust and other impurities.
[0007] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:
[0008] A semiconductor probe station includes a base and a probe head. A top plate is fixedly installed on the top of the base, and the probe head is fixedly installed on the top plate. A probe station body is fixedly installed on the base. A U-shaped groove is formed on the top plate, and the top end of the probe station body extends into the interior of the U-shaped groove.
[0009] A protective plate is slidably connected inside the U-shaped groove. A boss is fixedly installed on the protective plate. An inner shell is provided inside the boss. The inner shell matches the probe station body. A lifting component is provided on the boss. The lifting component is used to drive the inner shell to rotate and lift.
[0010] An elastic cleaning component is fixedly installed on the inner shell.
[0011] In one or more embodiments of this utility model, the lifting assembly includes a stud, a screw cylinder is provided at the middle position of the boss, the stud is screwed into the inside of the screw cylinder, and the bottom end of the stud penetrates into the inside of the boss and is fixedly connected to the inner shell.
[0012] In one or more embodiments of this utility model, a throttle is fixedly connected to the stud.
[0013] In one or more embodiments of the present invention, the elastic cleaning assembly includes a cleaning plate, the top end of which is slidably inserted into the interior of the inner housing, and multiple sets of second springs are fixedly installed between the top end of the cleaning plate and the top end of the interior of the inner housing.
[0014] The bottom of the cleaning plate is provided with a wiping pad.
[0015] In one or more embodiments of this utility model, the wiping pad is adhered and fixed to the bottom end of the cleaning plate.
[0016] In one or more embodiments of this utility model, the wiping pad is any one or more combinations of non-woven fabric, sponge, or fiber.
[0017] In one or more embodiments of this utility model, a limiting groove is formed on the inner sidewall of the U-shaped groove, and the edge of the protective plate is slidably inserted into the inside of the limiting groove.
[0018] In one or more embodiments of this utility model, a handle is fixedly installed on the protective plate.
[0019] In one or more embodiments of this utility model, a blocking component is provided at one end of the limiting groove away from the probe station body, and the blocking component matches the protective plate.
[0020] In one or more embodiments of the present invention, the blocking component includes a protrusion, a groove is provided on the inner wall of the limiting groove, a first spring is fixedly connected inside the groove, and one end of the protrusion is slidably inserted into the inside of the groove and fixedly connected to the first spring.
[0021] Compared with the prior art, the semiconductor probe station of this utility model provides comprehensive protection for the probe station body by sliding the protective plate above the probe station body and driving the inner shell to descend, so that the lower end face of the cleaning plate fits into the probe station body. At the same time, because the cleaning plate can elastically extend and retract, it can still rotate to wipe and clean the surface of the probe station body after it fits into the probe station body. No manual cleaning is required when using it again, making it very convenient to use. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a structural diagram of a semiconductor probe station in its first usage state according to an embodiment of the present invention;
[0024] Figure 2 This is a structural diagram of a semiconductor probe station in a second usage state according to an embodiment of the present invention;
[0025] Figure 3 This is an exploded view of the protective plate and boss of a semiconductor probe station according to one embodiment of the present invention;
[0026] Figure 4 This is a cross-sectional view of the protective plate and boss of a semiconductor probe station according to one embodiment of the present invention;
[0027] Figure 5 This is a front view of a semiconductor probe station according to an embodiment of the present invention;
[0028] Figure 6 This invention relates to a semiconductor probe station as described in one embodiment of the present invention. Figure 2 Enlarged view of point A in the middle;
[0029] Figure 7 This invention relates to a semiconductor probe station as described in one embodiment of the present invention. Figure 5 Enlarged view of section B in the middle.
[0030] Explanation of key figure labels:
[0031] 1. Base; 2. Top plate; 201. U-shaped groove; 202. Limiting groove; 203. Protrusion; 204. Groove; 205. First spring; 3. Probe head; 4. Probe stage body; 5. Protective plate; 501. Handle; 6. Boss; 601. Screw barrel; 7. Stud; 701. Turn handle; 8. Inner shell; 9. Cleaning plate; 901. Wiping plate; 10. Second spring. Detailed Implementation
[0032] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
[0033] like Figures 1-7 As shown, a semiconductor probe station according to one embodiment of the present invention includes a base 1 and a probe head 3. A top plate 2 is fixedly mounted on the top of the base 1 by a bracket, and the probe head 3 is fixedly mounted on the top plate 2. A probe station body 4 is fixedly mounted on the base 1, and the probe head 3 is located directly above the probe station body 4, enabling it to detect wafers positioned on the probe station body 4.
[0034] like Figure 1 and Figure 2 As shown, a U-shaped groove 201 is formed on the top plate 2, and the top of the probe station body 4 extends into the interior of the U-shaped groove 201. A protective plate 5 is slidably connected inside the U-shaped groove 201. Specifically, a limiting groove 202 is formed on the inner side wall of the U-shaped groove 201, and the edge of the protective plate 5 is slidably inserted into the interior of the limiting groove 202. By sliding the protective plate 5 above the probe station body 4, the probe station body 4 can be shielded and protected.
[0035] A handle 501 is fixedly installed at the front end of the protective plate 5, which facilitates pushing and pulling the protective plate 5 to slide and makes it easy to operate.
[0036] like Figure 3 and Figure 5 As shown, a boss 6 is fixedly installed on the protective plate 5, and an inner shell 8 is provided inside the boss 6. The inner diameter of the inner shell 8 is larger than the outer diameter of the probe station body 4.
[0037] like Figure 3 and Figure 4 As shown, a lifting assembly is provided on the boss 6. The lifting assembly is used to drive the inner housing 8 to rotate and lift inside the boss 6, so that the inner housing 8 can be sleeved on the probe station body 4.
[0038] Specifically, the lifting assembly includes a stud 7 and a screw cylinder 601 located at the center of the boss 6. The stud 7 is threaded into the inside of the screw cylinder 601, and its bottom end extends through the inside of the boss 6 and is fixedly connected to the inner housing 8. The stud 7 can rotate and lift inside the screw cylinder 601. During this rotation and lifting process, the stud 7 drives the inner housing 8 to rotate and lift, allowing the inner housing 8 to gradually fit onto the probe station body 4, thus providing comprehensive protection for the probe station body 4 and preventing contamination of its surface.
[0039] A throttle 701 is fixedly connected to the stud 7, which allows the operator to manually rotate the stud 7, thus enhancing operability.
[0040] An elastic cleaning assembly is fixedly installed inside the inner housing 8. Specifically, the elastic cleaning assembly includes a cleaning plate 9, the top end of which is slidably inserted into the inside of the inner housing 8. The cleaning plate 9 can extend and retract inside the inner housing 8. Multiple sets of second springs 10 are fixedly installed between the top end of the cleaning plate 9 and the top end inside the inner housing 8, so that the cleaning plate 9 can elastically extend and retract inside the inner housing 8.
[0041] In the initial state, the lower half of the cleaning plate 9 is located outside the inner housing 8. As the inner housing 8 rotates and descends to fit onto the probe station body 4, the lower end face of the cleaning plate 9 will first contact and adhere to the upper end face of the probe station body 4. As the inner housing 8 descends, the cleaning plate 9 will gradually move into the inner housing 8. During this process, the cleaning plate 9 will adhere closely to the probe station body 4 and rotate with the inner housing 8, thereby wiping and cleaning the surface of the probe station body 4.
[0042] A wiping pad 901 is provided at the bottom of the cleaning plate 9. Preferably, the wiping pad 901 is any one or more combinations of non-woven fabric, sponge, or fiber, which can effectively improve the wiping and cleaning effect and ensure the cleanliness of the probe station body 4.
[0043] Furthermore, the wiping pad 901 is fixed to the bottom of the cleaning plate 9 by Velcro or adhesive tape, and can be directly peeled off for cleaning or replacement.
[0044] like Figure 2 , Figure 6 and Figure 7 As shown, a blocking component is provided at the end of the limiting groove 202 away from the probe station body 4. Specifically, the blocking component includes a protrusion 203, and a groove 204 is formed on the inner wall of the limiting groove 202. A first spring 205 is fixedly connected inside the groove 204. One end of the protrusion 203 is slidably inserted into the groove 204 and fixedly connected to the first spring 205. The protrusion 203 can elastically expand and contract inside the groove 204. When the protective plate 5 slides forward to contact the protrusion 203, it will drive the protrusion 203 to retract into the groove 204. Then, the protrusion 203 will be in close contact with the protective plate 5. The friction between the two increases the sliding resistance of the protective plate 5, making it difficult for the protective plate 5 to slide naturally. This ensures that the protective plate 5 will not move naturally after being removed from above the probe station body 4, so that the wafer inspection operation can proceed smoothly.
[0045] In use, the protective plate 5 is slid away from the probe station body 4 to allow the wafer to be placed on the probe station body 4 for testing. After use, the protective plate 5 can be pushed back above the probe station body 4, and the handle 701 can be turned to rotate the stud 7, causing the stud 7 to rotate and descend the inner housing 8. During descent, the cleaning plate 9 at the bottom of the inner housing 8 will first contact the probe station body 4, and as the inner housing 8 continues to rotate and descend, it will rotate on the probe station body 4, wiping the probe station body 4. The wiping force gradually increases, achieving efficient wiping and cleaning of the surface of the probe station body 4.
[0046] When used again, the stud 7 drives the inner housing 8 to rotate and rise by rotating the handle 701 in the opposite direction. During the initial stage of rising, the cleaning plate 9 also rotates with the inner housing 8 to wipe and clean the probe station body 4 again. This ensures that the probe station body 4 can be wiped and cleaned after use and before use again, thus ensuring the cleanliness of the probe station body 4 surface and preventing contamination of the wafer.
[0047] Compared with the prior art, the semiconductor probe station of this utility model slides the protective plate 5 above the probe station body 4 and drives the inner shell 8 to descend, so that the lower end face of the cleaning plate 9 fits against the probe station body 4, providing comprehensive protection for the probe station body 4. At the same time, since the cleaning plate 9 can elastically extend and retract, it can still rotate to wipe and clean the surface of the probe station body 4 after it fits against the probe station body 4. No manual cleaning is required when using it again, making it very convenient to use.
[0048] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0049] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A semiconductor probe station comprising a base and a probe head, characterized by, A top plate is fixedly installed on the top of the base, the probe head is fixedly installed on the top plate, a probe station body is fixedly installed on the base, a U-shaped groove is opened on the top plate, and the top of the probe station body extends through the interior of the U-shaped groove. A protective plate is slidably connected inside the U-shaped groove. A boss is fixedly installed on the protective plate. An inner shell is provided inside the boss. The inner shell matches the probe station body. A lifting component is provided on the boss. The lifting component is used to drive the inner shell to rotate and lift. An elastic cleaning component is fixedly installed on the inner shell.
2. The probe station of claim 1, wherein: The lifting assembly includes a stud, and a screw cylinder is provided at the middle position of the boss. The stud is screwed into the inside of the screw cylinder, and the bottom end of the stud penetrates into the inside of the boss and is fixedly connected to the inner shell.
3. The probe station of claim 2, wherein: A throttle is fixedly connected to the stud.
4. The probe station of claim 1, wherein: The elastic cleaning assembly includes a cleaning plate, the top end of which is slidably inserted into the interior of the inner housing, and multiple sets of second springs are fixedly installed between the top end of the cleaning plate and the top end inside the inner housing. The bottom of the cleaning plate is provided with a wiping pad.
5. The probe station of claim 4, wherein: The wiping pad is attached and fixed to the bottom of the cleaning plate.
6. The probe station according to claim 4 or 5, wherein The wiping pad is any one or more combinations of non-woven fabric, sponge, or fiber.
7. The probe station of claim 1, wherein: A limiting groove is provided on the inner wall of the U-shaped groove, and the edge of the protective plate is slidably inserted into the inside of the limiting groove.
8. The probe station of claim 7, wherein: A handle is fixedly installed on the protective plate.
9. The probe station of claim 7, wherein the probe card is a wafer probe card. A blocking component is provided at the end of the limiting groove away from the probe station body, and the blocking component is matched with the protective plate.
10. The probe station of claim 9, wherein: The blocking component includes a protrusion, and a groove is formed on the inner wall of the limiting groove. A first spring is fixedly connected inside the groove, and one end of the protrusion is slidably inserted into the inside of the groove and fixedly connected to the first spring.