A power management IC device that facilitates heat dissipation

Abstract

This utility model relates to the field of power management technology and discloses a power management IC device with easy heat dissipation. It includes a chassis and a circuit board fixed to the inner wall of the chassis bottom. An IC chip is disposed in the center of the upper surface of the circuit board, and a heat-conducting base is disposed on the upper surface of the IC chip. Six sets of heat-conducting rods are inserted into the outer surface of the heat-conducting base, and multiple sets of heat sinks are fixedly connected to the top of the outer surface of each heat-conducting rod. This power management IC device with easy heat dissipation, through the coordinated use of the heat-conducting base, heat-conducting rods, heat sinks, and an exhaust fan, allows the heat generated by the IC chip to be transferred to the heat-conducting base, which in turn transfers the heat to the heat-conducting rods, which then transfer the heat to the heat sinks. The exhaust fan circulates outside air from the left side to the right side of the chassis. The outside air passes over the heat sinks and carries away the heat, thereby further improving the heat dissipation performance of the device for the IC chip, reducing the operating temperature of the IC chip, and extending the lifespan of the IC chip.

Description

Technical Field

[0001] This utility model relates to the field of power management technology, specifically to a power management IC device that facilitates heat dissipation. Background Technology

[0002] Power management refers to how to effectively distribute power to different components of a system. Power management is crucial for mobile devices that rely on battery power. By reducing energy consumption when components are idle, an excellent power management system can extend battery life by two or three times. Power management technology, also known as power control technology, is an interdisciplinary technology that integrates power conversion, modern electronics, network construction, and automatic control. It is now widely used in many fields. Power management IC devices are generally used to manage the power of IC-driven electrical appliances, playing a role in centralized power switching management. Existing power management IC devices generally consist of a casing and a power management device body; however, existing power management IC devices directly fix the IC chip on the motherboard, and the casing only has heat dissipation slots for heat dissipation, which is not very effective. Long-term high-temperature use of the IC chip will shorten its lifespan. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] In view of the shortcomings of the prior art, the present invention provides a power management IC device that facilitates heat dissipation, thus solving the problems mentioned in the background art.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: a power management IC device for easy heat dissipation, comprising a chassis and a circuit board fixed to the inner wall of the bottom of the chassis. An IC chip is disposed in the middle of the upper surface of the circuit board, and a heat-conducting base is disposed on the upper surface of the IC chip. Six sets of heat-conducting rods are inserted into the outer surface of the heat-conducting base. Multiple sets of heat sinks are fixedly connected to the top of the outer surface of the heat-conducting rods. Two sets of locking mechanisms are disposed on the front side of the outer surface of the heat-conducting base. Clamping grooves are provided on both the left and right sides of the upper surface of the heat-conducting base. A fastening frame is disposed on the inner wall of the clamping groove. A ventilation pipe is connected to the left side of the chassis. An exhaust fan is fixedly connected to the inner wall of the ventilation pipe. A dust cap is threadedly connected to the left side of the outer surface of the ventilation pipe. A dustproof mesh is fixedly connected to the inner wall of the dust cap. Three sets of ventilation slots are provided on the right side of the chassis.

[0007] Preferably, the locking mechanism includes a locking seat, with two sets of mounting bolts inserted on both the left and right sides of the outer surface of the locking seat. The mounting bolts are threaded to the circuit board. A U-shaped locking rod is slidably inserted on the back of the locking seat. A pressing plate is fixedly connected to the front of the U-shaped locking rod. A first spring is provided between the pressing plate and the locking seat.

[0008] Preferably, the fastening frame includes a fixed base, with fixing bolts inserted on both the left and right sides of the outer surface of the fixed base. The fixing bolts are threaded to the circuit board. The top of the outer surface of the fixed base is hinged to the fastening plate. Three sets of sliding pins are slidably inserted on the upper surface of the fastening plate. A second spring is fitted on the outer surface of the sliding pin and a pressure plate is fixedly connected to the bottom end. A locking block is fixedly connected to the front of the fastening plate. A locking groove adapted to the U-shaped locking rod is opened on the outer surface of the locking block.

[0009] Preferably, the left and right rear sides of the U-shaped locking rod are fixedly connected to limit blocks, and the outer surface of the locking seat is provided with a limit groove that matches the limit block.

[0010] Preferably, an anti-slip pad is fixedly connected to the lower surface of the pressure plate. The anti-slip pad is made of silicone and has a thickness of one millimeter.

[0011] Preferably, both the heat-conducting rod and the heat-conducting base are made of pure copper, and the diameter of the heat-conducting rod is four millimeters.

[0012] (III) Beneficial Effects

[0013] Compared with the prior art, this utility model provides a power management IC device that facilitates heat dissipation, and has the following beneficial effects:

[0014] 1. This heat-dissipating power management IC device uses a combination of a heat-conducting base, a heat-conducting rod, a heat sink, and an exhaust fan. The heat generated by the IC chip is transferred to the heat-conducting base, which then transfers the heat to the heat-conducting rod. The heat-conducting rod then transfers the heat to the heat sink. The exhaust fan allows outside air to flow from the left side of the chassis to the right side. The outside air passes over the heat sink and carries away the heat, thereby further improving the heat dissipation performance of the device for the IC chip, reducing the operating temperature of the IC chip, and extending the lifespan of the IC chip.

[0015] 2. This heat-dissipating power management IC device, through the setting of a locking mechanism and a fastening bracket, allows the user to press the fastening plate and pressure plate into the clamping groove when installing the heat-conducting base. The U-shaped locking rod automatically fixes the locking block, thereby further facilitating the installation of the heat-conducting base. When removing the heat-conducting base, only the pressing plate needs to be squeezed. At the same time, the second spring applies downward pressure to the pressure plate, making the pressure plate firmly press the heat-conducting base, further enhancing the stability of the heat-conducting base installation.

[0016] 3. This heat-dissipating power management IC device, through the setting of a locking mechanism and a fastening bracket, allows the user to press the fastening plate and pressure plate into the clamping groove when installing the heat-conducting base. The U-shaped locking rod automatically fixes the locking block, thereby further facilitating the installation of the heat-conducting base. When removing the heat-conducting base, only the pressing plate needs to be squeezed. At the same time, the second spring applies downward pressure to the pressure plate, making the pressure plate firmly press the heat-conducting base, further enhancing the stability of the heat-conducting base installation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic cross-sectional view of the present invention.

[0019] Figure 3 This is a partial structural diagram of the present invention;

[0020] Figure 4 This is a schematic diagram of the locking mechanism of this utility model;

[0021] Figure 5 This is a schematic diagram of the fastening frame structure of this utility model;

[0022] Figure 6 This is a schematic diagram showing the unfolded structure of this utility model.

[0023] In the diagram: 1. Chassis; 101. Ventilation slot; 2. Circuit board; 3. IC chip; 4. Heat-conducting base; 401. Clamping slot; 5. Heat-conducting rod; 6. Locking mechanism; 601. Locking seat; 602. Mounting bolt; 603. U-shaped locking rod; 604. Pressing plate; 605. First spring; 7. Fastening frame; 701. Fixing base; 702. Fixing bolt; 703. Fastening plate; 704. Sliding pin; 705. Second spring; 706. Pressure plate; 707. Locking block; 708. Locking slot; 8. Ventilation duct; 9. Exhaust fan; 10. Dust cap; 11. Dust filter; 12. Heat sink. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-6This utility model provides a technical solution: a power management IC device with convenient heat dissipation, including a chassis 1 and a circuit board 2 fixed to the inner wall of the bottom of the chassis 1. An IC chip 3 is disposed in the middle of the upper surface of the circuit board 2, and a heat-conducting base 4 is disposed on the upper surface of the IC chip 3. Six sets of heat-conducting rods 5 are inserted into the outer surface of the heat-conducting base 4. The heat-conducting rods 5 are arranged in a distributed manner to avoid the heat concentration at the top of the heat-conducting rods 5, which is conducive to the uniform transfer of heat from the heat-conducting rods 5 to the heat sink 12. Multiple sets of heat sinks 12 are fixedly connected to the top of the outer surface of the heat-conducting rods 5. The heat sinks 12 are placed horizontally, and there are multiple layers of gaps between the heat sinks 12, which is conducive to air passing through the gaps between the heat sinks 12 and carrying away heat. The heatsink 4 has two locking mechanisms 6 on the front side of its outer surface. Clamping grooves 401 are provided on both the left and right sides of its upper surface, with a fastening bracket 7 on the inner wall of each groove. A ventilation pipe 8 is connected to the left side of the chassis 1, aligned with the heatsink 12, allowing air to directly blow onto it, facilitating heat dissipation. An exhaust fan 9 is fixedly connected to the inner wall of the ventilation pipe 8. A dust cap 10 is threaded onto the left side of the outer surface of the ventilation pipe 8, with a dust filter 11 fixedly connected to its inner wall. Three ventilation slots 101 are provided on the right side of the chassis 1. These, along with the heatsink 4, heat rod 5, heatsink 12, and exhaust fan 9, enable the heatsink 12 to dissipate heat effectively. The heat generated by IC chip 3 is transferred to the heat-conducting base 4, which in turn transfers the heat to the heat-conducting rod 5. The heat-conducting rod 5 then transfers the heat to the heat sink 12. The exhaust fan 9 draws outside air from the left side of the chassis 1 to the right side. This air passes over the heat sink 12 and carries away the heat, further improving the heat dissipation performance of the IC chip 3, reducing its operating temperature, and extending its lifespan. By incorporating the locking mechanism 6 and the fastening bracket 7, the user can press the fastening plate 703 and the pressure plate 706 into the clamping groove 401 when installing the heat-conducting base 4. The U-shaped locking rod 603 automatically secures the locking block 707, thus... The installation of the heat-conducting base 4 is made easier. When removing the heat-conducting base 4, only the pressing plate 604 needs to be squeezed. At the same time, the second spring 705 applies downward pressure to the pressure plate 706, so that the pressure plate 706 firmly presses the heat-conducting base 4, which further enhances the stability of the heat-conducting base 4 installation. By setting the dust cap 10 and the dust screen 11, the dust screen 11 plays a role in blocking dust from the air drawn into the chassis 1 by the exhaust fan 9, which further reduces the probability of dust accumulation on the internal components of the chassis 1. When the user needs to clean the dust screen 11, he only needs to rotate the dust cap 10 to remove the dust cap 10 and the dust screen 11, and then clean the dust on the surface of the dust screen 11.

[0026] In this utility model, in order to fix the fastening frame 7, the locking mechanism 6 includes a locking seat 601. Two sets of mounting bolts 602 are inserted on both the left and right sides of the outer surface of the locking seat 601. The mounting bolts 602 are threaded to the circuit board 2. A U-shaped locking rod 603 is slidably inserted on the back of the locking seat 601. A pressing plate 604 is fixedly connected to the front of the U-shaped locking rod 603. A first spring 605 is provided between the pressing plate 604 and the locking seat 601, so that the U-shaped locking rod 603 can fix the fastening frame 7, thereby realizing the fixation of the fastening frame 7.

[0027] In this utility model, to further facilitate the installation of the heat-conducting seat 4, the fastening frame 7 includes a fixed seat 701. Fixed bolts 702 are inserted on both the left and right sides of the outer surface of the fixed seat 701. The fixed bolts 702 are threaded to the circuit board 2. The top of the outer surface of the fixed seat 701 is hinged to the fastening plate 703. Three sets of sliding pins 704 are slidably inserted on the upper surface of the fastening plate 703. A second spring 705 is fitted on the outer surface of the sliding pin 704 and a pressure plate 706 is fixedly connected to the bottom end. A locking block 707 is fixedly connected to the front of the fastening plate 703. The outer surface of the locking block 707 is provided with a locking groove 708 that matches the U-shaped locking rod 603, so that the user can fix the heat-conducting seat 4 by pressing the fastening plate 703, thereby further facilitating the installation of the heat-conducting seat 4.

[0028] In this utility model, in order to prevent the U-shaped locking rod 603 from sliding out of the locking seat 601, limit blocks are fixedly connected to the rear side of the left and right sides of the U-shaped locking rod 603. The outer surface of the locking seat 601 is provided with a limit groove that matches the limit block. By setting the limit block and the limit groove, the U-shaped locking rod 603 is prevented from sliding out of the locking seat 601.

[0029] In this utility model, in order to further enhance the stability of the pressure plate 706 in fixing the heat-conducting seat 4, an anti-slip pad is fixedly connected to the lower surface of the pressure plate 706. The anti-slip pad is made of silicone and has a thickness of one millimeter, thereby increasing the friction between the pressure plate 706 and the heat-conducting seat 4, and thus further enhancing the stability of the pressure plate 706 in fixing the heat-conducting seat 4.

[0030] In this invention, in order to further enhance the thermal conductivity of the heat-conducting rod 5 and the heat-conducting base 4, both the heat-conducting rod 5 and the heat-conducting base 4 are made of pure copper. The diameter of the heat-conducting rod 5 is four millimeters. By setting the materials of the heat-conducting rod 5 and the heat-conducting base 4, the thermal conductivity of the heat-conducting rod 5 and the heat-conducting base 4 is further enhanced.

[0031] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0032] In use, the heat-conducting base 4 is placed on the upper surface of the IC chip 3, folded down and pressed against the fastening plate 703. The locking block 707 is inserted between the U-shaped locking rod 603 and the locking seat 601. The first spring 605 is compressed and then extended, and the U-shaped locking rod 603 is engaged in the locking groove 708, thereby fixing the fastening plate 703. The second spring 705 applies downward pressure to the pressure plate 706, causing the pressure plate 706 to press the heat-conducting base 4 tightly. The heat generated by the IC chip 3 is transferred to the heat-conducting base 4, and the heat-conducting base 4 transfers the heat to the heat-conducting base. Heat rod 5 transfers heat to heat sink 12, and starts exhaust fan 9. Exhaust fan 9 draws in outside air from ventilation pipe 8 and exhausts it through ventilation slot 101. Outside air passes through heat sink 12 and carries away heat, thereby achieving heat dissipation for IC chip 3. Dust filter 11 blocks dust from the air drawn into chassis 1 by exhaust fan 9. When it is necessary to clean dust filter 11, simply rotate dust cap 10 to remove dust cap 10 and dust filter 11, and then clean the dust on the surface of dust filter 11.

[0033] In summary, this heat-dissipating power management IC device, through the combined use of the heat-conducting base 4, heat-conducting rod 5, heat sink 12, and exhaust fan 9, allows the heat generated by the IC chip 3 to be transferred to the heat-conducting base 4, which in turn transfers the heat to the heat-conducting rod 5. The heat-conducting rod 5 then transfers the heat to the heat sink 12. The exhaust fan 9 allows outside air to flow from the left side to the right side of the chassis 1. The outside air passes through the heat sink 12 and carries away the heat, thereby further improving the heat dissipation performance of the device for the IC chip 3, reducing the operating temperature of the IC chip 3, and extending the service life of the IC chip 3.

[0034] This heat-dissipating power management IC device, through the setting of locking mechanism 6 and fastening bracket 7, allows the user to press the fastening plate 703 and pressure plate 706 into the clamping groove 401 when installing the heat-conducting base 4. The U-shaped locking rod 603 automatically fixes the locking block 707, thereby further facilitating the installation of the heat-conducting base 4. When removing the heat-conducting base 4, only the pressing plate 604 needs to be squeezed. At the same time, the second spring 705 applies downward pressure to the pressure plate 706, so that the pressure plate 706 firmly presses the heat-conducting base 4, further enhancing the stability of the heat-conducting base 4 installation.

[0035] This heat-dissipating power management IC device, by setting up a dust cap 10 and a dust filter 11, allows the dust filter 11 to block dust from the air drawn into the chassis 1 by the exhaust fan 9, further reducing the probability of dust accumulation on the internal components of the chassis 1. When the user needs to clean the dust filter 11, they only need to rotate the dust cap 10 to remove the dust cap 10 and the dust filter 11, and then clean the dust on the surface of the dust filter 11.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A power management IC device with easy heat dissipation, comprising a chassis (1) and a circuit board (2) fixed to the inner wall of the bottom of the chassis (1), characterized in that: An IC chip (3) is disposed in the middle of the upper surface of the circuit board (2). A heat-conducting base (4) is disposed on the upper surface of the IC chip (3). Six sets of heat-conducting rods (5) are inserted into the outer surface of the heat-conducting base (4). Multiple sets of heat sinks (12) are fixedly connected to the top of the outer surface of the heat-conducting rods (5). Two sets of locking mechanisms (6) are disposed on the front side of the outer surface of the heat-conducting base (4). Clamping grooves (401) are provided on both the left and right sides of the upper surface of the heat-conducting base (4). A fastening frame (7) is provided on the inner wall of the clamping groove (401). A ventilation pipe (8) is connected to the left side of the chassis (1). An exhaust fan (9) is fixedly connected to the inner wall of the ventilation pipe (8). A dust cap (10) is threadedly connected to the left side of the outer surface of the ventilation pipe (8). A dustproof net (11) is fixedly connected to the inner wall of the dust cap (10). Three sets of ventilation slots (101) are provided on the right side of the chassis (1).

2. The power management IC device with heat dissipation as described in claim 1, characterized in that: The locking mechanism (6) includes a locking seat (601). Two sets of mounting bolts (602) are inserted on both the left and right sides of the outer surface of the locking seat (601). The mounting bolts (602) are threaded to the circuit board (2). A U-shaped locking rod (603) is slidably inserted on the back of the locking seat (601). A pressing plate (604) is fixedly connected to the front of the U-shaped locking rod (603). A first spring (605) is provided between the pressing plate (604) and the locking seat (601).

3. The power management IC device with easy heat dissipation according to claim 2, characterized in that: The fastening frame (7) includes a fixed base (701), and fixed bolts (702) are inserted on both the left and right sides of the outer surface of the fixed base (701). The fixed bolts (702) are threaded to the circuit board (2). The top of the outer surface of the fixed base (701) is hinged to the fastening plate (703). Three sets of sliding pins (704) are slidably inserted on the upper surface of the fastening plate (703). A second spring (705) is fitted on the outer surface of the sliding pin (704) and a pressure plate (706) is fixedly connected to the bottom end. A locking block (707) is fixedly connected to the front of the fastening plate (703). A locking groove (708) that matches the U-shaped locking rod (603) is opened on the outer surface of the locking block (707).

4. A power management IC device with easy heat dissipation according to claim 2, characterized in that: Limiting blocks are fixedly connected to the rear side of both the left and right sides of the U-shaped locking rod (603), and a limiting groove adapted to the limiting block is provided on the outer surface of the locking seat (601).

5. A power management IC device with easy heat dissipation according to claim 3, characterized in that: The lower surface of the pressure plate (706) is fixedly connected with an anti-slip pad, which is made of silicone and has a thickness of one millimeter.

6. A power management IC device with easy heat dissipation according to claim 1, characterized in that: The heat-conducting rod (5) and the heat-conducting base (4) are both made of pure copper, and the diameter of the heat-conducting rod (5) is four millimeters.

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