A trimming mechanism for semiconductor plating

Abstract

The utility model discloses a kind of edge cleaning mechanisms for semiconductor electroplating, including the chamber of closed appearance;Rotary assembly is driven to rotate via rotary motor, rotary assembly is set outside chamber, the transmission shaft in rotary assembly is inserted into from below to chamber, transmission shaft is equipped with first sealing assembly outside;Lead screw lifting module is driven via lifting motor, lead screw lifting module is set outside chamber and is connected with rotary motor;Protective shell is transversely set in the top of transmission shaft;Telescopic motor is set in protective shell, and action is followed transmission shaft, telescopic motor drives push rod transverse telescopic, second sealing assembly is equipped between push rod and protective shell;Liquid injection part can be multi-angle rotation and is set in the front end of push rod.The nozzle of the utility model can be adjusted to lift, rotate and horizontal telescopic, can be adjusted to horizontal direction and vertical direction, and the nozzle has high degree of freedom, strong compatibility;The sealing of complete machine is good, and there is no damage to transmission shaft, telescopic motor and push rod caused by chemical liquid.

Description

Technical Field

[0001] This utility model relates to an edge-washing mechanism, and more particularly to an edge-washing mechanism for semiconductor electroplating. Background Technology

[0002] In the current semiconductor electroplating process, the wafer is placed on the wafer clamping mechanism in the edge cleaning chamber. The clamping mechanism rotates, and then the edge cleaning mechanism sprays a cleaning solution onto the edge of the wafer.

[0003] However, while existing edge-washing mechanisms possess rotation and lifting functions, the rotation angle and lifting distance cannot be automatically adjusted, and the adjustment range is limited. Furthermore, the nozzles cannot be adjusted horizontally, and they are fixed-angle nozzles with limited freedom of adjustment. When the edge-washing effect is unsatisfactory, it is difficult to make corresponding adjustments, thus failing to achieve the desired result. Additionally, when process requirements necessitate changes in edge-washing width and angle, these mechanisms cannot be met. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art by providing a cleaning mechanism for semiconductor electroplating. The nozzle can be adjusted at multiple angles, providing a high degree of freedom in cleaning, excellent cleaning effect, and strong compatibility.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: an edge-washing mechanism for semiconductor electroplating, comprising:

[0006] A chamber, wherein the chamber is sealed;

[0007] A rotating assembly is driven to rotate by a rotating motor and is disposed outside the chamber. A drive shaft inside the rotating assembly extends from bottom to top into the chamber. A first sealing assembly for preventing liquid medicine from entering is provided outside the drive shaft.

[0008] A lead screw lifting module, which is driven by a lifting motor, is disposed outside the cavity and connected to the rotary motor, for driving the transmission shaft to move up and down along the vertical direction of the cavity;

[0009] A protective housing is horizontally positioned on top of the drive shaft;

[0010] A telescopic motor is installed inside the protective shell and moves in tandem with the drive shaft. The telescopic motor drives the push rod to extend and retract laterally. A second sealing assembly is provided between the push rod and the protective shell.

[0011] The spraying section is rotatable at multiple angles and is located at the front end of the push rod to spray the liquid medicine out in multiple directions.

[0012] Furthermore, the first sealing assembly includes an inner sleeve fitted over the drive shaft, and an outer sleeve located outside the inner sleeve is provided below the protective shell, with the outer sleeve extending downward beyond the inner sleeve.

[0013] Furthermore, the second sealing assembly includes two opposing sealing rings fitted onto the push rod.

[0014] Furthermore, the spraying unit includes a liquid delivery assembly and a nozzle assembly; the nozzle assembly includes a base disposed at the front end of the push rod, and a rotating seat that can rotate in the horizontal direction is provided at the bottom of the base; a rotating block that can rotate in the vertical direction is provided on the rotating seat; a nozzle is provided on the rotating block; the liquid delivery assembly passes through the drive shaft and the protective shell and is connected to the nozzle.

[0015] Furthermore, the liquid medicine delivery assembly includes a liquid medicine pipeline that passes through the drive shaft and the protective shell and is connected to an adapter outside the protective shell. The adapter is connected to the nozzle through the adapter pipeline.

[0016] Furthermore, the rotating base is L-shaped; the rotating base has a first display surface located on the side adjacent to the base and a second display surface located below the rotating block; the first display surface and the second display surface have angle icons that display the rotation angle of the rotating base and the rotating block.

[0017] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0018] This utility model discloses an edge-washing mechanism for semiconductor electroplating. Through a rotary motor, a lifting motor, and a telescopic motor, the nozzle can be adjusted to lift, rotate, and extend. The control is precise and the operation is convenient. At the same time, the function of horizontal and vertical rotation of the nozzle is added, which improves the freedom of nozzle adjustment. The nozzle can be freely adjusted in all directions within the range, which enhances compatibility and achieves better edge-washing effect. It is also more convenient to adjust and improves work efficiency.

[0019] In addition, to prevent the liquid medicine from damaging the rotary motor, lifting motor and telescopic motor, the rotary motor and lifting motor are installed outside the chamber. The transmission shaft is protected by the first sealing component, and the second sealing component and protective shell improve the sealing of the push rod at the telescopic motor during extension and retraction. The whole machine is safe and stable and has a long service life. Attached Figure Description

[0020] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0021] Figure 1 This is a partial cross-sectional view of an embodiment of the present invention;

[0022] Figure 2 This is a three-dimensional structural diagram of the present invention with the cavity omitted.

[0023] Figure 3 This is a three-dimensional structural diagram of the nozzle assembly in one embodiment of the present invention;

[0024] Figure 4 for Figure 2 Side view;

[0025] Figure 5 This is a partial cross-sectional view of the rotating component, protective shell, and spraying part in one embodiment of the present invention;

[0026] Figure 6 This is a partial cross-sectional view of the present invention with the nozzle omitted.

[0027] The components are as follows: 1. Chamber; 2. Rotating assembly; 3. First sealing assembly; 4. Screw lifting module; 5. Protective shell; 6. Telescopic motor; 7. Push rod; 8. Second sealing assembly; 9. Spraying section; 10. Drive shaft; 20. Rotating motor; 30. Inner sleeve; 31. Outer sleeve; 40. Lifting motor; 80. Sealing ring; 90. Base; 91. Rotating seat; 92. Rotating block; 93. Nozzle; 94. Liquid pipeline; 95. Adapter; 96. Adapter pipeline; 910. First display surface; 911. Second display surface; 912. Angle icon. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0029] This invention provides an edge-washing mechanism for semiconductor electroplating, which solves the problems of existing edge-washing mechanisms, such as the inability to adjust the nozzle laterally or at multiple angles, low nozzle freedom, and inability to meet cleaning process requirements, as well as poor compatibility.

[0030] For ease of understanding, the specific processes in the embodiments of this application are described below. Please refer to [link / reference]. Figures 1 to 4 An edge-washing mechanism for semiconductor electroplating according to an embodiment of this application includes a chamber 1, a rotating assembly 2, a first sealing assembly 3, a lead screw lifting module 4, a protective shell 5, a telescopic motor 6, a push rod 7, a second sealing assembly 8, and a liquid spraying section 9.

[0031] The chamber 1 is sealed, allowing semiconductor processing to be carried out in a closed environment to ensure the effectiveness of wafer cleaning. The rotating assembly 2 is driven to rotate by a rotary motor 20, and the rotating assembly 2 is located outside the chamber 1 to prevent the chemical solution from entering the rotary motor 20 and causing damage. The drive shaft 10 inside the rotating assembly 2 extends from bottom to top into the chamber 1. The drive shaft 10 is provided with a first sealing assembly 3 to prevent the chemical solution from entering the drive shaft 10, thereby protecting the drive shaft from corrosion by the chemical solution.

[0032] See Figure 1 and Figure 6 The lead screw lifting module 4 is driven by the lifting motor 40. The lead screw lifting module 4 is located outside the chamber 1 and connected to the rotary motor to drive the transmission shaft 10 to move up and down along the vertical direction of the chamber 1. By also setting the lead screw lifting module 4 outside the chamber 1, the liquid medicine can be prevented from entering the lifting motor 40 and causing damage, just like the rotary component 2.

[0033] A protective shell 5 is horizontally positioned at the top of the drive shaft 10, and a telescopic motor 6 is located inside the protective shell 5. The protective shell 5 primarily protects the telescopic motor 6 from corrosion by the liquid and also prevents metal particles from the motor from entering the chamber 1 and causing contamination. The telescopic motor 6 moves in tandem with the drive shaft 10, driving the push rod 7 to extend and retract laterally within the protective shell 5. A second sealing assembly 8 is provided between the push rod 7 and the protective shell 5. This second sealing assembly 8 ensures a tight seal between the push rod 7 and the protective shell 5 when driven by the telescopic motor 6, preventing metal particles from the motor 6 from entering the chamber or corrosive gases from the chamber from corroding the motor 6. The spraying part 9 is rotatably positioned at the front end of the push rod 7 to spray the liquid at multiple angles.

[0034] The edge-washing mechanism for semiconductor electroplating of this utility model uses a rotary motor 20, a lifting motor 40, and a telescopic motor 6 to drive the nozzle 93 to perform highly free rotation, lifting, and horizontal telescopic movements. The rotary motor and the lifting motor are located outside the chamber 1, and the transmission shaft is sealed by a first sealing component to prevent the chemical solution from entering the rotary motor and the lifting motor. At the same time, the second sealing component 8 and the protective shell 5 protect the telescopic motor 6 to prevent metal particles in the telescopic motor from entering the chamber and causing contamination, and also to prevent corrosive gases in the chemical solution from corroding the telescopic motor 6.

[0035] For further details, please refer to [link / reference]. Figure 1 and Figure 5The first sealing assembly 3 includes an inner sleeve 30 sleeved outside the drive shaft 10. The bottom of the inner sleeve 30 is connected to the cavity 1 and fixed to the cavity 1. Below the protective shell 5, there is also an outer sleeve 31 located outside the inner sleeve 30, and the outer sleeve 31 extends downward beyond the inner sleeve 30. During the processing, the cooperation between the inner sleeve 30 and the outer sleeve 31 prevents the liquid medicine from splashing onto the drive shaft 10.

[0036] For further details, please refer to [link / reference]. Figure 5 The second sealing component 8 includes two opposing sealing rings 80 sleeved on the push rod 7. When the push rod 7 is driven to extend and retract forward by the telescopic motor 6, the two sealing rings 80 can effectively ensure the sealing between the push rod 7 and the protective shell 5, preventing the liquid medicine from entering the telescopic motor 6.

[0037] For further details, please refer to [link / reference]. Figure 3 The spraying unit 9 includes a liquid delivery assembly and a nozzle assembly. The nozzle assembly includes a base 90 located at the front end of the push rod 7, and a horizontally rotatable rotating seat 91 at the bottom of the base 90. A vertically rotatable rotating block 92 is mounted on the rotating seat 91, and a nozzle 93 is mounted on the rotating block 92. The liquid delivery assembly passes through the drive shaft and protective shell and connects to the nozzle. Thus, during operation, the nozzle 93 can be adjusted horizontally via the rotating seat 91, and vertically via the rotating block 92, meeting the cleaning requirements of different processes and offering convenient and labor-saving adjustments.

[0038] For further details, please refer to [link / reference]. Figure 1 The liquid medicine transmission assembly includes a liquid medicine pipeline 94, which passes through the drive shaft 10 and the protective shell 5 and is connected to an adapter 95 outside the protective shell 5. The adapter 95 is connected to the nozzle 93 through an adapter pipeline 96, thereby realizing the internal transmission of the liquid medicine with a safe and stable transmission effect. Figure 1 The nozzle 93 in the diagram is a schematic diagram of the state when it is separated from the rotating seat.

[0039] For further details, please refer to [link / reference]. Figure 3 The rotating base 91 is L-shaped; it has a first display surface 910 located on the side adjacent to the base 90 and a second display surface 911 located below the rotating block 92; both the first and second display surfaces have angle icons 912 that display the rotation angle of the rotating base and the rotating block. This allows for quick identification of the rotation angle when adjusting the nozzle 93 in the horizontal and vertical directions, facilitating actual adjustments.

[0040] See Figures 1 to 5During operation, the liquid medicine is transmitted from the liquid medicine pipeline 94, adapter 95, and adapter pipeline 96 to the nozzle 93, where the liquid medicine is sprayed out. At this time, the first sealing component protects the drive shaft, and the protective shell and the second sealing component protect the telescopic motor, preventing corrosive gases in the liquid medicine from corroding the drive shaft and the telescopic motor. Then, the rotation angle, height, and horizontal position of the nozzle can be adjusted over a wide range by means of the rotary motor, lifting motor, and telescopic motor. The angle of the nozzle can also be rotated by means of the rotating seat and rotating block. The nozzle can be adjusted in all directions, and the nozzle adjustment has a high degree of freedom, thus meeting the needs of different processes.

[0041] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A washing mechanism for semiconductor electroplating, characterized in that, include: The chamber (1) is closed; A rotating assembly (2) is driven to rotate by a rotating motor (20), and the rotating assembly (2) is disposed outside the chamber (1). A drive shaft (10) inside the rotating assembly (2) extends from bottom to top into the chamber (1). A first sealing assembly (3) for preventing liquid medicine from entering is provided outside the drive shaft (10). A lead screw lifting module (4) is driven by a lifting motor (40). The lead screw lifting module (4) is located outside the chamber (1) and connected to the rotary motor (20) to drive the transmission shaft (10) to move up and down along the vertical direction of the chamber (1). A protective shell (5) is laterally disposed on the top of the drive shaft (10); A telescopic motor (6) is installed inside the protective shell (5) and moves along with the transmission shaft (10). The telescopic motor (6) drives the push rod (7) to extend and retract laterally. A second sealing assembly (8) is provided between the push rod (7) and the protective shell (5). The spraying part (9) is rotatably disposed at the front end of the push rod (7) at multiple angles to spray the liquid medicine out in multiple directions.

2. The edge-washing mechanism for semiconductor electroplating as described in claim 1, characterized in that: The first sealing assembly (3) includes an inner sleeve (30) sleeved outside the drive shaft (10), and an outer sleeve (31) located outside the inner sleeve (30) is provided below the protective shell (5), and the outer sleeve (31) extends downward beyond the inner sleeve (30).

3. The edge-washing mechanism for semiconductor electroplating as described in claim 1, characterized in that: The second sealing assembly (8) includes two opposing sealing rings (80) fitted onto the push rod (7).

4. The edge-washing mechanism for semiconductor electroplating as described in claim 1, characterized in that: The spraying unit includes a liquid delivery assembly and a nozzle assembly; the nozzle assembly includes a base (90) disposed at the front end of the push rod (7), and a rotating seat (91) that can rotate horizontally is provided on the base (90); a rotating block (92) that can rotate vertically is provided on the rotating seat (91); a nozzle (93) is provided on the rotating block (92); the liquid delivery assembly passes through the drive shaft (10) and the protective shell (5) and is connected to the nozzle (93).

5. The edge-washing mechanism for semiconductor electroplating as described in claim 4, characterized in that: The liquid delivery assembly includes a liquid pipeline (94); the liquid pipeline (94) passes through the drive shaft (10) and the protective shell (5) and is connected to an adapter (95) outside the protective shell (5); the adapter (95) is connected to the nozzle (93) through an adapter pipeline (96).

6. The edge-washing mechanism for semiconductor electroplating as described in claim 4, characterized in that: The rotating base (91) is L-shaped; the rotating base (91) has a first display surface (910) located on the side adjacent to the base (90) and a second display surface (911) located below the rotating block (92); the first display surface (910) and the second display surface (911) have angle icons (912) that display the rotation angle of the rotating base (91) and the rotating block (92).

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