Processor system

Abstract

The application relates to a processor system. The processor system comprises a substrate, a processor arranged on the substrate, at least one first connector arranged on the substrate, each first connector being connected to the processor through a wire, at least one function expansion card, the function expansion card being provided with a second connector and a function device, the function device being connected to the second connector through a wire, and the second connector being connected to the first connector through a cable. The method can relieve the problem of crowded space of a mainboard.

Description

Technical Field

[0001] This application relates to the field of processors, and in particular to a processor system. Background Technology

[0002] In addition to the processor, a chip typically needs to include peripheral devices such as a network controller, a display chip, and PCIe (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard). The processor and these peripheral devices together form a fully functional system.

[0003] In traditional technology, the processor in the chip is usually soldered onto the motherboard, and connected to various peripheral devices through PCB (Printed Circuit Board) traces at the motherboard level.

[0004] However, with the development of semiconductor technology, the speed of the bus on the processor is getting higher and higher, and the number of buses and peripherals is also increasing, leading to a shortage of motherboard space. Therefore, a new method for arranging various devices is needed. Utility Model Content

[0005] Therefore, it is necessary to provide a processor system to address the aforementioned technical problems.

[0006] In a first aspect, this application provides a processor system, comprising:

[0007] substrate;

[0008] The processor is disposed on the substrate;

[0009] At least one first connector is disposed on the substrate, and each first connector is connected to the processor via a trace.

[0010] At least one function expansion card, wherein the function expansion card is provided with a second connector and a function device, the function device is connected to the second connector via wiring, and the second connector is connected to the first connector via a cable.

[0011] In one embodiment, the system further includes:

[0012] The motherboard is fixedly connected to the substrate;

[0013] At least one function expansion card connector is provided on the motherboard, and each function expansion card is fixed to the motherboard through the function expansion card connector.

[0014] In one embodiment, the system further includes:

[0015] The first physical slot located on the function expansion card is connected to the second connector via a wiring; the first physical slot is used to connect to a standard plug-in card.

[0016] In one embodiment, the function expansion card includes a high-speed parallel bus function expansion card and a high-speed serial bus function expansion card;

[0017] The functional devices on the high-speed parallel bus function expansion card and the standard plug-in card connected to the function expansion card are all high-speed parallel bus devices;

[0018] The functional devices on the high-speed serial bus function expansion card and the standard plug-in card connected to the function expansion card are all high-speed serial bus devices.

[0019] In one embodiment, the first connector includes a parallel function expansion card connector and a serial function expansion card connector, wherein the parallel function expansion card connector is used to connect the high-speed parallel bus function expansion card, and the serial function expansion card connector is used to connect the high-speed serial bus function expansion card.

[0020] The system also includes:

[0021] The processor is connected to each of the serial function expansion card connectors via the high-speed input / output chip die.

[0022] In one embodiment, the system further includes:

[0023] The second physical slot, located on the motherboard, is connected to the parallel function expansion card connector via a cable. The second physical slot is used to connect to a standard expansion card.

[0024] In one embodiment, the system further includes:

[0025] Basic components, including at least BIOS flash memory and / or clock crystal oscillator;

[0026] A low-speed input / output chip die, wherein the basic device is connected through the low-speed input / output chip die and the high-speed input / output chip die.

[0027] In one embodiment, the system further includes:

[0028] The high-speed interface chip located on the motherboard is connected to the bare die of the high-speed input / output chip.

[0029] The low-speed interface chip is located on the motherboard and is connected to the bare die of the low-speed input / output chip.

[0030] In one embodiment, the high-speed parallel bus function expansion card includes a memory function expansion card, the functional devices on the memory function expansion card include a memory controller, and the standard plug-in card connected to the memory function expansion card includes a memory module.

[0031] In one embodiment, the system further includes:

[0032] A third connector is disposed on the substrate. The third connector is connected to the processor via a high-speed input / output chip die. The third connector is used to connect to other processors via cables.

[0033] In one embodiment, the system further includes:

[0034] A voltage regulator is disposed on the substrate.

[0035] In one embodiment, the system further includes:

[0036] The power controller, located on the motherboard, is connected to each of the function expansion card connectors via wiring.

[0037] Each of the aforementioned expansion cards is also used to receive power from the power controller via the expansion card connector.

[0038] In one embodiment, the system further includes:

[0039] A power board, wherein at least one first power connector is provided on the power board;

[0040] The substrate and each of the functional expansion cards are also provided with a second power connector. The first power connector is connected to the second power connector via a cable. The substrate and the functional expansion cards receive power from the power board through the second power connector.

[0041] The aforementioned processor system separates functional components onto expansion cards, which are then connected to the motherboard containing the processor via cables. This method fully utilizes the vertical space within the chassis to route the cables between the expansion cards and the motherboard, eliminating the need to route all connections between the functional components and the processor onto a single motherboard, thus alleviating space constraints. Furthermore, since cables offer higher transmission speeds, lower insertion losses, and greater flexibility in insertion and removal compared to PCB traces, connecting the expansion cards and processor via cables improves signal transmission quality and enhances the flexibility of connecting the processor to functional components. Attached Figure Description

[0042] Figure 1This is a schematic diagram of a processor system in one embodiment;

[0043] Figure 2 This is a schematic diagram of a processor system in another embodiment.

[0044] Explanation of reference numerals in the attached figures:

[0045] Substrate 100; Processor 101; First connector 102; Parallel function expansion card connector 102a; Serial function expansion card connector 102b; High-speed input / output chip die 103; Basic device 104; Low-speed input / output chip die 105; Third connector 106; Voltage regulator 107;

[0046] Function expansion card 200; high-speed parallel bus function expansion card 200a; high-speed serial bus function expansion card 200b; second connector 201; functional device 202; first physical slot 203;

[0047] Motherboard 300; Function expansion card connector 301; Second physical slot 302; High-speed interface chip 303; Low-speed interface chip 304; Power controller 305. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0049] It should be noted that the terms "first," "second," etc., used in this application may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from the second element. The terms "comprising" and "having," and any variations thereof, used in this application, are intended to cover non-exclusive inclusion. The term "multiple" used in this application refers to two or more.

[0050] In traditional technology, the processor in a chip is either soldered directly onto the motherboard or installed in a socket soldered onto the motherboard. Peripherals can also be soldered onto the motherboard or connected to the motherboard via interfaces on the motherboard. The processor and these peripherals are connected via PCB traces on the motherboard.

[0051] However, this technology has at least two drawbacks:

[0052] First, peripherals or their interfaces cannot be adjusted after being soldered onto the motherboard, resulting in poor flexibility in peripheral setup. Furthermore, the limited width of the motherboard restricts the number of peripheral interfaces, further limiting the flexibility of peripheral configuration.

[0053] Secondly, PCB traces have significant insertion loss. Taking 16GHz as an example, the loss per inch of PCB trace is at least 0.7dB. Insertion loss affects signal integrity, leading to signal quality degradation and potentially causing data transmission errors, signal distortion, and other problems.

[0054] To address at least one of the aforementioned technical problems in conventional technologies, this application provides a processor system. Combined with... Figure 1 As shown, the processor system includes:

[0055] substrate 100;

[0056] Processor 101 disposed on substrate 100;

[0057] At least one first connector 102 is disposed on the substrate 100, and each first connector 102 is connected to the processor 101 via a wiring;

[0058] At least one function expansion card 200 is provided with a second connector 201 and a function device 202. The function device 202 is connected to the second connector 201 by wiring, and the second connector 201 is connected to the first connector 102 by a cable.

[0059] In this embodiment, the substrate 100 is used to carry the processor 101 and the first connector 102. The function expansion card 200 is independent of the substrate 100, and the function expansion card 200 is used to carry the functional device 202 and the second connector 201. The first connector 102 and the processor 101 are connected through traces in the substrate 100, and the functional device 202 and the second connector 201 are connected through traces in the function expansion card 200. The functional device 202 can be any peripheral device, such as including but not limited to a network controller, a display chip, etc.; or the functional device 202 can also be a functional module separated from the processor 101, such as a memory controller.

[0060] Those skilled in the art can configure the functional devices 202 on each functional expansion card 200 according to actual needs. For example, all sound card-related functional devices 202 can be configured on one functional expansion card 200, and all graphics card-related functional devices 202 can be configured on another functional expansion card 200. These functional expansion cards 200 and the baseboard 100 can be connected according to actual needs, thereby improving the flexibility of the installation of functional devices 202.

[0061] Multiple first connectors 102 can be disposed on the substrate 100. When the processor 101 needs to connect to a functional device 202, a cable is used to connect the first connector 102 to the second connector 201 on the functional expansion card 200 where the functional device 202 is located, so that the functional device 202 can communicate with the processor 101 via the cable. The first connector 102 and the second connector 201 can be connectors of any specification, as long as the first connector 102 and the second connector 201 can be connected by a cable and transmit data.

[0062] Besides the processor 101, the substrate 100 can also house other devices with relatively simple connections to the processor 101 and low signal transmission rate requirements, which do not need to be separated onto the function expansion card 200. For example, the substrate 100 can also house BIOS (Basic Input / Output System) flash memory, clock crystal oscillators, etc. These devices can be connected to the processor 101 via traces in the substrate 100.

[0063] The processor system provided in this application embodiment separates the functional device 202 onto the functional expansion card 200, and connects the functional expansion card 200 and the substrate 100 where the processor 101 is located via cables. In this way, the vertical space within the chassis can be fully utilized to route the connection cables between the functional expansion cards 200 and the substrate 100, eliminating the need to route all the connection paths between the functional device 202 and the processor 101 onto the same motherboard 300, thus alleviating space constraints. Furthermore, since the transmission rate of cables is higher than that of PCB traces, the insertion loss is lower, and insertion and removal are more flexible, connecting the functional expansion card 200 and the processor 101 via cables improves signal transmission quality and increases the flexibility of connecting the processor 101 to the functional device 202.

[0064] In one embodiment, the processor system further includes:

[0065] The motherboard 300 is fixedly connected to the base plate 100;

[0066] At least one function expansion card connector 301 is provided on the motherboard 300, and each function expansion card 200 is fixed to the motherboard 300 through the function expansion card connector 301.

[0067] In the embodiments of this application, such as Figure 2As shown, the motherboard 300 can be further configured, and the substrate 100 and the function expansion card 200 can be fixed to the motherboard 300. The substrate 100 can be fixed to the motherboard 300 by soldering or by a connector. The function expansion card 200 is fixed to the motherboard 300 by inserting it into the function expansion card connector 301.

[0068] The embodiments of this application do not limit the method of fixing the substrate 100 and the function expansion card 200 on the motherboard 300. For example, the substrate 100 and the function expansion card 200 can both be mounted on the motherboard 300, or the function expansion card 200 can also be mounted vertically on the motherboard 300.

[0069] When the substrate 100 or the function expansion card 200 is mounted on the motherboard 300, the setting method of the function expansion card connector 301 and the mounting direction of each function expansion card 200 can be adjusted so that the direction of the connecting cable of the second connector 201 on each function expansion card 200 is towards the substrate 100, thereby reducing the complexity of connecting the first connector 102 and the second connector 201 by cable.

[0070] Multiple expansion card connectors 301 can be arranged side-by-side on each side of the motherboard 300 where the first connector 102 is located on the substrate 100. The spacing between the multiple expansion card connectors 301 in the same row should be greater than the width of the expansion card 200. The spacing between expansion card connectors 301 in different rows should be greater than the sum of the length of the expansion card 200 and the length of the cable connector. Furthermore, considering that the width of the expansion card 200 with different functional devices 202 may vary, various possible spacings between the expansion card connectors 301 can be set according to the possible width of the expansion card 200. For example, the spacing between the expansion card connectors 301 in the row closest to the substrate 100 can be set as the minimum width of the expansion card 200, and the spacing between the expansion card connectors 301 in the second row closest to the substrate 100 can be set as the second minimum width of the expansion card 200, and so on. When it is necessary to fix the expansion card 200 to the motherboard 300, a suitable expansion card connector 301 can be selected according to the width of the expansion card 200 to install the expansion card 200.

[0071] When the function expansion card 200 is vertically mounted on the motherboard 300, the interface on the function expansion card 200 that connects to the function expansion card connector 301 can be set on either side of the second connector 201, so that the substrate 100 can still be connected through the second connector 201 when the function expansion card 200 is mounted on the motherboard 300.

[0072] Similarly, multiple expansion card connectors 301 can be arranged side-by-side on each side of the substrate 100. The length direction of each expansion card connector 301 can be parallel to the side of the substrate 100, so that the expansion card 200 faces the substrate 100 after being mounted on the expansion card connector 301. In this case, the spacing between expansion card connectors 301 in the same row should be greater than the width of the expansion card 200. Alternatively, the length direction of each expansion card connector 301 can be perpendicular to the side of the substrate 100, so that the side of the expansion card 200 faces the substrate 100 after being mounted on the expansion card connector 301. In this case, the spacing between expansion card connectors 301 in the same row should be greater than the thickness of the expansion card 200.

[0073] If the function expansion card 200 has a physical slot for installing the card, then considering the thickness of the card, the function expansion card 200 can be installed on the outermost row or column of function expansion card connectors 301, so that there are no other function expansion card connectors 301 in the card installation direction of the function expansion card 200, thus avoiding the situation where the card cannot be installed normally.

[0074] The motherboard 300 can be used only to support the substrate 100 and the various function expansion cards 200, without any PCB traces or functional devices 202 arranged on it. In this case, the function expansion card connector 301 on the motherboard 300 can be a connector used only for physically fixing the function expansion cards 200.

[0075] Alternatively, the motherboard 300 can also be used to power the baseboard 100 and each function expansion card 200. In this case, a power controller 305 needs to be set on the motherboard 300. The power controller 305 can be connected to the baseboard 100 and each function expansion card connector 301 through the traces on the motherboard 300. In this case, the function expansion card connector 301 is a power connector.

[0076] The motherboard 300 can also accommodate some common functional devices 202, such as BMC (Baseboard Management Controller) chips, EC (Embedded Controller) chips, etc. These functional devices 202 can be connected to the baseboard 100 and various expansion card connectors 301 via traces on the motherboard 300. In this case, the expansion card connectors 301 can also be high-speed connectors. With this configuration, common functional devices 202 that are widely used in various systems can be integrated onto the motherboard 300, while each expansion card 200 can accommodate optional or customizable functional devices 202.

[0077] In one embodiment, the processor system further includes:

[0078] The first physical slot 203, located on the function expansion card 200, is connected to the second connector 201 via a wiring.

[0079] In this embodiment, the function expansion card 200 is further provided with physical slots for installing standard expansion cards (hereinafter referred to as the first physical slot 203). The physical slot is connected to the second connector 201 via wiring on the function expansion card 200. The physical slot is used to connect standard expansion cards, which may include, but are not limited to: PCIe (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard) cards, AMR (Audio / Modem Riser) cards, CPCI (Compact Peripheral Component Interconnect) cards, memory modules, etc. Those skilled in the art can configure the type and number of physical slots on each function expansion card 200 according to actual needs.

[0080] In one example, each standard expansion card can be installed at an angle to the surface of the expansion card 200 when mounted in a physical slot. This angle can be any value from 0 to 90 degrees. This method of installing standard expansion cards utilizes the vertical space inside the chassis, eliminating the limitations imposed by the width of the expansion card 200, motherboard 300, or chassis width, thus increasing the number of standard expansion cards that can be installed.

[0081] In one example, the physical slot's length direction can be further aligned with the first edge of the expansion card 200 (where the first edge can be any edge longer than the physical slot's length), and an interface for connecting the expansion card connector 301 can be provided on the second edge of the expansion card 200 opposite to the first edge. This ensures that when the expansion card 200 is installed in the expansion card connector 301, the surface of the expansion card 200 is perpendicular to the surface of the motherboard 300, and the first edge is parallel to the surface of the motherboard 300. This arrangement achieves the effect of each standard expansion card being parallel to the surface of the motherboard 300, maximizing the use of vertical space within the chassis.

[0082] In one embodiment, the function expansion card 200 includes a high-speed parallel bus function expansion card 200a and a high-speed serial bus function expansion card 200b.

[0083] The functional device 202 on the high-speed parallel bus function expansion card 200a and the standard plug-in card connected to the function expansion card 200 are both high-speed parallel bus devices.

[0084] The functional device 202 on the high-speed serial bus function expansion card 200b and the standard plug-in card connected to the function expansion card 200 are both high-speed serial bus devices.

[0085] In this embodiment, the function expansion card 200 is divided into a high-speed parallel bus function expansion card 200a and a high-speed serial bus function expansion card 200b. The high-speed parallel bus function expansion card 200a can be equipped with high-speed parallel bus devices, such as memory, PCI (Peripheral Component Interconnect) devices, and SCSI (Small Computer System Interface) devices. The high-speed serial bus function expansion card 200b can be equipped with high-speed serial bus devices, such as PCIe devices, SATA (Serial ATA) hard drives, and serial flash memory.

[0086] The first connector 102 to which the high-speed parallel bus function expansion card 200a is connected can be connected to a module on the substrate 100 responsible for controlling parallel data transmission, or these first connectors 102 can be directly connected to the processor 101. The first connector 102 to which the high-speed serial bus function expansion card 200b is connected can be connected to a module on the substrate 100 responsible for controlling serial data transmission.

[0087] In one embodiment, the first connector 102 includes a parallel function expansion card connector 102a and a serial function expansion card connector 102b. The parallel function expansion card connector 102a is used to connect a high-speed parallel bus function expansion card 200a, and the serial function expansion card connector 102b is used to connect a high-speed serial bus function expansion card 200b.

[0088] The processor system also includes:

[0089] The processor 101 is connected to the high-speed input / output chip die 103 and the serial function expansion card connectors 102b.

[0090] In this embodiment, the first connector 102 can be divided into a parallel function expansion card connector 102a responsible for connecting the high-speed parallel bus function expansion card 200a, and a serial function expansion card connector 102b responsible for connecting the high-speed serial bus function expansion card 200b. For example... Figure 2As shown, each parallel function expansion card connector 102a can be directly connected to the processor 101 through the traces on the substrate 100, and each serial function expansion card connector 102b can be connected to the high-speed input / output chip die 103 on the substrate 100. The other end of the high-speed input / output chip die 103 is connected to the processor 101, so that when the processor 101 needs to communicate with the high-speed serial bus devices on each high-speed serial bus function expansion card 200b, the high-speed serial signal is processed through the high-speed input / output chip die 103.

[0091] In one embodiment, the processor system further includes:

[0092] The second physical slot 302, located on the motherboard 300, is connected to the parallel function expansion card connector 102a via a cable. The second physical slot 302 is used to connect to a standard expansion card.

[0093] In the embodiments of this application, such as Figure 2 As shown, a physical slot can also be set on the motherboard 300 (hereinafter referred to as the second physical slot 302). Figure 2 The diagram shows one second physical slot 302, but in reality, there can be one or more second physical slots 302. Each second physical slot 302 can be connected to the parallel function expansion card connector 102a via a cable and is used to install standard plug-in cards belonging to high-speed parallel bus devices.

[0094] In one embodiment, the processor system further includes:

[0095] Basic device 104, which includes at least BIOS flash memory and / or clock crystal oscillator;

[0096] The low-speed input / output chip die 105 and the basic device 104 are connected through the low-speed input / output chip die 105 and the high-speed input / output chip die 103.

[0097] In this embodiment, the basic device 104 includes devices necessary for system operation, such as BIOS flash memory and clock crystal oscillator. Figure 2 As shown, the basic device 104 can be disposed on the substrate 100. Since the output of the basic device 104 is usually a low-speed signal, a low-speed input / output chip die 105 for processing low-speed signals can be further disposed on the substrate 100, and each basic device 104 can be connected to a high-speed input / output chip die 103 through the low-speed input / output chip die 105, so that after the high-speed input / output chip die 103 integrates the signal output by the low-speed input / output chip die 105, it transmits the signal to the processor 101 or each high-speed serial bus function expansion card 200b.

[0098] In one embodiment, the processor system further includes:

[0099] The high-speed interface chip 303, which is located on the motherboard 300, is connected to the high-speed input / output chip die 103.

[0100] The low-speed interface chip 304, located on the motherboard 300, is connected to the low-speed input / output chip die 105.

[0101] In this embodiment, the motherboard 300 may also be equipped with a high-speed interface chip 303 (e.g., a network controller, an onboard display chip, etc.) and a low-speed interface chip 304 (e.g., a BMC (Baseboard Management Controller) chip, an EC (Embedded Controller) chip, etc.). The high-speed interface chip 303 can be connected to the high-speed input / output chip die 103 via traces on the motherboard 300, and the low-speed interface chip 304 can be connected to the low-speed input / output chip die 105 via traces on the motherboard 300, so that the processor 101 can be connected to the chips on the motherboard 300 via the high-speed input / output chip die 103 and the low-speed input / output chip die 105.

[0102] In one embodiment, the high-speed parallel bus function expansion card 200a includes a memory function expansion card 200, the functional device 202 on the memory function expansion card 200 includes a memory controller, and the standard plug-in card connected to the memory function expansion card 200 includes a memory module.

[0103] In this embodiment, the memory controller can be separated from the processor 101 and disposed as a functional device 202 on the function expansion card 200. The function expansion card 200 containing the memory controller is a memory function expansion card 200, which belongs to the high-speed parallel bus function expansion card 200a. The memory controller can be used to convert the serial high-speed signal received by the second connector 201 into a parallel high-speed signal.

[0104] The memory expansion card 200 has various physical slots for connecting memory modules. Memory modules can be installed perpendicular to the memory expansion card 200 when inserted into the memory slots. Each memory slot can be connected to the memory controller via wiring on the expansion card 200, enabling the memory controller to perform memory access control functions.

[0105] In one embodiment, the processor system further includes:

[0106] The third connector 106 is disposed on the substrate 100. The third connector 106 is connected to the processor 101 through the high-speed input / output chip die 103. The third connector 106 is used to connect to other processor systems through cables.

[0107] In the embodiments of this application, see further reference. Figure 2 As shown, a third connector 106 may also be disposed on the substrate 100. The third connector 106 is connected to the processor 101 via a high-speed input / output chip die 103. It should be noted that the high-speed input / output chip die 103 connected to the third connector 106 can be configured as follows: Figure 2 As shown, the high-speed input / output chip die 103 connected to each serial function expansion card connector 102b may differ from, or be the same as, the high-speed input / output chip die 103 connected to each serial function expansion card connector 102b. Those skilled in the art can configure the connection relationship between the serial function expansion card connector 102b and the third connector 106 and the high-speed input / output chip die 103 according to specific requirements. The third connector 106 can be... Figure 2 The number shown can be one or more.

[0108] When multiple processor systems need to be connected, the third connector 106 on different processor systems can be connected in pairs via cables to achieve interconnection between different processor systems.

[0109] The third connector 106 can be as follows Figure 2 The first connectors 102 are arranged to face different edges of the substrate 100, so that when different processor systems need to be connected by cables, the cables installed on the third connector 106 will not affect the connection between the processor 101 and the various function expansion cards 200.

[0110] In one embodiment, the processor system further includes:

[0111] A voltage regulator 107 is disposed on the substrate 100.

[0112] In this embodiment, a voltage regulator 107 can be disposed on the substrate 100 to manage the power supply voltage of the substrate 100 and the function expansion card 200. The number and placement of the voltage regulators 107 can be determined according to the power supply network design of the substrate 100. If the function expansion card 200 needs to be powered independently, one or more voltage regulators 107 can also be disposed on the function expansion card 200.

[0113] In one embodiment, the processor system further includes:

[0114] The power controller 305, located on the motherboard 300, is connected to the connectors 301 of each function expansion card via wiring.

[0115] Each function expansion card 200 is also used to receive power from the power controller 305 through the function expansion card connector 301.

[0116] In this embodiment, a power controller 305 may be provided on the motherboard 300 so that the motherboard 300 can provide power to the substrate 100 and each functional expansion card 200. The power controller 305 can be connected to the substrate 100 and each functional expansion card connector 301 via wiring. Each functional expansion card connector 301 acts as a power connector, enabling each device on the functional expansion card 200 to receive power from the motherboard 300.

[0117] In one embodiment, the processor system further includes:

[0118] A power board, which has at least one first power connector;

[0119] The substrate 100 and each function expansion card 200 are also provided with a second power connector. The first power connector is connected to the second power connector via a cable. The substrate 100 and the function expansion card 200 receive power from the power board through the second power connector.

[0120] In this embodiment of the application, without the motherboard 300, a separate power supply board can be provided to power the baseboard 100 and each functional expansion card 200. The power supply board can be provided with at least one first power connector, and corresponding second power connectors are provided on the baseboard 100 and each functional expansion card 200.

[0121] When it is necessary for the processor 101 to connect to a certain functional device 202, a cable is used to connect the first connector 102 on the substrate 100 to the second connector 201 on the functional expansion card 200 where the functional device 202 is located. At the same time, a cable is used to connect the second power connector on the substrate 100 to the first power connector on the power board, and a cable is used to connect the second power connector on the functional expansion card 200 where the functional device 202 is located to the first power connector on the power board. In this way, the power board can supply power to the substrate 100 and the functional expansion card 200 that the substrate 100 needs to connect to.

[0122] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A processor system, characterized in that, include: substrate; A processor disposed on the substrate; At least one first connector is disposed on the substrate, and each first connector is connected to the processor via a trace. At least one function expansion card, wherein the function expansion card is provided with a second connector and a function device, the function device is connected to the second connector via wiring, and the second connector is connected to the first connector via a cable.

2. The system according to claim 1, characterized in that, The system also includes: The motherboard is fixedly connected to the substrate; At least one function expansion card connector is provided on the motherboard, and each function expansion card is fixed to the motherboard through the function expansion card connector.

3. The system according to claim 2, characterized in that, The system also includes: The first physical slot located on the function expansion card is connected to the second connector via a wiring; the first physical slot is used to connect to a standard plug-in card.

4. The system according to claim 3, characterized in that, The expansion cards include high-speed parallel bus expansion cards and high-speed serial bus expansion cards. The functional devices on the high-speed parallel bus function expansion card and the standard plug-in card connected to the function expansion card are all high-speed parallel bus devices; The functional devices on the high-speed serial bus function expansion card and the standard plug-in card connected to the function expansion card are all high-speed serial bus devices.

5. The system according to claim 4, characterized in that, The first connector includes a parallel function expansion card connector and a serial function expansion card connector. The parallel function expansion card connector is used to connect the high-speed parallel bus function expansion card, and the serial function expansion card connector is used to connect the high-speed serial bus function expansion card. The system also includes: The processor is connected to each of the serial function expansion card connectors via the high-speed input / output chip die.

6. The system according to claim 5, characterized in that, The system also includes: The second physical slot, located on the motherboard, is connected to the parallel function expansion card connector via a cable. The second physical slot is used to connect to a standard expansion card.

7. The system according to claim 5, characterized in that, The system also includes: Basic components, including at least BIOS flash memory and / or clock crystal oscillator; A low-speed input / output chip die, wherein the basic device is connected through the low-speed input / output chip die and the high-speed input / output chip die.

8. The system according to claim 7, characterized in that, The system also includes: The high-speed interface chip located on the motherboard is connected to the bare die of the high-speed input / output chip. The low-speed interface chip is located on the motherboard and is connected to the bare die of the low-speed input / output chip.

9. The system according to claim 4, characterized in that, The high-speed parallel bus function expansion card includes a memory function expansion card, the functional devices on the memory function expansion card include a memory controller, and the standard plug-in card connected to the memory function expansion card includes a memory module.

10. The system according to claim 1, characterized in that, The system also includes: A third connector is disposed on the substrate, which is connected to the processor via a high-speed input / output chip die, and is used to connect to other processor systems via cables.

11. The system according to claim 1, characterized in that, The system also includes: A voltage regulator is disposed on the substrate.

12. The system according to claim 2, characterized in that, The system also includes: The power controller, located on the motherboard, is connected to each of the function expansion card connectors via wiring. Each of the aforementioned expansion cards is also used to receive power from the power controller via the expansion card connector.

13. The system according to claim 1, characterized in that, The system also includes: A power board, wherein at least one first power connector is provided on the power board; The substrate and each of the functional expansion cards are also provided with a second power connector. The first power connector is connected to the second power connector via a cable. The substrate and the functional expansion cards receive power from the power board through the second power connector.

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