Detachable lamp bead infrared heating plate

Abstract

The utility model relates to the technical field of heating plate, especially infrared heating plate with detachable lamp pearl, it includes: the heat dissipation base plate and a plurality of lamp pearl module, the heat dissipation base plate inside is embedded with the power bus, and the corresponding lamp pearl module is opened with a plurality of installation stations for installing lamp pearl module, every installation station all is provided with the connecting terminal, and every connecting terminal all is electrically connected with the power bus, lamp pearl module includes module shell, infrared luminophore and connecting interface, infrared luminophore installs in module shell inside, and connecting interface sets up in module shell back and is matched with the connecting terminal in installation station, detachable locking assembly is set up in module shell and is used for with lamp pearl module detachable fixed connection in installation station, makes module shell and the installation surface in installation station tight contact simultaneously. The present application has can solve the problem of lamp pearl quick replacement and maintenance, and improve the effect of heat dissipation and heat uniformity.

Description

Technical Field

[0001] This utility model relates to the technical field of heating plates, and in particular to an infrared heating plate with detachable LED beads. Background Technology

[0002] Infrared heating plates achieve efficient heating by emitting infrared radiation through infrared lamp beads, and are widely used in industrial drying, plastic welding, semiconductor curing, food processing and household appliances. Currently, most existing infrared heating plates use LED beads welded and riveted to a ceramic substrate or metal-based printed circuit board, and are encapsulated in an integrated structure within a ceramic or metal frame. This structure forms a non-removable, integral heating module with significant drawbacks: 1. Individual or partial LED bead damage prevents independent replacement, requiring complete scrapping or return to the factory for repair, resulting in long equipment downtime; 2. Poor flexibility prevents adjustment of LED bead power and wavelength according to process requirements, making it difficult to adapt to customized heating; 3. Poor heat dissipation and thermal uniformity, with thermal expansion and contraction at solder joints easily leading to poor soldering and causing localized overheating that accelerates LED bead damage. Therefore, designing an infrared heating plate with detachable LED beads that can solve the problems of rapid LED bead replacement and maintenance, as well as improve heat dissipation and thermal uniformity, is a technical problem that enterprise technicians urgently need to solve. Utility Model Content

[0003] To address the shortcomings of the prior art, this application provides an infrared heating plate with detachable LED beads.

[0004] The above-mentioned inventive objective of this application is achieved through the following technical solutions: An infrared heating plate with detachable LED beads includes a heat dissipation substrate and several LED bead modules. A power supply bus is embedded inside the heat dissipation substrate, and several mounting stations for installing LED bead modules are opened corresponding to the LED bead modules. Each mounting station is provided with a connection terminal, and each connection terminal is electrically connected to the power supply bus. The LED module includes a module housing, an infrared emitter, and a connection interface. The infrared emitter is installed inside the module housing, and the connection interface is located on the back of the module housing and matches the connection terminal in the installation station. A detachable locking assembly is provided on the module housing and is used to detachably and securely connect the LED module to the installation station, while ensuring close contact between the module housing and the installation surface in the installation station.

[0005] Preferably, the detachable locking assembly is one of the following: threaded connection structure, lever clamping structure, snap-fit ​​structure, or plug-in structure.

[0006] Preferably, the LED module further includes a highly thermally conductive flexible interface, which is disposed within the installation station and sandwiched between the module shell and the installation surface within the installation station.

[0007] Preferably, the highly thermally conductive flexible interface is one or a combination of thermally conductive silicone grease pads, phase change thermally conductive sheets, and metal spring pressure plates.

[0008] Preferably, the connecting terminal is a high-temperature resistant spring pin contact or a ceramic plug.

[0009] Preferably, the conductive contacts of the connection interface are silver-plated copper contacts.

[0010] Preferably, the module housing includes an outer cover and a heat dissipation base. The outer cover is fixedly connected to the top surface of the heat dissipation base, and the connection interface is located on the bottom surface of the heat dissipation base. The heat dissipation base is used to make close contact with the mounting surface in the installation station. The outer cover is made of glass, and the heat dissipation base is made of ceramic or metal.

[0011] Preferably, the wavelengths of the bands generated by the several infrared emitters are a collection of the same wavelength or a combination of two or more different wavelengths.

[0012] Preferably, the arrangement of the LED modules on the heat dissipation substrate is either regular or random.

[0013] Compared with the prior art, the beneficial effects of this utility model are: This utility model solves the problem of traditional integrated heating plates having to scrap the entire unit or return it to the factory for repair when a single or partial LED bead is damaged. Users can quickly replace faulty LED bead modules on-site without professional tools, significantly reducing maintenance costs and time. Meanwhile, the LED module can make close contact with the heat dissipation substrate mounting surface through a highly thermally conductive flexible interface, which can effectively optimize the heat conduction path, avoid the local overheating problem caused by the poor soldering of traditional welding points, improve heating uniformity and extend the overall service life of the LED and heating plate. In addition, several infrared emitters can be designed with the same wavelength as a set or multiple wavelengths combined, and the lamp modules can be arranged regularly or randomly on the heat dissipation substrate. The power density and infrared wavelength of the heating area can be flexibly adjusted according to different process requirements to meet customized heating scenarios and overcome the shortcomings of traditional heating plates in terms of poor flexibility. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 yes Figure 1 A magnified view of part A in the middle; Figure 3 This is a schematic diagram of the structure of the LED module in one embodiment of this application; Figure 4This is another structural schematic diagram of the LED module in one embodiment of this application.

[0015] Reference numerals: 1. Heat dissipation substrate; 2. LED module; 21. Module housing; 211. Outer cover; 212. Heat dissipation base; 22. Infrared emitter; 23. Connection interface; 3. Detachable locking assembly; 4. Power supply bus; 5. Installation station; 6. Connection terminal; 7. High thermal conductivity flexible interface. Detailed Implementation

[0016] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of this application, including various details to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this application. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0017] It should be noted that the terms "first," "second," etc., used in this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in orders other than those illustrated or described herein. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with this disclosure.

[0018] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0019] The following is a reference appendix. Figure 1 To be continued Figure 4 This application describes an infrared heating plate with detachable LED beads.

[0020] Reference Figures 1 to 4The infrared heating plate with detachable LED beads includes a heat dissipation substrate 1, several LED bead modules 2 with the same structure, and several detachable locking components 3. Typically, the heat dissipation substrate 1 can be made of materials with good thermal conductivity and structural strength, such as aluminum alloy. A power supply bus 4 is embedded inside the heat dissipation substrate 1, and several installation stations 5 for installing the LED bead modules 2 are opened corresponding to the LED bead modules 2. Each installation station 5 is provided with a connection terminal 6, and each connection terminal 6 is electrically connected to the power supply bus 4 to realize power conduction. The LED bead module 2 includes a module shell 21, an infrared emitter 22, and a connection interface 23. The infrared emitter 22 is installed inside the module shell 21, and the connection interface 23 is located on the back of the module shell 21 and matches the connection terminal 6 in the installation station 5. The detachable locking components 3 are located on the module shell 21 and are used to detachably and fix the LED bead module 2 in the installation station 5, while ensuring that the module shell 21 is in close contact with the installation surface of the installation station 5. Specifically, by embedding the power supply bus 4 into the heat dissipation substrate 1 and opening the mounting station 5 with the connection terminal 6, and using the detachable locking component 3 to fix the lamp bead module 2 and ensure the tight contact between the module shell 21 and the mounting surface, the detachable assembly of the lamp bead module 2 and the heat dissipation substrate 1 and the stable electrical connection are realized. It is worth mentioning that the installation station 5 can be set as a working slot or a station area divided on the heat dissipation substrate 1. The two installation station forms can be flexibly selected according to the size of the LED module 2, the overall structure of the heating plate and the requirements for ease of assembly.

[0021] As a preferred option, the detachable locking component 3 is one of the following: threaded connection structure, lever pressing structure, snap-fit ​​structure, and plug-in structure. Technicians can choose the appropriate locking method according to the application scenario of the heating plate, such as space size and ease of operation requirements, so as to complete the fixing and disassembly of the lamp module 2 without the need for complicated professional tools. Specifically, the conventional implementation of the threaded connection structure can be achieved by machining an external thread on the module housing 21 and machining an internal thread that matches the external thread in the installation station 5. During installation, the lamp module 2 can be aligned with the installation station 5 and rotated to tighten, and during disassembly, it can be removed by rotating in the opposite direction. The conventional implementation of the lever clamping structure can be achieved by hinged a rotatable lever at the edge of the mounting station 5 corresponding to the heat dissipation substrate 1 via a pivot. The end of the lever near the lamp module 2 is provided with a pressure block that is adapted to the top surface of the lamp module 2. Some levers can also be equipped with torsion springs to provide preload. During installation, after the lamp module 2 is placed in the mounting station 5, the lever is moved to make the pressure block press against the top surface of the lamp module 2. During disassembly, the lever can be moved in the opposite direction to unlock it. The conventional implementation of the snap-fit ​​structure can achieve elastic snap-fit ​​by setting elastic buckles on the outside of the module housing 21 and setting slots on the inner sidewall of the installation station 5. The conventional implementation of the plug-in structure can be achieved by setting a slot structure between the module housing 21 and the installation station 5, and the assembly and disassembly can be completed by plugging and unplugging. The specific composition of the above structure is common knowledge to those skilled in the art. It is only an example and is not intended to limit or elaborate. Preferably, the LED module 2 also includes a highly thermally conductive flexible interface 7, which is disposed within the mounting station 5 and sandwiched between the module housing 21 and the mounting surface of the mounting station 5. By setting the highly thermally conductive flexible interface 7, its flexible deformation characteristics are utilized and it is in close contact with the detachable locking component 3 to fill the tiny gaps between the module housing 21 and the mounting surface. This eliminates air gaps, constructs an efficient heat conduction path, and quickly conducts the heat generated by the LED module 2 during operation to the heat dissipation substrate 1, ensuring the temperature uniformity of the heating area, delaying the aging and damage of the LEDs caused by high temperatures, and extending the lifespan of the LEDs.

[0022] Specifically, the high thermal conductivity flexible interface 7 is one or a combination of thermally conductive silicone grease pads, phase change thermal conductive sheets, and metal spring clips. Technicians can select the appropriate interface type according to the operating temperature range and thermal conductivity requirements of the heating plate. For example, thermally conductive silicone grease pads are suitable for medium and low temperature scenarios, combining flexibility and basic thermal conductivity efficiency; phase change thermal conductive sheets can further improve thermal conductivity after phase change at a specific temperature, making them suitable for medium and high temperature scenarios; metal spring clips are resistant to high temperatures and have stable elasticity, which can always maintain close contact between the module shell 21 and the mounting surface, continuously transferring the heat generated by the LED module 2, making them suitable for high temperature scenarios.

[0023] Preferably, the connecting terminal 6 is a high-temperature resistant spring pin contact or a ceramic plug. The high-temperature resistant spring pin contact ensures a tight contact with the connecting interface 23 through elastic deformation, avoiding loosening of the contact caused by thermal expansion and contraction. The ceramic plug has excellent high-temperature insulation performance, preventing leakage or short circuit risks in high-temperature environments. Both of these can ensure a stable electrical connection between the connecting terminal 6 and the connecting interface 23, ensuring the reliability of the heating plate operation. It is worth mentioning that the high-temperature resistant spring needle contact is usually composed of a needle tip, a spring and a needle tube. In this application, the material selection of each part needs to take into account high temperature resistance, conductivity and mechanical properties. Among them, the needle tip is the part that makes direct contact, the spring is the core part that provides continuous contact pressure, and the needle tube is the supporting and guiding part for the needle tip and the spring. When the three are assembled together, they can achieve stable contact conductivity and long-lasting elastic deformation capability. Ceramic connectors typically include an insulating body made of ceramic material and a conductive post disposed on the insulating body. One end of the conductive post is used to contact the connection interface 23 and the other end is electrically connected to the power supply bus 4. During operation, the insulating body made of ceramic material can withstand high temperatures for a long time, ensuring a stable power supply connection for the LED module 2. Furthermore, the high insulation of the ceramic material can effectively isolate the conductive post from the heat dissipation substrate 1, preventing short circuits.

[0024] Preferably, the conductive contacts of the connection interface 23 are copper-plated silver contacts. By utilizing the high conductivity of copper, the basic conductivity efficiency is ensured. At the same time, the silver plating reduces the surface resistance of the contacts, which can further optimize the electrical performance and heat dissipation burden of the heating plate. In addition, the silver plating has good oxidation resistance, which can delay the oxidation and corrosion of the contacts after long-term use, extend the service life of the connection interface 23, and ensure the long-term stability of the electrical connection.

[0025] In addition, the module housing 21 includes an outer cover 211 and a heat dissipation base 212. The outer cover 211 is fixedly connected to the top surface of the heat dissipation base 212, and the connection interface 23 is set on the bottom surface of the heat dissipation base 212. The heat dissipation base 212 is used to make close contact with the mounting surface of the mounting station 5. The outer cover 211 is made of glass, and the heat dissipation base 212 is made of ceramic or metal. The glass outer cover 211 can effectively transmit the infrared radiation emitted by the infrared emitter 22, while protecting the infrared emitter 22 from external dust and impact. The heat dissipation base 212, which is supported by ceramic or metal, has good thermal conductivity and can quickly conduct the heat generated by the infrared emitter 22 to the outside, further improving the functionality and durability of the LED module 2.

[0026] Preferably, the wavelengths of the bands generated by the infrared emitters 22 are a collection of the same wavelength or a combination of two or more different wavelengths. Technicians can flexibly configure the wavelength combination of the infrared emitters 22 according to the heating process requirements by using the detachable setting function of the lamp module, so that the heating plate can be adapted to a variety of heating scenarios.

[0027] In addition, the arrangement of several LED modules 2 on the heat dissipation substrate 1 can be either regular or random. Regular arrangement can achieve uniform temperature distribution in the heating area of ​​the heating plate, which can be adapted to scenarios that require uniform heating. Random arrangement can achieve high-power heating in specific areas by adjusting the density of LED modules 2 in key heating areas, which can be adapted to scenarios that require localized enhanced heating, further expanding the application scenarios of the heating plate and meeting the differentiated power density requirements of different processes for the heating area.

[0028] This application solves the problem of traditional integrated heating plates needing to scrap the entire unit or return it to the factory for repair after a single or partial lamp bead is damaged. Users can quickly replace the faulty lamp bead module 2 on-site without professional tools, which significantly reduces maintenance costs and time. Meanwhile, the LED module 2 can be in close contact with the mounting surface of the heat dissipation substrate 1 through the highly thermally conductive flexible interface 7, which can effectively optimize the heat conduction path, avoid the local overheating problem caused by the poor soldering of traditional welding points, improve heating uniformity and extend the overall service life of the LED and the heating plate. In addition, several infrared emitters 22 can be designed with the same wavelength set or multiple wavelengths combined, and the lamp bead modules 2 can be arranged regularly or randomly on the heat dissipation substrate 1. The power density and infrared wavelength of the heating area can be flexibly adjusted according to different process requirements to meet customized heating scenarios and overcome the shortcomings of traditional heating plates with poor flexibility.

[0029] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An infrared heating plate with detachable LED beads, characterized in that, include: The heat dissipation substrate (1) and several lamp bead modules (2) are provided. A power supply bus (4) is embedded inside the heat dissipation substrate (1), and several mounting stations (5) for mounting the lamp bead modules (2) are provided for each lamp bead module (2). Each mounting station (5) is provided with a connection terminal (6), and each connection terminal (6) is electrically connected to the power supply bus (4). The LED module (2) includes a module housing (21), an infrared emitter (22), and a connection interface (23). The infrared emitter (22) is installed inside the module housing (21), and the connection interface (23) is located on the back of the module housing (21) and matches the connection terminal (6) in the installation station (5). A detachable locking assembly (3) is provided on the module housing (21) and is used to detachably and securely connect the LED module (2) to the installation station (5) while ensuring that the module housing (21) is in close contact with the installation surface of the installation station (5).

2. The infrared heating plate with detachable LED beads as described in claim 1, characterized in that, The detachable locking component (3) is one of the following: threaded connection structure, lever clamping structure, snap-fit ​​structure, or plug-in structure.

3. The infrared heating plate with detachable LED beads as described in claim 1, characterized in that, The LED module (2) also includes a highly thermally conductive flexible interface (7), which is located in the installation station (5) and sandwiched between the module shell (21) and the installation surface of the installation station (5).

4. The infrared heating plate with detachable LED beads as described in claim 3, characterized in that, The high thermal conductivity flexible interface (7) is one or a combination of thermally conductive silicone grease pad, phase change thermally conductive sheet, and metal spring pressure plate.

5. The infrared heating plate with detachable LED beads as described in claim 1, characterized in that, The connecting terminal (6) is a high-temperature resistant spring pin contact or a ceramic plug.

6. The infrared heating plate with detachable LED beads as described in claim 1, characterized in that, The conductive contacts of the connection interface (23) are copper-plated silver contacts.

7. The infrared heating plate with detachable LED beads as described in claim 1, characterized in that, The module housing (21) includes an outer cover (211) and a heat sink base (212). The outer cover (211) is fixedly connected to the top surface of the heat sink base (212), and the connection interface (23) is located on the bottom surface of the heat sink base (212). The heat sink base (212) is used to make close contact with the mounting surface of the installation station (5). The outer cover (211) is made of glass, and the heat sink base (212) is made of ceramic or metal.

8. The infrared heating plate with detachable LED beads as described in claim 1, characterized in that, The wavelengths of the bands produced by several infrared emitters (22) are a collection of the same wavelength or a combination of two or more different wavelengths.

9. An infrared heating plate with detachable LED beads as described in claim 1, characterized in that, The arrangement of several LED modules (2) on the heat dissipation substrate (1) is either regular or random.

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