A CPO machine case and CPO cabinet

Abstract

The utility model discloses a kind of CPO machine case and CPO cabinet, it is related to optical fiber communication technical field, the CPO machine case includes box, ASIC module, air cooling component and liquid cooling component, accommodating cavity is equipped in box, air inlet and air outlet hole that accommodating cavity is communicated are equipped on box, air inlet and air outlet hole form ventilation flow path between them;ASIC module is located in accommodating cavity and is located on ventilation flow path, ASIC module has ASIC chip, multiple light engines and PCB board, ASIC chip and multiple light engines are located in PCB board, multiple light engines are electrically connected with ASIC chip;Air cooling component has heat-removing fan, heat-removing fan is located in box and is oppositely arranged with air outlet hole;Liquid cooling component includes liquid cooling unit, liquid inlet pipe and liquid outlet pipe, liquid cooling unit is attached to ASIC chip, liquid inlet pipe and liquid outlet pipe are connected to liquid cooling unit and are used for external radiator.

Description

Technical Field

[0001] This utility model relates to the field of optical fiber communication technology, and in particular to a CPO chassis and CPO cabinet. Background Technology

[0002] With the rapid development of artificial intelligence, cloud computing, and hyperscale data centers, network data throughput is growing exponentially, placing extremely high demands on the data transmission rate and bandwidth of servers and switching equipment. Traditional pluggable optical modules in switching equipment, such as QSFP-DD (Quad Small Form-Factor Pluggable-Double Density) and OSFP (Octal Small Form-Factor Pluggable), face challenges in power consumption, panel density, and signal integrity as speeds evolve towards 800G, 1.6T, and higher. Co-Packaged Optics (CPO) technology is a next-generation key technology for solving these problems. It integrates the optical engine and an ASIC chip (Application-Specific Integrated Circuit) on the same printed circuit board (PCB) using advanced packaging technology to form an ASIC module, significantly shortening the electrical path distance, thereby reducing signal attenuation and power consumption, and increasing transmission density.

[0003] However, the application of CPO technology also brings new challenges to equipment chassis design, especially in terms of thermal management. Regarding thermal management, the CPO package concentrates the high power density heat of the ASIC chip and optical engine into a very small area, resulting in a heat flux density far exceeding that of traditional designs. The optical engine is extremely sensitive to temperature; excessively high operating temperatures can cause laser wavelength drift, performance degradation, and even failure. Traditional air-cooling and heatsink designs are no longer sufficient to meet its demanding heat dissipation requirements. Utility Model Content

[0004] The main purpose of this utility model is to propose a CPO chassis and CPO cabinet, which aims to solve the problem that traditional air-cooling and heat sink designs can hardly meet the growing heat dissipation requirements of CPO chassis.

[0005] To achieve the above objectives, the CPO chassis proposed in this utility model includes a chassis, an ASIC module, an air-cooling component, and a liquid-cooling component. The chassis has a receiving cavity, and the chassis has an air inlet and an air outlet communicating with the receiving cavity, forming a ventilation channel between the air inlet and the air outlet. The ASIC module is located within the receiving cavity and on the ventilation channel. The ASIC module includes an ASIC chip, multiple optical engines, and a PCB board. The ASIC chip and the multiple optical engines are located on the PCB board, and the multiple optical engines are electrically connected to the ASIC chip. The air-cooling component has a heat dissipation fan, which is located in the chassis and opposite to the air outlet. The liquid-cooling component includes a liquid-cooling unit, an inlet pipe, and an outlet pipe. The liquid-cooling unit abuts against and fits against the ASIC chip, and both the inlet pipe and the outlet pipe are connected to the liquid-cooling unit and used for connecting an external heat sink.

[0006] In one embodiment, the ASIC module includes a plurality of ASIC chips, and the liquid cooling assembly includes a plurality of liquid cooling units and a plurality of connecting pipes. Each liquid cooling unit abuts against one of the ASIC chips. Each connecting pipe connects two adjacent liquid cooling units to connect the plurality of liquid cooling units in series. The liquid inlet pipe and the liquid outlet pipe are respectively located at both ends of the plurality of liquid cooling units connected in series.

[0007] In one embodiment, the liquid cooling unit includes a thermally conductive upper shell, a mounting bracket, and a thermally conductive lower shell stacked together; the thermally conductive upper shell, the mounting bracket, and the thermally conductive lower shell enclose a sealed liquid passage cavity; the thermally conductive upper shell has an inlet hole and an outlet hole communicating with the liquid passage cavity, the inlet pipe is communicating with the inlet hole, and the outlet pipe is communicating with the outlet hole; the thermally conductive lower shell abuts against the ASIC chip, and the mounting bracket is detachably connected to the PCB board.

[0008] In one embodiment, the lower heat-conducting shell has a plurality of heat-dissipating protrusions on the side facing the upper heat-conducting shell, and the heat-dissipating protrusions are located inside the liquid passage cavity.

[0009] In one embodiment, the CPO chassis further includes a first external light source, a first fiber optic management box, a first patch cord, and a second patch cord; the first external light source passes through the chassis and extends into the receiving cavity; the first fiber optic management box includes a first housing and a flexible fiber optic plate, the first housing passes through the chassis and extends into the receiving cavity, a first receiving groove is formed inside the first housing, the opening of the first receiving groove is located on the top wall of the first housing, a first fiber optic coupler is provided on the side wall of the first housing, the first fiber optic coupler is used to connect an external fiber optic cable, the flexible fiber optic plate is disposed inside the first housing and connected to the first fiber optic coupler; the first patch cord connects the first external light source and the flexible fiber optic plate, and the second patch cord connects the flexible fiber optic plate and the optical engine;

[0010] And / or, the CPO chassis further includes a second external light source, a second fiber optic management box, a third patch cord, and a fourth patch cord; the second external light source passes through the chassis and extends into the receiving cavity; the second fiber optic management box has a second housing, which passes through the chassis and extends into the receiving cavity, and a second receiving groove is formed inside the second housing, the opening of the second receiving groove being located on the top wall of the second housing, a second fiber optic coupler is provided on the side wall of the second housing, the second fiber optic coupler is used to connect external optical fibers, and a winding component is provided inside the second housing; the third patch cord connects the second external light source to one of the optical engines, and the fourth patch cord connects another optical engine to the second fiber optic coupler and is wound around the winding component.

[0011] In one embodiment, a first housing is slidably disposed within the housing, the first housing being configured to slide away from or toward the housing to expose or conceal the opening of the first receiving slot.

[0012] In one embodiment, the CPO chassis further includes a third fiber coupler, a jumper, a fourth fiber coupler, and a connecting fiber; the third fiber coupler and the fourth fiber coupler are fixedly disposed within the receiving cavity; the second jumper, the third fiber coupler, the jumper, the fourth fiber coupler, the connecting fiber, and the optical engine are connected in sequence.

[0013] In one embodiment, the CPO chassis further includes a cable management component surrounding the ASIC module. The cable management component includes a base box and a cover. The base box has a cable management groove surrounding the ASIC module. The cover is disposed over the opening of the cable management groove and is detachably connected to the base box. The base box has a cable passage opening communicating with the external space and the cable management groove. The cable passage opening is disposed opposite to the optical engine. The connecting optical fiber portion is located within the cable management groove.

[0014] This utility model also proposes a CPO cabinet, which includes a cabinet body and a CPO chassis as described in any of the above embodiments, wherein a receiving space is formed in the cabinet body, and the CPO chassis is disposed in the receiving space.

[0015] In one embodiment, the CPO cabinet includes a plurality of CPO chassis, which are stacked within the cabinet; and / or, the cabinet has an opening communicating with the receiving space, the CPO cabinet also includes a cabinet door, the cabinet door is movably connected to the cabinet and covers the opening, and the CPO chassis is slidably connected to the cabinet and can enter or extend from the receiving space through the opening.

[0016] The CPO chassis proposed in this invention includes a chassis, an ASIC module, an air-cooling component, and a liquid-cooling component. The chassis has a housing cavity, and the chassis has an air inlet and an air outlet communicating with the housing cavity, forming a ventilation channel between the air inlet and the air outlet. The ASIC module is located within the housing cavity and on the ventilation channel. The ASIC module includes an ASIC chip, multiple optical engines, and a PCB board. The ASIC chip and multiple optical engines are located on the PCB board, and all optical engines are electrically connected to the ASIC chip. The air-cooling component has a heat dissipation fan located within the chassis and opposite to the air outlet. The liquid-cooling component includes a liquid-cooling unit, an inlet pipe, and an outlet pipe. The liquid-cooling unit is attached to the ASIC chip, and both the inlet and outlet pipes are connected to the liquid-cooling unit and used for connecting an external heat sink. This invention improves the heat dissipation performance of the CPO chassis by using a liquid-cooling component to dissipate heat from the ASIC chip within the chassis, and simultaneously using an air-cooling component to further dissipate heat from other components within the chassis and the remaining components of the ASIC module, such as the optical engines. This helps ensure the normal operation of the various electronic and photonic components within the chassis. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of a CPO chassis embodiment provided by this utility model;

[0019] Figure 2 for Figure 1 A structural diagram showing the concealed portion of the CPO chassis.

[0020] Figure 3 for Figure 1Top view of the CPO chassis;

[0021] Figure 4 for Figure 3 A schematic diagram of the liquid cooling unit structure in the diagram;

[0022] Figure 5 for Figure 3 A cross-sectional view of the liquid cooling unit in the middle;

[0023] Figure 6 for Figure 3 Exploded view of the first fiber optic management box in the middle;

[0024] Figure 7 for Figure 3 Exploded view of the second fiber optic management box;

[0025] Figure 8 for Figure 3 Exploded view of the ASIC module and cable management components;

[0026] Figure 9 This is a structural schematic diagram of an embodiment of the CPO cabinet provided by this utility model.

[0027] Explanation of icon numbers:

[0028] 1000, CPO rack;

[0029] 100. CPO chassis;

[0030] 1. Housing; 1a. Receiving cavity; 1b. Air inlet; 1c. Air outlet;

[0031] 2. ASIC module; 21. ASIC chip; 22. Light engine; 23. PCB board;

[0032] 31. Exhaust fan;

[0033] 41. Liquid cooling unit; 41a. Liquid passage chamber; 411. Thermally conductive upper shell; 411a. Liquid inlet; 411b. Liquid outlet; 412. Mounting bracket; 413. Thermally conductive lower shell; 4131. Heat dissipation protrusion; 42. Liquid inlet pipe; 43. Liquid outlet pipe; 44. Connecting pipe;

[0034] 51. First external light source; 52. Second external light source;

[0035] 6. First fiber optic management box; 61. First box body; 61a. First receiving slot; 62. Fiber optic flexible board; 63. First fiber optic coupler; 64. Winding reel;

[0036] 7. Second fiber optic management box; 71. Second box body; 71a. Second receiving slot; 72. Second fiber optic coupler; 73. Winding component;

[0037] 81. First jumper; 82. Second jumper; 83. Third jumper; 84. Fourth jumper; 85. Adapter jumper; 86. Connecting fiber; 87. Third fiber coupler; 88. Fourth fiber coupler;

[0038] 9. Cable management components; 91. Base box; 91a. Cable management channel; 91b. Cable guide; 92. Box cover;

[0039] 200. Cabinet.

[0040] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0042] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0043] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0044] This utility model proposes a CPO chassis 100.

[0045] Please see Figure 2 and Figure 3In one embodiment of this utility model, the CPO chassis 100 includes a chassis 1, an ASIC module 2, an air-cooling assembly, and a liquid-cooling assembly. The chassis 1 has a receiving cavity 1a, and the chassis 1 has an air inlet 1b and an air outlet 1c communicating with the receiving cavity 1a. A ventilation channel is formed between the air inlet 1b and the air outlet 1c. The ASIC module 2 is disposed in the receiving cavity 1a and located on the ventilation channel. The ASIC module 2 has an ASIC chip 21, multiple optical engines 22, and a PCB board 23. The ASIC chip 21 and the multiple optical engines 22 are disposed on the PCB board 23, and the multiple optical engines 22 are all electrically connected to the ASIC chip 21. The air-cooling assembly has a heat dissipation fan 31, which is disposed in the chassis 1 and is arranged opposite to the air outlet 1c. The liquid-cooling assembly includes a liquid-cooling unit 41, an inlet pipe 42, and an outlet pipe 43. The liquid-cooling unit 41 is attached to the ASIC chip 21, and the inlet pipe 42 and the outlet pipe 43 are both connected to the liquid-cooling unit 41 and used for external heat sink connection.

[0046] In this embodiment, the enclosure 1 is the main structure of the CPO chassis 100, and its interior has a receiving cavity 1a for installing components such as the ASIC module 2, air-cooled components, liquid-cooled components, and optical fibers. The enclosure 1 has an air inlet 1b and an air outlet 1c communicating with the receiving cavity 1a, forming a ventilation channel between them. The design of the ventilation channel is based on aerodynamic principles. Through a reasonable aperture and channel layout, it can be ensured that air can flow smoothly through the interior of the chassis, carrying away heat. For example, the air inlet 1b and air outlet 1c can be located on opposite side walls of the receiving cavity 1a. Multiple small-aperture air inlets 1b can also be arranged in an array, which can increase the air intake area and prevent debris from entering the chassis and damaging internal components, thus protecting the safety of the internal components. The selection of the enclosure 1 considers the thermal conductivity and mechanical strength of its materials. For example, aluminum alloy can be used, ensuring good heat dissipation performance while providing sufficient structural strength to support the internal components. For example, the housing 1 in this embodiment is rectangular in shape, and its size is based on the size of the ASIC module 2 and other components, with some space reserved for fiber optic cable routing, so as to achieve both a compact spatial layout and efficient heat dissipation.

[0047] ASIC module 2 is the core component of CPO chassis 100. Its structure includes an ASIC chip 21, multiple optical engines 22, and a PCB board 23. The ASIC chip 21 and the multiple optical engines 22 are all mounted on the PCB board 23, and the multiple optical engines 22 are electrically connected to the ASIC chip 21 and surround it. The ASIC chip 21 is a key component for data processing, generating a large amount of heat during operation, making it a primary focus for heat dissipation. The optical engines 22 are responsible for transmitting and receiving optical signals and are temperature-sensitive, requiring a good heat dissipation environment to ensure performance. The PCB board 23, as a supporting and connecting component, is made of multiple layers of high thermal conductivity material, effectively conducting heat and tightly connecting the ASIC chip 21 and the optical engines 22 together to form a high-efficiency data processing and transmission unit.

[0048] The air-cooling component is an auxiliary heat dissipation component of the CPO chassis 100, and its main structure includes an exhaust fan 31. The exhaust fan 31 is mounted on the chassis 1 and is positioned opposite the exhaust vent 1c. Its working principle is to generate airflow by rotating, which exhausts hot air from inside the chassis through the exhaust vent 1c, while simultaneously drawing in cool air through the intake vent 1b, forming air convection and carrying away heat from the remaining components and ASIC module 2 inside the chassis.

[0049] The liquid cooling assembly includes a liquid cooling unit 41, an inlet pipe 42, and an outlet pipe 43. The liquid cooling unit 41 abuts against and adheres to the back of the ASIC chip 21, enabling it to quickly absorb the heat generated by the ASIC chip 21. Both the inlet pipe 42 and the outlet pipe 43 are connected to the liquid cooling unit 41 and are used to connect an external heat sink. The external heat sink may include heat dissipation pipes and a fan. The pipes may be equipped with heat dissipation fins, and the exhaust direction of the cooling fan is directed towards the heat dissipation fins and heat dissipation pipes to improve heat dissipation efficiency. The liquid cooling unit 41 is filled with a highly thermally conductive coolant, such as a water-glycol mixture, which circulates to remove the heat generated by the ASIC chip 21. The inlet pipe 42 and the outlet pipe 43 are made of high-temperature resistant and corrosion-resistant materials to ensure stable and reliable coolant circulation.

[0050] In this embodiment, the chassis 1, ASIC module 2, air-cooled component, and liquid-cooled component work together to achieve the heat dissipation function of the CPO chassis 100. The liquid-cooled component directly dissipates heat from the ASIC chip 21. Its liquid-cooling unit 41 is tightly attached to the chip surface, which can quickly absorb the heat generated by the chip and transfer the heat to the external heat sink through the inlet pipe 42 and outlet pipe 43. The air-cooled component dissipates heat from the remaining components in the chassis and the remaining components of the ASIC module 2. The airflow generated by its exhaust fan 31 can remove the heat generated by components such as the optical engine 22, while also assisting the liquid-cooled component in dissipating heat. The ventilation channel design of the chassis 1 provides a good airflow environment for the air-cooled component, ensuring that the airflow can flow smoothly through the inside of the chassis and remove heat. This combination of air-cooling and liquid-cooling fully combines the advantages of both heat dissipation methods and achieves a highly efficient heat dissipation effect. Compared with the traditional single air-cooled design, the heat dissipation performance of the CPO chassis 100 of this utility model is significantly improved, which can ensure the normal operation of various electronic and photonic components in the chassis under high power operation, avoid performance degradation and component failure caused by overheating, thereby improving the reliability and stability of the CPO chassis 100.

[0051] Further, please refer to Figure 2 and Figure 8 In one embodiment of the present invention, the ASIC module 2 includes a plurality of ASIC chips 21, and the liquid cooling assembly includes a plurality of liquid cooling units 41 and a plurality of connecting pipes 44. Each liquid cooling unit 41 abuts against an ASIC chip 21; each connecting pipe 44 connects two adjacent liquid cooling units 41 so that the plurality of liquid cooling units 41 are connected in series, and the liquid inlet pipe 42 and the liquid outlet pipe 43 are respectively disposed at both ends of the plurality of liquid cooling units 41 connected in series.

[0052] In this embodiment, the ASIC module 2 includes multiple ASIC chips 21 integrated on the same PCB board 23 for handling large-scale data transmission and computing tasks. Each ASIC chip 21 generates a large amount of heat during operation, thus requiring efficient heat dissipation measures to ensure its performance and stability. Accordingly, the liquid cooling assembly in this embodiment is optimized, comprising multiple liquid cooling units 41 and multiple connecting pipes 44. Each liquid cooling unit 41 abuts and adheres to an ASIC chip 21, directly contacting the chip surface and rapidly absorbing heat. The connecting pipes 44 connect adjacent liquid cooling units 41, connecting multiple liquid cooling units 41 in series. Inlet pipes 42 and outlet pipes 43 are respectively located at both ends of the series-connected liquid cooling units 41, forming a complete coolant circulation system. The heat generated by each ASIC chip 21 is rapidly absorbed by its corresponding liquid cooling unit 41, then transferred to the next liquid cooling unit 41 through the connecting pipes 44, and finally discharged outside the chassis through the outlet pipes 43. This series-connected liquid cooling unit 41 design ensures that the coolant can carry away the corresponding heat when flowing through each liquid cooling unit 41, achieving a highly efficient heat dissipation effect. Furthermore, multiple liquid cooling units 41 can complete the circulation by being externally connected to the radiator through a liquid inlet pipe 42 and a liquid outlet pipe 43, eliminating the need for multiple liquid inlet pipes 42 and liquid outlet pipes 43, thus reducing the space occupied by the receiving cavity 1a.

[0053] Further, please refer to Figure 4 and Figure 5 In one embodiment of this utility model, the liquid cooling unit 41 includes a heat-conducting upper shell 411, a mounting bracket 412, and a heat-conducting lower shell 413 stacked together; the heat-conducting upper shell 411, the mounting bracket 412, and the heat-conducting lower shell 413 enclose a sealed liquid passage cavity 41a; the heat-conducting upper shell 411 has an inlet hole 411a and an outlet hole 411b communicating with the liquid passage cavity 41a, the inlet pipe 42 is communicating with the inlet hole 411a, and the outlet pipe 43 is communicating with the outlet hole 411b; the heat-conducting lower shell 413 abuts against the ASIC chip 21, and the mounting bracket 412 is detachably connected to the PCB board 23.

[0054] In this embodiment, the liquid cooling unit 41 consists of a heat-conducting upper shell 411, a mounting bracket 412, and a heat-conducting lower shell 413 stacked together, forming a sealed liquid passage cavity 41a inside. The mounting bracket 412 is located between the heat-conducting upper shell 411 and the heat-conducting lower shell 413 and forms part of the inner wall of the liquid passage cavity 41a. Compared with placing the mounting bracket 412 outside the receiving cavity 1a, the overall thickness of the liquid cooling unit 41 can be reduced while ensuring that the volume and shape of the liquid passage cavity 41a remain unchanged, thus reducing the space occupied by the liquid cooling unit 41.

[0055] Specifically, the thermally conductive upper shell 411 is the upper structure of the liquid cooling unit 41. Its main function is to form a sealed liquid passage chamber 41a and provide inlet and outlet channels for the coolant. The thermally conductive upper shell 411 is made of a metal material with high thermal conductivity, such as aluminum alloy or copper alloy, to ensure that heat can be quickly conducted from the ASIC chip 21 to the coolant. Its structure is designed as a flat plate with a smooth surface to reduce the resistance to coolant flow. The thermally conductive upper shell 411 has an inlet hole 411a and an outlet hole 411b that communicate with the liquid passage chamber 41a. The inlet pipe 42 communicates with the inlet hole 411a, and the outlet pipe 43 communicates with the outlet hole 411b, ensuring that the coolant can smoothly enter and exit the liquid cooling unit 41.

[0056] The mounting bracket 412 is located between the thermally conductive upper shell 411 and the thermally conductive lower shell 413. Its main function is to fix the thermally conductive upper shell 411 and the thermally conductive lower shell 413 to the PCB board 23 and participate in forming a sealed liquid passage cavity 41a. The mounting bracket 412 is made of high-strength, corrosion-resistant materials, such as stainless steel or high-strength plastic, to ensure the stability and reliability of the structure. Exemplarily, the mounting bracket 412 includes an annular portion and fixing portions distributed around the annular portion. The thermally conductive upper shell 411 and the thermally conductive lower shell 413 clamp the annular portion to form the liquid passage cavity 41a. The fixing portions are strip-shaped and radially distributed. The fixing portions and the annular portion are integrally formed. The end of the fixing portion away from the annular portion is provided with a screw hole, which can be fixed to the PCB board 23 by screws.

[0057] The thermally conductive lower shell 413 is the lower structure of the liquid cooling unit 41. Its main function is to contact the ASIC chip 21 to absorb the heat generated by the ASIC chip 21 and quickly conduct it to the coolant. The thermally conductive lower shell 413 is also made of a metal material with high thermal conductivity, such as aluminum alloy or copper alloy, to ensure efficient heat conduction. Its structure is designed as a flat plate with a smooth lower surface, which fits tightly against the ASIC chip 21 to ensure good thermal contact. The dimensions of the thermally conductive lower shell 413 are optimized according to the dimensions of the ASIC chip 21 to achieve the best heat dissipation effect.

[0058] Further, please refer to Figure 4 and Figure 5 In one embodiment of the present invention, the heat-conducting lower shell 413 is provided with a plurality of heat dissipation protrusions 4131 on the side facing the upper shell, and the heat dissipation protrusions 4131 are located in the liquid passage cavity 41a.

[0059] In this embodiment, the heat dissipation protrusion 4131 is part of the heat-conducting lower shell 413, and its main function is to increase the contact area between the heat-conducting lower shell 413 and the coolant, thereby improving heat dissipation efficiency. The shape of the heat dissipation protrusion 4131 can be varied, such as rectangular, circular, or triangular, and the specific shape can be optimized according to actual heat dissipation requirements. In this embodiment, the heat dissipation protrusion 4131 adopts a rectangular structure and is arranged in a matrix to achieve a uniform heat dissipation effect. The height and spacing of the heat dissipation protrusion 4131 are optimized to ensure that the coolant can flow smoothly through the heat dissipation protrusion 4131 and avoid local heat accumulation. The heat dissipation protrusion 4131 can be formed by integral casting or by slotting on the heat-conducting lower shell 413. When the coolant flows through the liquid cavity 41a, the heat dissipation protrusion 4131 can significantly increase the contact area between the coolant and the heat-conducting lower shell 413, thereby improving heat exchange efficiency. This not only improves heat dissipation efficiency but also maintains the overall compact and stable structure of the liquid cooling unit 41.

[0060] Beyond thermal management, the application of CPO technology also brings new challenges to fiber optic management within equipment chassis. CPO boards typically need to directly connect to fiber optic arrays with up to 32, 64, or even more cores. The bending radius, stress management, tensile strength, and routing of these fibers within the chassis become exceptionally complex. Inadequate cabling design can lead to increased optical signal loss and decreased link reliability.

[0061] Please see Figure 3 , Figure 6 and Figure 7In one embodiment of this utility model, the CPO chassis 100 further includes a first external light source 51, a first fiber optic management box 6, a first jumper 81, and a second jumper 82. The first external light source 51 passes through the chassis 1 and extends into the receiving cavity 1a. The first fiber optic management box 6 includes a first box body 61 and a fiber optic flexible plate 62. The first box body 61 passes through the chassis 1 and extends into the receiving cavity 1a. A first receiving groove 61a is formed inside the first box body 61. The opening of the first receiving groove 61a is located on the top wall of the first box body 61. A first fiber optic coupler 63 is provided on the side wall of the first box body 61. The first fiber optic coupler 63 is used to connect external optical fibers. The fiber optic flexible plate 62 is disposed inside the first box body 61 and connected to the first fiber optic coupler 63. The first jumper 81 connects the first external light source 51 and the fiber optic flexible plate 62, and the second jumper 82 connects the fiber optic 82. 6. Flexible board 62 and optical engine 22; and / or, CPO chassis 100 also includes a second external light source 52, a second fiber optic management box 7, a third jumper 83 and a fourth jumper 84; the second external light source 52 passes through the box 1 and extends into the receiving cavity 1a; the second fiber optic management box 7 has a second box body 71, which passes through the box 1 and extends into the receiving cavity 1a, and a second receiving groove 71a is formed inside the second box body 71. The groove opening of the second receiving groove is located on the top wall of the second box body 71, and a second fiber optic coupler 72 is provided on the side wall of the second box body 71. The second fiber optic coupler 72 is used to connect external optical fibers, and a winding member 73 is provided inside the second box body 71; the third jumper 83 connects the second external light source 52 and an optical engine 22, and the fourth jumper 84 connects another optical engine 22 and the second fiber optic coupler 72 and is wound around the winding member 73.

[0062] This embodiment proposes two management schemes for external optical fibers. The first scheme utilizes a flexible fiber optic board 62 to solve the problems of ultra-high density optical fiber interconnection, space and layout constraints, avoids messy wiring, improves heat dissipation performance, simplifies assembly and testing steps, and reduces management and maintenance costs. The second scheme adopts a traditional patch cord solution and sets up a fiber winding component to organize and constrain the patch cords, preventing them from becoming tangled.

[0063] Specifically, in the first scheme, the primary function of the first external laser source 51 (ELS) is to provide a stable light source for optical fiber communication. The first external laser source 51 passes through the housing 1 and extends into the receiving cavity 1a. Its light source type can be selected according to actual needs, such as a laser light source or an LED light source, with specific selection considering the power, wavelength, and stability of the light source. The first optical fiber management box 6 includes a first box body 61 and an optical fiber flexible plate 62. The first box body 61 is the main structure of the optical fiber management box, and its main function is to house and protect the optical fiber flexible plate 62 and related optical fiber connectors. The first box body 61 passes through the housing 1 and extends into the receiving cavity 1a, and its interior forms a first receiving groove 61a for fixing the optical fiber flexible plate 62. The opening of the first receiving groove 61a is located on the top wall of the first box body 61, facilitating observation and management or maintenance operations within the first box body 61 by operators. A first optical fiber coupler 63 is provided on the front side wall of the first box body 61 for connecting external optical fibers, ensuring the stability and reliability of the optical fiber connection. The material of the first housing 61 can be a high-strength, corrosion-resistant material, such as stainless steel or high-strength plastic, to ensure the stability and durability of its structure. The fiber optic flexible plate 62 is composed of multiple sets of ribbon optical fibers based on MT connectors. These ribbon optical fibers with MT connectors are decomposed and combined inside the backplane to form a fiber optic network. Its basic structure includes a flexible substrate, multiple optical fibers arranged in a preset manner, and a protective layer. The flexible substrate can be made of a highly flexible material such as polyimide (PI). Multiple optical fibers are arranged in a certain way and attached to the flexible substrate to form a flexible fiber cross-array plate. After the optical fibers are arranged, a protective layer is applied to the optical fibers using lamination or coating techniques to enhance the mechanical strength and durability of the optical fibers. The two ends of the fiber array are equipped with MT plugs or other high-density connectors for connection with the first fiber coupler 63, the first jumper 81, and the second jumper 82. The first jumper 81 connects the first external light source 51 to the MT plugs or other high-density connectors equipped at both ends of the fiber array on the fiber optic flexible plate 62. Its main function is to transmit the optical signal from the external light source to the fiber optic flexible plate 62. The first jumper fiber 81 is made of highly flexible, low-loss optical fiber material to ensure high-quality transmission of optical signals. The second jumper fiber 82 connects the MT plugs or other high-density connectors at both ends of the fiber array on the flexible fiber optic plate 62 to the optical engine 22. Its main function is to transmit the optical signals on the flexible fiber optic plate 62 to the optical engine 22. The second jumper fiber 82 is also made of highly flexible, low-loss optical fiber material to ensure high-quality transmission of optical signals. In this embodiment, the first external light source 51, the first fiber management box 6, the first jumper fiber 81, and the second jumper fiber 82 cooperate with each other to realize the fiber management and signal transmission functions of the CPO chassis 100.The first external light source 51 transmits optical signals to the fiber optic flexible board 62 via the first jumper 81, and the fiber optic flexible board 62 transmits optical signals to the optical engine 22 via the second jumper 82. The first fiber optic management box 6 is connected to the external optical fiber via the first fiber optic coupler 63 to ensure the stability and reliability of the fiber optic connection. Replacing the traditional optical cable wiring method with the fiber optic flexible board 62 not only solves the space problem, but also accommodates more cores, improves heat flow outlet, and facilitates production and management. In particular, it has advantages in cross-connection. The flexible design of the fiber optic flexible board 62 can adapt to different spatial layouts and bending requirements, and it can preset the arrangement of the fiber array, optimize the fiber path and layout, and the fiber array is fixed to the flexible substrate without the need for combing, simplifying the assembly and testing process and reducing costs. Furthermore, a winding reel 64 can be set in the first box 61 for the second jumper 82 to be wound. When multiple second jumpers 82 are set, the length of the second jumpers 82 coming out of the first box 61 can be adjusted by different winding turns or methods to ensure the neatness and orderliness of the optical fibers in the box 1.

[0064] In the second scheme, the second external light source 52 is another external light source component of the CPO chassis 100. Its main function is to provide a stable light source for optical fiber communication. The specific configuration can be referenced to the first external light source 51, and will not be elaborated here. The second optical fiber management box 7 includes a second box body 71, whose main function is to accommodate and protect optical fibers and related optical fiber connectors. The second box body 71 passes through the housing 1 and extends into the receiving cavity 1a. A second receiving groove 71a is formed inside, used to fix the optical fiber and the winding component 73. The opening of the second receiving groove 71a is located on the top wall of the second box body 71, facilitating the management and maintenance of the optical fiber. The second box body 71 can be referenced to the first box body 61, and will not be elaborated here. The second optical fiber management box 7 contains a winding component 73, whose main function is to comb and constrain the jumpers, preventing them from becoming tangled. The winding component 73 can be a winding post, a winding frame, or other forms of fixing device; the specific design is optimized according to actual needs. The winding component 73 is made of high-strength, wear-resistant materials, such as metal or high-strength plastic, to ensure its stability and reliability during long-term use. The winding component 73 is designed to be adjustable to accommodate jumpers of different lengths, ensuring neat arrangement and management of the jumpers. The third jumper 83 connects the second external light source 52 to an optical engine 22, and its main function is to transmit the optical signal from the external light source to the optical engine 22. The third jumper 83 is made of highly flexible, low-loss optical fiber material to ensure high-quality transmission of the optical signal. The fourth jumper 84 connects another optical engine 22 to a second fiber coupler 72 and is wound around the winding component 73. Its main function is to transmit the optical signal from the optical engine 22 to the second fiber coupler 72 and output it. The fourth jumper 84 is also made of highly flexible, low-loss optical fiber material to ensure high-quality transmission of the optical signal. The winding component 73 organizes and constrains the third jumper 83 and the fourth jumper 84, preventing the jumpers from becoming tangled and improving the maintainability and stability of the system. This design not only improves the flexibility and reliability of fiber management, but also enhances heat dissipation performance, simplifies assembly and testing processes, and reduces costs by optimizing fiber paths and layout.

[0065] It should be noted that the CPO chassis 100 can use either of the two solutions mentioned above, or both solutions can be used simultaneously to improve compatibility and cabling flexibility.

[0066] Further, please refer to Figure 1 In one embodiment of this utility model, the first box body 61 is slidably inserted through the box body 1. The first box body 61 is configured to slide away from or close to the box body 1 so that the opening of the first receiving groove 61a is exposed or concealed. The second box body 71 can also be slidably inserted through the box body 1 with reference to the configuration of the first box body 61. Hereinafter, the first box body 61 will be used as an example, and the second box body 71 will not be described in detail.

[0067] In this embodiment, to improve the flexibility and convenience of fiber optic management and enhance system maintainability, a first housing 61 is slidably mounted on the housing 1 via a sliding mechanism. The sliding mechanism can be a combination of a guide rail and a slider; the guide rail is mounted on the housing 1, and the slider is fixed to the outside of the first housing 61. This design ensures that the first housing 61 can slide smoothly while maintaining a tight connection with the housing 1. The sliding mechanism is made of high-strength, wear-resistant materials, such as metal or high-strength plastic, to ensure its stability and reliability during long-term use. Therefore, when fiber optic redistribution or other management operations are required, the first housing 61 can be pulled out and the wiring within it adjusted without disassembling the housing 1, improving the flexibility and convenience of fiber optic management and enhancing system maintainability.

[0068] Beyond thermal and fiber optic management, the application of CPO technology also presents new challenges to the maintainability and serviceability of the equipment chassis. Unlike traditional pluggable modules, the CPO optical engine 22 is bonded to the ASIC. If the optical component fails, the entire motherboard may need to be replaced, resulting in extremely high maintenance costs. Therefore, the chassis needs to be designed to facilitate the plugging and unplugging of fiber optic connectors, diagnostics, and partial replacement.

[0069] Please see Figure 2 and Figure 3 In one embodiment of this utility model, the CPO chassis 100 further includes a third fiber coupler 87, a jumper 85, a fourth fiber coupler 88, and a connecting fiber 86; the third fiber coupler 87 and the fourth fiber coupler 88 are fixedly disposed in the receiving cavity 1a; the second jumper 82, the third fiber coupler 87, the jumper 85, the fourth fiber coupler 88, the connecting fiber 86, and the optical engine 22 are connected in sequence.

[0070] In this embodiment, the third fiber optic coupler 87 is fixedly disposed within the receiving cavity 1a, and its main function is to connect the adapter jumper 85 and the second jumper 82. The fourth fiber optic coupler 88 is fixedly disposed within the receiving cavity 1a, and its main function is to connect the adapter jumper 85 and the connecting optical fiber 86. The third fiber optic coupler 87 and the fourth fiber optic coupler 88 can be fixed to the side wall of the receiving cavity 1a by means of a mounting panel, and the mounting panel can be fixed to the side wall of the receiving cavity 1a by bolts. It should be noted that the fiber optic coupler is also called a fiber optic adapter, and it has sockets at both ends for the fiber optic connectors at the jumper ends to be inserted to achieve coupling. The adapter jumper 85 connects the third fiber optic coupler 87 and the fourth fiber optic coupler 88, and its main function is to achieve flexible allocation of optical signals. The adapter jumper 85 is made of highly flexible, low-loss optical fiber material to ensure high-quality transmission of optical signals. The connecting fiber optic cable 86 connects the fourth fiber optic coupler 88 and the optical engine 22. Its main function is to transmit optical signals to the optical engine 22 or to the fourth fiber optic coupler 88. The connecting fiber optic cable 86 is also made of highly flexible, low-loss optical fiber material to ensure high-quality transmission of optical signals.

[0071] In this embodiment, the third fiber coupler 87, the adapter patch cord 85, the fourth fiber coupler 88, and the connecting fiber optic cable 86 cooperate to jointly realize the fiber optic management and signal transmission functions of the CPO chassis 100. The second patch cord 82 connects the first fiber management box 6 and the third fiber coupler 87. The third fiber coupler 87 is connected to the fourth fiber coupler 88 through the adapter patch cord 85. The fourth fiber coupler 88 is connected to the optical engine 22 through the connecting fiber optic cable 86. This design allows for management actions such as wiring without adjusting the position and connection of the second patch cord 82 and the connecting fiber optic cable 86 during daily operation of the equipment. Even if the third fiber coupler 87, the fourth fiber coupler 88, and the adapter patch cord 85 are damaged due to repeated plugging and unplugging, they can be replaced at a very low cost without damaging the ASIC module 2. This decoupled design facilitates testing, maintenance, and upgrades, significantly improving the maintenance efficiency and reliability of the CPO chassis 100 and ensuring the high performance and high reliability of the CPO chassis 100 in high-density fiber optic communication scenarios.

[0072] Further, please refer to Figure 3 and Figure 8In one embodiment of this utility model, the CPO chassis 100 further includes a cable management component 9, which is arranged around the ASIC module 2. The cable management component 9 includes a bottom box 91 and a cover 92. A cable management groove 91a is formed on the bottom box 91, which is arranged around the ASIC module 2. The cover 92 is placed over the groove of the cable management groove 91a and is detachably connected to the bottom box 91. A cable passage 91b is formed on the bottom box 91, which communicates with the external space and the cable management groove 91a. The cable passage 91b is arranged opposite to the optical engine 22. The portion connecting the optical fiber 86 is located inside the cable management groove 91a.

[0073] In this embodiment, the base box 91 is the main structure of the cable management component 9, and its main function is to accommodate and protect the connecting optical fibers 86. The base box 91 is arranged around the ASIC module 2, and the cable management groove 91a formed on the base box 91 is also arranged around the ASIC module 2. The side wall of the cable management groove 91a is provided with a pressure plate for fixing and constraining the connecting optical fibers 86. The shape and size of the cable management groove 91a can be optimized according to the specifications and quantity of the optical fibers to ensure that the optical fibers can be neatly arranged in the groove. The base box 91 is made of high-strength, wear-resistant materials, such as metal or high-strength plastic, to ensure its stability and reliability during long-term use.

[0074] The cover 92 is used to cover the opening of the cable management slot 91a, protecting the optical fiber from external interference and damage. The cover 92 is connected to the base box 91 via a detachable connection, such as a screw connection or a snap-fit ​​connection, for easy maintenance and replacement. The cover 92 is made of the same material as the base box 91 to ensure the stability and reliability of the overall structure. The design of the cover 92 takes into account its tight fit with the base box 91, ensuring that the optical fiber will not loosen or shift within the cable management slot 91a.

[0075] The base box 91 has a cable passage 91b that connects to the external space and the cable management channel 91a, allowing the connecting optical fiber 86 to extend and connect to the optical engine 22. Therefore, the cable passage 91b is positioned opposite the optical engine 22 to ensure that the connecting optical fiber 86 can be connected to the optical engine 22 conveniently and smoothly. The size and shape of the cable passage 91b are optimized according to the specifications of the optical fiber to ensure smooth passage. The cable management component 9 provides orderly arrangement and protection for the connecting optical fiber 86. The connecting optical fiber 86 is partially located within the cable management channel 91a, entering and exiting through the cable passage 91b to connect to the optical engine 22. This design makes the fiber cabling within the chassis neater and more orderly, reducing fiber crossings and tangles, and improving system reliability and maintainability.

[0076] This utility model also proposes a CPO cabinet 1000, which includes a cabinet body 200 and a CPO chassis 100 as described in any of the above embodiments. The cabinet body 200 has a receiving space, and the CPO chassis 100 is disposed within the receiving space. The specific structure of the CPO chassis 100 is as described in the above embodiments. Since this CPO cabinet 1000 adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0077] Further, please refer to Figure 9 In one embodiment of this utility model, the CPO cabinet 1000 includes a plurality of CPO chassis 100, which are stacked inside the cabinet body 200; and / or, the cabinet body 200 is provided with an opening communicating with the receiving space, the CPO cabinet 1000 also includes a cabinet door, the cabinet door is movably connected to the cabinet body 200 and covers the opening, and the CPO chassis 100 is slidably connected to the cabinet body 200 and can enter or extend into the receiving space through the opening.

[0078] In this embodiment, the cabinet 200 is the main structure of the CPO cabinet 1000, with an internal space for installing multiple CPO chassis 100. The cabinet 200 can be made of high-strength, corrosion-resistant metal materials, such as aluminum alloy or stainless steel, to ensure structural stability and durability. Multiple CPO chassis 100 are stacked within the cabinet 200. This design improves the space utilization of the cabinet, allowing it to accommodate more CPO chassis 100 and meet the needs of high-density fiber optic communication. The design of each CPO chassis 100 can refer to the above embodiment. The cabinet 200 has an opening communicating with the accommodating space for the entry and exit of the CPO chassis 100. The CPO cabinet 1000 also includes a cabinet door, not shown in the accompanying drawings. The cabinet door is movably connected to the cabinet 200 and covers the opening. For example, the cabinet door can be hinged to the cabinet 200 to form a revolving door, or connected via a sliding track to form a sliding door.

[0079] The CPO chassis 100 is slidably connected to the cabinet 200, allowing it to enter or exit the receiving space through an opening. This design facilitates the management and maintenance of the CPO chassis 100, improving system maintainability. The sliding connection is achieved via guide rails and sliders; the guide rails are installed inside the cabinet 200, and the sliders are fixed to the outside of the CPO chassis 100. The sliding mechanism design ensures that the CPO chassis 100 can smoothly enter and exit the cabinet 200 while maintaining a tight connection with the cabinet 200.

[0080] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A CPO chassis, characterized in that, The CPO chassis includes: The box body has a receiving cavity inside, and the box body has an air inlet and an air outlet communicating with the receiving cavity, forming a ventilation channel between the air inlet and the air outlet; An ASIC module is disposed within the receiving cavity and located on the ventilation channel. The ASIC module has an ASIC chip, multiple optical engines, and a PCB board. The ASIC chip and the multiple optical engines are disposed on the PCB board, and the multiple optical engines are electrically connected to the ASIC chip. An air-cooled assembly, comprising an exhaust fan disposed within the housing and positioned opposite the air outlet; and A liquid cooling assembly includes a liquid cooling unit, an inlet pipe, and an outlet pipe. The liquid cooling unit abuts against and is attached to the ASIC chip. The inlet pipe and the outlet pipe are both connected to the liquid cooling unit and used for connecting an external heat sink.

2. The CPO chassis as described in claim 1, characterized in that, The ASIC module includes a plurality of ASIC chips, and the liquid cooling component includes a plurality of liquid cooling units and a plurality of communication pipes, with each liquid cooling unit abutting against one of the ASIC chips; Each of the connecting pipes connects two adjacent liquid cooling units to enable multiple liquid cooling units to be connected in series, and the inlet pipe and the outlet pipe are respectively located at both ends of the multiple liquid cooling units connected in series.

3. The CPO chassis as described in claim 1, characterized in that, The liquid cooling unit includes a heat-conducting upper shell, a mounting bracket, and a heat-conducting lower shell stacked together. The heat-conducting upper shell, the mounting bracket, and the heat-conducting lower shell together form a sealed liquid passage cavity; The heat-conducting upper shell has an inlet hole and an outlet hole that communicate with the liquid passage cavity. The inlet pipe communicates with the inlet hole, and the outlet pipe communicates with the outlet hole. The thermally conductive lower shell abuts against the ASIC chip, and the mounting bracket is detachably connected to the PCB board.

4. The CPO chassis as described in claim 3, characterized in that, The lower heat-conducting shell has multiple heat dissipation protrusions on the side facing the upper heat-conducting shell, and the heat dissipation protrusions are located inside the liquid passage cavity.

5. The CPO chassis as described in claim 1, characterized in that, The CPO chassis also includes a first external light source, a first fiber optic management box, a first patch cord, and a second patch cord. The first external light source passes through the housing and extends into the receiving cavity; The first fiber optic management box includes a first box body and a fiber optic flexible plate. The first box body passes through the box body and extends into the receiving cavity. A first receiving groove is formed in the first box body. The opening of the first receiving groove is located on the top wall of the first box body. A first fiber optic coupler is provided on the side wall of the first box body. The first fiber optic coupler is used to connect an external fiber optic cable. The fiber optic flexible plate is disposed in the first box body and connected to the first fiber optic coupler. The first jumper fiber connects the first external light source to the fiber optic flexible plate, and the second jumper fiber connects the fiber optic flexible plate to the optical engine; And / or, the CPO chassis further includes a second external light source, a second fiber optic management box, a third jumper, and a fourth jumper; The second external light source passes through the housing and extends into the receiving cavity; The second fiber optic management box has a second box body, which passes through the box body and extends into the receiving cavity. A second receiving groove is formed in the second box body. The opening of the second receiving groove is located on the top wall of the second box body. A second fiber optic coupler is provided on the side wall of the second box body. The second fiber optic coupler is used to connect an external fiber optic cable. A winding component is provided in the second box body. The third jumper fiber connects the second external light source to one of the optical engines, and the fourth jumper fiber connects another optical engine to the second optical fiber coupler and is wound around the winding member.

6. The CPO chassis as described in claim 5, characterized in that, The first box is slidably inserted into the housing, and the first box is configured to slide away from or toward the housing so that the opening of the first receiving slot is exposed or concealed.

7. The CPO chassis as described in claim 5, characterized in that, The CPO chassis also includes a third fiber optic coupler, a jumper, a fourth fiber optic coupler, and connecting optical fibers; The third fiber optic coupler and the fourth fiber optic coupler are fixedly disposed within the receiving cavity; The second jumper, the third fiber coupler, the adapter jumper, the fourth fiber coupler, the connecting fiber, and the optical engine are connected in sequence.

8. The CPO chassis as described in claim 7, characterized in that, The CPO chassis also includes cable management components arranged around the ASIC module; The cable management component includes a base box and a cover. The base box has a cable management groove formed around the ASIC module. The cover is placed over the opening of the cable management groove and is detachably connected to the base box. The bottom box has a cable passage opening that connects the external space and the cable management channel, and the cable passage opening is positioned opposite to the light engine; The connecting optical fiber portion is located within the cable management groove.

9. A CPO cabinet, characterized in that, The CPO cabinet includes a cabinet and a CPO chassis as described in any one of claims 1 to 8, wherein the cabinet has a receiving space and the CPO chassis is disposed within the receiving space.

10. The CPO cabinet as described in claim 9, characterized in that, The CPO cabinet includes multiple CPO chassis, which are stacked inside the cabinet. And / or, the cabinet is provided with an opening communicating with the receiving space, the CPO cabinet also includes a cabinet door, the cabinet door is movably connected to the cabinet and covers the opening, the CPO chassis is slidably connected to the cabinet and can enter or extend from the receiving space through the opening.

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