Electronic device heat dissipation device and electronic device

Abstract

The application discloses an electronic equipment heat dissipation device and electronic equipment. The electronic equipment heat dissipation device comprises a bracket, the bracket is movably arranged in a cabinet; a heat conduction member, the heat conduction member is connected with the bracket, and is switched between a heat dissipation position for heat exchange cooperation with a heat generating device and an avoiding position for avoiding the heat generating device under the driving of the bracket; the heat conduction member has an evaporation section for heat exchange cooperation with the heat generating device and a condensation section for heat dissipation; a cold plate assembly, the cold plate assembly is connected with the bracket, and the cold plate assembly is arranged at intervals between the heat generating device; and the condensation section is connected with the cold plate assembly and is in heat exchange cooperation. The application solves the problem that the heat dissipation structure in the prior art cannot meet the heat dissipation and maintenance requirements.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and more particularly to a heat dissipation device for electronic devices and electronic devices. Background Technology

[0002] Currently, hard drives, memory, and other components installed in servers and other electronic devices are designed for small size, high capacity, and hot-swappability, resulting in significant heat generation and high requirements for heat dissipation. Existing heat dissipation structures typically involve placing heat sinks or similar cooling plates between components. However, this approach is only suitable for situations with larger gaps between components and is unsuitable for situations with smaller gaps, failing to meet heat dissipation needs. Furthermore, the heat dissipation structure often affects hot-swapping of components, hindering ease of maintenance. Some solutions employ direct-contact liquid cooling, which requires designing complex sealed flow channels, increasing manufacturing costs and the risk of leakage, and also increasing the difficulty of component disassembly. Utility Model Content

[0003] This application provides a heat dissipation device and an electronic device for electronic devices, so as to at least solve the problem that the heat dissipation structure in the related art cannot meet the heat dissipation and maintenance requirements.

[0004] This application provides a heat dissipation device for electronic devices, comprising: a bracket movably disposed within a chassis; a heat-conducting component connected to the bracket and switching between a heat dissipation position cooperating with a heat-generating device and a position avoiding the heat-generating device under the action of the bracket, the heat-conducting component having an evaporation section for cooperating with the heat-generating device and a condensation section for heat dissipation; and a cold plate assembly connected to the bracket, with the cold plate assembly spaced apart from the heat-generating device, the condensation section being connected to the cold plate assembly and cooperating with it for heat exchange.

[0005] In one exemplary embodiment, the heat dissipation device for an electronic device further includes an elastic element that abuts against the evaporation section and provides the evaporation section with a spring force close to the heat-generating device.

[0006] In one exemplary embodiment, the evaporation section has a flat structure with a heat exchange surface for heat exchange with a heating device.

[0007] In one exemplary embodiment, the heat-conducting element further includes an insulation section, the two ends of which are connected to an evaporation section and a condensation section, respectively, and the insulation section has an insulation layer for heat insulation.

[0008] In one exemplary embodiment, the outer surface of the evaporation section has a heat-conducting layer, and the evaporation section exchanges heat with the heat-generating device through the heat-conducting layer.

[0009] In one exemplary embodiment, there are multiple heat-conducting elements, and at least two heat-conducting elements are capable of exchanging heat with the same heat-generating device.

[0010] In one exemplary embodiment, the heat dissipation device for an electronic device further includes a heat transfer element disposed between the heat-generating device and the evaporation section, and a heat-conducting element that exchanges heat with the same heat-generating device is connected to the same heat transfer element.

[0011] In an exemplary embodiment, the cold plate assembly includes: a substrate, in which a cooling channel is provided, the cooling channel having a straight structure and / or a curved structure, and a condensation section cooperating with the substrate for heat exchange; and an inlet / outlet connector, which is connected to the substrate and communicates with the cooling channel.

[0012] In one exemplary embodiment, the outer surface of the substrate has a mounting groove, the condensing section is embedded in the mounting groove, and the cold plate assembly further includes a pressure plate that presses the condensing section into the mounting groove; or, the condensing section has a transition structure with a transition surface that is connected to the substrate surface and used for heat exchange.

[0013] This application also provides an electronic device, including a chassis, a heat-generating device, and the aforementioned heat dissipation device for the electronic device. The heat dissipation device is movably disposed inside the chassis and is used to dissipate heat from the heat-generating device.

[0014] Through this application, due to the arrangement of the heat-conducting component, the evaporation section of the heat-conducting component can exchange heat with the heating element, and the condensation section can exchange heat with the cold plate assembly. This allows the heat-conducting component to extend the gaps between the heating elements, transferring heat from the densely packed heating elements to the spacious cold plate assembly. This allows the cold plate assembly and other structures to avoid the gaps between heating elements and the vicinity of the heating elements, thus achieving heat dissipation adaptability for densely arranged heating elements and ensuring effective heat dissipation. Simultaneously, the entire heat dissipation device adopts a movable arrangement; the bracket can move the heat-conducting component and the cold plate assembly together, creating a separable connection between the heat-conducting component and the heating element. During normal heat dissipation, the evaporation section is located at the heating element, ensuring stable heat exchange. When it is necessary to insert or remove the heating element, the bracket moves the heat-conducting component out, allowing it to avoid the disassembly of the heating element. This enables insertion and removal of the heating element without disconnecting any liquid circuit connections and without affecting the operation of other components, meeting the requirements of easy maintenance and high availability. Attached Figure Description

[0015] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1This is a schematic diagram of the structure of the heat dissipation device for electronic devices provided in the embodiments of this application;

[0017] Figure 2 for Figure 1 Top view;

[0018] Figure 3 for Figure 1 Side view.

[0019] The above figures include the following reference numerals:

[0020] 10. Heat-conducting component; 11. Evaporation section; 12. Condensation section; 13. Insulation section; 14. Adapter structure; 20. Cold plate assembly; 21. Substrate; 22. Liquid inlet / outlet connector; 30. Heat transfer component. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0022] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] To address the problem that heat dissipation structures in related technologies cannot meet the needs of heat dissipation and maintenance, this application provides a heat dissipation device for electronic devices and an electronic device.

[0025] like Figures 1 to 3 The illustrated heat dissipation device for an electronic device includes a bracket, a heat-conducting component 10, and a cold plate assembly 20. The bracket is movably disposed within a chassis. The heat-conducting component 10 is connected to the bracket and, driven by the bracket, switches between a heat dissipation position that engages with a heat-generating device and a position that avoids the heat-generating device. The heat-conducting component 10 has an evaporation section 11 for engaging with the heat-generating device and a condensation section 12 for heat dissipation. The cold plate assembly 20 is connected to the bracket and is spaced apart from the heat-generating device. The condensation section 12 is connected to the cold plate assembly 20 and engages with it for heat exchange.

[0026] In this embodiment, by setting up the heat-conducting component 10, the evaporation section 11 of the heat-conducting component 10 can exchange heat with the heating device, and the condensation section 12 can exchange heat with the cold plate assembly 20. This allows the heat-conducting component 10 to extend the gap between the heating devices, transferring the heat from the location of the densely packed heating devices to the space-sufficient cold plate assembly 20. This allows the cold plate assembly 20 and other structures to avoid the gaps between the heating devices and the location near the heating devices, thereby achieving heat dissipation adaptability for the densely arranged heating devices and ensuring the heat dissipation effect. Meanwhile, the heat dissipation device adopts a movable configuration, meaning that the bracket can move the heat-conducting component 10 and the cold plate assembly 20 together, thereby forming a separable connection between the heat-conducting component 10 and the heat-generating device. During normal heat dissipation, the evaporation section 11 is located at the heat-generating device, thus enabling stable heat exchange with the heat-generating device. When it is necessary to insert or remove the heat-generating device, the bracket moves the heat-conducting component 10 out, allowing the heat-conducting component 10 to avoid the disassembly of the heat-generating device. This allows the heat-generating device to be inserted or removed without disconnecting any liquid circuit connections and without affecting the operation of other components, meeting the requirements of easy maintenance and high availability.

[0027] This embodiment uses a server as an example of electronic equipment. Accordingly, the heat-generating device is a hard drive used for storing data. More specifically, the hard drive is an E1.S (Enterprise 1.Slim) solid-state drive, which has advantages such as small size (25mm×111mm×9.5mm / 15mm / 25mm), high capacity, and hot-swappable support, with a gap of less than 10mm between them. Of course, the above-mentioned electronic equipment and heat-generating device can also be other devices or components.

[0028] In this embodiment, the bracket can be connected to the inner wall of the chassis via a guide rail or similar structure, allowing the entire heat dissipation device to be pulled out and moved within the chassis. The bracket is preferably made of metal, such as aluminum alloy or galvanized steel.

[0029] In this embodiment, the heat dissipation device for the electronic device also includes an elastic element. The elastic element can be a spring, a spring-loaded bracket, or similar structure. It can be mounted on a bracket, with one end abutting against the evaporation section 11. The elastic element consistently provides a spring force to the evaporation section 11, keeping it close to the heat-generating device. Thus, when the heat-conducting element 10 is positioned to engage with the heat-generating device, the elastic element provides a continuous pressing force to the evaporation section 11. Due to the elastic element, the evaporation section 11 remains close to the heat-generating device, allowing for efficient heat exchange either directly or indirectly through an intermediate component. This ensures effective heat exchange and prevents the evaporation section 11 from being too far away from the heat-generating device, which would reduce the heat exchange efficiency. When it is necessary to insert or remove the heat-generating device, the elastic element can be released.

[0030] In this embodiment, the heat-conducting component 10 is preferably a heat pipe, which has a near end and a far end. The near end is the evaporation section 11 and the far end is the condensation section 12. In this way, there is no need to use liquid cooling for heat dissipation, thereby avoiding the risk of leakage and reducing manufacturing costs and leakage risks.

[0031] like Figure 2 As shown, in this embodiment, the heat-conducting component 10 is arranged to extend along the length of the heating element, thereby covering most of the length of the heating element, improving the heat exchange effect between the component and the heating element, enhancing heat transfer, and improving heat dissipation. The bracket in this embodiment can also move along the length of the heat-conducting component 10, allowing the bracket to move and cause the heat-conducting component 10 to avoid the heating element's insertion / removal direction perpendicular to its length.

[0032] like Figure 1 As shown, the evaporation section 11 in this embodiment has a flat structure, with a preferred thickness of 2-4 mm. The side of the flat structure has a large heat exchange surface, which is used for heat exchange with the heating element. Because the heat exchange surface has a large area, the flat structure can increase the heat exchange effect between the evaporation section 11 and the heating element, while reducing the thickness of the evaporation section 11. This allows the evaporation section 11 to extend into the gap between the heating elements, thus meeting the requirements of scenarios with small gaps between the heating elements.

[0033] In addition to the evaporation section 11 mentioned above, the heat pipe in this embodiment can be arranged in a flat shape, so that the heat pipe can transfer heat efficiently and reduce space occupation.

[0034] Optionally, the outer surface of the evaporation section 11 has a heat-conducting layer. The heat-conducting layer can be made of a high thermal conductivity interface material such as thermally conductive gel or phase change material, so that the evaporation section 11 can exchange heat with the heat-generating device through the heat-conducting layer, thereby improving the heat exchange effect.

[0035] In addition to the aforementioned heat-conducting layer, other structures can also be provided in the evaporation section 11 as intermediate transition structures. The electronic device heat dissipation device of this embodiment also includes a heat transfer element 30. The heat transfer element 30 can be a component with high thermal conductivity, such as an aluminum alloy part. The heat transfer element 30 is disposed between the heat-generating device and the evaporation section 11. The heat transfer element 30 can be in the form of a heat transfer plate or similar structure, with a large area, thereby covering the surface of the heat-generating device as much as possible. Thus, the heat transfer element 30 can further improve the heat exchange effect between the evaporation section 11 and the heat-generating device, ensuring efficient transfer of heat from the heat-generating device to the evaporation section 11 for heat dissipation.

[0036] Optionally, the number of heat-conducting elements 10 can be set as needed. The heat-conducting elements 10 can be configured in a one-to-one correspondence with the heating devices, meaning each heating device has one corresponding heat-conducting element 10; or a multi-to-one correspondence can be used, meaning each heating device has multiple corresponding heat-conducting elements 10, so that at least two heat-conducting elements 10 can exchange heat with the same heating device. For example... Figure 1 As shown in the illustration, this embodiment uses two heat-conducting elements 10 corresponding to each heating element as an example, and one corresponding heat transfer element 30. The heat-conducting element 10 that exchanges heat with the same heating element is connected to the same heat transfer element 30, meaning both heat-conducting elements 10 are connected to the same heat transfer element 30. This allows the heat transfer element 30 to contact and exchange heat with the heating element, and the evaporation sections 11 of the two heat-conducting elements 10 can contact and exchange heat with the heat transfer element 30. The heat from the evaporation sections 11 is transferred to the condensation sections 12 and exchanges heat with the cold plate assembly 20, thereby achieving cooling and heat dissipation of the heating element. Of course, the above quantities and corresponding relationships can be adjusted as needed and are not limited to the arrangement in this embodiment.

[0037] The heat-conducting component 10 in this embodiment also includes an insulating section 13. The two ends of the insulating section 13 are connected to the evaporation section 11 and the condensation section 12, respectively, thus forming a three-section structure of the heat-conducting component 10 consisting of the evaporation section 11, the insulating section 13, and the condensation section 12. The insulating section 13 is located outside the length coverage of the heating element and does not exchange heat with it; instead, it serves as a transition for heat transfer. The insulating section 13 in this embodiment has an insulating layer for heat insulation. The insulating layer can be disposed on the outside of the insulating section 13 and surround its outer peripheral surface, thereby reducing heat loss and ensuring that most of the heat is transferred to the condensation section 12 for heat exchange with the cold plate assembly 20, thus ensuring heat dissipation to the outside.

[0038] Optionally, since multiple heat-conducting elements 10 are provided, the condensation sections 12 of the heat-conducting elements 10 and the cold plate assembly 20 can also be arranged in a one-to-one or multiple-to-one manner. In this embodiment, only one cold plate assembly 20 is provided. Regardless of the heating device it is paired with, the condensation sections 12 of all heat-conducting elements 10 are located at the cold plate assembly 20 and exchange heat with the cold plate assembly 20. In this way, the condensation of multiple heat-conducting elements 10 can be achieved through one cold plate assembly 20, and the heat of the cold plate assembly 20 can be handled uniformly, reducing the complexity of the structure.

[0039] like Figure 1 and Figure 3As shown, the cold plate assembly 20 of this embodiment includes a substrate 21 and inlet / outlet connectors 22. The condensing section 12 is heat-exchange aligned with the substrate 21. The substrate 21 can be made of plate-shaped aluminum alloy or copper. Cooling channels are provided within the substrate 21. The cooling channels can adopt a straight structure and / or a curved structure as needed. In this embodiment, a curved structure is preferred, more precisely, an S-shaped structure, so that the cooling channels can cover the substrate 21 as much as possible along the plane of the substrate 21 to ensure the heat exchange effect between the cooling channels and the condensing section 12. The inlet / outlet connectors 22 are connected to the substrate 21. There can be two inlet / outlet connectors 22, which are respectively connected to the openings at both ends of the cooling channels to achieve communication between the cooling channels and the external liquid supply device, thereby realizing the circulation and heat exchange of the coolant in the cooling channels.

[0040] Optionally, the specific fit between the condensation section 12 and the substrate 21 can be set as needed. For example... Figure 1 and Figure 2 As shown, in this embodiment, the condensing section 12 has a transition structure 14. The material of the transition structure 14 is the same as that of the heat pipe. The transition structure 14 has a transition surface, which is connected to the surface of the substrate 21 and used for heat exchange. Specifically, the transition structure 14 in this embodiment adopts an L-shaped structure. Of its two segments, one segment is connected to the condensing section 12, and the other segment has a transition surface and is connected to the substrate 21. This allows the condensing section 12 to achieve heat exchange with the substrate 21 through the transition structure 14. The transition structure 14 can be similar to the heat transfer element 30, also using a heat-conducting element 10 that cooperates with the same heat-generating device for heat exchange and connected to the same transition structure 14, thereby simplifying the structure while ensuring the heat exchange effect.

[0041] In one embodiment not shown, the outer surface of the substrate 21 has a mounting groove whose shape matches the condensing section 12. The condensing section 12 is embedded in the mounting groove, thereby achieving heat exchange through the contact between the condensing section 12 and the inner wall of the mounting groove. Correspondingly, the cold plate assembly 20 also includes a pressure plate, which is movably disposed at the opening of the mounting groove. When the condensing section 12 is installed into the mounting groove, the pressure plate can press the condensing section 12, thereby keeping the condensing section 12 within the mounting groove and preventing accidental dislodgement.

[0042] This embodiment also provides an electronic device, including a chassis, a heat-generating component, and the aforementioned heat dissipation device. The heat dissipation device is movably disposed within the chassis and is used to dissipate heat from the heat-generating component. The arrangement of the cold plate assembly 20 within the chassis can be adjusted as needed; it can be arranged longitudinally along the side wall of the chassis or laterally at the rear end of the bracket, flexibly adapting to the overall layout within the chassis.

[0043] This embodiment enables hot-swappable maintenance. Using heat pipes as a heat conduction bridge, the heat-generating device and the heat dissipation device are decoupled. During maintenance, the device can be removed simply by loosening the elastic element, without disconnecting any fluid lines. Single-panel replacement time is shortened, and it does not affect the operation of other modules. Space utilization is improved; the heat pipe thickness is only 2-4mm, fitting snugly against the heat-generating device with almost no increase in module spacing requirements. The cold plate assembly 20 can be placed on the side wall or back panel of the chassis, avoiding the narrow spaces directly above and below the device, supporting higher-density device deployment. It offers good modularity and scalability; the bracket, heat pipes, and cold plate assembly 20 are all modularly designed, allowing flexible configuration of the number of heat pipes and the length of the substrate 21 to adapt to different architectural layouts within the node. With excellent heat dissipation performance and good temperature uniformity, the heat pipe's equivalent thermal conductivity can reach more than 100 times that of copper, enabling rapid heat transfer from the heat-generating device to the cold plate assembly 20. The flexible flow channel design of the substrate 21 allows for a large heat exchange area structure, improving the heat dissipation capacity of a single module. The isothermal characteristics of the heat pipe ensure temperature consistency across multiple modules within the bracket, avoiding localized hot spots. System reliability is improved by eliminating the leakage risk associated with traditional direct-contact cold plates. The coolant exists only within the cold plate assembly 20, isolated from the devices. Furthermore, the heat pipe is a passive device with no moving parts, ensuring high reliability. The elastic element provides constant contact pressure, avoiding the increased contact thermal resistance caused by vibration and loosening in traditional screw fixing.

[0044] It should be noted that "multiple" in the above embodiments refers to at least two.

[0045] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0046] In this embodiment, by setting up the heat-conducting component 10, the evaporation section 11 of the heat-conducting component 10 can exchange heat with the heating device, and the condensation section 12 can exchange heat with the cold plate assembly 20. This allows the heat-conducting component 10 to extend the gap between the heating devices, transferring the heat from the location of the densely packed heating devices to the space-sufficient cold plate assembly 20. This allows the cold plate assembly 20 and other structures to avoid the gaps between the heating devices and the location near the heating devices, thereby achieving heat dissipation adaptability for the densely arranged heating devices and ensuring the heat dissipation effect. Meanwhile, the heat dissipation device adopts a movable configuration, meaning that the bracket can move the heat-conducting component 10 and the cold plate assembly 20 together, thereby forming a separable connection between the heat-conducting component 10 and the heat-generating device. During normal heat dissipation, the evaporation section 11 is located at the heat-generating device, thus enabling stable heat exchange with the heat-generating device. When it is necessary to insert or remove the heat-generating device, the bracket moves the heat-conducting component 10 out, allowing the heat-conducting component 10 to avoid the disassembly of the heat-generating device. This allows the heat-generating device to be inserted or removed without disconnecting any liquid circuit connections and without affecting the operation of other components, meeting the requirements of easy maintenance and high availability.

[0047] The above provides a detailed description of a heat dissipation device and an electronic device for electronic devices provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation device for electronic devices, characterized in that, include: A bracket, which is movably mounted inside the chassis; A heat-conducting component (10) is connected to the bracket and switches between a heat dissipation position that cooperates with the heat-generating device and a position that avoids the heat-generating device under the drive of the bracket. The heat-conducting component (10) has an evaporation section (11) for heat exchange with the heat-generating device and a condensation section (12) for heat dissipation. The cold plate assembly (20) is connected to the bracket and is spaced apart from the heating device. The condensing section (12) is connected to the cold plate assembly (20) and cooperates in heat exchange.

2. The heat dissipation device for electronic devices according to claim 1, characterized in that, The heat dissipation device for the electronic device also includes an elastic element that abuts against the evaporation section (11) and provides the evaporation section (11) with elasticity close to the heat-generating device.

3. The heat dissipation device for electronic devices according to claim 1, characterized in that, The evaporation section (11) has a flat structure with a heat exchange surface for heat exchange with the heating device.

4. The heat dissipation device for electronic devices according to claim 1, characterized in that, The heat-conducting component (10) further includes an insulation section (13), the two ends of which are connected to the evaporation section (11) and the condensation section (12) respectively, and the insulation section (13) has an insulation layer for heat insulation.

5. The heat dissipation device for electronic devices according to claim 1, characterized in that, The outer surface of the evaporation section (11) has a heat-conducting layer, and the evaporation section (11) exchanges heat with the heating device through the heat-conducting layer.

6. The heat dissipation device for electronic devices according to claim 1, characterized in that, There are multiple heat-conducting elements (10), and at least two of the heat-conducting elements (10) can exchange heat with the same heat-generating device.

7. The heat dissipation device for electronic devices according to claim 6, characterized in that, The heat dissipation device of the electronic device also includes a heat transfer element (30), which is disposed between the heat-generating device and the evaporation section (11), and the heat-conducting element (10) that cooperates with the same heat-generating device for heat exchange is connected to the same heat transfer element (30).

8. The heat dissipation device for electronic devices according to claim 1, characterized in that, The cold plate assembly (20) includes: The substrate (21) has a cooling channel provided therein, the cooling channel having a straight structure and / or a curved structure, and the condensation section (12) is in heat exchange cooperation with the substrate (21). Liquid inlet / outlet connector (22) is connected to the substrate (21) and communicates with the cooling channel.

9. The heat dissipation device for electronic devices according to claim 8, characterized in that, The outer surface of the substrate (21) has a mounting groove, the condensing section (12) is embedded in the mounting groove, and the cold plate assembly (20) further includes a pressure plate, which presses the condensing section (12) into the mounting groove; or, The condensation section (12) has a transition structure (14) with a transition surface that is connected to the surface of the substrate (21) and used for heat exchange.

10. An electronic device, characterized in that, The device includes a chassis, a heat-generating component, and a heat dissipation device for an electronic device as described in any one of claims 1 to 9. The heat dissipation device is movably disposed within the chassis and is used to dissipate heat from the heat-generating component.

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