Temple and eyeglasses

Abstract

The application relates to a mirror leg and glasses, which comprise a shell, a mounting cavity arranged in the shell, an electronic module arranged in the mounting cavity, the electronic module having a heat source capable of generating heat, a first heat dissipation piece arranged in the mounting cavity and attached to the heat source, and a second heat dissipation piece arranged in the mounting cavity and attached to the side of the first heat dissipation piece away from the heat source, the side of the second heat dissipation piece away from the first heat dissipation piece being attached to the side of the shell at the mounting cavity, and the attached area of the second heat dissipation piece and the shell being larger than the attached area of the first heat dissipation piece and the heat source. In the mirror leg, the heat source of the electronic module can be more effectively dissipated, the heat dissipation performance of the mirror leg is improved, and the heat accumulation during use is effectively reduced.

Description

Technical Field

[0001] This application relates to the field of eyewear technology, and in particular to a temple and eyeglasses. Background Technology

[0002] To meet diverse user needs, smart glasses and AR glasses often integrate multiple functional modules, such as displays, processors, sensors, cameras, and batteries. These modules generate heat during operation, especially under high load conditions, and the accumulation of heat may negatively impact device performance.

[0003] However, most smart glasses and AR glasses currently on the market use a design structure where the temples are mounted on circuit boards. While this design can achieve integration of functional modules to a certain extent, it also brings challenges in terms of heat dissipation. Utility Model Content

[0004] This application provides a temple for eyeglasses that has good heat dissipation and can effectively reduce heat accumulation during use.

[0005] To achieve the above objectives, according to a first aspect of this application, a temple is provided, comprising:

[0006] A housing, wherein an installation cavity is provided inside the housing;

[0007] An electronic module, wherein the electronic module is disposed within the mounting cavity, and the electronic module has a heat source capable of generating heat.

[0008] A first heat sink is disposed within the mounting cavity and attached to the heat source; and,

[0009] The second heat sink is disposed in the mounting cavity and is attached to the side of the first heat sink away from the heat source. The side of the second heat sink away from the first heat sink is attached to the side of the housing located in the mounting cavity, and the contact area between the second heat sink and the housing is greater than the contact area between the first heat sink and the heat source.

[0010] Optionally, the temple further includes a hinge, which is connected to the housing and is hinged to the frame;

[0011] The hinge joint is provided with a hinge interface, which is connected to the mounting cavity;

[0012] The second heat sink extends to the hinge interface to fit against the side of the hinge member located at the hinge interface.

[0013] Optionally, the first heat sink includes a heat sink block and a heat sink cover. The heat sink block is attached to the heat source, and the heat sink cover is connected to the electronic module or the housing and abuts against the heat sink block. The side of the heat sink cover away from the heat sink block is attached to the second heat sink.

[0014] Optionally, the heat sink includes a support portion and a fitting portion. The support portion is arranged along the edge of the fitting portion. The side of the support portion away from the fitting portion is connected to the electronic module or the housing. An accommodating cavity is formed between the support portion and the fitting portion. The heat sink is located in the accommodating cavity. The fitting portion abuts against the heat sink. The side of the fitting portion away from the heat sink is fitted with the second heat sink.

[0015] Optionally, the support portion is provided with multiple communication ports, which are arranged along the edge of the fitting portion, and the mounting cavity and the receiving cavity are connected through the multiple communication ports.

[0016] Optionally, the heat sink is a thermal paste sheet; and / or,

[0017] The second heat sink is a VC vapor chamber; and / or,

[0018] The ratio of the contact area of ​​the second heat sink to the housing to the contact area of ​​the heat sink block to the heat source is greater than 10.

[0019] Optionally, the housing includes:

[0020] Inner shell, which can conform to the human body; and,

[0021] The outer shell is detachable from the human body and is connected to the inner shell. The mounting cavity is formed between the inner shell and the outer shell. The side of the second heat sink that is away from the first heat sink is attached to the side of the outer shell located in the mounting cavity.

[0022] Optionally, the housing is provided with a first heat dissipation hole, which leads to the mounting cavity; and / or,

[0023] The inner shell is provided with a second heat dissipation hole, which leads to the mounting cavity.

[0024] Optionally, the outer shell has a first connecting portion arranged along its edge, the inner shell has a second connecting portion arranged along its edge, the outer shell and the inner shell are detachably connected, and the first connecting portion and the second connecting portion engage.

[0025] According to a second aspect of this application, eyeglasses are provided, including the temples described in the first aspect above.

[0026] In the temple of this application embodiment, the first heat sink can absorb the heat energy generated by the heat source and transfer it to the second heat sink, which then transfers the heat energy to the housing. Through the coordinated work of the first heat sink, the second heat sink, and the housing, the heat source of the electronic module can be dissipated more effectively, thereby improving the heat dissipation performance of the temple and effectively reducing heat accumulation during use. Furthermore, since the contact area between the second heat sink and the housing is larger than the contact area between the first heat sink and the heat source, the temperature distribution on the housing can be more uniform during heat transfer, avoiding local overheating of the housing.

[0027] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0030] Figure 1 This is a schematic diagram of the structure of the glasses provided in an exemplary embodiment of this disclosure.

[0031] Figure 2 This is a schematic diagram of the temple structure provided in an exemplary embodiment of this disclosure.

[0032] Figure 3 yes Figure 2 The exploded view of the temple shown.

[0033] Figure 4 yes Figure 2 The exploded view shows the electronic module and the first heat sink of the temple.

[0034] Figure 5 yes Figure 2 The diagram shows the structure of the heat sink on the temple of the mirror.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Temple; 11. Housing; 111. Mounting cavity; 112. Inner housing; 1121. Second heat dissipation hole; 1122. Second connecting part; 113. Outer housing; 1131. First connecting part; 12. Electronic module; 13. Second heat dissipation component; 14. Hinge; 141. Hinge interface; 15. Heat sink; 16. Heat sink cover; 161. Support part; 162. Fitting part; 163. Receiving cavity; 164. Communication port;

[0037] 2. Eyeglass frames. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0039] According to the first aspect of this application, in conjunction with Figures 2-5 It is known that a temple 1 is provided, comprising:

[0040] Housing 11, with an installation cavity 111 inside the housing 11;

[0041] Electronic module 12 is disposed in mounting cavity 111 and has a heat source capable of generating heat.

[0042] The first heat sink is disposed within the mounting cavity 111 and attached to the heat source; and,

[0043] The second heat sink 13 is disposed in the mounting cavity 111 and is attached to the side of the first heat sink away from the heat source. The side of the second heat sink 13 away from the first heat sink is attached to the side of the housing 11 located in the mounting cavity 111, and the contact area between the second heat sink 13 and the housing 11 is greater than the contact area between the first heat sink and the heat source.

[0044] When the electronic module 12 of the temple 1 is working, the heat source generates heat. At this time, the heat energy generated by the heat source can be absorbed by the first heat sink and transferred to the second heat sink 13. Finally, the second heat sink 13 transfers the heat energy to the housing 11. Through the coordinated work of the first heat sink, the second heat sink 13 and the housing 11, the heat source of the electronic module 12 is dissipated more effectively, thereby improving the heat dissipation performance of the temple 1 and effectively reducing heat accumulation during use. Furthermore, since the contact area between the second heat sink 13 and the housing 11 is larger than the contact area between the first heat sink and the heat source, the temperature distribution on the housing 11 can be more uniform during the heat transfer process, avoiding local overheating of the housing 11.

[0045] In some embodiments, the temple 1 further includes a hinge 14, which is connected to the housing 11 and is hinged to the frame.

[0046] A hinge interface 141 is provided at the hinge member 14, and the hinge interface 141 is connected to the mounting cavity 111.

[0047] The second heat sink 13 extends to the hinge interface 141 to fit against the side of the hinge 14 located at the hinge interface 141.

[0048] Since the second heat sink 13 extends to the hinge interface 141 to fit against the side of the hinge 14, the heat conduction area of ​​the second heat sink 13 can be increased, which can effectively improve the heat dissipation performance of the temple 1.

[0049] In some embodiments, when the temple 1 is folded onto the frame via the hinge 14, the hinge interface 141 can be exposed to the outside, so that external airflow can enter the mounting cavity 111 through the hinge interface 141, thereby further improving the heat dissipation performance of the temple 1.

[0050] In some embodiments, the first heat sink includes a heat sink 15 and a heat sink cover 16. The heat sink 15 is attached to a heat source, and the heat sink cover 16 is connected to the electronic module 12 or the housing 11 and abuts against the heat sink 15. The side of the heat sink cover 16 facing away from the heat sink 15 is attached to the second heat sink 13.

[0051] Before assembling the temple 1, the heat sink 16 and heat sink 15 can be installed on the electronic module 12 to facilitate the subsequent assembly of the temple 1; and the heat sink 16 can also ensure that the position between the heat sink 15 and the electronic module 12 is more stable.

[0052] In some embodiments, the heat sink 16 is made of a thermally conductive and insulating material, which can meet the heat dissipation requirements and avoid affecting the circuit structure on the electronic module 12.

[0053] For example, the heat sink 16 may be made of existing thermally conductive insulating materials such as thermally conductive plastic, boron nitride ceramic, or thermally conductive epoxy resin.

[0054] In some embodiments, the heat sink 16 includes a support portion 161 and a fitting portion 162. The support portion 161 is arranged along the edge of the fitting portion 162. The side of the support portion 161 away from the fitting portion 162 is connected to the electronic module 12 or the housing 11. An accommodating cavity 163 is formed between the support portion 161 and the fitting portion 162. The heat sink 15 is located in the accommodating cavity 163, and the fitting portion 162 abuts against the heat sink 15. The side of the fitting portion 162 away from the heat sink 15 is fitted with the second heat sink 13.

[0055] The cavity 163 formed by the heat sink 16 can not only accommodate the heat sink 15, but also accommodate the electronic components on the electronic module 12, so as to protect the electronic components on the electronic module 12.

[0056] In some embodiments, the support portion 161 is provided with a plurality of communication ports 164, which are arranged along the edge of the fitting portion 162, and the mounting cavity 111 and the receiving cavity 163 are connected through the plurality of communication ports 164.

[0057] In addition to being able to directly attach to the bonding part 162 for heat transfer, the heat sink 15 can also transfer heat to the airflow in the mounting cavity 111 through the connecting port 164.

[0058] In some embodiments, the heat sink 15 is a thermal paste sheet; and / or,

[0059] The second heat sink 13 is a VC heat sink; and / or,

[0060] The ratio of the contact area of ​​the second heat sink 13 to the housing 11 to the contact area of ​​the heat sink 15 to the heat source is greater than 10.

[0061] For example, the size of the heat sink 15 can be 9mm×9mm×3mm, wherein the contact area with the heat source is close to 9mm×9mm, and the size of the second heat sink 13 is 100mm×12mm×0.2mm, wherein the contact area with the housing 11 is close to 100mm×12mm.

[0062] In some embodiments, the housing 11 includes:

[0063] Inner shell 112, inner shell 112 can adhere to the human body; and,

[0064] The outer shell 113 is able to be separated from the human body. The outer shell 113 is connected to the inner shell 112. The mounting cavity 111 is formed between the inner shell 112 and the outer shell 113. The side of the second heat sink 13 that is away from the first heat sink is attached to the side of the outer shell 113 located in the mounting cavity 111.

[0065] When the temple 1 dissipates heat, the heat is transferred to the outer shell 113. The outer shell 113 is a structure that is away from the human body, which can prevent the user from being burned.

[0066] In some embodiments, the housing 113 is provided with a first heat dissipation hole, which leads to the mounting cavity 111; and / or,

[0067] The inner shell 112 is provided with a second heat dissipation hole 1121, which leads to the mounting cavity 111.

[0068] External airflow can flow into the mounting cavity 111 through the first heat dissipation hole and / or the second heat dissipation hole 1121 to improve the heat dissipation performance of the temple 1.

[0069] In some embodiments, the outer shell 113 has a first connecting portion 1131 arranged along its edge, and the inner shell 112 has a second connecting portion 1122 arranged along its edge. The outer shell 113 and the inner shell 112 are detachably connected, and the first connecting portion 1131 and the second connecting portion 1122 engage. The engagement of the first connecting portion 1131 and the second connecting portion 1122 can effectively enhance the connection stability between the outer shell 113 and the inner shell 112.

[0070] For example, the engagement of the first connecting part 1131 and the second connecting part 1122 is specifically as follows: the inner side of the first connecting part 1131 has a groove, the outer side of the second connecting part 1122 has a groove, the first connecting part 1131 is fitted onto the outer side of the second connecting part 1122, the first connecting part 1131 extends into the groove on the outer side of the second connecting part 1122, and the second connecting part extends into the groove on the inner side of the first connecting part 1131.

[0071] For example, the heat source can be a chip, a display IC, or other components. Electronic module 12 is a circuit board on which components are arranged.

[0072] In some embodiments, the temples also have an interface for connecting to an external power source to charge or directly power the electronic module 12 (when the electronic module 12 integrates a battery).

[0073] According to a second aspect of this application, a pair of glasses is provided, combining Figures 1-4 It is known that the frame 2 and the temple 1 mentioned in the first aspect are connected together.

[0074] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0075] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0076] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0077] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A type of temple for eyeglasses, characterized in that, include: A housing, wherein an installation cavity is provided inside the housing; An electronic module, wherein the electronic module is disposed within the mounting cavity, and the electronic module has a heat source capable of generating heat. A first heat sink is disposed inside the mounting cavity and attached to the heat source; and, The second heat sink is disposed in the mounting cavity and is attached to the side of the first heat sink away from the heat source. The side of the second heat sink away from the first heat sink is attached to the side of the housing located in the mounting cavity, and the contact area between the second heat sink and the housing is greater than the contact area between the first heat sink and the heat source.

2. The temple of the glasses according to claim 1, characterized in that, The temple also includes a hinge, which is connected to the housing and can be hinged to the frame. The hinge joint is provided with a hinge interface, which is connected to the mounting cavity; The second heat sink extends to the hinge interface to fit against the side of the hinge member located at the hinge interface.

3. The temple of the glasses according to claim 1, characterized in that, The first heat sink includes a heat sink block and a heat sink cover. The heat sink block is attached to the heat source, and the heat sink cover is connected to the electronic module or the housing and abuts against the heat sink block. The side of the heat sink cover away from the heat sink block is attached to the second heat sink.

4. The temple according to claim 3, characterized in that, The heat sink is a thermal paste sheet; and / or, The second heat sink is a VC vapor chamber; and / or, The ratio of the contact area of ​​the second heat sink to the housing to the contact area of ​​the heat sink block to the heat source is greater than 10.

5. The temple according to claim 3, characterized in that, The heat sink includes a support portion and a fitting portion. The support portion is arranged along the edge of the fitting portion. The side of the support portion away from the fitting portion is connected to the electronic module or the housing. An accommodating cavity is formed between the support portion and the fitting portion. The heat sink is located in the accommodating cavity. The fitting portion abuts against the heat sink. The side of the fitting portion away from the heat sink is fitted with the second heat sink.

6. The temple of the glasses according to claim 5, characterized in that, The support portion is provided with multiple communication ports, which are arranged along the edge of the fitting portion, and the mounting cavity and the receiving cavity are connected through the multiple communication ports.

7. The temple according to any one of claims 1-6, characterized in that, The housing includes: Inner shell, which can conform to the human body; and, The outer shell is detachable from the human body and is connected to the inner shell. The mounting cavity is formed between the inner shell and the outer shell. The side of the second heat sink that is away from the first heat sink is attached to the side of the outer shell located in the mounting cavity.

8. The temple according to claim 7, characterized in that, The outer casing is provided with a first heat dissipation hole, which leads to the mounting cavity; and / or... The inner shell is provided with a second heat dissipation hole, which leads to the mounting cavity.

9. The temple according to claim 7, characterized in that, The outer shell has a first connecting portion arranged along its edge, and the inner shell has a second connecting portion arranged along its edge. The outer shell and the inner shell are detachably connected, and the first connecting portion and the second connecting portion engage.

10. A pair of eyeglasses, characterized in that, Includes the temples as described in any one of claims 1-9.

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