Battery device and electric appliance

Abstract

This application discloses a battery device and an electrical appliance. The battery device includes: a housing, the inner surface of a first housing wall of which includes a central region and an edge region; multiple battery cells; multiple thermoelectric coolers, including a first thermoelectric cooler assembly located in the central region and a second thermoelectric cooler assembly located in the edge region; a first relay connected to the first thermoelectric cooler assembly, the first relay having a first connection state to allow the first thermoelectric cooler assembly to cool the battery cells located in the central region; and a second relay connected to the second thermoelectric cooler assembly, the second relay having a second connection state to allow the second thermoelectric cooler assembly to heat the battery cells located in the edge region. The battery device and electrical appliance of this application can improve the efficiency of temperature control in the battery device.

Description

Technical Field

[0001] This application relates to the field of batteries, and more specifically, to a battery device and an electrical appliance. Background Technology

[0002] Energy conservation and emission reduction are key to the sustainable development of the automotive industry, and electric vehicles, due to their energy-saving and environmentally friendly advantages, have become an important component of this sustainable development. For electric vehicles, battery technology is a crucial factor in their development.

[0003] During battery operation, excessively low temperatures can reduce battery performance, while excessively high temperatures may cause thermal runaway in individual battery cells. Therefore, proper temperature control of the battery system is crucial. Utility Model Content

[0004] This application provides a battery device and an electrical appliance that can improve the efficiency of temperature control in the battery device.

[0005] In a first aspect, a battery device is provided, comprising: a housing including a first housing wall, the inner surface of the first housing wall facing the interior of the housing including a central region and an edge region; a plurality of battery cells housed within the housing; a plurality of thermoelectric coolers including a first thermoelectric cooler assembly located in the central region and a second thermoelectric cooler assembly located in the edge region, the first thermoelectric cooler assembly including at least one first thermoelectric cooler and the second thermoelectric cooler assembly including at least one second thermoelectric cooler; a first relay connected to the first thermoelectric cooler assembly, the first relay having a first connection state, in which the first thermoelectric cooler assembly cools the battery cells located in the central region; and a second relay connected to the second thermoelectric cooler assembly, the second relay having a second connection state, in which the second thermoelectric cooler assembly heats the battery cells located in the edge region.

[0006] Therefore, the battery device in this embodiment uses a semiconductor cooling chip to adjust the temperature of the individual battery cells. The semiconductor cooling chip is lighter and replaces traditional water-cooled plates, reducing the overall weight of the battery device and increasing energy density. Furthermore, by using two relays, the battery device can control the semiconductor cooling chips in different areas to adjust the temperature of the individual battery cells in those areas, reducing temperature differences and improving the performance and stability of the battery device. Specifically, considering that the edge areas of the housing are closer to the external environment, the battery cells in these areas dissipate heat more easily than those in the middle areas, meaning the temperature of the battery cells in the middle areas is higher than that in the edge areas. Therefore, the first relay connected to the first semiconductor cooling chip assembly has a first connection state, in which the first semiconductor cooling chip assembly can cool the battery cells in the middle areas. The second relay connected to the second semiconductor cooling chip assembly has a second connection state, in which the second semiconductor cooling chip assembly can heat the battery cells in the edge areas, thus adjusting the temperature of the battery cells in different areas of the housing under different environments and reducing temperature differences.

[0007] In some embodiments, the first relay further has a third connection state, in which the first thermoelectric cooler assembly heats the battery cell located in the middle region; and / or, the second relay further has a fourth connection state, in which the second thermoelectric cooler assembly cools the battery cell located in the edge region. Thus, in different application scenarios, the first thermoelectric cooler assembly in the middle region can heat or cool the corresponding battery cell, and the second thermoelectric cooler assembly in the edge region can also heat or cool the corresponding battery cell, providing more flexible temperature control and improving the stability and efficiency of the battery device.

[0008] In some embodiments, the edge region includes at least one corner region on the inner surface, which is the area of ​​the inner surface near the intersection of two adjacent edges. Considering that the corner region is closer to the outside of the housing, the battery cells located in the corner region dissipate heat more easily; that is, the temperature of the corner region is generally lower than the temperature of other regions, easily creating a temperature difference with other regions. Therefore, placing a second semiconductor cooling chip in the corner region, and controlling the temperature separately from other regions, is beneficial for adjusting the temperature differences between different regions within the battery device, thereby improving the performance and stability of the battery device.

[0009] In some embodiments, the edge region includes the entire corner region of the inner surface. The temperature of the battery cells in all corner regions can be adjusted via a first relay, thereby reducing the temperature difference between battery cells in each corner region and those in other regions.

[0010] In some embodiments, the edge region includes at least one edge region of the inner surface, which is the region of the inner surface closest to any one edge. Considering that the edge region is closer to the external environment of the housing, the battery cells located in the edge region dissipate heat more easily; that is, the temperature of the edge region is generally lower than the temperature of other regions, easily generating temperature differences. Therefore, the edge region includes a second semiconductor cooling chip, which helps to adjust the temperature differences between different regions within the battery device, thereby improving the performance and stability of the battery device.

[0011] In some embodiments, the edge region includes the two oppositely disposed edge regions of the inner surface, so as to limit the number of second semiconductor cooling chips to a certain extent, thereby controlling costs and facilitating temperature adjustment, thereby reducing temperature differences within the battery device and improving the performance of the battery device.

[0012] In some embodiments, the edge region is an annular region to facilitate temperature regulation.

[0013] In some embodiments, along the width direction of the inner surface, the width of the inner surface is L1, and the total width of the plurality of second thermoelectric coolers located on the same side of the edge region is L2, where L2 / L1 satisfies: 1 / 4 ≤ L2 / L1 ≤ 1 / 3; and / or, along the length direction of the inner surface, the length of the inner surface is L3, and the total length of the plurality of second thermoelectric coolers located on the same side of the edge region is L4, where L4 / L3 satisfies: 1 / 4 ≤ L4 / L3 ≤ 1 / 3. Setting L2 / L1 ≤ 1 / 3 and L4 / L3 ≤ 1 / 3 can limit the number of second thermoelectric coolers disposed in the edge region perpendicular to the width and length directions to not be too large, thereby reducing the number of thermoelectric coolers used in the battery device, thereby reducing costs and saving power. By setting L2 / L1≥1 / 4 and L4 / L3≥1 / 4, the number of second semiconductor cooling chips set in the edge areas perpendicular to the width and length directions can be controlled to ensure that there are not too few chips. This allows for the adjustment of the temperature of multiple battery cells by using an appropriate number of semiconductor cooling chips, thereby improving the temperature uniformity of the battery device.

[0014] In some embodiments, the intermediate region is the entire area of ​​the inner surface excluding the edge region; or, the intermediate region includes the area where the center point of the inner surface is located and the area near the center point; or, the intermediate region is an annular region surrounding the center point of the inner surface. This allows for different application scenarios and improves the temperature regulation efficiency of the battery device.

[0015] In some embodiments, the intermediate region is an annular region surrounding the center point of the inner surface. The radial length of the inner surface is L5, and the distance between the first thermoelectric cooler closest to the center point in the intermediate region and the center point is L6. L6 / L5 satisfies: 1 / 2 ≤ L6 / L5 ≤ 2 / 3. Setting L6 / L5 ≤ 2 / 3 limits the position of the innermost first thermoelectric cooler from being too far from the center, facilitating temperature adjustment of the battery cells near the center and resulting in a more uniform distribution of thermoelectric coolers, thus aiding temperature control. Simultaneously, setting L6 / L5 ≥ 1 / 2 limits the position of the innermost first thermoelectric cooler from being too close to the center, thereby limiting the gap between it and adjacent thermoelectric coolers to be smaller, or reducing the number of thermoelectric cooler rings. This reduces costs and allows for adjustment of temperature differences in different areas within the battery device, improving temperature uniformity.

[0016] In some embodiments, the first thermoelectric cooler assembly includes: multiple rows of first thermoelectric coolers arranged along the length direction of the inner surface, each row of first thermoelectric coolers including a plurality of first thermoelectric coolers arranged along the width direction of the inner surface; and / or, the second thermoelectric cooler assembly includes: multiple rows of second thermoelectric coolers arranged along the length direction of the inner surface, each row of second thermoelectric coolers including a plurality of second thermoelectric coolers arranged along the width direction of the inner surface. Through the above-described arrangement of multiple rows of first thermoelectric coolers and / or multiple rows of second thermoelectric coolers, the distribution of thermoelectric coolers can be made more regular, which facilitates temperature control, reduces temperature differences in different areas, facilitates assembly, and improves the processing efficiency of the battery device.

[0017] In some embodiments, the outer surface of the first housing wall away from the interior of the housing is provided with a plurality of fins arranged at intervals to improve the heat dissipation efficiency of the first housing wall and to assist the semiconductor cooling chip disposed on the inner surface of the first housing wall in regulating the temperature of the battery cells.

[0018] In some embodiments, along the direction of gravity, the first housing wall is the bottom wall of the housing, and the battery cells are disposed on the first housing wall. Under the action of gravity, the distance between the battery cells and the semiconductor cooling chip is reduced, and the degree of contact between the two is increased, so as to facilitate heat transfer.

[0019] In some embodiments, the thickness of the thermoelectric cooler ranges from 0.5 mm to 2 mm. Setting the thickness of the thermoelectric cooler to be greater than or equal to 0.5 mm reduces the processing difficulty and facilitates implementation. Setting the thickness of the thermoelectric cooler to be less than or equal to 2 mm limits the space occupied by the thermoelectric cooler in the battery device, thereby increasing the energy density of the battery device. The thermoelectric cooler is typically a sheet-like structure, and its thickness usually refers to its average thickness.

[0020] In some embodiments, a thermally conductive layer is provided between the semiconductor cooling chip and the battery cell to improve heat transfer efficiency and temperature regulation efficiency.

[0021] In some embodiments, a first temperature sensor is provided in the middle region, the first temperature sensor being disposed in the area between two adjacent battery cells in the middle region; and / or, a second temperature sensor is provided in the edge region, the second temperature sensor being disposed in the area between two adjacent battery cells in the edge region, so that the first temperature sensor and the second temperature sensor can measure the temperature of more battery cells.

[0022] In some embodiments, the first thermoelectric cooler assembly includes a plurality of first thermoelectric coolers connected in series; and / or, the second thermoelectric cooler assembly includes a plurality of second thermoelectric coolers connected in series. Series connections require relatively short wiring, simplifying the connection structure and reducing space requirements; furthermore, series connections enable faster temperature regulation of the thermoelectric coolers, improving temperature regulation efficiency.

[0023] In some embodiments, the battery cell includes: a housing, the housing including a first housing wall and a second housing wall, the first housing wall facing the first housing wall; and electrode terminals disposed on the second housing wall. The first housing wall without electrode terminals is relatively flat, which facilitates the mutual fixation between the first housing wall and the first housing wall, improves heat transfer between the first housing wall and the semiconductor cooling chip, and thus improves temperature regulation efficiency.

[0024] In a second aspect, an electrical device is provided, comprising: a battery device as described in the first aspect or any embodiment of the first aspect, the battery device being used to provide electrical energy to the electrical device.

[0025] In some embodiments, the electrical equipment is a vehicle, a ship, or a spacecraft. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a vehicle according to one embodiment of this application;

[0027] Figure 2 This is an exploded view of a partial structure of a battery device according to an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the structure of the second housing portion according to an embodiment of this application;

[0029] Figure 4 This is a top view of the second housing portion according to an embodiment of this application;

[0030] Figure 5 This is another top view of the second housing portion according to an embodiment of this application;

[0031] Figure 6 This is another top view of the second housing portion according to an embodiment of this application;

[0032] Figure 7 This is another top view of the second housing portion according to an embodiment of this application;

[0033] Figure 8 This is another top view of the second housing portion according to an embodiment of this application;

[0034] Figure 9 This is another top view of the second housing portion according to an embodiment of this application;

[0035] Figure 10 This is another top view of the second housing portion according to an embodiment of this application;

[0036] Figure 11 This is a schematic diagram of the structure of the first box wall according to an embodiment of this application;

[0037] Figure 12 This is a cross-sectional structural diagram of the first box wall according to an embodiment of this application;

[0038] Figure 13 This is a schematic diagram of the structure of a battery cell according to an embodiment of this application;

[0039] Figure 14 This is a schematic diagram of a first relay connecting to a first semiconductor refrigeration chip assembly according to an embodiment of this application;

[0040] Figure 15 This is a schematic block diagram illustrating the control unit controlling the first relay and the second relay according to one embodiment of this application.

[0041] Figure 16 This is a schematic flowchart illustrating a method for controlling the temperature of a battery device according to an embodiment of this application.

[0042] The accompanying drawings are not drawn to scale. Detailed Implementation

[0043] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0046] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0049] In the embodiments of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width, and other dimensions of various components in the embodiments of this application shown in the accompanying drawings, as well as the overall thickness, length, width, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this application.

[0050] In this application, "multiple" refers to two or more (including two), and similarly, "multiple groups" refers to two or more (including two), and "multiple pieces" refers to two or more (including two).

[0051] The battery apparatus mentioned in the embodiments of this application may include one or more battery cell assemblies for providing voltage and capacity. A battery cell assembly may include multiple battery cells, which are connected in series, parallel, or mixed connections via a busbar.

[0052] In some embodiments, a battery cell assembly is typically formed by arranging multiple battery cells.

[0053] As an example, a battery cell assembly can be a battery module, which is formed by arranging and fixing multiple battery cells together to form an independent module. As another example, a battery module can be formed by bundling multiple battery cells together with cable ties.

[0054] In some embodiments, the battery device may be a battery pack, which includes a housing and one or more individual battery cells housed within the housing.

[0055] As an example, the battery cell assembly can be a battery module, which can be housed in a housing by fixing the battery module in the housing.

[0056] As an example, battery cell assemblies can also be housed in a housing by directly fixing multiple battery cells to the housing.

[0057] In this embodiment of the application, the battery cell can be a secondary battery, which refers to a battery cell that can be recharged to activate the active materials and continue to be used after the battery cell has been discharged.

[0058] The battery cell can be a lithium-ion battery, sodium-ion battery, sodium-lithium-ion battery, lithium metal battery, sodium metal battery, lithium-sulfur battery, magnesium-ion battery, nickel-metal hydride battery, nickel-cadmium battery, lead-acid battery, etc., and the embodiments of this application are not limited to this.

[0059] If the temperature of a battery device is too low during use, its performance will be reduced; however, if the temperature is too high, it may cause thermal runaway of individual battery cells. Therefore, it is very important to regulate the temperature of the battery device.

[0060] This application provides a battery device, an electrical appliance, and a method for controlling the temperature of the battery device, which can solve the above-mentioned problems. The battery device of this application includes a housing, multiple battery cells, multiple thermoelectric coolers, a first relay, and a second relay. The housing is used to house the multiple battery cells. The housing includes a first housing wall, the inner surface of which facing the interior of the housing includes an edge region and a central region. The multiple thermoelectric coolers include a first thermoelectric cooler assembly located in the central region and a second thermoelectric cooler assembly located in the edge region, wherein the first thermoelectric cooler assembly includes at least one first thermoelectric cooler, and the second thermoelectric cooler assembly includes at least one second thermoelectric cooler. The first relay is connected to the first thermoelectric cooler assembly and has a first connection state, in which the first thermoelectric cooler assembly cools the battery cells located in the central region. The second relay is connected to the second thermoelectric cooler assembly and has a second connection state, in which the second thermoelectric cooler assembly heats the battery cells located in the edge region.

[0061] The battery device in this application uses a semiconductor cooling chip to adjust the temperature of the individual battery cells. The semiconductor cooling chip is lighter and replaces traditional water-cooled plates and other structures, reducing the overall weight of the battery device and increasing energy density. Furthermore, by incorporating two relays, the battery device can control the semiconductor cooling chip in different areas to adjust the temperature of the individual battery cells in those areas, reducing temperature differences between cells and thus improving the performance and stability of the battery device.

[0062] Specifically, considering that the edge area of ​​the enclosure is closer to the external environment, the battery cells located in this area dissipate heat more easily than those located in the middle area of ​​the enclosure. That is, the temperature of the battery cells in the middle area is higher, while the temperature of the battery cells in the edge area is lower. Therefore, the first relay connected to the first semiconductor cooling chip assembly has a first connection state. In this first connection state, the first semiconductor cooling chip assembly can cool down the battery cells in the middle area. The second relay connected to the second semiconductor cooling chip assembly has a second connection state. In this second connection state, the second semiconductor cooling chip assembly can heat the battery cells in the edge area. This adjusts the temperature of the battery cells in different areas of the enclosure under different environments, reducing temperature differences.

[0063] The technical solutions described in the embodiments of this application are applicable to various electrical devices that use battery devices.

[0064] Electrical devices can include vehicles, mobile phones, portable devices, laptops, ships, spacecraft, electric toys, and power tools, etc. Vehicles can be gasoline-powered cars, natural gas-powered cars, or new energy vehicles; new energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. Spacecraft include airplanes, rockets, space shuttles, and spacecraft, etc. Electric toys include stationary or mobile electric toys, such as game consoles, electric car toys, electric ship toys, and electric airplane toys, etc. Power tools include metal cutting power tools, grinding power tools, assembly power tools, and railway power tools, such as electric drills, electric grinders, electric wrenches, electric screwdrivers, electric hammers, impact drills, concrete vibrators, and electric planers, etc. This application does not impose any special limitations on the above-mentioned electrical devices.

[0065] For ease of explanation, the following embodiments will use a vehicle as an example of an electrical device.

[0066] For example, such as Figure 1 The diagram shown is a structural schematic of a vehicle 1 according to one embodiment of this application. Vehicle 1 can be a gasoline-powered vehicle, a natural gas-powered vehicle, or a new energy vehicle. New energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. A motor 40, a controller 30, and a battery device 10 can be installed inside vehicle 1. The controller 30 controls the battery device 10 to supply power to the motor 40. For example, the battery device 10 can be installed at the bottom, front, or rear of vehicle 1. The battery device 10 can be used to power vehicle 1. For example, the battery device 10 can serve as the operating power source for vehicle 1, for example, to meet the electrical system requirements of vehicle 1, such as for starting, navigation, and operation. In another embodiment of this application, the battery device 10 can not only serve as the operating power source for vehicle 1, but also as the driving power source for vehicle 1, replacing or partially replacing gasoline or natural gas to provide driving power for vehicle 1.

[0067] In some embodiments, the battery device 10 of this application can also be applied to an aircraft, for example, to power the aircraft. Exemplarily, the battery device 10 can be used as a driving power source; for example, the battery device 10 can completely or partially replace energy sources such as fuel or natural gas to provide driving force for the aircraft. Alternatively, the battery device 10 can also be used as an operating power source to provide power to at least some components of the aircraft; for example, the battery device 10 can be used to provide electrical energy to the aircraft's navigation system, starting device, or control module, but the embodiments of this application are not limited thereto.

[0068] In some embodiments, the battery device 10 of this application can be located anywhere within the aircraft. For example, the battery device 10 can be installed at the center of the aircraft, below the motors, which helps maintain the stability of the aircraft's center of gravity. Alternatively, the battery device 10 can be installed at the top or upper part of the aircraft, typically for ease of battery replacement or to optimize the aircraft's aerodynamic performance.

[0069] The aircraft in this application embodiment is a device for flight, capable of flying within or outside the atmosphere. For example, an aircraft can include aircraft, spacecraft, rockets, and missiles. Aircraft are generally those that fly within the atmosphere, such as airships, drones, airplanes, helicopters, rotorcraft, and electric vertical takeoff and landing (eVTOL) aircraft. Spacecraft are generally those that fly in space, such as artificial Earth satellites, manned spacecraft, space probes, and space shuttles. A rocket is an aircraft propelled by the reaction force generated by a rocket engine, capable of flying within or outside the atmosphere. A missile is a controllable rocket equipped with a warhead, typically used for military purposes.

[0070] Figure 2 A partial structural schematic diagram of the battery device 10 according to an embodiment of this application is shown. Figure 2 As shown, the battery device 10 of this application embodiment may include a plurality of battery cells 20 to meet different power usage requirements. The shape of the battery cell 20 in this application embodiment can be set according to actual application. For example, the battery cell 20 can be as follows: Figure 2 The cylindrical shape shown, or it could be different. Figure 2 The embodiments shown may be cuboids or other shapes, but are not limited to these.

[0071] It should be understood that, such as Figure 2 As shown, the battery device 10 of this embodiment may further include a housing 11, which can be used to accommodate multiple battery cells 20. The housing 11 of this embodiment has a hollow interior, and the multiple battery cells 20 are accommodated within the housing 11. The housing 11 may include two parts, referred to herein as a first housing portion 111 and a second housing portion 112, which are fastened together. The shapes of the first housing portion 111 and the second housing portion 112 can be determined according to the shape of the components housed inside, for example, according to the shape of the combination of the multiple battery cells 20 housed inside. At least one of the first housing portion 111 and the second housing portion 112 has an opening. For example, as... Figure 2As shown, the first housing portion 111 and the second housing portion 112 can both be hollow cuboids with one open side each. The openings of the first housing portion 111 and the second housing portion 112 are opposite to each other, and the first housing portion 111 and the second housing portion 112 are interlocked to form a housing 11 with a closed chamber, which can be used to accommodate multiple battery cells 20. The multiple battery cells 20 are connected in parallel, series, or mixed and placed inside the housing 11 formed by the interlocking of the first housing portion 111 and the second housing portion 112.

[0072] For example, unlike Figure 2 As shown, either the first housing portion 111 or the second housing portion 112 may have only one hollow cuboid with an opening, while the other is plate-shaped to cover the opening. Taking the second housing portion 112 as a hollow cuboid with one opening and the first housing portion 111 as a plate-shaped example, then the first housing portion 111 covers the opening of the second housing portion 112 to form a housing 11 with a closed chamber, which can be used to accommodate multiple battery cells 20.

[0073] like Figure 2 As shown, for ease of explanation, this application embodiment defines three directions: the length direction X of the battery device 10, the width direction Y of the battery device 10, and the height direction Z of the battery device 10. The length direction X, the width direction Y, and the height direction Z are perpendicular to each other, and the size of the battery device 10 in the length direction X is greater than the size in the width direction Y.

[0074] Figure 3 A schematic diagram of a partial structure of the housing 11 according to an embodiment of this application is shown, for example, Figure 3 As shown Figure 2 A schematic diagram of the structure of the second box section 112 of the box 11 shown; Figure 4 A top view schematic diagram of a partial structure of the housing 11 according to an embodiment of this application is shown, for example, Figure 4 It shows Figure 3 A top view of the second housing section 112 shown.

[0075] In this embodiment, the battery device 10 includes a housing 11, a plurality of battery cells 20, a plurality of thermoelectric coolers 12, a first relay 131, and a second relay 132. Specifically, the housing 11 includes a first housing wall 113, the inner surface 1131 of which facing the interior of the housing 11 includes a central region 1101 and an edge region 1102; the plurality of battery cells 20 are housed within the housing 11; the plurality of thermoelectric coolers 12 include a first thermoelectric cooler assembly 121 located in the central region 1101 and a second thermoelectric cooler assembly 122 located in the edge region 1102, the first thermoelectric cooler assembly 121 including at least one first thermoelectric cooler 1211, and the second thermoelectric cooler assembly 122 including at least one first thermoelectric cooler 1211. Includes at least one second thermoelectric cooler 1221; a first relay 131 is connected to the first thermoelectric cooler assembly 121, the first relay 131 has a first connection state, in which the first thermoelectric cooler assembly 121 cools the battery cell 20 located in the middle region 1101; a second relay 132 is connected to the second thermoelectric cooler assembly 122, the second relay 132 has a second connection state, in which the second thermoelectric cooler assembly 122 heats the battery cell 20 located in the edge region 1102.

[0076] It should be understood that the housing 11 in this embodiment includes multiple walls, for example, such as Figure 3 and Figure 4 As shown, taking a rectangular box 11 as an example, the box 11 includes six walls. In this embodiment, the first box wall 113 can be any one of the walls of the box 11, for example, as... Figure 3 and Figure 4 As shown, this application embodiment uses the first box wall 113 as the bottom wall of the second box part 112 as an example for description, but this application embodiment is not limited to this.

[0077] The first housing wall 113 has an inner surface 1131 facing the interior of the housing 11, the inner surface 1131 being perpendicular to the thickness direction of the first housing wall 113. For example, as Figure 3 and Figure 4 As shown, taking the thickness direction of the first housing wall 113 as the height direction Z of the battery device 10 as an example, the inner surface 1131 of the first housing wall 113 is perpendicular to the height direction Z of the battery device 10 and faces the inside of the housing 11.

[0078] The inner surface 1131 of this application embodiment includes a middle region 1101 and an edge region 1102, wherein the middle region 1101 is closer to the geometric center of the inner surface 1131 than the edge region 1102, that is, with respect to the radial direction of the inner surface 1131, the middle region 1101 is located inside the edge region 1102.

[0079] In this embodiment of the application, a plurality of thermoelectric coolers 12 are disposed on the inner surface 1131 of the first housing wall 113. A first thermoelectric cooler assembly 121 is disposed in the middle region 1101, which includes at least one first thermoelectric cooler 1211, that is, at least one first thermoelectric cooler 1211 is disposed in the middle region 1101. A second thermoelectric cooler assembly 122 is disposed in the edge region 1102, which includes at least one second thermoelectric cooler 1221, that is, at least one second thermoelectric cooler 1221 is disposed in the edge region 1102.

[0080] It should be understood that the number of first semiconductor cooling chips 1211 provided in the middle region 1101 and the number of second semiconductor cooling chips 1221 provided in the edge region 1102 in the embodiments of this application can be set according to actual applications, and the two numbers can be the same or different to suit different application scenarios.

[0081] Each thermoelectric cooler 12 in this embodiment can be used to adjust the temperature inside the battery device 10. For example, it can heat the battery cells 20 inside the battery device 10 when the temperature is too low to increase the temperature and thus improve the performance of the battery device 10. It can also cool the battery cells 20 inside the battery device 10 when the temperature is too high to reduce the temperature and reduce the risk of thermal runaway of the battery cells 20 inside the battery device 10. Furthermore, the thermoelectric cooler 12 is lighter and can replace traditional water-cooled plates and other structures, thereby reducing the total mass of the battery device 10 and increasing the energy density.

[0082] The battery device 10 of this application embodiment includes a first relay 131, which is connected to a first thermoelectric cooler assembly 121, meaning that all the first thermoelectric coolers 1211 included in the first thermoelectric cooler assembly 121 can be controlled by the first relay 131. The battery device 10 also includes a second relay 132, which is connected to a second thermoelectric cooler assembly 122, meaning that all the second thermoelectric coolers 1221 included in the second thermoelectric cooler assembly 122 can be controlled by the second relay 132.

[0083] Considering that the edge region 1102 of the housing 11 is closer to the external environment, the battery cells 20 located in this region are easier to dissipate heat than the battery cells 20 located in the middle region 1101 of the housing 11. That is, the temperature of the battery cells 20 located in the middle region 1101 is higher, while the temperature of the battery cells 20 located in the edge region 1102 is lower. Therefore, the first relay 131 connected to the first semiconductor cooling chip assembly 121 has a first connection state. In this first connection state, the first semiconductor cooling chip assembly 121 can cool down the battery cells 20 located in the middle region 1101. The second relay 132 connected to the second semiconductor cooling chip assembly 122 has a second connection state. In this second connection state, the second semiconductor cooling chip assembly 122 can heat the battery cells 20 located in the edge region 1102, so as to adjust the temperature of the battery cells 20 in different regions of the housing 11 under different environments and reduce temperature differences.

[0084] Therefore, the battery device 10 of this application embodiment can control the semiconductor cooling chip 12 in different regions through the two relays provided, so as to adjust the temperature of the battery cells 20 in different regions, reduce the temperature difference between the battery cells in different regions, and thus improve the performance and stability of the battery device 10.

[0085] In some embodiments, the battery device 10 in high-rate discharge applications has higher requirements for temperature regulation. For example, the battery device 10 used in aircraft needs to have high-power discharge capabilities to provide faster flight speeds or accelerate speed increases. For instance, the power needs to increase from 100 kW to about 200 kW, which corresponds to a doubling of the discharge current. This leads to a drastic temperature rise in the battery device 10. At this time, the temperature rise of the battery cell 20 in the center of the battery device 10 is too high. Therefore, the battery device 10 in this embodiment can individually control the semiconductor cooling chip 12 in the middle region 1101 through the first relay 131, which can better regulate the temperature of the battery cell 20 in the middle region 1101 to meet the cooling requirements of the battery device 10.

[0086] In some embodiments, the first relay 131 further has a third connection state, in which the first thermoelectric cooler assembly 121 heats the battery cell 20 located in the middle region 1101; and / or, the second relay 132 further has a fourth connection state, in which the second thermoelectric cooler assembly 122 cools the battery cell 20 located in the edge region 1102. Thus, in different application scenarios, the first thermoelectric cooler assembly 121 in the middle region 1101 can heat or cool the corresponding battery cell 20, and the second thermoelectric cooler assembly 122 in the edge region 1102 can also heat or cool the corresponding battery cell 20, making temperature control more flexible and improving the stability and operating efficiency of the battery device 10.

[0087] It should be understood that the battery cell 20 located in the intermediate region 1101 in this embodiment of the application may include a battery cell 20 installed within the intermediate region 1101, that is, at least a portion of the battery cell 20 is located within the intermediate region 1101. Similarly, the battery cell 20 located in the edge region 1102 may include a battery cell 20 installed within the edge region 1102, that is, at least a portion of the battery cell 20 is located within the edge region 1102.

[0088] It should be understood that the specific arrangement of the plurality of thermoelectric coolers 12 disposed on the inner surface 1131 of the first housing wall 113 can be designed according to actual applications, so that at least a portion of the inner surface 1131 of the first housing wall 113 includes thermoelectric coolers 12. Furthermore, depending on the different placement positions of the plurality of thermoelectric coolers 12, the division of the middle region 1101 and the edge region 1102 in this embodiment can also be designed according to actual applications to suit different application scenarios. The shapes of the middle region 1101 and the edge region 1102 in this embodiment can be the same or different. For example, the shape of the middle region 1101 or the edge region 1102 can be a circular region, a rectangular region, or a triangular region. Correspondingly, when both the middle region 1101 and the edge region 1102 include a plurality of thermoelectric coolers 12, the number and distribution of the thermoelectric coolers 12 in the middle region 1101 and the edge region 1102 can be the same or different.

[0089] The different arrangements of the multiple semiconductor cooling chips 12 will now be described with reference to the accompanying drawings.

[0090] In some embodiments, such as Figure 3 and Figure 4As shown, the entire or almost entire area of ​​the inner surface 1131 of the first housing wall 113 can be provided with semiconductor cooling chips 12. Furthermore, for ease of installation and control, multiple semiconductor cooling chips 12 can be installed in a certain order.

[0091] like Figure 3 and Figure 4 As shown, along the length of the inner surface 1131 of the first housing wall 113, multiple rows of thermoelectric coolers 12 are disposed on the inner surface 1131. Each row of thermoelectric coolers 12 includes multiple thermoelectric coolers 12 arranged along the width direction of the inner surface 1131. For example, taking the length direction of the inner surface 1131 of the first housing wall 113 as the length direction X of the battery device 10 and the width direction of the inner surface 1131 of the first housing wall 113 as the width direction Y of the battery device 10, by disposing of multiple rows of thermoelectric coolers 12, almost the entire area of ​​the inner surface 1131 of the first housing wall 113 is provided with thermoelectric coolers 12, so as to adjust the temperature of the battery cells 20 in different areas and improve the reliability of the battery device 10.

[0092] It should be understood that the number of semiconductor refrigeration chips 12 included in the multi-row semiconductor refrigeration chip 12 of this application embodiment may be the same or different, so as to be suitable for different application scenarios. For example, it can be applied to boxes 11 of different shapes.

[0093] In some embodiments, such as Figure 3 and Figure 4 As shown, multiple rows of thermoelectric coolers 12 are evenly distributed along the length of the inner surface 1131 of the first housing wall 113, that is, the distance between any two adjacent rows of thermoelectric coolers 12 is the same.

[0094] Similarly, along the width direction of the inner surface 1131 of the first housing wall 113, each column of semiconductor cooling chips 12 includes a plurality of semiconductor cooling chips 12 that are evenly distributed, that is, the distance between each two adjacent semiconductor cooling chips 12 in the same column is the same.

[0095] By uniformly distributing multiple rows of thermoelectric coolers 12 among themselves and / or among multiple thermoelectric coolers 12, the thermoelectric coolers 12 on the inner surface of the first housing wall 113 are relatively uniformly distributed, so that the battery cells 20 in different areas can be regulated by the corresponding thermoelectric coolers 12, thereby improving the temperature regulation efficiency.

[0096] It should be understood that when the semiconductor cooling chip 12 is provided in all or almost all areas of the inner surface of the first housing wall 113, the middle area 1101 and the edge area 1102 of this application embodiment can be divided in a variety of ways.

[0097] For example, the intermediate region 1101 and the edge region 1102 are divided equally based on the total number and / or total area occupied by the thermoelectric coolers 12 disposed on the inner surface 1131 of the first housing wall 113. Exemplarily, the inner surface 1131 of the first housing wall 113 includes an intermediate region 1101 and an edge region 1102 of equal area, and the number of first thermoelectric coolers 1211 included in the intermediate region 1101 is the same as the number of second thermoelectric coolers 1221 included in the edge region 1102. Considering that the multiple thermoelectric coolers 12 on the inner surface 1131 of the first housing wall 113 are typically evenly distributed, evenly dividing the intermediate region 1101 and the edge region 1102 facilitates control and is easy to implement.

[0098] For example, considering the different heat dissipation capabilities of battery cells 20 in different areas within the housing 11 of different sizes, the inner surface 1131 of the first housing wall 113 can be divided into a middle area 1101 and an edge area 1102 with different areas, based on their dimensions. For example, as shown... Figure 4 As shown, the inner surface 1131 of the first housing wall 113 can be divided into a middle region 1101 and an edge region 1102 with different areas. Correspondingly, the number of first semiconductor cooling chips 1211 included in the middle region 1101 and the number of second semiconductor cooling chips 1221 included in the edge region 1102 are also different, so as to increase the temperature regulation efficiency for battery devices 10 of different sizes and different application scenarios.

[0099] For example, the first wall 113 of the housing 11 is connected to at least one beam 114, which can divide the interior of the housing 11 into multiple sub-spaces, each of which can accommodate multiple battery cells 20. Correspondingly, the multiple sub-spaces divided by the at least one beam 114 can be used to divide the interior into a central region 1101 and an edge region 1102. For example, if the housing 11 has one beam 114 that divides the interior of the housing 11 into two sub-spaces, the area closer to the beam 114 can be the central region 1101, and the area farther from the beam 114 can be the edge region 1102. However, the embodiments of this application are not limited to this.

[0100] For example, the inner surface 1131 of the first housing wall 113 of the housing 11 can be divided into more regions to connect multiple relays, each relay controlling the temperature of a battery cell 20 in a region, so as to improve the temperature regulation efficiency of the battery device 10.

[0101] It should be understood that the above-mentioned classification methods can be used individually or in combination. For example, ... Figure 3 and Figure 4 As shown, in each of the two subspaces divided by beam 114, the central region of the inner surface 1131 near the first box wall 113 can be designated as an intermediate region 1101, and the edge region of the central region of the inner surface far from the first box wall 113 can be designated as an edge region 1102. The two intermediate regions 1101 corresponding to the two subspaces can be controlled by two first relays 131 respectively, and the two edge regions 1102 corresponding to the two subspaces can be controlled by two second relays 132 respectively. The embodiments of this application are not limited to this.

[0102] Different regional division methods can be adopted according to different application scenarios, which can improve the flexibility of the battery device 10 and enable the battery device 10 to have good temperature regulation performance in different scenarios.

[0103] It should be understood that this is different from the above. Figure 3 and Figure 4 As shown, the semiconductor cooling chip 12 can also be provided only in a local area of ​​the inner surface 1131 of the first housing wall 113 to reduce the number of semiconductor cooling chips 12 and thus reduce the cost of the battery device 10. Examples will be provided below with reference to the accompanying drawings.

[0104] Figure 5 Another top view schematic diagram of the second housing portion 112 of the housing 11 according to an embodiment of this application is shown, for example, different from Figure 3 and Figure 4 The embodiment shown, Figure 5 It can be Figure 2 Another possible implementation of the second housing portion 112 of the shown housing 11, wherein, Figure 5 The second box section 112 shown does not have a beam 114, but the relevant description applies to embodiments with at least one beam 114, and will not be repeated here for the sake of brevity.

[0105] In some embodiments, the edge region 1102 includes at least one corner region 1103 of the inner surface 1131 of the first housing wall 113, the corner region 1103 being the region of the inner surface 1131 near the intersection of two adjacent edges. For example... Figure 5As shown, taking the inner surface 1131 of the first housing wall 113 as a rectangle as an example, the area near the intersection of each pair of adjacent sides is the corner area 1103. Then the rectangular inner surface 1131 of the first housing wall 113 has four corner areas 1103. The edge area 1102 includes at least one of the four corner areas 1103. That is, at least one of the four corner areas 1103 is provided with a second semiconductor cooling chip 1221. All the second semiconductor cooling chips 1221 included in each corner area 1103 belong to the second semiconductor cooling chip set 122.

[0106] In some embodiments, each corner region 1103 of the edge region 1102 of the inner surface 1131 may include at least one second semiconductor cooling chip 1221, for example, Figure 5 Taking each corner region 1103 as an example, which includes 12 second semiconductor cooling chips 1221, the embodiments of this application are not limited to this.

[0107] Considering that the corner region 1103 is closer to the outside of the housing 11, the battery cells 20 located in the corner region 1103 are easier to dissipate heat. That is, the temperature of the corner region 1103 is usually lower than that of other regions, which easily leads to a temperature difference with other regions. Therefore, a second semiconductor cooling chip 1221 is set in the corner region 1103 to control the temperature separately from other regions. This is beneficial for adjusting the temperature differences between different regions within the battery device 10, thereby improving the performance and stability of the battery device 10.

[0108] It should be understood that the number of corner regions 1103 included in the edge region 1102 can be set according to the actual application. For example, the edge region 1102 includes all corner regions 1103 of the inner surface 1131, that is, each corner region 1103 of the inner surface 1131 can be provided with a second semiconductor cooling chip 1221, and all the second semiconductor cooling chips 1221 of the entire corner region 1103 belong to the second semiconductor cooling chip set 122. The temperature of the battery cell 20 in the entire corner region 1103 can be adjusted by the first relay 131, thereby reducing the temperature difference between each corner region 1103 and the battery cell 20 in other regions.

[0109] For example, the edge region 1102 of this application embodiment may also include a portion of the corner region 1103 of the inner surface 1131. For example, two corner regions 1103 that are opposite to each other or adjacent to each other in all the corner regions 1103 included in the inner surface 1131 are provided with a second semiconductor cooling chip 1221 to control the battery cell 20 in the portion of the corner region 1103. This application embodiment is not limited to this.

[0110] In some embodiments, when the edge region 1102 includes multiple corner regions 1103, the number of second thermoelectric coolers 1221 included in different corner regions 1103 may be the same or different; when each corner region 1103 includes multiple second thermoelectric coolers 1221, the arrangement of the second thermoelectric coolers 1221 included in different corner regions 1103 may also be the same or different. For example, as Figure 5 As shown, the number of second semiconductor cooling chips 1221 included in different corner regions 1103 can be the same and the arrangement can be the same to facilitate assembly and control, so that the temperature between different corner regions 1103 is relatively balanced.

[0111] It should be understood that when the edge region 1102 includes at least one corner region 1103, the intermediate region 1101 may include at least a portion of the region of the inner surface 1131 other than the at least one corner region 1103. For example, as Figure 5 As shown, taking the edge region 1102 as an example that includes all corner regions 1103, the middle region 1101 may include all regions except the all corner regions 1103, or the middle region 1101 may include a local area in the middle of the inner surface 1131. Furthermore, the shape of the middle region 1101 can be set according to the actual application, and the embodiments of this application are not limited thereto.

[0112] Figure 6 This paper shows another top view of the second housing portion 112 of the housing 11 according to an embodiment of the present application. For example, it is different from... Figure 5 The various embodiments shown, Figure 6 It can be Figure 2 Another possible implementation of the second housing portion 112 of the shown housing 11, wherein, with Figure 5 similar, Figure 6 The second box section 112 shown also does not have a beam 114, but the relevant description applies to embodiments with at least one beam 114, and for the sake of brevity, it will not be repeated here.

[0113] In some embodiments, a plurality of semiconductor cooling chips 12 are disposed along the diagonal region of the inner surface 1131 of the first housing wall 113. In this embodiment, the diagonal region refers to the region near the diagonal of the inner surface 1131 of the first housing wall 113, which may include the line connecting any two non-adjacent vertices of the inner surface 1131 of the first housing wall 113. Figure 6As shown, taking the inner surface 1131 of the first housing wall 113 as a rectangle as an example, the inner surface 1131 of the first housing wall 113 has two diagonals. Placing semiconductor cooling chips 12 in the diagonal areas can reduce the number of semiconductor cooling chips 12 used, and can also regulate the temperature of the battery cells 20 in different areas within the battery device 10, thereby reducing costs and saving power while minimizing temperature differences within the battery device 10.

[0114] It should be understood that when multiple diagonal regions of the inner surface 1131 of the first housing wall 113 are provided with semiconductor cooling chips 12, the number of semiconductor cooling chips 12 included in different diagonal regions can be the same or different; when each diagonal region includes multiple semiconductor cooling chips 12, the arrangement of the semiconductor cooling chips 12 included in different diagonal regions can also be the same or different. For example, as Figure 6 As shown, for the inner surface 1131 of the rectangle, the number of semiconductor cooling chips 12 included in each diagonal region can be set to be the same and the arrangement can be the same, so as to facilitate processing and control and make the temperature of different regions uniform.

[0115] It should be understood that when multiple diagonal regions are provided with semiconductor cooling chips 12, the middle region 1101 and the edge region 1102 can be divided in various ways, and the embodiments of this application are not limited to this.

[0116] For example, such as Figure 6 As shown, the inner surface 1131 of the first housing wall 113 includes multiple diagonal regions. The two ends of each diagonal region can be corner regions 1103. The edge region 1102 can include the two ends of each diagonal region, while the middle region 1101 can include the portion of each diagonal region located between the two ends. The battery cells 20 within the middle region 1101 are temperature-regulated by the corresponding first semiconductor cooling chip assembly 121, while the battery cells 20 within the edge region 1102 are temperature-regulated by the corresponding second semiconductor cooling chip assembly 122, thereby reducing temperature differences within the battery device 10.

[0117] Figure 7 This paper shows another top view of the second housing portion 112 of the housing 11 according to an embodiment of the present application. For example, it is different from... Figure 5 and Figure 6 The various embodiments shown, Figure 7 It can be Figure 2 Another possible implementation of the second housing portion 112 of the shown housing 11, wherein, with Figure 5 and Figure 6 similar, Figure 7The second box section 112 shown also does not have a beam 114, but the relevant description applies to embodiments with at least one beam 114, and for the sake of brevity, it will not be repeated here.

[0118] In some embodiments, the edge region 1102 includes at least one side edge region 1104 of the inner surface 1131, the edge region 1104 being a region of the inner surface 1131 adjacent to any one edge. For example... Figure 7 As shown, taking the inner surface 1131 of the first housing wall 113 as a rectangle as an example, the inner surface 1131 of the first housing wall 113 has four edge regions 1104. The edge region 1102 may include at least one of the four edge regions 1104. That is, at least one of the four edge regions 1104 is provided with a second semiconductor cooling chip 1221. All the second semiconductor cooling chips 1221 included in each edge region 1104 belong to the second semiconductor cooling chip set 122.

[0119] Additionally, for each edge region 1104 included in the edge region 1102, the edge region 1104 may include a corner region 1103 or may not include a corner region 1103. For example, as Figure 7 As shown, each edge region 1104 may include a corner region 1103, meaning that the corner region 1103 of the edge region 1104 is also provided with a second semiconductor cooling chip 1221. Alternatively, unlike... Figure 7 In this embodiment of the application, the edge region 1104 may also exclude the corner region 1103. That is, the edge region 1104 may only include the middle position of each side of the inner surface 1131 except for the corner, and the corner region 1103 is not provided with the second semiconductor cooling chip 1221.

[0120] Considering that the edge region 1104 is closer to the external environment of the housing 11, the battery cells 20 located in the edge region 1104 are easier to dissipate heat. That is, the temperature of the edge region 1104 is usually lower than that of other regions, which easily leads to temperature differences. Therefore, the edge region 1104, which includes the edge region 1102, is provided with a second semiconductor cooling chip 1221, which is beneficial to adjust the temperature differences between different regions within the battery device 10, thereby improving the performance and stability of the battery device 10.

[0121] It should be understood that the number of edge regions 1104 included in edge region 1102 can be set according to the actual application. For example, as Figure 7As shown, the edge region 1102 is an annular region, that is, the edge region 1102 includes all the edge regions 1104 of the inner surface 1131. Each edge region 1104 of the inner surface 1131 of the first housing wall 113 is provided with a second semiconductor cooling chip 1221. All the second semiconductor cooling chips 1221 of all the edge regions 1104 belong to the second semiconductor cooling chip set 122, so as to facilitate the temperature regulation of the battery cell 20 in the annular edge region 1102.

[0122] It should be understood that in the case where the edge region 1102 of this application embodiment includes all the edge regions 1104 of the inner surface 1131, the edge region 1102 is annular, and the specific size of each edge region 1104 can be set according to the actual application.

[0123] In some embodiments, along the width direction of the inner surface 1131 of the first housing wall 113, the width of the inner surface 1131 of the first housing wall 113 is L1, and the total width of at least one second semiconductor cooling chip 1221 disposed in the same side edge region 1104 in at least one side edge region 1104 is L2, and L2 / L1 satisfies: 1 / 4 ≤ L2 / L1 ≤ 1 / 3. For example... Figure 7 As shown, taking the width direction of the inner surface 1131 of the first housing wall 113 as the width direction Y of the battery device 10 as an example, in the two edge regions 1104 arranged along the width direction Y of the battery device 10, at least one row of second semiconductor cooling chips 1221 can be provided on the same side edge region 1104, for example, Figure 7 Taking two columns of second semiconductor refrigeration chips 1221 as an example, the total width of the at least one column of second semiconductor refrigeration chips 1221 is L2.

[0124] Setting L2 / L1 ≤ 1 / 3 limits the number of second thermoelectric coolers 1221 installed in the edge region 1104 perpendicular to the width direction Y, thereby limiting the number of second thermoelectric coolers 1221 used in the battery device 10, reducing cost and saving power. Simultaneously setting L2 / L1 ≥ 1 / 4 controls the number of second thermoelectric coolers 1221 installed in the edge region 1104 perpendicular to the width direction Y, ensuring that the number is not too small. This allows for the adjustment of the temperature of multiple battery cells 20 using an appropriate number of second thermoelectric coolers 1221, improving the temperature uniformity of the battery device 10.

[0125] Similarly, along the length direction of the inner surface 1131 of the first housing wall 113, the length of the inner surface 1131 of the first housing wall 113 is L3, and the total length of the plurality of second semiconductor cooling chips 1221 disposed in the same side edge region 1104 in at least one side edge region 1104 is L4, where L4 / L3 satisfies: 1 / 4 ≤ L4 / L3 ≤ 1 / 3. In this embodiment, the length dimension L3 of the inner surface 1131 of the first housing wall 113 is greater than or equal to the width dimension L1 of the inner surface 1131 of the first housing wall 113. For example, as... Figure 7 As shown, taking the length direction of the inner surface 1131 of the first housing wall 113 as the length direction X of the battery device 10 as an example, in the two edge regions 1104 arranged along the length direction X of the battery device 10, at least one row of second semiconductor cooling chips 1221 can be provided on the same side edge region 1104, for example, Figure 7 Taking a row of second semiconductor refrigeration chips 1221 as an example, the total width of the at least one row of second semiconductor refrigeration chips 1221 is L4.

[0126] Setting L4 / L3 ≤ 1 / 3 limits the number of second thermoelectric coolers 1221 installed in the edge region 1104 perpendicular to the length direction X, thereby reducing the number of second thermoelectric coolers 1221 used in the battery device 10, thus reducing cost and saving power. Simultaneously, setting L4 / L3 ≥ 1 / 4 controls the number of second thermoelectric coolers 1221 installed in the edge region 1104 perpendicular to the length direction X, ensuring that the number is not too small. This allows for the adjustment of the temperature of multiple battery cells 20 within the edge region 1104 using an appropriate number of second thermoelectric coolers 1221, thereby improving the temperature uniformity of the battery device 10.

[0127] Or, different from Figure 7 As shown, the edge region 1102 may include a partial edge region 1104, that is, the second semiconductor cooling chip 1221 is provided only in a partial edge region 1104 of the inner surface 1131 of the first housing wall 113.

[0128] Figure 8 This paper shows another top view of the second housing portion 112 of the housing 11 according to an embodiment of the present application. For example, it is different from... Figures 5 to 7 The various embodiments shown, Figure 8 It can be Figure 2 Another possible implementation of the second housing portion 112 of the shown housing 11, wherein, with Figures 5 to 7 similar, Figure 8 The second box section 112 shown also does not have a beam 114, but the relevant description applies to embodiments with at least one beam 114, and for the sake of brevity, it will not be repeated here.

[0129] In some embodiments, the edge region 1102 may include a portion of the edge region 1104 of the inner surface 1131 of the first housing wall 113. For example, as Figure 8 As shown, the edge region 1102 includes two opposing edge regions 1104 on the inner surface 1131 to limit the number of second semiconductor cooling chips 1221 to a certain extent, which can control costs and facilitate temperature adjustment, thereby reducing temperature differences within the battery device 10 and improving the performance of the battery device 10.

[0130] In some embodiments, such as Figure 7 and Figure 8 As shown, when multiple edge regions 1104 of the inner surface 1131 of the first housing wall 113 are provided with second thermoelectric coolers 1221, the number of second thermoelectric coolers 1221 included in different edge regions 1104 can be the same or different; when each edge region 1104 includes multiple second thermoelectric coolers 1221, the arrangement of the second thermoelectric coolers 1221 included in different edge regions 1104 can also be the same or different. For example, as Figure 7 and Figure 8 As shown, for the inner surface 1131 of the rectangle, second semiconductor cooling chips 1221 with the same number and arrangement of different edge regions 1104 can be provided to facilitate assembly.

[0131] It should be understood that the number of thermoelectric coolers 12 disposed on any edge region 1104 can be set according to the actual application. For example, the size and number of thermoelectric coolers 12 can be set according to the size of the inner surface of the first housing wall 113.

[0132] In some embodiments, for each edge region 1104 included in the edge region 1102, the number of second semiconductor cooling wafers 1221 disposed in different regions of the edge region 1104 may be the same or different. For example, as Figure 7 and Figure 8 As shown, for the inner surface 1131 of the rectangle, it can be as follows: Figure 7 The diagram shows that multiple second semiconductor cooling chips 1221 are evenly arranged in different regions of each edge region 1104 to facilitate assembly and control; alternatively, it can be arranged as follows: Figure 8 The embodiments shown in the diagram arrange different numbers of second semiconductor cooling chips 1221 in different regions of each edge region 1104. For example, the number of second semiconductor cooling chips 1221 in the corner region 1103 of each edge region 1104 can be more, so as to adjust the temperature difference in different regions. The embodiments of this application are not limited to this.

[0133] In the above, as Figures 5 to 8The various embodiments shown mainly describe the possible implementation of the edge region 1102 of the present application embodiments. The possible configuration of the middle region 1101 of the present application embodiments will be described below with reference to the accompanying drawings.

[0134] In some embodiments, the intermediate region 1101 comprises the entire inner surface 1131 excluding the edge region 1102, so that different regions of the inner surface 1131 are correspondingly provided with semiconductor cooling chips 12, thereby regulating the temperature of the battery cells 20 in different regions and reducing the temperature difference of the battery device 10. For example, for such Figure 5 as well as Figure 7-8 In the various embodiments shown, the intermediate region 1101 may include the region of the inner surface 1131 other than the edge region 1102.

[0135] Figure 9 This paper shows another top view of the second housing portion 112 of the housing 11 according to an embodiment of the present application. For example, it is different from... Figures 5 to 8 The various embodiments shown, Figure 9 It can be Figure 2 Another possible implementation of the second housing portion 112 of the shown housing 11, wherein, with Figures 5 to 8 similar, Figure 9 The second box section 112 shown also does not have a beam 114, but the relevant description applies to embodiments with at least one beam 114, and for the sake of brevity, it will not be repeated here.

[0136] In some embodiments, regardless of how the edge regions 1102 are distributed, the intermediate region 1101 includes the region where the center point of the inner surface 1131 is located and the region near the center point; that is, the intermediate region 1101 may include local regions other than the edge regions 1102. Figure 9 As shown, multiple first semiconductor cooling chips 1211 can be provided in the middle region 1101 of the inner surface 1131 of the first housing wall 113. These multiple first semiconductor cooling chips 1211 can be arranged in a certain pattern and can be formed into any shape to adjust the temperature of the corresponding battery cell 20.

[0137] Considering that the heat dissipation capacity of the battery cells 20 in the middle region 1101 of the inner surface 1131 of the first housing wall 113 is relatively weak and the temperature is usually high, multiple first semiconductor cooling chips 1211 can be set in the middle region 1101 to adjust the temperature of the battery cells 20 corresponding to the middle region 1101, so as to reduce the temperature difference between the battery cells 20 and the edge region 1102 and improve the performance of the battery device 10.

[0138] Figure 10This paper shows another top view of the second housing portion 112 of the housing 11 according to an embodiment of the present application. For example, it is different from... Figures 5 to 9 The various embodiments shown, Figure 10 It can be Figure 2 Another possible implementation of the second housing portion 112 of the shown housing 11, wherein, with Figures 5 to 9 similar, Figure 10 The second box section 112 shown also does not have a beam 114, but the relevant description applies to embodiments with at least one beam 114, and for the sake of brevity, it will not be repeated here.

[0139] In some embodiments, the intermediate region 1101 is an annular region surrounding the center point O of the inner surface 1131, and the intermediate region 1101 may include at least one ring of first semiconductor cooling chips 1211. Setting an annular intermediate region 1101 can save the number of first semiconductor cooling chips 1211 and reduce costs.

[0140] It should be understood that when the intermediate region 1101 includes an annular region, the edge region 1102 can also be annular in shape to facilitate assembly; or the edge region 1102 can also be other shapes, for example, the edge region 1102 may include such as Figure 5 The corner area 1103 shown is suitable for different application scenarios.

[0141] like Figure 10 As shown, the following description will take the example where both the middle region 1101 and the edge region 1102 are annular.

[0142] In some embodiments, along the radial direction of the inner surface 1131 of the first housing wall 113, a plurality of turns of thermoelectric coolers 12 are disposed on the inner surface 1131, wherein each turn of the thermoelectric cooler 12 is annular. Figure 10 As shown, two rings of thermoelectric coolers 12 are arranged radially along the inner surface 1131 of the first housing wall 113, each ring of thermoelectric coolers 12 being annular; or, unlike... Figure 10 As shown, three or more rings of thermoelectric coolers 12 can be arranged radially along the inner surface 1131 of the first housing wall 113. Furthermore, the shape of each ring of thermoelectric coolers 12 can be the same as or different from the shape of the inner surface 1131 of the first housing wall 113; the shapes of different rings of thermoelectric coolers 12 can also be the same or different. For example, as... Figure 10 As shown, taking the inner surface 1131 of the first housing wall 113 as a rectangle as an example, each ring of semiconductor cooling wafers 12 can also form a square ring; or, unlike... Figure 10As shown, each ring of semiconductor cooling pads 12 can also be other shapes, such as a circular ring, or one ring of semiconductor cooling pads 12 can be a square ring and the other ring of semiconductor cooling pads 12 can be a circular ring. The embodiments of this application are not limited to these.

[0143] Considering that the battery cells 20 near the edge area 1102 of the housing 11 usually dissipate heat faster, while the battery cells 20 in the middle area 1101 of the housing 11 of the battery device 10 dissipate heat relatively slowly, which easily leads to temperature differences, by setting up multi-ring semiconductor cooling plates 12, the temperature of the battery cells 20 can be adjusted in different areas to reduce temperature differences.

[0144] In some embodiments, the spacing between every two adjacent rings of the multi-ring thermoelectric cooler 12 may be the same or different; and the spacing between every two adjacent rings of the thermoelectric cooler 12 may be set according to the size of the inner surface 1131 of the first housing wall 113.

[0145] It should be understood that when the inner surface 1131 is provided with multiple turns of thermoelectric cooler 12, the intermediate region 1101 may include one or more turns of thermoelectric cooler 12 located on the inner side, and the edge region 1102 may include one or more turns of thermoelectric cooler 12 located on the outer side. Furthermore, the number of turns of the thermoelectric cooler 12 included in the intermediate region 1101 may be the same as or different from the number of turns of the thermoelectric cooler 12 included in the edge region 1102. For example, as... Figure 10 As shown, taking the inner surface 1131 with two rings of thermoelectric coolers 12 as an example, the middle region 1101 may include the inner ring of thermoelectric coolers 12, that is, the inner ring of thermoelectric coolers 12 belongs to the first thermoelectric cooler set 121, while the edge region 1102 includes the outer ring of thermoelectric coolers 12, that is, the outer ring of thermoelectric coolers 12 belongs to the second thermoelectric cooler set 122.

[0146] It should be understood that, in the case where the intermediate region 1101 is an annular region surrounding the center point O of the inner surface 1131, the specific location and size of the intermediate region 1101 can be set according to the actual application.

[0147] In some embodiments, the radial length of the inner surface 1131 is L5, and the distance between the first semiconductor cooling chip 1211 closest to the center point O in the intermediate region 1101 and the center point O is L6, where L6 / L5 satisfies: 1 / 2 ≤ L6 / L5 ≤ 2 / 3. For example, as... Figure 10As shown, taking the first semiconductor refrigeration chip assembly 121 in the middle region 1101 as a square ring as an example, the center of the inner surface 1131 of the first housing wall 113 is point O. Then, the dimensions between the center O of the inner surface 1131 of the first housing wall 113 and different regions of the same ring of semiconductor refrigeration chips 12 are different. Taking the width direction Y of the battery device 10 as an example, along the radial direction of the inner surface 1131 of the first housing wall 113, the radial length L5 of the inner surface 1131 of the first housing wall 113 is half the width of the inner surface 1131 of the first housing wall 113; the distance L6 between the ring of first semiconductor refrigeration chips 1211 closest to the center O in the middle region 1101 and the center O is half the width of the inner ring of the ring of first semiconductor refrigeration chips 1211.

[0148] Setting L6 / L5 ≤ 2 / 3 limits the position of the innermost first thermoelectric cooler 1211 from being too far from the center O, facilitating effective temperature regulation of the battery cells 20 near the center O. Simultaneously, setting L6 / L5 ≥ 1 / 2 limits the position of the innermost first thermoelectric cooler 1211 from being too close to the center O, thereby limiting the gap between this ring of first thermoelectric coolers 1211 and the adjacent ring of thermoelectric coolers 12 to be smaller, or reducing the number of rings of thermoelectric coolers 12. This reduces costs and allows for adjustment of temperature differences in different areas within the battery device 10, improving the temperature uniformity of the battery device 10.

[0149] It should be understood that, in the above-mentioned cases... Figures 5 to 10 The various embodiments shown illustrate possible distributions of a plurality of semiconductor cooling chips 12 on the inner surface 1131 of the first housing wall 113 according to embodiments of this application. The above embodiments can be described as follows: Figures 5 to 10 The above-described arrangements can be used individually or combined to set up multiple semiconductor cooling chips 12. The embodiments of this application are not limited to this, and will not be described in detail here.

[0150] In this embodiment of the application, for the middle region 1101 and the edge region 1102 of any shape, the first semiconductor refrigeration chip 1211 in the first semiconductor refrigeration chip set 121 and the second semiconductor refrigeration chip 1221 in the second semiconductor refrigeration chip set 122 can be arranged in a certain order to facilitate assembly and control.

[0151] In some embodiments, the first thermoelectric cooler assembly 121 includes: multiple rows of first thermoelectric coolers 1211 arranged along the length direction of the inner surface 1131, each row of first thermoelectric coolers 1211 including multiple first thermoelectric coolers 1211 arranged along the width direction of the inner surface 1131; and / or, the second thermoelectric cooler assembly 122 includes: multiple rows of second thermoelectric coolers 1221 arranged along the length direction of the inner surface 1131, each row of second thermoelectric coolers 1221 including multiple second thermoelectric coolers 1221 arranged along the width direction of the inner surface 1131. Through the above-described arrangement of multiple rows of first thermoelectric coolers 1211 and / or multiple rows of second thermoelectric coolers 1221, the distribution of the thermoelectric coolers 12 can be made more regular, which facilitates temperature control, reduces temperature differences in different areas, facilitates assembly, and improves the processing efficiency of the battery device 10.

[0152] In some embodiments, a plurality of semiconductor cooling wafers 12 are symmetrically distributed on the inner surface 1131 of the first housing wall 113. For example, as Figures 3 to 10 As shown, for the above embodiments, considering that the inner surface 1131 of the first housing wall 113 is usually a symmetrical structure, the semiconductor cooling chips 12 provided on the inner surface 1131 of the first housing wall 113 are symmetrically distributed, which can make the semiconductor cooling chips 12 more evenly distributed, facilitate temperature control, and reduce the temperature difference in the battery device 10.

[0153] It should be understood that the specific structure of the thermoelectric cooler 12 in this application embodiment can be set according to actual applications. For example, the thermoelectric cooler 12 can adopt a multilayer semiconductor material stack structure, the semiconductor materials include P-type semiconductors and N-type semiconductors, and the type, thickness and arrangement of the semiconductor materials can be flexibly set to suit different application scenarios.

[0154] In some embodiments, the encapsulation material of the semiconductor cooling chip 12 can typically be a high-temperature resistant and corrosion-resistant material. For example, the encapsulation material may include one or more of ceramics, metals or epoxy resins, but the embodiments of this application are not limited thereto.

[0155] It should be understood that the size and shape of each thermoelectric cooler 12 in the embodiments of this application can be flexibly set according to actual applications. For example, as Figures 3 to 10 As shown, the multiple semiconductor cooling chips 12 disposed on the inner surface of the first housing wall 113 are generally the same size and shape, so as to facilitate processing and assembly and improve efficiency.

[0156] In some embodiments, the thickness of the thermoelectric cooler 12 in this application embodiment ranges from [0.5mm, 2mm]. Setting the thickness of the thermoelectric cooler 12 to be greater than or equal to 0.5mm can reduce the processing difficulty of the thermoelectric cooler 12 and facilitate its implementation. Setting the thickness of the thermoelectric cooler 12 to be less than or equal to 2mm can limit the space occupied by the thermoelectric cooler 12 in the battery device 10 and improve the energy density of the battery device 10. The thermoelectric cooler 12 is typically a sheet-like structure, and the thickness of the thermoelectric cooler 12 usually refers to its average thickness.

[0157] In some embodiments, the thickness of the thermoelectric cooler 12 can be any one of the following values ​​or between any two of the following values: 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, or 2mm.

[0158] It should be understood that, to further improve temperature regulation efficiency, the battery device 10 may also be provided with other structures. For example, Figure 11 This application shows another schematic diagram of the first housing wall 113 from an embodiment of the present application, for example, Figure 11 It can be a schematic diagram of the outer surface 1132 of the first box wall 113, that is, a schematic diagram of the surface of the first box wall 113 away from the interior of the box 11. Figure 12 A partial cross-sectional view of the first housing wall 113 of an embodiment of this application is shown, the cross-section being perpendicular to the length direction X of the battery device 10.

[0159] In some embodiments, the first housing wall 113 further has an outer surface 1132 facing the outside of the housing 11, the outer surface 1132 being perpendicular to the thickness direction of the first housing wall 113; in addition, the inner surface 1131 and the outer surface 1132 of the first housing wall 113 are disposed opposite to each other along the thickness direction of the first housing wall 113. For example, taking the thickness direction of the first housing wall 113 as the height direction Z of the battery device 10, the outer surface 1132 of the first housing wall 113 is perpendicular to the height direction Z of the battery device 10 and faces the outside of the housing 11.

[0160] In some embodiments, such as Figure 11 and Figure 12As shown, the outer surface 1132 of the first housing wall 113, which is away from the interior of the housing 11, is provided with a plurality of fins 1133 arranged at intervals to improve the heat conduction efficiency of the first housing wall 113 and assist the semiconductor cooling chip 12, which is disposed on the inner surface 1131 of the first housing wall 113, in regulating the temperature of the battery cell 20. For example, the fins 1133 can be used for heat exchange between the semiconductor cooling chip 12 and the external environment of the housing 11, accelerating the heat transfer and thus assisting the semiconductor cooling chip 12 in regulating the temperature of the battery cell 20.

[0161] It should be understood that the specific shape, size, and number of fins 1133 in the embodiments of this application can be set according to actual applications. For example, as Figure 11 and Figure 12 As shown, multiple fins 1133 can be uniformly arranged on the outer surface of the first housing wall 113 to improve the heat dissipation capacity of different areas. Specifically, multiple rows of fins 1133 are arranged along the length direction X of the battery device 10, and each row of fins 1133 includes multiple fins 1133 arranged along the width direction Y of the battery device 10. Each fin 1133 is elongated to facilitate processing.

[0162] In some embodiments, a thermally conductive layer is provided between the semiconductor cooling chip 12 and the battery cell 20 to improve heat transfer and temperature regulation efficiency. For example, the thermally conductive layer may include at least one of the following materials: thermally conductive silicone, graphite sheet, or other highly thermally conductive materials.

[0163] In some embodiments, the thermally conductive layer can be connected and fixed to the thermoelectric cooler 12, and / or, the thermally conductive layer can also be connected and fixed to the battery cell 20. Furthermore, the thermally conductive layer and the thermoelectric cooler 12, as well as the thermally conductive layer and the battery cell 20, can be fixedly connected in various ways. For example, if the thermally conductive layer includes thermally conductive silicone, it can be fixed to the battery cell 20 and / or the thermoelectric cooler 12 by the adhesive properties of the silicone itself. As another example, if the thermally conductive layer includes a graphite sheet, the graphite sheet can be adhered and fixed to the battery cell 20 and / or the thermoelectric cooler 12 using an adhesive with a high thermal conductivity; however, the embodiments of this application are not limited to these methods.

[0164] It should be understood that the first housing wall 113 in this embodiment can be any wall of the housing 11. For example, along the direction of gravity, the first housing wall 113 is the bottom wall of the housing 11, and the battery cell 20 is disposed on the first housing wall 113. Under the action of gravity, the distance between the battery cell 20 and the semiconductor cooling chip 12 is reduced, and the degree of contact between the two is increased, so as to facilitate heat transfer.

[0165] It should be understood that the wall of the battery cell 20 in this embodiment of the application, which contacts the first housing wall 113, is typically a relatively flat wall. For example, Figure 13 A schematic diagram of the structure of a battery cell 20 according to an embodiment of this application is shown. Figure 13 As shown, the battery cell 20 includes: a housing 21, which includes a first housing wall 211 and a second housing wall 212, with the first housing wall 211 facing the first housing wall 113; and electrode terminals 22 disposed on the second housing wall 212. The second housing wall 212 is provided with electrode terminals 22, which typically protrude from the second housing wall 212. If the second housing wall 212 faces the first housing wall 113, the partially protruding structure of the second housing wall 212 would affect heat transfer. However, by aligning the first housing wall 211 of the battery cell 20 (without electrode terminals 22) towards the first housing wall 113, the first housing wall 211 is relatively flat, facilitating mutual fixation between the first housing wall 211 and the first housing wall 113, improving heat transfer between the first housing wall 211 and the semiconductor cooling chip 12, thereby improving temperature regulation efficiency.

[0166] In some embodiments, the outer casing 21 can be a steel casing, an aluminum casing, a plastic casing (such as a polypropylene casing), a composite metal casing (such as a copper-aluminum composite casing 21), or an aluminum-plastic film, etc. In some embodiments, the outer casing 21 can be a sealed structure or a non-sealed structure. As an example, when the outer casing 21 is a non-sealed structure, the outer casing 21 serves to protect the electrode assembly, and a sealing bag is also included between the outer casing 21 and the electrode assembly. The sealing bag is used to encapsulate the electrode assembly and electrolyte. Specifically, the sealing bag can be a bag-shaped insulating component or an aluminum-plastic film. When the outer casing 21 is a sealed structure, it is used to encapsulate components such as the electrode assembly and electrolyte.

[0167] As an example, the battery cell 20 can be a cylindrical battery cell, a prismatic battery cell, a pouch battery cell, or a battery cell 20 of other shapes. Prismatic battery cells include prismatic battery cells, blade-shaped battery cells, and multi-prismatic batteries, such as hexagonal prismatic batteries. This application does not have any particular limitations.

[0168] In some embodiments, the housing 21 includes an end cap and a housing, the housing having an opening, and the end cap covering the opening. The housing may have one or more openings. The end cap may also be provided one or more.

[0169] In some embodiments, at least one electrode terminal 22 is provided on the housing 21, and the electrode terminal 22 is electrically connected to the tab. The electrode terminal 22 can be directly connected to the tab, or it can be indirectly connected to the tab through a current collector. The electrode terminal 22 can be provided on the end cap or on the housing.

[0170] It should be understood that in this application embodiment, the first relay 131 is connected to the first thermoelectric cooler assembly 121, and the second relay 132 is connected to the second thermoelectric cooler assembly 122. The method for controlling the temperature of the battery cell 20 in this application embodiment will be described below with reference to the accompanying drawings, taking the first relay 131 connected to the first thermoelectric cooler assembly 121 as an example. The relevant description is also applicable to the second thermoelectric cooler assembly 122 connected to the second relay 132, and will not be repeated here.

[0171] It should be understood that when the first thermoelectric cooler assembly 121 of the present application embodiment includes a plurality of first thermoelectric coolers 1211, the plurality of first thermoelectric coolers 1211 may be connected in series and / or in parallel; similarly, when the second thermoelectric cooler assembly 122 includes a plurality of second thermoelectric coolers 1221, the plurality of second thermoelectric coolers 1221 may be connected in series and / or in parallel.

[0172] For example, the first thermoelectric cooler assembly 121 includes a plurality of first thermoelectric coolers 1211 connected in series; and / or, the second thermoelectric cooler assembly 122 includes a plurality of second thermoelectric coolers 1221 connected in series. The series connection requires relatively short wiring, which simplifies the connection structure and reduces the space occupied; and the series connection enables the thermoelectric cooler 12 to adjust the temperature faster and improve the temperature adjustment efficiency.

[0173] For example, the first thermoelectric cooler assembly 121 includes a plurality of first thermoelectric coolers 1211 connected in parallel; and / or, the second thermoelectric cooler assembly 122 includes a plurality of second thermoelectric coolers 1221 connected in parallel. The parallel connection results in a smaller current, which can save power consumption.

[0174] Figure 14 A schematic diagram of a first relay 131 connected to a first semiconductor cooling chip assembly 121 is shown according to an embodiment of this application.

[0175] It should be understood that, in this embodiment of the application, the cooling direction of each thermoelectric cooler 12 is adjustable, meaning that each thermoelectric cooler can switch between cooling and heating modes to achieve constant temperature management of the battery device 10. For example, the switching between cooling and heating functions of the first thermoelectric cooler assembly 121 can be achieved through a first relay 131; and the switching between cooling and heating functions of the second thermoelectric cooler assembly 122 can be achieved through a second relay 132. The specific implementation of the first relay 131 and the second relay 132 can be set according to actual applications. For example, the first relay 131 and / or the second relay 132 in this embodiment of the application can be a double-pole double-throw relay, or it can be two single-pole double-throw relays; this embodiment of the application is not limited to this.

[0176] like Figure 14 As shown, taking the first relay 131 as an example, the first relay 131 has two contacts, namely the first contact 1311 and the second contact 1312.

[0177] like Figure 14 As shown, the first relay 131 has a first connection state. In this first connection state, the first contact 1311 can be connected to the positive terminal of the power supply, and the second contact 1312 can be connected to the negative terminal of the power supply. This allows the first electrode of the first thermoelectric cooler assembly 121 to be connected to the positive terminal of the power supply, and the second electrode to be connected to the negative terminal of the power supply. The polarities of the first electrode and the second electrode are opposite. In this way, the first thermoelectric cooler assembly 121 can cool down the battery cell 20 in the intermediate region 1101.

[0178] In some embodiments, the first relay 131 also has a second third connection state. In this third connection state, the connection method of the two contacts is adjusted so that the first contact 1311 is connected to the negative terminal of the power supply and the second contact 1312 is connected to the positive terminal of the power supply. This allows the first electrode of the first semiconductor cooling chip assembly 121 to be connected to the negative terminal of the power supply and the second electrode to be connected to the positive terminal of the power supply. In this way, the first semiconductor cooling chip assembly 121 can heat the battery cell 20 in the intermediate region 1101.

[0179] Thus, by switching the two contacts of the first relay 131, the cooling and heating functions of the first thermoelectric cooler assembly 121 can be switched. Similarly, the second relay 132 can also switch the cooling and heating functions of the second thermoelectric cooler assembly 122 by switching its two contacts.

[0180] In some embodiments, the battery device 10 may include a control unit 15, which is connected to a first relay 131 and a second relay 132 respectively, for controlling the switching of contacts of the first relay 131 and the second relay 132.

[0181] Figure 15 A schematic block diagram of a control unit 15 controlling a first relay 131 and a second relay 132 according to an embodiment of this application is shown. Figure 16 A schematic flowchart of a method 300 for controlling the temperature of a battery device 10 according to an embodiment of this application is shown.

[0182] In the embodiments of this application, such as Figure 15 and Figure 16As shown, method 300 may include: S310, controlling the first relay 131 to be in a first connection state according to the temperature of the battery cell 20 corresponding to the middle region 1101, and in the first connection state, cooling the battery cell 20 corresponding to the middle region 1101 through the first semiconductor cooling chip assembly 121; S320, controlling the second relay 132 to be in a second connection state according to the temperature of the battery cell 20 corresponding to the edge region 1102, and heating the battery cell 20 corresponding to the edge region 1102 through the second semiconductor cooling chip assembly 122.

[0183] It should be understood that the method 300 of this application embodiment can be applied to the battery device 10 of the various embodiments described above, and for the sake of brevity, it will not be described again here. For example, the battery device 10 includes a housing 11, a plurality of battery cells 20, a plurality of thermoelectric coolers 12, a first relay 131 and a second relay 132. The housing 11 includes a first housing wall 113. The inner surface 1131 of the first housing wall 113 facing the interior of the housing 11 includes a middle region 1101 and an edge region 1102. The plurality of thermoelectric coolers 12 includes a first thermoelectric cooler set 121 located in the middle region 1101 and a second thermoelectric cooler set 122 located in the edge region 1102. The first thermoelectric cooler set 121 includes at least one first thermoelectric cooler 1211, and the second thermoelectric cooler set 122 includes at least one second thermoelectric cooler 1221. The first relay 131 is connected to the first thermoelectric cooler set 121, and the second relay 132 is connected to the second thermoelectric cooler set 122.

[0184] It should be understood that the method 300 in this embodiment can be executed by a control unit 15 within the battery device 10. In some embodiments, the control unit 15 can be a battery management system (BMS) for ease of implementation.

[0185] By using the method 300 of this application embodiment, the two relays can be used to control the semiconductor cooling chip 12 in different regions, thereby adjusting the temperature of the battery cell 20 in different regions, reducing the temperature difference between the battery cells in different regions, and thus improving the performance and stability of the battery device 10.

[0186] In some embodiments, the method 300 further includes: controlling the first relay 131 to be in a third connection state according to the temperature of the battery cell 20 corresponding to the middle region 1101, and heating the battery cell 20 corresponding to the middle region 1101 through the first semiconductor cooling chip assembly 121 in the third connection state; and / or controlling the second relay 132 to be in a fourth connection state according to the temperature of the battery cell 20 corresponding to the edge region 1102, and cooling the battery cell 20 corresponding to the edge region 1102 through the second semiconductor cooling chip assembly 122 in the fourth connection state.

[0187] In this way, in different application scenarios, the first semiconductor cooling chip set 121 in the middle region 1101 can heat or cool the corresponding battery cell 20, and the second semiconductor cooling chip set 122 in the edge region 1102 can also heat or cool the corresponding battery cell 20, making temperature control more flexible and improving the stability and working efficiency of the battery device 10.

[0188] It should be understood that the temperature in this embodiment can be measured using a temperature sensor. For example, a first temperature sensor 141 is provided in the middle region 1101; and / or a second temperature sensor 142 is provided in the edge region 1102. The first temperature sensor 141 can be used to determine the temperature of at least one battery cell 20 corresponding to the middle region 1101 for temperature regulation. Similarly, the second temperature sensor 142 can be used to determine the temperature of at least one battery cell 20 corresponding to the edge region 1102 for temperature regulation.

[0189] It should be understood that the position and number of the first temperature sensor 141 and the second temperature sensor 142 in the embodiments of this application can be set according to actual applications. In some embodiments, such as Figure 4 As shown, the first temperature sensor 141 is disposed in the area between two adjacent battery cells 20 in the middle region 1101; and / or, the second temperature sensor 142 is disposed in the area between two adjacent battery cells 20 in the edge region 1102. This makes efficient use of space and allows the first temperature sensor 141 and the second temperature sensor 142 to measure the temperature of multiple battery cells 20 respectively.

[0190] In some embodiments, one or more first temperature sensors 141 may be provided in the middle region 1101, and one or more second temperature sensors 142 may be provided in the edge region 1102, so as to measure the battery cells 20 at different positions in the middle region 1101 and the edge region 1102, thereby improving the accuracy of temperature measurement.

[0191] In some embodiments, the number of temperature sensors disposed in the middle region 1101 and the edge region 1102 may be the same or different. For example, the position and number of the first temperature sensor 141 may be reasonably set according to the shape and size of the middle region 1101, and the second temperature sensor 142 may be reasonably set according to the shape and size of the edge region 1102, so as to improve the accuracy of temperature measurement.

[0192] In some embodiments, the control unit 15 may be used to control the temperature of the first thermoelectric cooler assembly 121 and / or the temperature of the second thermoelectric cooler assembly 122, which may include: controlling the temperature of the first thermoelectric cooler assembly 121 by controlling at least one of the power, state, and operating mode of the first thermoelectric cooler assembly 121; and / or, controlling the temperature of the second thermoelectric cooler assembly 122 by controlling at least one of the power, state, and operating mode of the second thermoelectric cooler assembly 122; wherein the state includes an on state and an off state, and the operating mode includes a cooling mode and a heating mode.

[0193] The following description uses the control of the temperature of the first thermoelectric cooler assembly 121 as an example, but the same description applies to the control of the temperature of the second thermoelectric cooler assembly 122. Furthermore, the control unit 15 can control the temperatures of the first thermoelectric cooler assembly 121 and the second thermoelectric cooler assembly 122 respectively.

[0194] In some embodiments, the control unit 15 can control the temperature of the first thermoelectric cooler assembly 121 by controlling its power, thereby controlling the temperature of the battery cell 20 corresponding to the intermediate region 1101. Specifically, the control unit 15 can adjust the temperature regulation capability of the first thermoelectric cooler assembly 121 by adjusting its power. For example, a higher power of the first thermoelectric cooler assembly 121 results in a higher temperature regulation capability, leading to a greater temperature change in the corresponding battery cell 20; conversely, a lower power of the first thermoelectric cooler assembly 121 results in a weaker temperature regulation capability, leading to a smaller temperature change in the corresponding battery cell 20.

[0195] In some embodiments, the control unit 15 can control the temperature of the first thermoelectric cooler assembly 121 by controlling its state, thereby controlling the temperature of the battery cell 20 corresponding to the intermediate region 1101. Specifically, the control unit 15 can control some of the first thermoelectric coolers 1211 in the intermediate region 1101 to be turned on and some to be turned off, thereby adjusting the temperature regulation capability of the first thermoelectric cooler assembly 121. For example, controlling the opening of more of the first thermoelectric coolers 1211 will result in a higher overall temperature regulation capability of the first thermoelectric cooler assembly 121 in the intermediate region 1101, leading to a greater temperature change in the corresponding battery cell 20; conversely, controlling the opening of fewer of the first thermoelectric coolers 1211 will result in a weaker temperature regulation capability of the first thermoelectric cooler assembly 121 in the intermediate region 1101, leading to a smaller temperature change in the corresponding battery cell 20.

[0196] In some embodiments, the control unit 15 can control the first thermoelectric cooler assembly 121 to switch between different operating modes to suit different scenarios. For example, if the temperature of the battery cell 20 corresponding to the measured intermediate region 1101 is too high, the first relay 131 is controlled to adjust the first thermoelectric cooler assembly 121 to a cooling mode to cool the battery cell 20; or, if the temperature of the battery cell 20 corresponding to the measured intermediate region 1101 is too low, the first relay 131 is controlled to adjust the first thermoelectric cooler assembly 121 to a heating mode to heat the battery cell 20.

[0197] It should be understood that the above three control methods can be used individually or in combination, and the embodiments of this application are not limited thereto.

[0198] It should be understood that S310 and S320 of the embodiments of this application can be implemented in a variety of ways.

[0199] In some embodiments, S310 may specifically include: controlling the first relay 131 to be in a first connection state when the temperature of the battery cell 20 corresponding to the intermediate region 1101 is greater than or equal to a first threshold; or, controlling the first relay 131 to be in a third connection state when the temperature of the battery cell 20 corresponding to the intermediate region 1101 is less than or equal to a second threshold, wherein the second threshold is less than the first threshold. By measuring the temperature of the battery cell 20 corresponding to the intermediate region 1101 and adjusting the temperature of the battery cell 20 corresponding to the intermediate region 1101 accordingly, the temperature of the battery cell 20 corresponding to the intermediate region 1101 can be effectively monitored and adjusted, reducing the situation of excessively high or low temperatures.

[0200] Similarly, S320 can specifically include: controlling the second relay 132 to be in a second connection state when the temperature of the battery cell 20 corresponding to the edge region 1102 is less than or equal to a fourth threshold; or, controlling the second relay 132 to be in a fourth connection state when the temperature of the battery cell 20 corresponding to the edge region 1102 is greater than or equal to a third threshold, wherein the fourth threshold is less than the third threshold. By measuring the temperature of the battery cell 20 corresponding to the edge region 1102 and adjusting the temperature of the battery cell 20 corresponding to the edge region 1102 accordingly, the temperature of the battery cell 20 corresponding to the edge region 1102 can be effectively monitored and adjusted, reducing situations where the temperature is too high or too low.

[0201] It should be understood that the specific values ​​of the first threshold, second threshold, third threshold, and fourth threshold in the embodiments of this application can be set according to actual applications. For example, by limiting the values ​​of the first and third thresholds, the risk of thermal runaway of the battery cell 20 within the battery device 10 can be reduced, thereby improving the reliability of the battery device 10. Furthermore, by limiting the values ​​of the second and fourth thresholds, the battery device 10 can have a favorable operating environment, thereby improving its performance.

[0202] In some embodiments, the specific values ​​of the first threshold, the second threshold, the third threshold, and the fourth threshold can be set according to the specific positions of the corresponding middle region 1101 and the edge region 1102; the four thresholds can be different; or, the first threshold and the third threshold can be the same, and the second threshold and the fourth threshold can be the same, but the embodiments of this application are not limited thereto.

[0203] In this embodiment of the application, in order to reduce the temperature difference between different regions within the battery device 10, the temperature of the semiconductor cooling chip 12 can also be adjusted according to the temperature difference between different regions. For example, the inner surface 1131 of the first housing wall 113 may also include a reference region. By measuring the temperature difference between the middle region 1101 and the reference region, the temperature of the battery cell 20 corresponding to the middle region 1101 can be adjusted, and / or, by measuring the temperature difference between the edge region 1102 and the reference region, the temperature of the battery cell 20 corresponding to the edge region 1102 can be adjusted.

[0204] In some embodiments, the method 300 may further include: adjusting the temperature of the first semiconductor cooling chip assembly 121 by controlling the first relay 131 according to the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region, so as to adjust the temperature of the battery cell 20 corresponding to the intermediate region 1101. This can reduce the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region, thereby reducing the temperature difference at different locations within the battery device 10 and improving the dynamic performance of the battery device 10.

[0205] In some embodiments, the above-mentioned adjustment of the temperature of the battery cell 20 corresponding to the intermediate region 1101 by controlling the first relay 131 to adjust the temperature of the first thermoelectric cooler assembly 121 based on the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region may specifically include: when the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region exceeds a first preset range, adjusting the temperature of the first thermoelectric cooler assembly 121 by controlling the first relay 131 to adjust the temperature of the battery cell 20 corresponding to the intermediate region 1101 until the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region meets the first preset range, thereby reducing the temperature difference between different regions.

[0206] For example, if the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region exceeds a first preset range, and if the temperature of the battery cell 20 corresponding to the intermediate region 1101 is higher than the temperature of the battery cell 20 corresponding to the reference region, then by controlling the first relay 131 to be in a first connection state, the first semiconductor cooling chip assembly 121 lowers the temperature of the battery cell 20 corresponding to the intermediate region 1101 until the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region meets the first preset range; conversely, if the temperature of the battery cell 20 corresponding to the intermediate region 1101 is lower than the temperature of the battery cell 20 corresponding to the reference region, then by controlling the first relay 131 to be in a third connection state, the first semiconductor cooling chip assembly 121 raises the temperature of the battery cell 20 corresponding to the intermediate region 1101 until the temperature difference between the battery cell 20 corresponding to the intermediate region 1101 and the battery cell 20 corresponding to the reference region meets the first preset range.

[0207] Similarly, S320 may specifically include: adjusting the temperature of the second semiconductor cooling chip assembly 122 by controlling the second relay 132 based on the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region, thereby adjusting the temperature of the battery cell 20 corresponding to the edge region 1102. This can reduce the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region, thereby reducing the temperature difference at different locations within the battery device 10 and improving the dynamic performance of the battery device 10.

[0208] In some embodiments, the above-mentioned adjustment of the temperature of the battery cell 20 corresponding to the edge region 1102 by controlling the second relay 132 to adjust the temperature of the second thermoelectric cooler assembly 122 based on the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region may specifically include: when the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region exceeds a second preset range, adjusting the temperature of the second thermoelectric cooler assembly 122 by controlling the second relay 132 to adjust the temperature of the battery cell 20 corresponding to the edge region 1102 until the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region meets the second preset range, thereby reducing the temperature difference between different regions.

[0209] For example, if the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region exceeds a second preset range, and if the temperature of the battery cell 20 corresponding to the edge region 1102 is lower than the temperature of the battery cell 20 corresponding to the reference region, then the second relay 132 is controlled to be in a second connection state, so that the second thermoelectric cooler assembly 122 increases the temperature of the battery cell 20 corresponding to the edge region 1102 until the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region meets the second preset range; conversely, if the temperature of the battery cell 20 corresponding to the edge region 1102 is higher than the temperature of the battery cell 20 corresponding to the reference region, then the second relay 132 is controlled to be in a fourth connection state, so that the second thermoelectric cooler assembly 122 decreases the temperature of the battery cell 20 corresponding to the edge region 1102 until the temperature difference between the battery cell 20 corresponding to the edge region 1102 and the battery cell 20 corresponding to the reference region meets the second preset range.

[0210] It should be understood that the first preset range and the second preset range can be set according to actual applications, and the first preset range may be the same as or different from the second preset range. The embodiments of this application are not limited thereto.

[0211] It should be understood that the reference area in this application embodiment can be any area of ​​the housing 11. For example, the reference area can be any area of ​​the first housing wall 113 or any other wall besides the first housing wall 113. As another example, the reference area can be any area of ​​the inner surface 1131 of the first housing wall 113, and the reference area can be the same as or different from the middle area 1101 or the edge area 1102.

[0212] In some embodiments, the reference region includes a middle region 1101 or an edge region 1102. For example, in S310, if the reference region includes the edge region 1102, the first relay 131 can be controlled to adjust the temperature of the first thermoelectric cooler assembly 121 based on the temperature difference between the battery cell 20 corresponding to the middle region 1101 and the battery cell 20 corresponding to the edge region 1102, thereby adjusting the temperature of the battery cell 20 corresponding to the middle region 1101. As another example, in S320, if the reference region includes the middle region 1101, the second relay 132 can be controlled to adjust the temperature of the second thermoelectric cooler assembly 122 based on the temperature difference between the battery cell 20 corresponding to the middle region 1101 and the battery cell 20 corresponding to the edge region 1102, thereby adjusting the temperature of the battery cell 20 corresponding to the edge region 1102. This reduces the temperature difference between the battery cell 20 corresponding to the middle region 1101 and the battery cell 20 corresponding to the edge region 1102.

[0213] In some embodiments, the reference region can be a different region from the middle region 1101 and the edge region 1102. Then, based on the temperature of the battery cell 20 corresponding to the reference region, the temperature of the battery cell 20 corresponding to the middle region 1101 and the battery cell 20 corresponding to the edge region 1102 can be adjusted to reduce the temperature difference of the battery cells 20 in the three regions, thereby reducing temperature overshoot of the battery cells 20 in different regions within the battery device 10.

[0214] According to some embodiments of this application, this application also provides an electrical device including the battery device 10 described in any of the above embodiments, and the battery device 10 is used to provide electrical energy to the electrical device.

[0215] The electrical equipment can be any of the aforementioned devices or systems that utilize the battery device 10.

[0216] According to some embodiments of this application, see Figures 3 to 10This application provides a battery device 10, including: a housing 11, including a first housing wall 113, the inner surface 1131 of the first housing wall 113 facing the interior of the housing 11 including a central region 1101 and an edge region 1102; a plurality of battery cells 20, housed within the housing 11; and a plurality of semiconductor cooling chips 12, including a first semiconductor cooling chip set 121 located in the central region 1101 and a second semiconductor cooling chip set 122 located in the edge region 1102, the first semiconductor cooling chip set 121 including at least one first semiconductor cooling chip 1211 and a second semiconductor cooling chip set 122. The thermoelectric cooler assembly 122 includes at least one second thermoelectric cooler 1221; a first relay 131 connected to the first thermoelectric cooler assembly 121, the first relay 131 having a first connection state in which the first thermoelectric cooler assembly 121 cools the battery cell 20 located in the intermediate region 1101; and a second relay 132 connected to the second thermoelectric cooler assembly 122, the second relay 132 having a second connection state in which the second thermoelectric cooler assembly 122 heats the battery cell 20 located in the edge region 1102. The first relay 131 also has a third connection state in which the first thermoelectric cooler assembly 121 heats the battery cell 20 located in the intermediate region 1101; and / or, the second relay 132 also has a fourth connection state in which the second thermoelectric cooler assembly 122 cools the battery cell 20 located in the edge region 1102.

[0217] Edge region 1102 includes at least one corner region 1103 of inner surface 1131, where corner region 1103 is the region of inner surface 1131 near the intersection of two adjacent edges. Edge region 1102 includes all corner regions 1103 of inner surface 1131. Edge region 1102 includes at least one edge region 1104 of inner surface 1131, where edge region 1104 is the region of inner surface 1131 near any one edge. Edge region 1102 includes two opposing edge regions 1104 of inner surface 1131. Edge region 1102 is an annular region. Along the width direction of the inner surface 1131, the width of the inner surface 1131 is L1, and the total width of the plurality of second semiconductor cooling chips 1221 located on the same side of the edge region 1104 is L2, and L2 / L1 satisfies: 1 / 4≤L2 / L1≤1 / 3; and / or, along the length direction of the inner surface 1131, the length of the inner surface 1131 is L3, and the total length of the plurality of second semiconductor cooling chips 1221 located on the same side of the edge region 1104 is L4, and L4 / L3 satisfies: 1 / 4≤L4 / L3≤1 / 3.

[0218] The intermediate region 1101 is the entire area of ​​the inner surface 1131 except for the edge region 1102; or, the intermediate region 1101 includes the area where the center point of the inner surface 1131 is located and the area near the center point; or, the intermediate region 1101 is an annular region surrounding the center point of the inner surface 1131. The intermediate region 1101 is an annular region surrounding the center point of the inner surface 1131. The radial length of the inner surface 1131 is L5, and the distance between the first semiconductor cooling chip 1211 closest to the center point in the intermediate region 1101 and the center point is L6. L6 / L5 satisfies: 1 / 2 ≤ L6 / L5 ≤ 2 / 3.

[0219] The first semiconductor refrigeration chip assembly 121 includes: multiple rows of first semiconductor refrigeration chips 1211 arranged along the length direction of the inner surface 1131, each row of first semiconductor refrigeration chips 1211 including a plurality of first semiconductor refrigeration chips 1211 arranged along the width direction of the inner surface 1131; and / or, the second semiconductor refrigeration chip assembly 122 includes: multiple rows of second semiconductor refrigeration chips 1221 arranged along the length direction of the inner surface 1131, each row of second semiconductor refrigeration chips 1221 including a plurality of second semiconductor refrigeration chips 1221 arranged along the width direction of the inner surface 1131.

[0220] The outer surface 1132 of the first housing wall 113, away from the interior of the housing 11, is provided with a plurality of spaced fins 1133. Along the direction of gravity, the first housing wall 113 is the bottom wall of the housing 11. The thickness of the thermoelectric cooler 12 ranges from [0.5 mm to 2 mm]. A heat-conducting layer is provided between the thermoelectric cooler 12 and the battery cell 20.

[0221] A first temperature sensor 141 is provided in the middle region 1101, and the first temperature sensor 141 is located in the area between two adjacent battery cells 20 in the middle region 1101; and / or, a second temperature sensor 142 is provided in the edge region 1102, and the second temperature sensor 142 is located in the area between two adjacent battery cells 20 in the edge region 1102. The first thermoelectric cooler assembly 121 includes a plurality of first thermoelectric coolers 1211 connected in series; and / or, the second thermoelectric cooler assembly 122 includes a plurality of second thermoelectric coolers 1221 connected in series.

[0222] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A battery device, characterized in that, include: The housing (11) includes a first housing wall (113), the inner surface (1131) of the first housing wall (113) facing the interior of the housing (11) includes a middle region (1101) and an edge region (1102). Multiple battery cells (20) are housed within the housing (11); Multiple thermoelectric coolers (12) include a first thermoelectric cooler set (121) located in the middle region (1101) and a second thermoelectric cooler set (122) located in the edge region (1102), wherein the first thermoelectric cooler set (121) includes at least one first thermoelectric cooler (1211) and the second thermoelectric cooler set (122) includes at least one second thermoelectric cooler (1221). A first relay (131) is connected to the first semiconductor cooling chip assembly (121). The first relay (131) has a first connection state. In the first connection state, the first semiconductor cooling chip assembly (121) cools down the battery cell (20) located in the intermediate region (1101). The second relay (132) is connected to the second semiconductor refrigeration chip assembly (122). The second relay (132) has a second connection state in which the second semiconductor refrigeration chip assembly (122) heats the battery cell (20) located in the edge region (1102).

2. The battery device according to claim 1, characterized in that, The first relay (131) also has a third connection state in which the first semiconductor cooling chip assembly (121) heats the battery cell (20) located in the intermediate region (1101); and / or, The second relay (132) also has a fourth connection state in which the second semiconductor cooling chip assembly (122) cools the battery cell (20) located in the edge region (1102).

3. The battery device according to claim 1, characterized in that, The edge region (1102) includes at least one corner region (1103) of the inner surface (1131), the corner region (1103) being the region of the inner surface (1131) near the intersection of two adjacent edges.

4. The battery device according to claim 3, characterized in that, The edge region (1102) includes all the corner regions (1103) of the inner surface (1131).

5. The battery device according to claim 1, characterized in that, The edge region (1102) includes at least one side edge region (1104) of the inner surface (1131), the edge region (1104) being the region of the inner surface (1131) near any one side.

6. The battery device according to claim 5, characterized in that, The edge region (1102) includes the two oppositely disposed edge regions (1104) of the inner surface (1131).

7. The battery device according to claim 5, characterized in that, The edge region (1102) is a ring-shaped region.

8. The battery device according to claim 7, characterized in that, Along the width direction of the inner surface (1131), the width of the inner surface (1131) is L1, and the total width of the plurality of second semiconductor cooling wafers (1221) located on the same side of the edge region (1104) is L2, where L2 / L1 satisfies: 1 / 4 ≤ L2 / L1 ≤ 1 / 3; and / or, Along the length direction of the inner surface (1131), the length of the inner surface (1131) is L3, and the total length of the plurality of second semiconductor cooling chips (1221) located on the same side of the edge region (1104) is L4, and L4 / L3 satisfies: 1 / 4≤L4 / L3≤1 / 3.

9. The battery device according to claim 1, characterized in that, The intermediate region (1101) is the entire area of ​​the inner surface (1131) excluding the edge region (1102); or, The intermediate region (1101) includes the region where the center point of the inner surface (1131) is located and the region near the center point; or, The intermediate region (1101) is an annular region surrounding the center point of the inner surface (1131).

10. The battery device according to claim 1, characterized in that, The intermediate region (1101) is an annular region surrounding the center point of the inner surface (1131). Along the radial direction of the inner surface (1131), the radial length of the inner surface (1131) is L5, and the distance between the first semiconductor cooling chip (1211) closest to the center point in the intermediate region (1101) and the center point is L6, and L6 / L5 satisfies: 1 / 2≤L6 / L5≤2 / 3.

11. The battery device according to any one of claims 1 to 10, characterized in that, The first semiconductor refrigeration chip assembly (121) includes: multiple rows of first semiconductor refrigeration chips (1211) arranged along the length direction of the inner surface (1131), each row of first semiconductor refrigeration chips (1211) including a plurality of first semiconductor refrigeration chips (1211) arranged along the width direction of the inner surface (1131); and / or, The second semiconductor refrigeration chip assembly (122) includes: multiple rows of second semiconductor refrigeration chips (1221) arranged along the length direction of the inner surface (1131), each row of second semiconductor refrigeration chips (1221) including multiple second semiconductor refrigeration chips (1221) arranged along the width direction of the inner surface (1131).

12. The battery device according to any one of claims 1 to 10, characterized in that, The outer surface (1132) of the first housing wall (113) away from the interior of the housing (11) is provided with a plurality of fins (1133) arranged at intervals.

13. The battery device according to any one of claims 1 to 10, characterized in that, Along the direction of gravity, the first box wall (113) is the bottom wall of the box (11).

14. The battery device according to any one of claims 1 to 10, characterized in that, The thickness of the semiconductor cooling chip (12) ranges from [0.5 mm to 2 mm].

15. The battery device according to any one of claims 1 to 10, characterized in that, A heat-conducting layer is provided between the semiconductor cooling chip (12) and the battery cell (20).

16. The battery device according to any one of claims 1 to 10, characterized in that, The intermediate region (1101) is provided with a first temperature sensor (141), which is located in the region between two adjacent battery cells (20) in the intermediate region (1101); and / or, The edge region (1102) is provided with a second temperature sensor (142), which is located in the area between two adjacent battery cells (20) in the edge region (1102).

17. The battery device according to any one of claims 1 to 10, characterized in that, The first semiconductor refrigeration chip assembly (121) includes a plurality of the first semiconductor refrigeration chips (1211) connected in series; and / or, The second semiconductor refrigeration chip assembly (122) includes a plurality of second semiconductor refrigeration chips (1221) connected in series.

18. The battery device according to any one of claims 1 to 10, characterized in that, The battery cell (20) includes: The outer casing (21) includes a first outer casing wall (211) and a second outer casing wall (212), with the first outer casing wall (211) facing the first housing wall (113). Electrode terminal (22), the electrode terminal (22) is disposed on the second outer shell wall (212).

19. An electrical appliance, characterized in that, The battery device includes any one of claims 1 to 18, the battery device being used to supply power to the electrical equipment.

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