A semi-automatic clamping tool

Abstract

This invention provides a semi-automatic clamping fixture for clamping semiconductor substrates to achieve semiconductor substrate processing. It includes a base plate, a positioning component, and a clamping component. The upper surface of the base plate is used to place the semiconductor substrate to be processed, and pads are fixedly connected to the lower surfaces on both sides of the base plate. The positioning component includes a positioning pin II and a positioning hole. The positioning hole is opened on the upper surface of the base plate, and the positioning pin II is installed in the positioning hole. The clamping component includes a pressure plate and a pressure block. This invention, by setting up the clamping component, utilizes the extension and retraction of a cylinder piston rod to drive the pressure block and pressure plate downwards, achieving rapid clamping of the semiconductor substrate. It eliminates the need for manual screw tightening, completely eliminating the repeated screw tightening operations of traditional fixtures, reducing the labor intensity of manual screw tightening, and eliminating long waiting times for manual operation. This effectively shortens the part clamping time, reduces machine downtime due to waiting for clamping, and improves machine processing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor component clamping technology, specifically a semi-automatic clamping fixture. Background Technology

[0002] A semiconductor substrate is a basic material used to support and connect various electronic components in semiconductor devices. It is usually made of semiconductor materials such as silicon, germanium, and arsenide, or of insulating materials such as sapphire and quartz after special treatment for use in semiconductor manufacturing.

[0003] Common alumina ceramic substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. They can also be etched with various patterns like PCB boards and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnect technologies.

[0004] As electronic devices become smaller and more high-performance, the processing precision requirements for alumina ceramic substrates are becoming increasingly stringent. Not only must the flatness of the parts' edges and the tolerance of the holes be controlled within 0.02mm, but consistency and stability in mass production must also be met.

[0005] Currently, in the processing of alumina ceramic substrates, traditional clamping methods mostly rely on manual operation: on the one hand, it is necessary to manually fasten the pressure plate to fix the parts one by one with bolts, which is not only cumbersome and time-consuming, but also the uneven manual fastening force can easily lead to deformation or positioning deviation of the parts, affecting the processing accuracy; on the other hand, the clamping process requires workers to repeatedly adjust the position of the parts and use measuring tools to calibrate the positioning, and the clamping time of a single part is long, which causes the machine to be in a standby state for a long time, resulting in low production efficiency. Utility Model Content

[0006] The purpose of this invention is to provide a semi-automatic clamping fixture to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: A semi-automatic clamping fixture is used to clamp a semiconductor substrate to achieve semiconductor substrate processing. The semiconductor substrate a is an alumina ceramic substrate or an aluminum nitride ceramic substrate. The fixture includes: A base plate, the upper surface of which is used to place the semiconductor substrate to be processed, and the lower surfaces on both sides of the base plate are fixedly connected with pads. The side walls of the base plate are provided with multiple switches for controlling the cylinders fixedly installed on the lower surfaces of the base plate. The positioning component includes a positioning pin II and a positioning hole. The positioning hole is opened on the upper end face of the base plate. The line connecting the positioning holes forms a 90° angle. The positioning pin II is installed in the positioning hole, and the side wall of the positioning pin II can abut against two adjacent sides of the semiconductor substrate to be processed, thereby achieving the initial positioning of the semiconductor substrate. The clamping assembly, including a pressure plate and a pressure block, is driven by multiple cylinders to move the pressure plate and pressure block toward the base plate, thereby clamping and fixing the semiconductor substrate.

[0008] Preferably, the clamping assembly further includes cylinder I, which is fixedly connected to the lower end edge of the base plate by bolts. Two cylinders I are symmetrically arranged on the left and right edges of the base plate, and one cylinder I is arranged on the front and rear edges of the base plate. The output end of cylinder I is piston rod I. A through hole is provided on the base plate corresponding to the position of piston rod I. The end of piston rod I away from cylinder I extends through the through hole to the top of the base plate. The top of piston rod I is fixedly connected to a pressure block. The top of the pressure block extends toward the edge of the semiconductor substrate to be processed.

[0009] Preferably, a positioning pin I is inserted and fixed in the opposite direction perpendicular to the base plate on the lower end face of the top of the pressure block. The edge of the positioning pin I near the semiconductor substrate to be processed is in contact with the edge of the part, further restricting the displacement of the part during processing. The lower end face of the top of the pressure block abuts against the edge of the upper end face of the semiconductor substrate to be processed, and together with the positioning pin I, the part is clamped and fixed.

[0010] Preferably, the clamping assembly further includes cylinder II, which is fixedly connected to the lower end face of the base plate by bolts. Several cylinders II are distributed in the inner area formed by a ring of cylinders I. Two cylinders II are provided on each of the four sides of the base plate: front, rear, left, and right. The two cylinders II on the same side are symmetrically distributed along the length of the side. The top output end of the cylinder II is a piston rod II. The base plate has a matching through hole at the position of the piston rod II. The end of the piston rod II away from the cylinder II extends through the through hole to the top of the base plate and passes through a pre-set through hole on the surface of the workpiece. The top of the piston rod II is fixedly connected to the bottom of the driven bolt by a threaded connection. The extension and retraction of the piston rod II drives the driven bolt to move up and down synchronously.

[0011] Preferably, the pressure plate is a long strip-shaped plate structure with a mounting hole at each end. The mounting hole is integrally formed by a circular segment and a long strip segment. The diameter of the circular segment is larger than the outer diameter of the nut at the top of the driven bolt, allowing the nut of the driven bolt to pass through. The width of the long strip segment is adapted to the outer diameter of the driven bolt shank and is connected to one side of the circular segment. During assembly, the nut of the driven bolt is inserted into the mounting hole through the circular segment. Then, the pressure plate is pulled along the extension direction of the long strip segment, causing the shank of the driven bolt to move into the long strip segment. When the cylinder II drives the piston rod II to retract downward, the nut of the driven bolt will abut against the upper end face of the pressure plate, thereby driving the entire pressure plate to press down towards the base plate, thereby achieving auxiliary clamping and fixing of the semiconductor substrate to be processed below the pressure plate.

[0012] Preferably, the switch includes switch I, switch II and switch III.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model, by setting up a clamping assembly, uses the extension and retraction of the cylinder piston rod to drive the pressure block and pressure plate to press down, thereby achieving rapid clamping of the semiconductor substrate. There is no need for manual screw tightening, which completely eliminates the operation of repeatedly tightening screws in traditional tooling, reduces the labor intensity of manual screw tightening, and at the same time, there is no need to wait for manual operation for a long time, which effectively shortens the time spent clamping parts, reduces the idle time of the machine tool due to waiting for clamping, and improves the processing efficiency of the machine tool.

[0014] 2. This utility model, by setting a positioning component, has a 90° angle formed by the line connecting the positioning pins II to match the right-angle side of the part. The initial positioning can be completed simply by pushing the part to contact the side wall of the positioning pins II. With the cylinder-driven clamping component, the clamping time is quickly responded, the clamping time is optimized, the complicated adjustment steps of traditional clamping fixtures are simplified, the clamping operation becomes simpler, and the clamping time of a single part is significantly shortened compared with the traditional method, resulting in higher clamping efficiency. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the overall structure of this utility model; Figure 2 This is a three-dimensional schematic diagram of the bottom of the base plate of this utility model; Figure 3 This utility model Figure 1 Another perspective 3D illustration; Figure 4 This utility model Figure 3 3D schematic diagram of point A in the middle; Figure 5 This is a three-dimensional schematic diagram of cylinder II and pressure plate II of this utility model; Figure 6 This utility model Figure 5 3D schematic diagram of point A in the middle; Figure 7 This is a three-dimensional schematic diagram of the driven bolt of this utility model passing through a pre-set through hole in the part.

[0016] In the diagram: 1. Base plate; 2. Foot pad; 3. Switch I; 4. Switch II; 5. Switch III; 6. Cylinder I; 601. Piston rod I; 602. Pressure block; 603. Positioning pin I; 7. Cylinder II; 701. Piston rod II; 702. Driven bolt; 8. Pressure plate; 801. Mounting hole; 9. Positioning pin II; 901. Positioning hole. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Example: Please see Figures 1 to 6 This utility model provides a technical solution: A semi-automatic clamping fixture based on semiconductor substrate processing, wherein the semiconductor substrate a is an alumina ceramic substrate, includes a base plate 1, a positioning component, a clamping component and a control switch, to achieve rapid positioning and stable clamping of the semiconductor substrate a, reduce the intensity of manual operation, and is suitable for processing semiconductor substrates a with right-angled sides such as rectangular semiconductor chip carriers, semiconductor power device shells, and semiconductor packaging substrates.

[0019] The base plate 1 is a horizontally load-bearing rectangular plate. Its upper surface is finely ground to form a flat surface for placing the part a, which is used to stably support the semiconductor substrate a to be processed. Alternatively, the shape and size of the base plate 1 can be designed according to the shape and size of the semiconductor substrate a to be processed, so as to avoid the processing deviation of the part a due to unevenness of the placement surface. On the lower surface of the left and right sides of the base plate 1, two sets of pads 2 are symmetrically fixedly connected along the length direction. Each set of pads 2 includes two columnar structures of the same height. The bottom of the pads 2 is attached with anti-slip rubber pads, which can not only provide stable support for the base plate 1 and maintain the overall horizontal state of the base plate 1, but also prevent the tooling from sliding when placed on the machine. At the same time, three control switches with different functions are installed on both sides of the base plate 1, namely switch I 3, switch II 4 and switch III 5. All three switches are connected to the pneumatic control system on the lower surface of the base plate 1 through wires, thereby realizing precise control of each cylinder and meeting the operational requirements of different clamping stages.

[0020] The positioning component is used to initially position the semiconductor substrate a to be processed, ensuring that the part a will not be laterally displaced during processing, and includes positioning pin II9 and positioning hole 901.

[0021] The positioning hole 901 is located on the upper surface of the base plate 1 near the front edge (e.g., Figure 1 As shown), specifically, two are distributed along the length of the edge of the base plate 1, and the line connecting the two sets of positioning holes 901 forms a 90° angle, which is adapted to the right-angled side of the semiconductor substrate a to be processed; the positioning pin II9 is ​​a cylindrical structure, and its outer diameter is clearance-fitted with the inner diameter of the positioning hole 901. The positioning pin II9 can be selected according to the size of the part a to match the height specification. During assembly, the positioning pin II9 is ​​inserted into the positioning hole 901. The side wall of the positioning pin II9 can be tightly abutted against the two adjacent right-angled sides of the semiconductor substrate a to be processed, respectively. By using two-point positioning, the lateral movement of the part a is restricted, and the initial positioning of the part a on the base plate 1 is achieved.

[0022] The clamping assembly is used to fully clamp the semiconductor substrate a after it has been initially positioned by the positioning assembly, so as to prevent the part a from loosening or shifting due to vibration during the processing. It includes cylinder I6, pressure block 602, positioning pin I603, cylinder II7, driven bolt 702 and pressure plate 8.

[0023] Among them, there are six cylinders I6. Two cylinders I6 are symmetrically arranged along the length direction on the left and right sides of the base plate 1. The two cylinders I6 ensure that the clamping force on the left and right sides of the part a is uniform. A cylinder I6 is fixed in the middle position on the front and rear sides of the base plate 1. The six cylinders I6 together form an outer clamping ring around the part a.

[0024] In this embodiment, each cylinder I6 is fixedly connected to a preset mounting seat on the lower end face of the base plate 1 by bolts. A shock-absorbing pad is provided between the mounting seat and the cylinder I6 to reduce the vibration generated by the cylinder during operation and transmit it to the base plate 1. The output end of the cylinder I6 is a piston rod I601, which is a cylindrical metal rod with a chrome-plated surface to improve wear resistance. Correspondingly, a matching circular through hole is provided on the base plate 1 at the position opposite to the piston rod I601. A guide sleeve is installed on the inner wall of the through hole. The guide sleeve is made of wear-resistant brass to prevent direct friction between the piston rod I601 and the base plate 1 during reciprocating motion. The end of the piston rod I601 away from the cylinder I6 extends through the through hole and the guide sleeve to the top of the base plate 1, and the end of the piston rod I601 located above the base plate 1 is connected to the pressure block 602 by bolts.

[0025] The pressing block 602 is a strip-shaped metal block (such as...). Figure 4As shown), its top extends towards the edge of the semiconductor substrate a to be processed, and the lower end face of the top is adapted to the edge of the upper end face of the part a; at the same time, the lower end face of the horizontal section of the pressure block 602 is inserted and fixed with a positioning pin I 603 (as shown) in the opposite direction perpendicular to the base plate 1. Figure 4 As shown), the positioning pin I 603 is a short cylindrical structure with its axis perpendicular to the horizontal section of the pressure block 602. The positioning pin I 603 is close to one edge of the semiconductor substrate a to be processed, and can fit tightly against the side wall of the part a. Together with the positioning pin II 9, it further restricts the lateral displacement of the part a during the processing. When the cylinder I 6 receives the control signal, the piston rod I 601 drives the pressure block 602 to move downward. The lower end face of the horizontal section of the pressure block 602 abuts against the edge of the upper end face of the part a to achieve clamping. The positioning pin I 603 assists in limiting the position from the side, forming a double fixing effect to ensure the clamping stability of the edge of the part a.

[0026] There are eight cylinders II7, which are fixedly connected to the lower end face of the base plate 1 by bolts. The eight cylinders II7 are distributed in a rectangular shape in the inner area enclosed by six cylinders I6, specifically on the front, rear, left, and right sides of the base plate 1. Two cylinders II7 are symmetrically arranged on each side along the length direction (e.g., Figure 2 As shown), the spacing between the two cylinders II7 on the same side is adapted to the width or length of the semiconductor substrate a to be processed, ensuring that the pressure plate 8 can cover the inner area of ​​the part a.

[0027] The top output end of each cylinder II7 is a piston rod II701. The structure of piston rod II701 is the same as that of piston rod I601, and both are chrome-plated for wear resistance. The base plate 1, corresponding to the position of piston rod II701, also has a through hole with a guide sleeve. The end of piston rod II701 away from cylinder II7 extends through the through hole to the top of the base plate 1, and must pass through a pre-set through hole b on the surface of the semiconductor substrate a to be processed (this through hole b is a pre-set through hole b before the processing of part a, and its diameter is equal to or greater than the diameter of piston rod II701 and driven bolt 702, and does not affect the final function of part a). The piston rod II701 is located at the top above the base plate 1 and has an inner thread that forms a threaded engagement with the outer thread at the bottom of driven bolt 702. The two can be fixedly connected by rotating driven bolt 702, and it is also convenient to disassemble and replace during subsequent maintenance.

[0028] It should be noted that, in this embodiment, the cylinder II7 used in the clamping assembly is preferably an Airtac SDA40X35 ultra-thin cylinder, which can fit the installation space of the inner area of ​​the lower end face of the base plate 1, avoiding structural interference with the outer cylinder I6, while meeting the force requirements of the pressure plate 8 for clamping; cylinder I6 is preferably an Airtac QCKL40X20S rotary clamping cylinder from the QCK series. The specific structure of the above two types of cylinders (such as cylinder body material, seal type, piston rod connection method) and the connection specifications with the external pneumatic system (such as air pipe interface type, air pressure adjustment requirements) have been described in detail in the Airtac official technical manual and publicly available industry materials. These are existing technologies that can be directly obtained and applied by those skilled in the art, and there is no need to elaborate on their structural details and connection methods here.

[0029] The pressure plate 8 is a long strip-shaped plate structure, the length of which is adapted to the distance between the two cylinders II 7 on the same side. The thickness of the pressure plate 8 can be flexibly selected according to the height of part a to ensure that the pressure plate 8 will not interfere with other structures on the surface of part a when it is pressed down. Each pressure plate 8 has an integrally formed mounting hole 801 at both ends. The mounting hole 801 is composed of a circular hole segment and a long strip hole segment. The diameter of the circular hole segment is larger than the outer diameter of the nut at the top of the driven bolt 702, so that the nut of the driven bolt 702 can pass through. The width of the long strip hole segment is clearance-fitted with the outer diameter of the rod of the driven bolt 702, and one end of the long strip hole segment is connected to one side of the circular hole segment.

[0030] In this embodiment, during assembly, after placing the workpiece a, the pressure plate 8 is first moved from above, and the nut of the driven bolt 702 is inserted into the mounting hole 801 through the circular hole section. Then, the pressure plate 8 is pulled horizontally along the extension direction of the elongated hole section, so that the rod of the driven bolt 702 moves into the elongated hole section. At this time, the lower end face of the nut of the driven bolt 702 abuts against the upper end face of the pressure plate 8. When the cylinder II 7 drives the piston rod II 701 to retract downward, the driven bolt 702 will drive the pressure plate 8 to press down towards the base plate 1. The lower end face of the pressure plate 8 is in close contact with the middle of the upper end face of the semiconductor substrate a to be processed, thereby achieving auxiliary clamping of the inner side of the workpiece a. Together with the cylinder I 6 and the pressure block 602, it forms an all-round clamping effect.

[0031] The three switches are preferably manual valves, with switch I3 being the main switch, switch II4 being the pull switch, and switch III5 being the clamp switch. The switches can be flexibly selected according to the requirements.

[0032] The switch I3 is connected to the inlet and outlet valves of all cylinders I6 and II7. When starting, switch I3 controls the inlet valves of cylinders I6 and II7 to open and the outlet valves to close, so that compressed air enters the cylinders and pushes the piston rods to move, achieving synchronous clamping of the edges and the inside. When closing, switch I3 cuts off the air supply to all cylinders, controls the inlet valves to close and the outlet valves to open, so that the compressed air in the cylinders is discharged, each piston rod is reset, and the clamping of part a is released.

[0033] The switch II4 controls only the action of cylinder II7 and is used to fine-tune the inner clamping force during the processing. When part a vibrates slightly during processing, switch II4 can be operated to open the air inlet valve of cylinder II7, pushing piston rod II701 to retract further, which in turn increases the pressure of pressure plate 8 on the inner side of part a, preventing part a from loosening, and without affecting the clamping state of cylinder I6.

[0034] The switch Ⅲ5 is used for orderly operation during material change. When changing materials, the switch Ⅲ5 is triggered, which first controls the cylinder Ⅱ7 to exhaust and reset, and the pressure plate 8 is raised to create operating space. Then, the cylinder Ⅰ6 is controlled to exhaust and reset, completely releasing the clamp. After the new part a is positioned, the switch Ⅲ5 is triggered again, which first controls the cylinder Ⅰ6 to clamp the edge of part a, and then controls the cylinder Ⅱ7 to drive the pressure plate 8 to clamp the inner side, realizing rapid clamp change.

[0035] In this embodiment, the base plate 1, positioning components, clamping components, and control switches are combined to form a complete semi-automatic clamping fixture system. The various structures are mutually compatible and work together. During operation, the worker only needs to align the preset through-hole b of the semiconductor substrate a to be processed with the piston rod II 701 above the base plate 1, then push part a so that its two adjacent sides are in close contact with the positioning pin II 9 to complete the positioning. Next, the four pressure plates 8 are assembled into place, and finally, the corresponding control switch is triggered to stably and securely clamp part a in one operation. The entire process eliminates the need for manual screw tightening, completely eliminating the tedious steps of repeatedly tightening screws in traditional tooling. The clamping time for a single part a is significantly shortened compared to traditional methods, saving on labor costs.

[0036] Meanwhile, due to the efficient and seamless clamping process, the machine tool does not need to wait for the worker to complete the clamping before starting processing, significantly reducing the machine tool's idle time and achieving rapid connection between clamping and processing. This fixture, through the 90° angle positioning design of the positioning pin II9, combined with the clamping block 602 pressing the edge of part a and the auxiliary clamping of the inner side of part a by the pressure plate 8, can accurately position and stably fix part a in one go. This avoids the positioning deviation caused by multiple adjustments to the clamping position in traditional tooling, ensuring accurate and reliable positioning and effectively guaranteeing the processing precision and product quality of the semiconductor substrate a.

[0037] In addition, the entire fixture has a low operating threshold, requiring only one person to complete all clamping actions without the need for multiple people to cooperate, making it convenient and quick to operate; at the same time, it greatly reduces the number of manual clamping operations, and even in batch processing scenarios, the clamping interval can be further shortened through the step-by-step control of switch Ⅲ5, improving overall production efficiency while ensuring stable processing quality, and meeting the high-efficiency and high-precision processing and production needs of semiconductor substrate a.

[0038] In use, initially, cylinders I6 and II7 are both in the raised state with the piston rod extended. The pressure block 602, positioning pin I603, and pressure plate 8 are all away from the upper surface of the base plate 1. The operator first aligns the preset through hole b of the semiconductor substrate a to be processed with the piston rod II701 and driven bolt 702 above the base plate 1, and slowly lowers part a so that the piston rod II701 and driven bolt 702 pass through the through hole b. Then, part a is pushed until its two adjacent right-angled sides are in close contact with the sidewall of the positioning pin II9, completing the initial positioning of part a. Next, four long strip pressure plates 8 are taken, corresponding to the cylinder II7 groups on the front, back, left, and right sides of the base plate 1 respectively. The circular holes 801 at both ends of each pressure plate 8 are aligned with the nuts of the driven bolt 702 and inserted. Then, the pressure plate 8 is pulled horizontally along the direction of the long strip holes, so that the driven bolt... The rod of bolt 702 is moved into the elongated hole section; then switch I3 is pressed. Switch I3 controls the air inlet valves of cylinder I6 and cylinder II7 to open, and compressed air pushes piston rod I601 and piston rod II701 to retract. Piston rod I601 drives pressure block 602 and positioning pin I603 to press down. Pressure block 602 abuts against the edge of part a, and positioning pin I603 fits against the side wall of part a. At the same time, piston rod II701 drives pressure plate 8 to press down against the middle of part a through driven bolt 702, realizing the all-round fixation of part a. At this time, the machine can be started for CNC machining. If the inside of part a is slightly loose due to vibration during the machining process, switch II4 can be operated to control the air inlet valve of cylinder II7 to open, push piston rod II701 to retract further, drive pressure plate 8 to increase the internal pressure, and prevent part a from shifting.

[0039] After processing is completed, if further processing is required, switch Ⅲ5 is triggered directly. It first controls cylinder Ⅱ7 to exhaust and reset independently. Piston rod Ⅱ701 extends and lifts pressure plate 8 to a height that does not interfere with part removal. The operator then pulls each pressure plate 8 to return the rod of driven bolt 702 to the circular hole section, removes the four pressure plates 8, and then lifts the processed part a upward to separate it from piston rod Ⅱ701 and driven bolt 702. The above actions are repeated to complete continuous processing.

[0040] All other parts of this utility model not described herein are the same as existing technology, or are known technology, or can be implemented using existing technology, and will not be described in detail here.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semi-automatic clamping tool, characterized in that, Used to press semiconductor substrates to achieve semiconductor substrate processing, including: The base plate (1) has an upper surface for placing a semiconductor substrate to be processed. The lower surfaces on both sides of the base plate (1) are fixedly connected with pads (2). The side wall of the base plate (1) is provided with multiple switches for controlling the cylinder fixedly installed on the lower surface of the base plate (1). The positioning component includes a positioning pin II (9) and a positioning hole (901). The positioning hole (901) is opened on the upper end face of the base plate (1). The line connecting the positioning holes (901) forms a 90° angle. The positioning pin II (9) is installed in the positioning hole (901), and the side wall of the positioning pin II (9) can abut against two adjacent sides of the semiconductor substrate to be processed, thereby achieving the initial positioning of the semiconductor substrate. The clamping assembly includes a pressure plate (8) and a pressure block (602). Multiple cylinders drive the pressure plate (8) and the pressure block (602) to move toward the base plate (1) to achieve clamping and fixing of the semiconductor substrate.

2. The semi-automatic clamping fixture according to claim 1, characterized in that: The clamping assembly also includes cylinder I (6), which is fixedly connected to the lower end edge of the base plate (1) by bolts. Two cylinders I (6) are symmetrically arranged on the left and right sides of the base plate (1), and one cylinder I (6) is arranged on the front and rear sides of the base plate (1). The output end of the cylinder I (6) is piston rod I (601). The base plate (1) has a through hole corresponding to the position of piston rod I (601). The end of piston rod I (601) away from cylinder I (6) extends through the through hole to the top of the base plate (1). The top of piston rod I (601) is fixedly connected to pressure block (602). The top of pressure block (602) extends toward the edge of the semiconductor substrate to be processed.

3. A semi-automatic clamping tool according to claim 2, characterized in that: The lower end face of the top of the pressure block (602) is inserted and fixed with a positioning pin I (603) in the opposite direction to the base plate (1). The positioning pin I (603) is close to the edge of the semiconductor substrate to be processed and fits against the edge of the part. The lower end face of the top of the pressure block (602) abuts against the edge of the upper end face of the semiconductor substrate to be processed.

4. The semi-automatic clamping fixture according to claim 2, characterized in that: The clamping assembly also includes cylinder II (7), which is fixedly connected to the lower end face of the base plate (1) by bolts. Two cylinders II (7) are provided on each of the four sides of the base plate (1), namely the front side, the rear side, the left side and the right side. The two cylinders II (7) on the same side are symmetrically distributed along the length of the side. The top output end of the cylinder II (7) is piston rod II (701). The base plate (1) is provided with a suitable through hole corresponding to the position of piston rod II (701). The end of piston rod II (701) away from cylinder II (7) extends through the through hole to the top of the base plate (1) and passes through the pre-set through hole on the surface of the workpiece. The top of piston rod II (701) is fixedly connected to the bottom of driven bolt (702) by threaded connection. The extension and retraction of piston rod II (701) drives driven bolt (702) to move up and down synchronously.

5. A semi-automatic clamping fixture according to claim 4, characterized in that: The pressure plate (8) is a long strip plate structure. Each end of the pressure plate (8) is provided with a mounting hole (801). The mounting hole (801) is formed by integrally molding a circular hole segment and a long strip hole segment. The diameter of the circular hole segment is larger than the outer diameter of the nut at the top of the driven bolt (702) and is used for the nut of the driven bolt (702) to pass through. The width of the long strip hole segment is adapted to the outer diameter of the rod of the driven bolt (702) and is connected to one side of the circular hole segment.

6. The semi-automatic clamping tool according to claim 1, characterized in that: The switches include switch I (3), switch II (4) and switch III (5).

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