A glue-filling device for a smart ring
Patent Information
- Application Number
- CN202522233516.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-21
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-10-21
AI Technical Summary
然而,在胶水凝固的过程中,会有少量的胶水凝固在进胶孔和出胶孔,导致产品表面形成有注胶口,需要对这部分多余的胶体进行切割和表面修整,整体的生产效率较低
通过设置具有环形槽的硅胶模并配合灌胶针,以实现对智能指环的环形灌胶操作,改善了胶水凝固过程中出现注胶口的问题,使得胶水能够一次成型,无需二次加工,提升了产品外观的稳定性和一致性,并提升了整体的生产效率,由此降低了成本。
Smart Images

Figure CN224738645U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of smart ring technology, and more particularly to a potting device for smart rings. Background Technology
[0002] As a type of smart wearable device, smart rings are mainly used for health monitoring, gesture control, and identity recognition.
[0003] The hardware in a smart ring includes various sensors, such as optical heart rate sensors, body temperature sensors, touch sensors, and accelerometers. Some of these sensors, like the optical heart rate sensor, are located on the inner surface of the smart ring. In some cases, an adhesive coating process is applied to the inner surface of the smart ring. The cured adhesive has good optical transmittance and abrasion resistance, thus protecting these sensors while still allowing them to function.
[0004] In related technologies, the glue coating process involves creating two holes in a mold: one for glue inlet and the other for glue outlet. Glue is then applied to the inner surface of the smart ring via injection. However, during the glue solidification process, a small amount of glue solidifies in the inlet and outlet holes, resulting in glue inlets on the product surface. This excess glue needs to be cut and the surface trimmed, leading to low overall production efficiency. Utility Model Content
[0005] This application aims to at least address one of the technical problems existing in the background art. Therefore, one objective of this application is to provide a glue-filling device for smart rings, thereby improving the production efficiency and quality of the glue-filling process for smart rings to a certain extent.
[0006] This application provides an adhesive filling device for a smart ring, comprising a silicone mold and an adhesive filling needle. The silicone mold has an annular groove adapted to the smart ring. The annular groove includes a first inner wall and a second inner wall disposed opposite to each other. The first inner wall is arranged opposite to the inner surface of the smart ring, forming a gap between them. Along the axis of the annular groove, the height of the first inner wall relative to the bottom of the groove is greater than or equal to the height of the smart ring, and the height of the second inner wall relative to the bottom of the groove is less than the height of the smart ring. The adhesive filling needle is used to fill the gap with adhesive.
[0007] In some embodiments, the silicone mold is further provided with an adhesive guide groove for discharging adhesive that overflows from the annular groove.
[0008] In some embodiments, the adhesive guide groove is located outside the annular groove relative to the center of the annular groove.
[0009] In some embodiments, the adhesive guide groove extends along the extension direction of the annular groove.
[0010] In some embodiments, the silicone mold is further provided with an observation hole, the inner surface of which is disposed opposite to the first inner wall, and the portion between the inner surface of the observation hole and the first inner wall is configured as a transparent body.
[0011] In some embodiments, the observation hole extends through the silicone mold.
[0012] In some embodiments, the silicone mold further has an edge that is connected to the first inner wall and extends along the first inner wall toward the second inner wall, the edge being used to contact and connect with the end of the smart ring away from the bottom of the groove.
[0013] In some embodiments, the potting apparatus for the smart ring further includes a pressing mold that mates with the silicone mold, the smart ring being disposed between the silicone mold and the pressing mold.
[0014] In some embodiments, the Shore hardness of the silicone mold is in the range of 40 to 50.
[0015] In some embodiments, the glue-applying device for a smart ring further includes a drive member for driving the glue-applying needle to move along the extension direction of the annular groove.
[0016] The technical solutions of this application embodiment can achieve at least the following technical effects: By setting up a silicone mold with an annular groove and using a dispensing needle, an annular dispensing operation can be achieved for smart rings. This improves the problem of dispensing nozzles during glue solidification, allowing the glue to be molded in one step without secondary processing. This enhances the stability and consistency of the product's appearance and improves overall production efficiency, thereby reducing costs.
[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0018] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.
[0019] Figure 1 This is a schematic diagram of the structure of a silicone mold according to some embodiments of this application; Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA direction; Figure 3 This is a schematic diagram of the structure of a glue-pouring device for a smart ring according to some embodiments of this application.
[0020] Explanation of reference numerals in the attached figures: 100. A potting device for smart rings; 10. Silicone mold; 11. Annular groove; 111. First inner wall; 112. Second inner wall; 12. Adhesive guide groove; 13. Observation hole; 14. Along the edge; 20. Glue-dispensing needle; 200. Smart Ring; K, gap. Detailed Implementation
[0021] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0023] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.
[0024] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0025] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.
[0026] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).
[0027] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0028] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0029] Combination Figures 1 to 3 As shown, Figure 1 This is a schematic diagram of the structure of a silicone mold according to some embodiments of this application; Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA direction; Figure 3 This is a schematic diagram of the structure of a glue-pouring device for a smart ring according to some embodiments of this application.
[0030] This application provides a glue-filling device 100 for a smart ring, including a silicone mold 10 and a glue-filling needle 20. The silicone mold 10 has an annular groove 11 adapted to the smart ring 200. The annular groove 11 includes a first inner wall 111 and a second inner wall 112 arranged opposite to each other. The first inner wall 111 is arranged opposite to the inner surface of the smart ring 200, forming a gap K between them. Along the axis of the annular groove 11, the height of the first inner wall 111 relative to the bottom of the groove 11 is greater than or equal to the height of the smart ring 200, and the height of the second inner wall 112 relative to the bottom of the groove is less than the height of the smart ring 200. The glue-filling needle 20 is used to fill glue into the gap K.
[0031] Silicone mold 10 refers to a mold made of silicone material. Silicone mold 10 has a certain degree of hardness to reliably support the smart ring 200, while also having a certain degree of elasticity to facilitate demolding after the glue has solidified.
[0032] The annular groove 11 is a recess for supporting the smart ring 200 and allowing the adhesive to be molded into a preset shape. In the annular groove 11, the bottom supports the end of the smart ring 200. A first inner wall 111 forms a gap K between itself and the inner surface of the smart ring 200, thereby defining a space for filling the adhesive. The first inner wall 111 restricts the flow of the adhesive, allowing it to solidify within the gap K and adhere to the inner surface of the smart ring 200. The cross-sectional shape of the solidified adhesive is the same as the cross-sectional shape of the gap K. A second inner wall 112 is used to adhere to the outer surface of the smart ring 200, ensuring that the smart ring 200 is stably placed within the annular groove 11.
[0033] Wherein, the height of the first inner wall 111 relative to the bottom of the annular groove 11 is greater than or equal to the height of the smart ring 200. It can be understood that the first inner wall 111 can completely cover the inner surface of the smart ring 200, so that the solidified glue can fully cover the inner surface of the smart ring 200.
[0034] The height of the second inner wall 112 relative to the bottom of the groove is less than the height of the smart ring 200, so that at least a part of the smart ring 200 is exposed outside the annular groove 11, so that the smart ring 200 can be removed from the silicone mold 10 after the glue has solidified, thus realizing the demolding operation.
[0035] The glue-filling needle 20 is a component used to fill glue into the gap K. In some embodiments, the movement trajectory of the glue-filling needle 20 may be along the extension direction of the annular groove 11 so that the glue can be fully filled to every position of the gap K.
[0036] In some embodiments, the adhesive may be an epoxy adhesive.
[0037] By setting a silicone mold 10 with an annular groove 11 and cooperating with a dispensing needle 20, an annular dispensing operation is achieved for the smart ring 200, which improves the problem of dispensing nozzles during the glue solidification process, allowing the glue to be molded in one step without secondary processing, improving the stability and consistency of the product appearance, and increasing the overall production efficiency, thereby reducing costs.
[0038] Combination Figures 1 to 3 As shown, according to some embodiments of this application, the silicone mold 10 is further provided with an adhesive guide groove 12, which is used to guide the adhesive overflowing from the annular groove 11.
[0039] During the dispensing process of the dispensing needle 20, if the dispensing volume is too large or the dispensing rate is too fast, some glue may overflow from the gap K. In this case, the overflowing glue can flow into the guide groove 12, and the guide groove 12 will discharge the excess glue, thereby reducing the glue residue on other parts of the silicone mold 10, thus reducing the time spent on cleaning the silicone mold 10 afterward, and further improving the production efficiency of the product.
[0040] By setting up the adhesive guide groove 12, the amount of adhesive residue on other parts of the silicone mold 10 is reduced, thereby reducing the time spent cleaning the silicone mold 10 and further improving the production efficiency of the product.
[0041] Combination Figures 1 to 3 As shown, according to some embodiments of this application, the adhesive guide groove 12 is located outside the annular groove 11 relative to the center of the annular groove 11.
[0042] If the height of the first inner wall 111 is greater than the height of the second inner wall 112, then the direction of glue overflow is from the first inner wall 111 toward the second inner wall 112. The glue guide groove 12 is located outside the annular groove 11, so that the overflowing glue can flow smoothly into the glue guide groove 12.
[0043] Combination Figures 1 to 3 As shown, according to some embodiments of this application, the adhesive guide groove 12 extends along the extension direction of the annular groove 11.
[0044] The adhesive guide groove 12 extends along the extension direction of the annular groove 11. It can be understood that the adhesive guide groove 12 is also annular, so that the adhesive guide groove 12 can achieve 360-degree full coverage, so that no matter where the adhesive overflows from, it can flow smoothly into the adhesive guide groove 12.
[0045] Combination Figures 1 to 3 As shown, according to some embodiments of this application, the silicone mold 10 is further provided with an observation hole 13, the inner surface of the observation hole 13 is disposed opposite to the first inner wall 111, and the portion between the inner surface of the observation hole 13 and the first inner wall 111 is configured as a transparent body.
[0046] The observation hole 13 is located inside the annular groove 11, that is, the middle part of the silicone mold 10 is hollowed out, and the part between the inner surface of the observation hole 13 and the first inner wall 111 is configured as transparent to facilitate the inspection of whether there are air bubble defects after the glue is poured.
[0047] By setting up the observation hole 13, it is possible to inspect for bubble defects after glue dispensing.
[0048] Combination Figures 1 to 3 As shown, according to some embodiments of this application, the observation hole 13 extends through the silicone mold 10.
[0049] The observation hole 13 extends through the silicone mold 10, thus fully covering the inner surface of the smart ring 200, allowing for full observation of all parts of the adhesive, reducing blind spots and improving the reliability of defect inspection.
[0050] In some embodiments, bubble defects can be observed using a camera.
[0051] Combination Figure 2 and Figure 3 As shown, according to some embodiments of this application, the silicone mold 10 also has an edge 14, which is connected to the first inner wall 111 and extends along the first inner wall 111 toward the second inner wall 112. The edge 14 is used to contact and connect with the end of the smart ring 200 away from the bottom of the groove.
[0052] The edge 14 is in contact with the end of the smart ring 200 away from the bottom of the groove. On the one hand, the edge 14 can press the smart ring 200 into the annular groove 11. On the other hand, the edge 14 can seal the glue in the gap K to a certain extent, so that the glue can solidify more reliably according to the preset shape, thereby improving the quality of the product.
[0053] Meanwhile, based on the elasticity of the silicone mold 10, the edge 14 can deform appropriately so that the glue-filling needle 20 can be inserted between the edge 14 and the end of the smart ring 200 and fill the gap K with glue.
[0054] According to some embodiments of this application, the potting device 100 for a smart ring further includes a pressing mold that mates with the silicone mold 10, and the smart ring 200 is disposed between the silicone mold 10 and the pressing mold.
[0055] After the glue is poured, the pressing mold is pressed onto the silicone mold 10, so that the glue can be formed more reliably in one step without secondary processing, which improves product quality and production efficiency.
[0056] According to some embodiments of this application, the Shore hardness of the silicone mold 10 is in the range of 40 to 50.
[0057] In some embodiments, the Shore hardness of the silicone mold 10 can be 40, 41, 42, 43, 44, 45, 46, 47, 48, 49 or 50.
[0058] By controlling the hardness of the silicone mold 10 within a suitable range, it ensures that the first inner wall 111 can maintain sufficient stability during the glue solidification process, and also allows the glue-pouring needle 20 to extend between the edge 14 and the end of the smart ring 200 and to pour glue into the gap K.
[0059] According to some embodiments of this application, the glue-potting device 100 for a smart ring further includes a drive member for driving the glue-potting needle 20 to move along the extension direction of the annular groove 11.
[0060] In some embodiments, the drive element may be a robotic arm.
[0061] The drive unit moves the dispensing needle 20 to perform a circular dispensing operation, so that the glue can be fully filled into every part of the gap.
[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A potting device for smart rings, characterized in that, include: A silicone mold is provided with an annular groove adapted to a smart ring. The annular groove includes a first inner wall and a second inner wall arranged opposite to each other. The first inner wall is arranged opposite to the inner surface of the smart ring and forms a gap with the inner surface of the smart ring. Along the direction of the axis of the annular groove, the height of the first inner wall relative to the bottom of the annular groove is greater than or equal to the height of the smart ring, and the height of the second inner wall relative to the bottom of the groove is less than the height of the smart ring. A glue-filling needle is used to inject glue into the gap.
2. The potting device for a smart ring according to claim 1, characterized in that, The silicone mold is also provided with a glue guide groove, which is used to discharge the glue overflowing from the annular groove.
3. The potting device for a smart ring according to claim 2, characterized in that, The adhesive guide groove is located outside the annular groove relative to its center.
4. The potting device for a smart ring according to claim 2, characterized in that, The adhesive guide groove extends along the extension direction of the annular groove.
5. The potting device for a smart ring according to claim 1, characterized in that, The silicone mold is also provided with an observation hole, the inner surface of which is opposite to the first inner wall; the portion between the inner surface of the observation hole and the first inner wall is configured as a transparent body.
6. The potting apparatus for a smart ring according to claim 5, characterized in that, The observation hole extends through the silicone mold.
7. The potting device for a smart ring according to claim 1, characterized in that, The silicone mold also has an edge, which is connected to the first inner wall and extends along the first inner wall toward the second inner wall. The edge is used to contact and connect with the end of the smart ring that is away from the bottom of the groove.
8. The potting device for a smart ring according to claim 1, characterized in that, The potting device for the smart ring also includes a pressing mold that mates with the silicone mold, and the smart ring is disposed between the silicone mold and the pressing mold.
9. The potting device for a smart ring according to claim 1, characterized in that, The Shore hardness of the silicone mold is in the range of 40 to 50.
10. The potting apparatus for a smart ring according to any one of claims 1 to 9, characterized in that, The glue-potting device for smart rings further includes a driving component for driving the glue-potting needle to move along the extension direction of the annular groove.