A semiconductor refrigeration plate aging test equipment

Abstract

This utility model discloses a semiconductor refrigeration chip aging test device, including an upper shell and a lower shell. The upper shell houses an electronic control component and a temperature control component. The lower shell houses a TEC (Thermal Design Temperature) placement plate with a placement groove. A drainage channel communicating with the placement groove is formed at the bottom of the TEC placement plate. A condensate collection plate with a collection groove is formed below the TEC placement plate in the lower shell. The drainage channel communicates with the collection groove. This utility model, through a condensate drainage and collection system, allows condensate generated on the surface of the semiconductor refrigeration chip to flow from the placement groove through the drainage channel to the collection groove and be collected. This timely drainage prevents condensate accumulation, thus reducing the likelihood of affecting the test results and improving the stability and accuracy of the test results.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor refrigeration chip testing, and in particular to a semiconductor refrigeration chip aging test device. Background Technology

[0002] A thermoelectric cooler (TEC) is a solid-state cooling element based on the Peltier effect, composed of alternating P-type and N-type semiconductor materials. When direct current passes through it, electrons migrate within the semiconductor, absorbing heat on the cold side and releasing heat on the hot side, thus achieving temperature control without mechanical parts.

[0003] Thermal cycling test is one of the important test items in the aging test of thermoelectric coolers. The thermal cycling test simulates the alternation of hot and cold in actual use and detects material fatigue caused by thermal stress. The test method usually involves setting the thermoelectric cooler to cycle between high temperature and low temperature, and recording the cooling efficiency and resistance change after each cycle to evaluate the thermal stress fatigue and long-term reliability of the thermoelectric cooler.

[0004] During testing, the cold surface of a thermoelectric cooler rapidly cools to below the ambient dew point temperature. When humid air comes into contact with this low-temperature surface, water vapor condenses into liquid water due to the sudden drop in temperature. Especially when testing thermoelectric coolers in large batches, if the condensate is not removed in time, excessive accumulation may change the humidity of the testing environment, interfere with the stability of the temperature control system, and thus affect the test results. Utility Model Content

[0005] This invention provides a semiconductor refrigeration chip aging test device to solve the technical problem of condensation accumulation affecting test results.

[0006] This utility model provides a semiconductor refrigeration chip aging test device, including an upper shell and a lower shell. The upper shell is provided with an electronic control component and a temperature control component. The lower shell is provided with a TEC placement plate, which has a placement groove. A water flow groove communicating with the placement groove is formed at the bottom of the TEC placement plate. A condensate collection plate is provided below the TEC placement plate in the lower shell, which has a collection groove. The water flow groove is connected to the collection groove.

[0007] Furthermore, the bottom wall of the placement tank slopes downward from one side to the other, and the water trough is connected to the lower side of the placement tank.

[0008] Furthermore, both the placement trough and the inner wall of the water flow trough are provided with a hydrophobic insulating layer.

[0009] Furthermore, the collection tank is equipped with a water pipe assembly, and the condensate collection plate is provided with an inlet and an outlet, both of which are connected to the water pipe assembly.

[0010] Furthermore, the water pipe assembly includes a vertical section, a horizontal section, and a water valve. The upper end of the vertical section is connected to the water channel, and the lower end of the vertical section is connected to the horizontal section through the water valve. The horizontal section is connected to the water outlet, or to the water inlet and the water outlet.

[0011] Furthermore, the placement tank, water flow tank, collection tank, and water pipe assembly are provided in several groups, and the several groups of water pipe assemblies are connected to each other.

[0012] Furthermore, a heat dissipation baffle is provided between the TEC placement plate and the condensate collection plate.

[0013] Furthermore, the upper housing is provided with a power supply and a circuit board that are electrically connected. The electronic control component includes an electronic control probe that is electrically connected to the circuit board, and / or the temperature control component includes a TEC hot side temperature control probe and a TEC cold side temperature control probe that are electrically connected to the circuit board.

[0014] Furthermore, the upper housing edge is provided with a protrusion, and the lower housing edge is provided with a groove that mates with the protrusion. The upper housing and the lower housing are detachably connected through the protrusion and the groove.

[0015] Furthermore, the groove includes a first groove and a second groove, with the first groove located above the second groove. When the protrusion engages with the first groove, the electronically controlled probe can be disconnected from the thermoelectric cooler. When the protrusion engages with the second groove, the electronically controlled probe can be electrically connected to the thermoelectric cooler.

[0016] The beneficial effects of this invention are as follows: The semiconductor refrigeration chip aging test equipment of this invention, by setting a placement slot and a water flow channel on the TEC placement plate, and a collection slot on the condensate collection plate, with the placement slot, water flow channel, and collection slot connected, allows for timely removal of condensate during testing. When the semiconductor refrigeration chip is placed in the placement slot, the condensate generated on its surface during testing flows from the placement slot through the water flow channel to the collection slot and is collected there. This prevents condensate from accumulating and thus minimizes its impact on test results, improving the stability and accuracy of the test results. Furthermore, during large-scale testing of semiconductor refrigeration chips, the rapid accumulation of condensate, combined with the condensate discharge and collection system, further reduces the risk of electrical short circuits and corrosion, effectively improving safety and reliability. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of the semiconductor cooling chip aging test equipment of this utility model.

[0018] Figure 2 This is a cross-sectional view of the condensate collection plate of this utility model. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. Moreover, features in the embodiments of the present invention can be combined with each other without conflict.

[0020] like Figures 1-2 As shown, this utility model provides a semiconductor refrigeration chip aging test device, including an upper housing 1 and a lower housing 2. The upper housing 1 is provided with an electrical control component and a temperature control component. The lower housing 2 is provided with a TEC placement plate 5, a placement groove 51 is opened on the TEC placement plate 5, and a water flow groove 52 communicating with the placement groove 51 is opened at the bottom of the TEC placement plate 5. A condensate collection plate 6 is provided below the TEC placement plate 5 in the lower housing 2, and a collection groove 61 is opened on the condensate collection plate 6. The water flow groove 52 is connected to the collection groove 61.

[0021] Both the upper housing 1 and the lower housing 2 are rectangular, with the upper housing 1 covering the lower housing 2. The electrical control component and the temperature control component are important components of the semiconductor refrigeration chip aging test equipment. Both are fixedly connected within the cavity of the upper housing 1. During testing, the semiconductor refrigeration chip 101 is placed inside the semiconductor refrigeration chip aging test equipment. The electrical control component is used to apply forward and reverse power to the semiconductor refrigeration chip 101, providing conditions for cyclic switching between high and low temperatures. The temperature control component is used to monitor the temperature of the semiconductor refrigeration chip 101, acquiring its temperature data in real time. Other conventional components are not described in detail in this utility model.

[0022] A condensate collection plate 6 is placed inside the cavity of the lower housing 2, and a TEC placement plate 5 is placed on the condensate collection plate 6. Collection troughs 61 are used to collect condensate. Several collection troughs 61 are formed on the condensate collection plate 6, arranged in an array along the X and Y axes, forming a rectangular combination of 6 columns of 4 collection troughs 61, which are basically evenly distributed on the condensate collection plate 6. The upper ends of the collection troughs 61 penetrate the upper surface of the condensate collection plate 6.

[0023] Placement slot 51 is used to place the thermoelectric cooler 101, and drainage channel 52 is used to allow condensate from the surface of the thermoelectric cooler 101 to pass through. Several placement slots 51 and drainage channels 52 are provided, and their distribution is the same as that of collection channel 61, with each placement slot 51, drainage channel 52, and collection channel 61 corresponding to one another. The upper end of placement slot 51 penetrates the upper surface of the TEC placement plate 5, the upper end of drainage channel 52 connects to the lower end of placement slot 51, and the lower end of drainage channel 52 connects to the upper end of collection channel 61. The same set of placement slots 51, drainage channels 52, and collection channel 61 connects to form a condensate flow channel for the thermoelectric cooler 101.

[0024] This invention relates to a semiconductor refrigeration chip aging test device. By configuring a placement groove 51 and a water flow groove 52 on a TEC placement plate 5, and a collection groove 61 on a condensate collection plate 6, with the placement groove 51, water flow groove 52, and collection groove 61 connected, this condensate drainage and collection system allows the semiconductor refrigeration chip 101 to be placed in the placement groove 51 during testing. Condensate generated on the surface of the semiconductor refrigeration chip 101 during testing flows from the placement groove 51 through the water flow groove 52 to the collection groove 61 and is collected there. This timely drainage prevents condensate buildup, thus minimizing its impact on test results and improving the stability and accuracy of the test results. Furthermore, during large-scale testing of semiconductor refrigeration chips 101, the rapid condensate buildup further reduces the risk of electrical short circuits and corrosion due to the condensate drainage and collection system, effectively improving safety and reliability.

[0025] It should be noted that the number and distribution of the placement tank 51, the water flow tank 52 and the collection tank 61 are not limited to the rectangular arrangement described above. In practical applications, there may be only one set of placement tank 51, water flow tank 52 and collection tank 61, or multiple sets of placement tank 51, water flow tank 52 and collection tank 61 arranged in a straight line, a circle or the like, as long as the flow and collection of condensate on the surface of the semiconductor cooling chip 101 can be achieved.

[0026] In one specific embodiment, to improve the flow efficiency of condensate, the bottom wall of the placement tank 51 is designed as a slope. The bottom wall of the placement tank 51 slopes downward from one side to the other, and the water flow channel 52 is connected to the lower side of the placement tank 51, forming a gap between the bottom surface of the semiconductor cooling chip 101 and the bottom wall of the placement tank 51. The slope angle of the bottom wall of the placement tank 51 can be 1°, 5°, 10°, etc., and no specific angle is limited as long as it does not affect the test operation and results. The slope is more conducive to the drainage of condensate, accelerates the collection of condensate, and further reduces the impact of condensate on the test results.

[0027] In one specific embodiment, the inner walls of both the placement tank 51 and the water flow tank 52 are coated with a hydrophobic insulating layer to reduce the adhesion of condensate on their inner walls. Specifically, the hydrophobic insulating layer is polytetrafluoroethylene (PTFE), which is highly hydrophobic and resistant to chemical corrosion. In other embodiments, other coatings with both anti-condensation and antistatic functions can also be used, such as fluoropolymer-modified graphene, etc., which will not be listed here.

[0028] In one specific embodiment, the condensate collection plate 6 is further fixedly connected to a water pipe assembly for storing water within the collection tank 61. The collection tank 61 includes two parts: a vertical part along the Z-axis and a horizontal part along the Y-axis. Correspondingly, the water pipe assembly includes several vertical sections 71, horizontal sections 72, and a water valve 73. The vertical sections 71 and horizontal sections 72 are respectively embedded in the vertical and horizontal parts of the collection tank 61, closely adhering to the inner wall of the collection tank 61. The water valve 73 is located between the vertical sections 71 and the horizontal sections 72. One water pipe assembly corresponds to one collection tank 61 in number and one to another. One water pipe assembly includes one vertical section 71, two horizontal sections 72, and one water valve 73. The water valve 73 is a miniature three-way valve from the semiconductor field. The upper end of the vertical section 71 is connected to the lower end of the water channel 52, and the lower end of the vertical section 71 is fixedly connected to and communicates with the upper end of the water valve 73. The two ends of the water valve 73 are fixedly connected to and communicate with the two horizontal sections 72 respectively, so that the vertical section 71, the water valve 73, and the horizontal section 72 form a water flow channel divided into two from top to bottom. The two adjacent horizontal sections 72 of two adjacent water pipe assemblies in the same column are integrally formed and connected. The two horizontal sections 72 of the two water pipe assemblies at both ends of each column are integrally formed with a manifold 74 along the X-axis, connecting the water pipe assemblies at the same end of all columns.

[0029] A water inlet 62 is located at the center of one edge of the condensate collection plate 6, and a water outlet 63 is located at the center of the other edge. The middle sections of two manifold pipes 74 are connected to the water inlet 62 and the water outlet 63, respectively. After the water source is connected to the water inlet 62, water can flow in from the water inlet 62, through one manifold pipe 74, through the water pipe assembly, through the other manifold pipe 74, and finally out from the water outlet 63. Through the above technical solution, the condensate collection plate 6 can be used to collect condensate and then drain the accumulated condensate to prevent it from filling the condensate collection plate 6. The condensate collection plate 6 can also serve as a heat dissipation structure. The flowing water through the water pipe assembly can carry away the heat from the surface of the thermoelectric cooler 101, reducing the temperature difference between the surface of the thermoelectric cooler 101 and the surrounding environment, thereby reducing the generation of condensate. Moreover, the water does not directly contact the thermoelectric cooler 101 and hardly changes the temperature of the thermoelectric cooler 101 itself. Therefore, while adding a heat dissipation structure, it is possible to ensure that the surface temperature of the thermoelectric cooler 101 meets the test requirements, thereby improving the accuracy and reliability of the test results.

[0030] In one specific embodiment, if there is only one set of placement tank 51, water flow tank 52, collection tank 61 and water pipe assembly, then the two horizontal sections 72 are directly connected to the water inlet 62 and the water outlet 63 respectively, so that water can flow in and out.

[0031] In one specific embodiment, under some relatively low requirements, there may be no need for special heat dissipation. In this case, the condensate collection plate 6 does not need to play a heat dissipation role, so there is no need to set up a water inlet 62. After the condensate in the condensate collection plate 6 is full, it can be discharged directly from the water outlet 63.

[0032] In one specific embodiment, a heat dissipation baffle 8 is provided between the TEC placement plate 5 and the condensate collection plate 6. The heat dissipation baffle 8 is placed between the TEC placement plate 5 and the condensate collection plate 6, and has through holes 81 of the same number as the heat dissipation holes. The two ends of the through holes 81 are respectively connected to the lower end of the water flow channel 52 and the upper end of the collection channel 61, so that the heat dissipation baffle 8 does not affect the flow of condensate. The internal material of the heat dissipation baffle 8 is copper or aluminum with good thermal conductivity, and then a layer of insulating material polytetrafluoroethylene is coated on the surface of the copper or aluminum, thereby achieving both effective heat dissipation and prevention of short circuits. Similarly, other suitable heat dissipation materials can also be used for the heat dissipation baffle 8.

[0033] In one specific embodiment, in addition to the electronic control component and the temperature control component, a power supply and a circuit board 9 are also fixedly connected inside the upper housing 1. The power supply is electrically connected to the circuit board 9 and supplies power to the circuit board 9. The electronic control component includes an electronic control probe 31, the upper end of which is electrically connected to the circuit board 9, and the lower end is used to contact the thermoelectric cooler 101 to apply power to the thermoelectric cooler 101. The temperature control component includes a TEC hot-side temperature control probe 41 and a TEC cold-side temperature control probe 42. Both the TEC hot-side temperature control probe 41 and the TEC cold-side temperature control probe 42 are electrically connected to the circuit board 9 via wires. The TEC hot-side temperature control probe 41 and the TEC cold-side temperature control probe 42 contact the hot side and the cold side of the thermoelectric cooler 101, respectively, to monitor the surface temperature of the thermoelectric cooler 101.

[0034] In one specific embodiment, the upper housing 1 and the lower housing 2 are detachably connected. The upper housing 1 has protrusions 11 integrally formed along its length on both sides. Correspondingly, the lower housing 2 has a first groove 21 and a second groove 22 on both sides that mate with the protrusions 11, with the first groove 21 located above the second groove 22. The protrusions 11 have a certain elasticity, for example, made of rubber, and can undergo elastic deformation. After elastic deformation, the protrusions 11 can engage with the first groove 21 or the second groove 22, allowing the upper housing 1 to cover the lower housing 2 for testing, or disengage from the first groove 21 or the second groove 22, allowing the upper housing 1 to be removed from the lower housing 2 for inserting or removing the semiconductor cooling chip 101, thereby achieving a detachable connection between the upper housing 1 and the lower housing 2.

[0035] When the protrusion 11 engages with the first groove 21, there is a distance between the lower end of the electronic control probe 31 and the thermoelectric cooler 101. At this time, the lower end of the electronic control probe 31 cannot contact the thermoelectric cooler 101, i.e., it is disconnected from the thermoelectric cooler 101. When the protrusion 11 engages with the second groove 22, the lower end of the electronic control probe 31 contacts the thermoelectric cooler 101 and is connected to it. This design is to prevent the lower end of the electronic control probe 31 from colliding with the thermoelectric cooler 101 and damaging it when the upper housing 1 is quickly and forcefully closed onto the lower housing 2. This design protects the electronic control probe 31 and extends the service life of the thermoelectric cooler aging test equipment.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An aging test device for semiconductor cooling wafers, characterized in that: It includes an upper housing and a lower housing, wherein the upper housing is equipped with an electronic control component and a temperature control component; The lower housing is provided with a TEC placement plate, the TEC placement plate has a placement groove, the bottom of the TEC placement plate has a water flow groove communicating with the placement groove, and the lower housing is provided with a condensate collection plate below the TEC placement plate, the condensate collection plate has a collection groove, and the water flow groove is communicating with the collection groove.

2. The semiconductor refrigeration wafer aging test equipment according to claim 1, characterized in that: The bottom wall of the placement tank slopes downward from one side to the other, and the water channel is connected to the lower side of the placement tank.

3. The semiconductor refrigeration plate burn-in test apparatus of claim 2, wherein: Both the placement trough and the water flow trough have a hydrophobic insulating layer on their inner walls.

4. The semiconductor refrigeration piece aging test equipment according to claim 1, characterized in that: The collection tank is equipped with a water pipe assembly, and the condensate collection plate is provided with an inlet and an outlet, both of which are connected to the water pipe assembly.

5. The semiconductor refrigeration plate burn-in test apparatus of claim 4, wherein: The water pipe assembly includes a vertical section, a horizontal section, and a water valve. The upper end of the vertical section is connected to a water channel, and the lower end of the vertical section is connected to the horizontal section through the water valve. The horizontal section is connected to a water outlet, or to a water inlet and a water outlet.

6. The semiconductor refrigeration plate burn-in test apparatus of claim 5, wherein: The placement tank, water flow tank, collection tank, and water pipe assembly are provided in several groups, and the several groups of water pipe assemblies are connected to each other.

7. The semiconductor refrigeration wafer aging test equipment according to claim 5, characterized in that: A heat dissipation baffle is provided between the TEC placement plate and the condensate collection plate.

8. The semiconductor refrigeration wafer aging test equipment according to claim 1, characterized in that: The upper housing contains an electrically connected power supply and a circuit board. The electronic control component includes an electronic control probe electrically connected to the circuit board, and / or the temperature control component includes a TEC hot-side temperature control probe and a TEC cold-side temperature control probe electrically connected to the circuit board.

9. The semiconductor refrigeration plate burn-in test apparatus of claim 8, wherein: The upper housing has a protrusion on its edge, and the lower housing has a groove on its edge that mates with the protrusion. The upper housing and the lower housing are detachably connected by the protrusion and the groove.

10. The semiconductor refrigeration plate burn-in test apparatus of claim 9, wherein: The groove includes a first groove and a second groove. The first groove is located above the second groove. When the protrusion engages with the first groove, the electronically controlled probe can be disconnected from the thermoelectric cooler. When the protrusion engages with the second groove, the electronically controlled probe can be electrically connected to the thermoelectric cooler.

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