Electronic device

CN224746774UActive Publication Date: 2026-09-11BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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Patent Information

Application Number
CN202522017167.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-18
Publication Date
2026-09-11
Estimated Expiration
2035-09-18

AI Technical Summary

Technical Problem

但是,灌胶工艺的顺利执行需要依靠在中框上形成的灌胶孔,影响中框强度,而且灌胶制程要求高,容差性差

Benefits of technology

[0022]由上述实施例可知,本公开中通过密封件的密封可以在壳体组件上不开孔的情况下,实现显示面板与壳体组件之间的防水密封,可以提升壳体组件的强度和美观性,可以简化加工制程,提高容差性。

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Abstract

The present disclosure relates to an electronic device. The electronic device includes a display panel, a housing assembly including a bezel and a carrier plate disposed inside the bezel, the display panel being stacked with the carrier plate, an adhesive stage disposed at a non-display side of the display panel, a first adhesive member adhered between the carrier plate and the adhesive stage, the first adhesive member continuously extending from a first end to a second end along the bezel, a gap between the first end and the second end corresponding to a sound transceiving area, a second adhesive member located inside the first adhesive member and adhered between the carrier plate and the display panel, the second adhesive member covering the gap between the first end and the second end, and a sealing member disposed between the first adhesive member and the second adhesive member, the sealing member sealing a gap surrounded by the first end, the second adhesive member, the carrier plate, the adhesive stage, and the display panel, and a gap surrounded by the second end, the second adhesive member, the carrier plate, the adhesive stage, and the display panel.
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Description

Technical Field

[0001] This disclosure relates to the field of terminal technology, and more particularly to an electronic device. Background Technology

[0002] Currently, the mainstream method for sealing the gap between the screen and the mid-frame is potting. This involves injecting glue to create a waterproof structure between the screen and the mid-frame, achieving an airtight seal. However, the successful execution of the potting process relies on potting holes formed in the mid-frame, which affects the strength of the mid-frame. Furthermore, the potting process has high requirements and poor tolerance. Utility Model Content

[0003] This disclosure provides an electronic device to address the shortcomings of the related art.

[0004] According to embodiments of this disclosure, an electronic device is provided, comprising:

[0005] Display panel;

[0006] A housing assembly, the housing assembly including a frame and a carrier plate, the carrier plate being disposed inside the frame, and the display panel being stacked with the carrier plate;

[0007] A glue platform, wherein the glue platform is disposed on the non-display side of the display panel;

[0008] A first adhesive component is bonded between the carrier plate and the adhesive platform. The first adhesive component extends continuously from a first end along the frame to a second end, and a gap corresponding to a sound transceiver area is formed between the first end and the second end.

[0009] The second adhesive is located inside the first adhesive and is bonded between the carrier plate and the display panel, and the second adhesive covers the gap between the first end and the second end.

[0010] A sealing element is disposed between the first adhesive element and the second adhesive element to seal the gap formed by the first end, the second adhesive element, the carrier plate, the adhesive platform and the display panel, as well as the gap formed by the second end, the second adhesive element, the carrier plate, the adhesive platform and the display panel.

[0011] Optionally, the sealant may include an adhesive dispensing component.

[0012] Optionally, the carrier plate includes an overflow ramp located between the first adhesive and the second adhesive, and the dispensing element is bonded to the overflow ramp.

[0013] Optionally, the dispensing component includes a dammed silicone component.

[0014] Optionally, at least one of the first adhesive and the second adhesive is provided on the inner side of any position of the frame.

[0015] Optionally, the adhesive platform includes an annular adhesive platform, which corresponds to the recessed platform provided in the sound transceiver area.

[0016] Optionally, the surfaces of the annular adhesive platform that are bonded to the first adhesive member are at the same height.

[0017] Optionally, the first adhesive and / or the second adhesive may include an adhesive backing layer.

[0018] Optionally, the display panel includes a cover plate and a support layer. The cover plate forms the display side surface of the display panel, and the support layer forms the non-display side surface of the display panel. The adhesive platform is connected to the inner side of the cover plate and the inner side of the support layer, respectively, and the second adhesive is bonded to the support layer.

[0019] Optionally, the display panel includes a bent encapsulation portion;

[0020] The second adhesive extends continuously from the third end along the frame to the fourth end, and in the thickness direction of the electronic device, the projection of the bent encapsulation portion is located between the projection of the third end and the projection of the fourth end.

[0021] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0022] As can be seen from the above embodiments, the sealing of the sealing element in this disclosure can achieve a waterproof seal between the display panel and the housing assembly without opening holes in the housing assembly, which can improve the strength and aesthetics of the housing assembly, simplify the processing procedure, and improve tolerance.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0025] Figure 1 This is a top view schematic diagram of an electronic device according to an exemplary embodiment.

[0026] Figure 2 This is a schematic diagram illustrating the connection between a display panel and a substrate according to an exemplary embodiment.

[0027] Figure 3This is a top view of a partial structure of an electronic device according to an exemplary embodiment.

[0028] Figure 4 This is a partial cross-sectional schematic diagram of an electronic device according to an exemplary embodiment.

[0029] Figure 5 This is a partial cross-sectional schematic diagram of another electronic device according to an exemplary embodiment.

[0030] Figure 6 This is a side view schematic diagram of an electronic device according to an exemplary embodiment.

[0031] Figure 7 This is a schematic diagram illustrating another connection between a display panel and a mounting base according to an exemplary embodiment.

[0032] Figure 8 This is a cross-sectional schematic diagram of an annular adhesive platform according to an exemplary embodiment. Detailed Implementation

[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0034] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0035] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0036] Figure 1 This is a top view schematic diagram of an electronic device according to an exemplary embodiment. Figure 2This is a schematic diagram illustrating the connection between a display panel and a mounting base according to an exemplary embodiment. Figure 3 This is a partial structural top view of an electronic device according to an exemplary embodiment. Figure 4 This is a partial cross-sectional schematic diagram of an electronic device according to an exemplary embodiment. For example... Figures 1-4 As shown, the electronic device includes a display panel 1 and a housing assembly 2, which are assembled together. The housing assembly 2 includes a frame 21 and a carrier plate 22, with the carrier plate 22 disposed inside the frame 21. The display panel 1 and the carrier plate 22 are stacked together. A buffer layer can be provided between the display panel 1 and the carrier plate 22 to protect the display panel 1 in the event of an impact. The frame 21 and the carrier plate 22 can be an integral structure or separate structures that are subsequently fixedly connected through a process; this application does not impose any limitations on this.

[0037] The electronic device also includes a glue platform 3, a first adhesive component 4, a second adhesive component 5, and a sealing component 6, wherein the glue platform 3 is disposed on the non-display side of the display panel 1. The glue platform 3 may include a low-pressure injection molding platform, for example, it can be formed on the non-display side of the display panel 1 using a LIPO (Low-Injection Pressurized Overmolding) process. In some embodiments, the glue platform 3 can be bonded to the cover plate 11 of the display panel 1, and surround other layers of the display panel 1 on the inner side; or in other embodiments, such as... Figure 4 As shown, the display panel 1 includes a cover plate 11 and a support layer 12. The cover plate 11 can form the display side surface of the display panel 1, and the support layer 12 can form the non-display side surface of the display panel 1. The adhesive platform 3 can be connected to the inner side of the cover plate 11 and the inner side of the support layer 12 of the display panel 1 respectively, and can also be connected to the layer structure located between the cover plate 1 and the support layer 12, thereby covering the uneven area on the side of the display panel 1 and improving the waterproof performance.

[0038] The first adhesive component 4 is bonded between the carrier plate 22 and the adhesive platform 3. The first adhesive component 4 extends continuously from the first end 41 along the frame 21 to the second end 42. The first end 41 and the second end 42 form a gap corresponding to the sound transmission and reception area, that is, a sound transmission and reception channel can be formed at this position, such as the earpiece channel or the speaker channel. Furthermore, each position of the first adhesive component 4 is connected to the adhesive platform 3. Thus, on the entire ring structure of the frame 21, except for the gap between the first end 41 and the second end 42, the first waterproof seal between the display panel 1 and the housing assembly 2 can be achieved through the bonding of the adhesive platform 3 and the first adhesive component 4.

[0039] The second adhesive 5 is located inside the first adhesive 4 and is bonded between the carrier plate 22 and the display panel 1. Specifically, the second adhesive 5 can bond the carrier plate 22 and the support layer 12, thereby forming a second waterproof seal between the display panel 1 and the housing assembly 2 through the bonding of the second adhesive 5. Furthermore, the second adhesive 5 can cover the gap between the first end 41 and the second end 42, for example... Figure 3 As shown, in the vertical direction, the projection of the second adhesive 5 covers the projection of the gap between the first end 41 and the second end 42, thus forming at least one waterproof sealing structure in the sound transceiver area.

[0040] Furthermore, such as Figure 4 As shown, the sealing element 6 can seal the gap formed by the first end 41, the second adhesive element 5, the carrier plate 22, the adhesive platform 3, and the display panel 1. In other words, the sealing element 6 can seal the gap formed by the first adhesive element 4 and the second adhesive element 5, preventing moisture from the sound transceiver area from entering the electronic device through this gap. Specifically, when the side of the adhesive platform 3 contacts the side of the second adhesive element 5 after the display panel 1 is pressed together, the sealing element 6 can enter the gap between the adhesive platform 3 and the second adhesive element 5 to connect with the display panel 1 in order to improve airtightness. Of course, the sealing element 6 can also seal the gap formed by the second end 42, the second adhesive element 5, the carrier plate 22, the adhesive platform 3, and the display panel 1; for details, please refer to the embodiment of the first end 41.

[0041] Based on this technical solution, after forming the first adhesive component 4 and the second adhesive component 5 on the carrier plate 22, sealing components 6 can be formed at the interval between the first end 41 of the first adhesive component 4 and the second adhesive component 5, and at the interval between the second end 42 of the first adhesive component 4 and the second adhesive component 5. The display panel 1 can then be pressed and assembled onto the housing assembly 2. This design allows for a waterproof seal between the display panel 1 and the housing assembly 2 without opening holes in the housing assembly 2, improving the strength and aesthetics of the housing assembly 2, simplifying the manufacturing process, and increasing tolerance.

[0042] In this embodiment, to ensure that at least one waterproof seal is provided on the inner side of the frame 21, at least one of a first adhesive member 4 and a second adhesive member 5 is provided on the inner side of any position of the frame 21. For example... Figure 3 As shown, a second adhesive 5 is provided at the position corresponding to the interval area between the first end 41 and the second end 42, and a first adhesive is provided in the area cut off by the second adhesive 5 at the opposite end, so as to ensure that the entire circumference of the frame 21 can be waterproofed.

[0043] In some embodiments, to improve the sealing effect of the seal 6, the seal 6 may include an adhesive dispensing component. This allows adhesive to be applied to the space formed by the first end 41, the second adhesive 5, and the carrier plate 22 before assembling the display panel 1. Subsequently, the display panel 1 is pressed together, causing the display panel 1 and the adhesive platform 3 to bond to the adhesive dispensing component, thereby improving the airtightness of the electronic device. Further, as... Figure 5 As shown, when dispensing to form a dispensing component, in order to assist the flow of adhesive and provide an overflow path for the adhesive, the carrier plate 22 also includes an overflow slope 221 located between the first adhesive component 4 and the second adhesive component 5, and the dispensing component is bonded to the overflow slope 221.

[0044] The dispensing component may include a damming silicone component, which utilizes its excellent adhesion and strength to improve the sealing effect and reliability. The first adhesive component 4 may include an adhesive backing layer, and the second adhesive component 5 may also include an adhesive backing layer, resulting in stable and firm adhesion with a simple process. The damming silicone component may include an organic silicone material, which has good moisture-proof and insulating properties. It can form a dam between the first adhesive component 4 and the second adhesive component 5 to fill the gap and achieve a seal. The damming silicone component can be a cured component formed by heating after dispensing.

[0045] In some embodiments, the adhesive platform 3 is an annular adhesive platform to improve the airtightness of the electronic device, and the annular adhesive platform can be adaptively designed according to the sound path of the sound transceiver area. For example, in some embodiments, such as Figure 1 The electronic device shown forms a sound transceiver port located on the display side of the electronic device, or as... Figure 6 As shown, the electronic device forms a sound transceiver port located on the side of the housing assembly 2. To prevent sound from being blocked by the annular adhesive platform, as... Figure 7 and Figure 8 As shown, the annular rubber platform includes a recessed platform 31 corresponding to the sound transceiver area. The recessed platform 31 provides an effective path for sound transmission, and the sealing of the sealing member 6 can further protect against moisture entering through the sound transmission path.

[0046] Furthermore, the surfaces of the annular adhesive platform and the first adhesive member 4 are at the same height, thus ensuring that there are no gaps between the annular adhesive platform and the first adhesive member 4 that cannot be sealed. In particular, when the annular adhesive platform is connected to the surface of the support layer 12, the annular adhesive platform can shield the height difference caused by the difference in the stacking dimensions on the side of the display panel 1, achieving a good sealing effect between the adhesive platform 3 and the first adhesive member 4.

[0047] In the above embodiments, the second adhesive member 5 extends continuously from the third end 51 along the frame 21 to the fourth end 52. Furthermore, in the thickness direction of the electronic device, the projection of the bent encapsulation portion of the display panel 1 is located between the projection of the third end 51 and the projection of the fourth end 52. This avoids the second adhesive member 5 occupying the "chin" area of ​​the electronic device, thus facilitating the achievement of an extremely narrow bezel effect. The bent encapsulation portion houses the signal lines and gate lines of the display panel 1. Through the connection between the bent encapsulation portion and the driver IC and display cable of the display panel 1, the transmission of control signals to the display panel 1 is achieved.

[0048] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0049] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, comprising: include: Display panel; A housing assembly, the housing assembly including a frame and a carrier plate, the carrier plate being disposed inside the frame, and the display panel being stacked with the carrier plate; A glue platform, wherein the glue platform is disposed on the non-display side of the display panel; A first adhesive component is bonded between the carrier plate and the adhesive platform. The first adhesive component extends continuously from a first end along the frame to a second end, and a gap corresponding to the sound transceiver area is formed between the first end and the second end. The second adhesive is located inside the first adhesive and is bonded between the carrier plate and the display panel, and the second adhesive covers the gap between the first end and the second end. A sealing element is disposed between the first adhesive element and the second adhesive element to seal the gap formed by the first end, the second adhesive element, the carrier plate, the adhesive platform and the display panel, as well as the gap formed by the second end, the second adhesive element, the carrier plate, the adhesive platform and the display panel.

2. The electronic device of claim 1, wherein, The sealing element includes an adhesive dispensing component.

3. The electronic device of claim 2, wherein, The carrier plate includes an overflow ramp located between the first adhesive and the second adhesive, and the dispensing component is bonded to the overflow ramp.

4. The electronic device of claim 2, wherein, The dispensing components include silicone dam components.

5. The electronic device of claim 1, wherein, At least one of the first adhesive and the second adhesive is provided on the inner side of any position of the frame.

6. The electronic device of claim 1, wherein, The adhesive platform includes an annular adhesive platform, which corresponds to the recessed platform provided in the sound transceiver area.

7. The electronic device of claim 6, wherein, The surfaces of the annular adhesive platform that are bonded to the first adhesive component are at the same height.

8. The electronic device of claim 1, wherein, The first adhesive and / or the second adhesive include an adhesive backing layer.

9. The electronic device of claim 1, wherein, The display panel includes a cover plate and a support layer. The cover plate forms the display side surface of the display panel, and the support layer forms the non-display side surface of the display panel. The adhesive platform is connected to the inner side of the cover plate and the inner side of the support layer, respectively. The second adhesive is bonded to the support layer.

10. The electronic device of any of claims 1-9, wherein, The display panel includes a bent encapsulation section; The second adhesive extends continuously from the third end along the frame to the fourth end, and in the thickness direction of the electronic device, the projection of the bent encapsulation portion is located between the projection of the third end and the projection of the fourth end.