Intermediary connecting plate, grounding structure thereof, packaging module and electronic device

Abstract

This disclosure relates to an interfacing board and its grounding structure, packaging module, and electronic device. The grounding structure includes a plurality of first metal lines extending along a first direction and spaced apart in a second direction, and a plurality of second metal lines extending along the second direction and spaced apart in the first direction; the plurality of first metal lines intersect with the plurality of second metal lines. This grounding structure achieves higher integration density, improved shielding effect, and reduced crosstalk by arranging the plurality of first and second metal lines in the first and second directions.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more specifically, to an interposer board and its grounding structure, a packaging module, and an electronic device. Background Technology

[0002] Interposers, as a key component of advanced packaging technology, utilize microbumps to electrically interconnect with chips and the packaging substrate, enabling information exchange between the chip and the packaging substrate. Interposers typically contain multiple layers of signal lines to facilitate signal transmission between multiple chips, and grounding structures are required between adjacent layers of signal lines to reduce crosstalk.

[0003] In related technologies, with increasing integration and design rule limitations, current grounding structures can no longer meet the needs of high-density cabling. Utility Model Content

[0004] The purpose of this disclosure is to provide an intermediary connection board and its grounding structure, packaging module and electronic device. The grounding structure achieves higher integration density, improves shielding effect and reduces crosstalk by arranging multiple first metal lines and multiple second metal lines in a first direction and a second direction.

[0005] To achieve the above objectives, according to a first aspect of this disclosure, a grounding structure for an interfacing plate is provided, the grounding structure including a plurality of first metal wires extending along a first direction and spaced apart in a second direction, and a plurality of second metal wires extending along the second direction and spaced apart in the first direction; the plurality of first metal wires intersect with the plurality of second metal wires.

[0006] Optionally, the spacing between two adjacent second metal lines is greater than the spacing between two adjacent first metal lines; Wherein, the first direction is the signal transmission direction.

[0007] Optionally, the spacing B between two adjacent second metal lines and the spacing A between two adjacent first metal lines satisfy: 1.5A≤B≤2A.

[0008] Optionally, the width of the second metal wire is greater than the width of the first metal wire.

[0009] Optionally, the first direction is perpendicular to the second direction.

[0010] According to a second aspect of this disclosure, an intermediate connection plate is provided, including the grounding structure described above.

[0011] Optionally, the interfacing board includes alternately stacked isolation layers and signal layers, with the grounding structure disposed on the isolation layers.

[0012] Optionally, the interfacing board further includes a substrate layer and a shielding layer, with the isolation layer and the signal layer located between the substrate layer and the shielding layer.

[0013] According to a third aspect of this disclosure, an encapsulation module is provided, including the grounding structure described above or the intermediate connection board described above.

[0014] According to a fourth aspect of this disclosure, an electronic device is also provided, including the aforementioned packaging module.

[0015] The grounding structure disclosed herein employs multiple spaced first metal lines and multiple spaced second metal lines, with the first and second metal lines intersecting to form a mesh structure. This arrangement of the first and second metal lines in both a first and a second direction achieves higher integration density and improves shielding effectiveness. This grounding structure can be placed between two layers of signal lines to reduce crosstalk, or it can be placed on one side of a signal line to reduce interference from other devices on the other side, thus meeting the high-density wiring requirements of the interfacing board.

[0016] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a structural diagram of a grounding structure provided in some embodiments of this disclosure; Figure 2 This is a structural diagram of an intermediate connection plate provided in some embodiments of this disclosure; Figure 3 This is a structural diagram of a grounding structure provided in some other embodiments of this disclosure; Figure 4 This is a schematic diagram of the structure of the packaging module provided in some embodiments of this disclosure.

[0018] Explanation of reference numerals in the attached figures 1-Intermediate connection board; 2-Chip; 3-Packaging substrate; 10 - Isolation layer; 20 - Signal layer; 21 - Signal line; 30 - Substrate layer; 40 - Shielding layer; 100 - Grounding structure; 110 - First metal wire; 120 - Second metal wire. Detailed Implementation

[0019] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0020] In this disclosure, unless otherwise stated, directional terms such as "upper," "lower," "left," and "right" generally refer to upper, lower, left, and right relative to the figures; "inner" and "outer" refer to the inner and outer contours of the corresponding components; and "far" and "near" refer to the corresponding structure or component being away from or near another structure or component. In the figures of this disclosure, X indicates a first direction, i.e., the signal transmission direction of the signal line; Y indicates a second direction; and Z indicates the thickness direction of the intermediate connecting plate. Furthermore, the terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not have sequential or importance implications. In addition, in the following description, when referring to the figures, unless otherwise explained, the same reference numerals in different figures denote the same or similar elements. The above definitions are for explanation and illustration only and should not be construed as limiting this disclosure.

[0021] Interposers, as key components of advanced packaging technologies, utilize microbumps to electrically interconnect chips and the packaging substrate, enabling information exchange between them. Interposers typically contain multiple layers of signal lines to facilitate signal transmission between multiple chips, and grounding structures are required between adjacent layers of signal lines to reduce crosstalk. However, with the continuous increase in I / O density and the increasingly finer and denser signal line layouts, current grounding structures are no longer sufficient to meet the demands of high-density wiring.

[0022] The purpose of this disclosure is to provide an intermediary connection board 1 and its grounding structure 100, a packaging module and an electronic device. The grounding structure 100 achieves higher integration density, improves shielding effect and reduces crosstalk by arranging a plurality of first metal lines 110 and a plurality of second metal lines 120 in a first direction and a second direction.

[0023] To achieve the above objectives, such as Figures 1 to 4 As shown, according to a first aspect of this disclosure, a grounding structure 100 for an intermediate connection plate 1 is provided. The grounding structure 100 includes a plurality of first metal wires 110 extending along a first direction and spaced apart in a second direction, and a plurality of second metal wires 120 extending along the second direction and spaced apart in the first direction. The plurality of first metal wires 110 intersect with the plurality of second metal wires 120.

[0024] Through the above technical solution, namely the grounding structure 100 of this disclosure, multiple spaced first metal lines 110 and multiple spaced second metal lines 120 are used, and the multiple first metal lines 110 and multiple second metal lines 120 intersect to form a mesh structure. That is, by arranging the multiple first metal lines 110 and multiple second metal lines 120 in the first and second directions, a higher integration density is achieved. Through simulation and testing, this grounding structure can improve the shielding effect. Therefore, this grounding structure 100 can be arranged between two layers of signal lines 21 to reduce crosstalk between signal lines 21, or it can be arranged on one side of the signal line 21 to reduce interference from other devices on the other side of the signal line 21, so as to meet the high-density wiring requirements of the intermediate connection board 1.

[0025] It should be noted that the first and second directions here are defined with respect to the plane where the intermediate connecting plate 1 is located. That is, the plane formed by the first and second directions corresponds to the plane where the intermediate connecting plate 1 is located, and both the first and second directions are perpendicular to the thickness direction of the intermediate connecting plate 1.

[0026] It is understood that the grounding structure 100 includes a plurality of first metal lines 110 extending along a first direction, and the plurality of first metal lines 110 are spaced apart in a second direction. The grounding structure 100 also includes a plurality of second metal lines 120 extending along a second direction, and the plurality of second metal lines 120 are spaced apart in the first direction. The plurality of first metal lines 110 and the plurality of second metal lines 120 intersect to interconnect, thereby forming a cross-sectional structure (when the first direction is perpendicular to the second direction) or an approximately cross-sectional structure (when the first direction is not perpendicular to the second direction), thereby improving the signal shielding effect.

[0027] The grounding structure 100 can have multiple layers arranged along the thickness direction within the intermediate connection plate 1. Signal lines 21 can be arranged between two adjacent grounding structures 100, which can avoid crosstalk problems between multiple signal lines 21. The multi-layer grounding structure 100 can be interconnected in the thickness direction. The specific connection structure can adopt the structure known in related technologies, or it can be interconnected through through-holes in the thickness direction, such as through-silicon vias (TSVs).

[0028] It should be noted that the first metal wire 110 and the second metal wire 120 can be made of conductive metal materials, such as copper or nickel.

[0029] To further improve the shielding effect, such as Figure 1 As shown, in some embodiments, the spacing between two adjacent second metal lines 120 is greater than the spacing between two adjacent first metal lines 110; wherein, the first direction is the signal transmission direction.

[0030] The first metal line 110 extends in the same direction as the signal transmission direction, while the second metal line 120 extends perpendicular to the signal transmission direction. By making the spacing between two adjacent second metal lines 120 larger than the spacing between two adjacent first metal lines 110, and by placing the grounding structure 100 within the intermediate connection plate 1, electromagnetic coupling between adjacent signal lines 21 during signal transmission can be effectively reduced, thereby reducing crosstalk. This design is particularly effective in high-frequency signal transmission scenarios, significantly improving signal integrity and system reliability.

[0031] like Figure 1 As shown, the grounding structure 100 includes a plurality of first metal lines 110 and a plurality of second metal lines 120. The first metal lines 110 extend along the signal transmission direction, and the distance between two adjacent first metal lines 110 is A. The second metal lines 120 may extend in a direction that forms an angle with the signal transmission direction, and the distance between two adjacent second metal lines 120 is B, where B is greater than A.

[0032] The values ​​of A and B are set appropriately according to the requirements of signal frequency and package size. In some embodiments, the spacing B between two adjacent second metal lines 120 and the spacing A between two adjacent first metal lines 110 satisfy: 1.5A≤B≤2A. By setting the spacing between the second metal lines 120 to 1.5 to 2 times the spacing between the first metal lines 110, a better crosstalk suppression effect is obtained.

[0033] The widths of the first metal wire 110 and the second metal wire 120 can be appropriately selected. In some embodiments, the width of the second metal wire 120 is greater than the width of the first metal wire 110. While achieving the shielding effect, this also reduces the amount of metal material used, thereby lowering costs.

[0034] It should be noted that the width of the second metal line 120 can also be equal to the width of the first metal line 110, which can also meet the shielding effect. Here, the minimum width of the first metal line 110 and the second metal line 120 needs to be designed according to the signal strength of the signal line 21, the transmission method, and the interlayer spacing between the signal lines 21.

[0035] In some embodiments, the first direction is perpendicular to the second direction. For example... Figure 1 As shown, the first metal line 110 extending along the first direction and the second metal line 120 extending along the second direction are perpendicular to each other, and the first direction corresponds to the signal transmission direction. It should be noted that the first direction may not be perpendicular to the second direction; that is, the angle between the first and second directions is less than 90°. For example, the angle between the first and second directions can be 30°, 45°, 60°, or 75°, etc. Similarly, grounding can also be used to reduce crosstalk.

[0036] like Figure 2 , Figure 3 As shown, according to a second aspect of this disclosure, an intermediary connection board 1 is provided, which includes the grounding structure 100 described above. The grounding structure 100 can isolate signal lines 21 within the intermediary connection board 1 from each other, or isolate signal lines 21 from other structural layers (e.g., substrate layer 30). Therefore, the intermediary connection board 1 also possesses all the advantages of the grounding structure 100 described above.

[0037] It should be noted that the interposer is an intermediate structure used in the chip 2 packaging, mainly for connecting different chips 2, or for electrical or signal connections between chip 2 and the substrate.

[0038] The intermediate connecting plate 1 can be based on silicon, glass, or organic materials, such as BT (Bismaleimide Triazine) resin, ABF (Ajinomoto Build-up Film) resin, etc.

[0039] In some embodiments, the interfacing board 1 includes alternately stacked isolation layers 10 and signal layers 20, with a grounding structure 100 disposed on the isolation layers 10. The signal layers 20 are used to arrange signal lines 21, and the isolation layers 10 are used to avoid or reduce crosstalk. Disposing the grounding structure 100 on the isolation layers 10 can solve the crosstalk problem of the signal lines 21 within the signal layers 20.

[0040] Both isolation layer 10 and signal layer 20 are multi-layered and arranged alternately. Signal layer 20 and isolation layer 10 can each be two layers, arranged from bottom to top as alternating layers of signal layer 20, isolation layer 10, signal layer 20, and isolation layer 10. An isolation layer 10 is arranged between two signal layers 20, and this isolation layer 10 has a grounding structure 100 to prevent crosstalk between the two signal layers 20. An isolation layer 10 is also arranged above the upper signal layer 20, and this isolation layer 10 also has a grounding structure 100 to prevent crosstalk between external electrical components and the upper signal layer 20.

[0041] It should be noted that the isolation layer 10 and the signal layer 20 can also be arranged in other ways, such as... Figure 2 and Figure 3 As shown, both signal layer 20 and isolation layer 10 can be two layers, and from bottom to top, they are alternately stacked isolation layer 10, signal layer 20, isolation layer 10, and signal layer 20. By providing the aforementioned grounding structure 100 within isolation layer 10, crosstalk is avoided.

[0042] To further avoid crosstalk, such as Figure 3 As shown, in some embodiments, the interposer 1 further includes a substrate layer 30 and a shielding layer 40, with the isolation layer 10 and the signal layer 20 located between the substrate layer 30 and the shielding layer 40. The substrate layer 30 may be located at the bottom layer of the interposer 1, and may contain signal pins connected to the signal line 21 and ground pins connected to the grounding structure 100. The signal pins are used to connect to the signal terminal of the package substrate 3, and the ground pins are used to connect to the ground terminal of the package substrate 3.

[0043] To further improve the crosstalk prevention capability of the interposer board 1, in some embodiments, a shielding layer 40 can be arranged above the isolation layer 10 and the signal layer 20 of the interposer layer. The ball grid array for connection with the chip 2 can be arranged above the shielding layer 40. The shielding layer 40 can further improve the crosstalk prevention capability of the interposer layer and improve signal stability.

[0044] It should be noted that the shielding layer 40 is used for electromagnetic shielding or electrostatic protection to protect the chip 2 from external electromagnetic interference (EMI) and electrostatic discharge (ESD). The shielding layer 40 can be made of any suitable material.

[0045] For example, common shielding layer 40 materials include metallic materials such as copper (Cu) and nickel (Ni), which have good electrical conductivity and magnetic permeability and can effectively shield electromagnetic waves.

[0046] The shielding layer 40 material may also include conductive polymers. Some conductive polymer materials also have a certain electromagnetic shielding effect, while having good flexibility and processing performance.

[0047] The shielding layer 40 material can also be a composite material, such as nickel / copper / nickel coated polyester fiber cloth. This material combines the high conductivity of metals with the corrosion resistance of polymers, providing excellent shielding performance.

[0048] It is understood that the substrate layer 30, signal layer 20 and isolation layer 10 may also include other structures or corresponding devices to meet the requirements of signal transmission, insulation and encapsulation. For reference, please refer to relevant technologies, which will not be elaborated here.

[0049] like Figure 4 As shown, according to a third aspect of this disclosure, a packaging module is provided, which includes the grounding structure 100 or the intermediate connection plate 1 described above. Therefore, the packaging module also includes the advantages of the grounding structure 100 and the intermediate connection plate 1 described above.

[0050] In some embodiments, the packaging module may include a chip 2 and a packaging substrate 3. The chip 2 is connected to the packaging substrate 3 through an intermediate connection plate 1. The packaging substrate 3 is communicatively connected to the chip 2 through a signal line 21 arranged in the intermediate connection plate 1. The signal line 21 is arranged in a signal layer 20. The signal layers 20 are isolated from each other or from the substrate layer 30 through an isolation layer 10. Therefore, a grounding structure 100 formed by the intersection of multiple first metal lines 110 and multiple second metal lines 120 is arranged in the isolation layer 10 to improve shielding and reduce crosstalk.

[0051] According to a fourth aspect of this disclosure, an electronic device is also provided, which includes the above-described packaging module. Therefore, the electronic device also has all the advantages of the above-described packaging module, which will not be repeated here.

[0052] It should be noted that the electronic device includes, but is not limited to, mobile phones, smartwatches, tablets, laptops, microcontrollers, servers, etc.

[0053] The present disclosure discloses an interposer board 1, its grounding structure 100, a packaging module, and electronic devices. The grounding structure 100 employs multiple spaced first metal lines 110 and multiple spaced second metal lines 120, with the first metal lines 110 and second metal lines 120 intersecting to form a mesh structure. This arrangement of the first metal lines 110 and second metal lines 120 in both a first and a second direction achieves higher integration density and improves shielding effectiveness. The grounding structure 100 can be placed between two layers of signal lines 21 to reduce crosstalk between the signal lines 21, or it can be placed on one side of a signal line 21 to reduce interference from other devices on the other side, thus meeting the high-density wiring requirements of the interposer board 1.

[0054] Furthermore, the extension direction of the first metal line 110 is consistent with the signal transmission direction, while the extension direction of the second metal line 120 is perpendicular to the signal transmission direction. By arranging the spacing between two adjacent second metal lines 120 to be greater than the spacing between two adjacent first metal lines 110, the electromagnetic coupling between adjacent signal lines 21 during signal transmission can be effectively reduced, thereby reducing crosstalk.

[0055] Furthermore, the spacing B between two adjacent second metal lines 120 and the spacing A between two adjacent first metal lines 110 satisfy the condition: 1.5A≤B≤2A. By setting the spacing between the second metal lines 120 to 1.5 to 2 times the spacing between the first metal lines 110, this spacing design can achieve better crosstalk suppression, especially in high-frequency signal transmission scenarios.

[0056] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0057] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0058] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A ground structure of an intermediate connection plate, characterized by, The grounding structure includes a plurality of first metal wires extending along a first direction and spaced apart in a second direction, and a plurality of second metal wires extending along the second direction and spaced apart in the first direction; the plurality of first metal wires intersect with the plurality of second metal wires.

2. The grounding structure of claim 1, wherein, The spacing between two adjacent second metal lines is greater than the spacing between two adjacent first metal lines; Wherein, the first direction is the signal transmission direction.

3. The grounding structure according to claim 2, characterized in that, The spacing B between two adjacent second metal lines and the spacing A between two adjacent first metal lines satisfy: 1.5A≤B≤2A.

4. The grounding structure according to claim 1, characterized in that, The width of the second metal wire is greater than the width of the first metal wire.

5. The grounding structure according to any one of claims 1-4, characterized in that, The first direction is perpendicular to the second direction.

6. An intermediary connection plate, characterized in that, Includes the grounding structure described in any one of claims 1-5.

7. The interposer of claim 6, wherein, The interfacing board includes alternately stacked isolation layers and signal layers, with the grounding structure arranged in the isolation layers.

8. The intermediary connecting plate according to claim 7, characterized in that, The intermediate connection board further includes a substrate layer and a shielding layer, with the isolation layer and the signal layer located between the substrate layer and the shielding layer.

9. A packaging module, characterized in that, It includes the grounding structure as described in any one of claims 1-5 or the intermediate connection plate as described in any one of claims 6-8.

10. An electronic device, characterized in that, Includes the packaging module as described in claim 9.

Images