A tiled phased array transceiver assembly integrating two-dimensional and difference beamforming networks

Abstract

The application provides a tile phased array transceiving assembly integrating two-dimensional and difference beam forming networks, which comprises a fastening screw, a radio frequency and port connector, a radio frequency elevation port connector, a radio frequency azimuth port connector, a low frequency connector, an upper cavity, a welding ring, a pin, a lower cavity, a high and low frequency mixed pressure printed board, a radio frequency branch port connector, a multi-channel amplitude and phase control chip and a transceiving integrated multifunctional chip, the multi-channel amplitude and phase control chip and the transceiving integrated multifunctional chip are attached on the high and low frequency mixed pressure printed board, the radio frequency branch port connector is installed on the upper cavity, a mounting position of a wave absorbing material is reserved on the upper cavity, the low frequency connector, the pin, the radio frequency and port connector, the radio frequency elevation port connector, the radio frequency azimuth port connector and the high and low frequency mixed pressure printed board are installed on the lower cavity. The application integrates two-dimensional and difference beam forming networks, so that the transceiving assembly has the advantages of high integration, light weight, low assembly difficulty, high airtightness packaging and small size.

Description

Technical Field

[0001] This invention relates to the field of active phased array transceiver technology, and more particularly to a tile-type phased array transceiver with integrated two-dimensional sum-difference beamforming network. Background Technology

[0002] A phased array antenna is an antenna array system that achieves beamforming through phase control technology. With its characteristics of high scanning speed, high reliability, and strong anti-interference capability, phased array antennas have become a key technology in modern radar and communication systems. The core of a phased array antenna is the transceiver assembly (including circuitry and multi-functional chips). The design and integration level of the transceiver assembly directly determines the system performance and cost. Existing architectures mainly include "brick-type" and "tile-type" phased arrays. The tile-type architecture has higher integration, smaller size, and lighter weight, making it suitable for space-constrained platforms.

[0003] As an important component of the RF feed network between various modules of a phased array antenna, the two-dimensional sum-difference beamforming network distributes the RF signal sent from the transmitter to the active components when the antenna is in the transmitting state. When it is in the receiving state, it performs addition and subtraction operations on the RF received signal synthesized by the active components to form the RF sum port, RF elevation port, and RF azimuth port.

[0004] In existing technologies, transceiver components and two-dimensional sum-difference beamforming networks are often designed and packaged separately. This separate design results in low integration and large size, making it difficult to achieve miniaturization and low cost of phased array transceiver systems. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides a tile-type phased array transceiver component integrating a two-dimensional sum-difference beamforming network. This component integrates multiple RF interface connector channels and a two-dimensional sum-difference beamforming network, achieving the goals of small size, high integration, and lightweight design, thereby enabling the miniaturization and low-cost application of phased array transceiver systems.

[0006] The technical solution adopted in this invention is as follows:

[0007] A tile-type phased array transceiver assembly integrating a two-dimensional sum-difference beamforming network includes fastening screws, RF interface connectors, RF elevation interface connectors, RF azimuth interface connectors, a low-frequency connector, an upper cavity, solder rings, pins, a lower cavity, a high-low frequency mixed-voltage printed circuit board, RF splitter connectors, a multi-channel amplitude and phase control chip, and a transceiver multifunction chip. The multi-channel amplitude and phase control chip and the transceiver multifunction chip are mounted on the high-low frequency mixed-voltage printed circuit board. The RF splitter connectors, upper cavity, and lower cavity are also included. The cavity, solder ring, pin, high and low frequency mixed voltage printed circuit board, lower cavity, RF interface connector, RF pitch interface connector, RF azimuth interface connector, and low frequency connector are stacked vertically layer by layer from top to bottom; the RF interface connector is installed in the upper cavity, and the RF interface connector, RF pitch interface connector, RF azimuth interface connector, and low frequency connector are installed in the lower cavity. The upper cavity and lower cavity are fixed together by fastening screws, and the upper cavity, lower cavity, and solder ring are sealed together by laser sealing.

[0008] The RF interface connector, RF elevation interface connector, and RF azimuth interface connector are used for transmitting RF signal input and receiving RF signal output. In the transmitting direction, the transmitting RF signal input from the RF interface connector, RF elevation interface connector, and RF azimuth interface connector is distributed through two layers of RF networks, multi-channel amplitude and phase control, and transmitted power amplification by a high-low frequency mixed voltage printed circuit board, and then output to the antenna through the RF interface connector. In the receiving direction, the receiving RF signal input from the RF interface connector is the opposite. After low-noise amplification, multi-channel amplitude and phase control, and synthesis by two layers of RF distribution networks by a transceiver multifunction chip, the receiving RF signal is output to the back-end through the RF interface connector, RF elevation interface connector, and RF azimuth interface connector.

[0009] Furthermore, the low-frequency connector is used for power supply and control signal input. The power supply and control signals input from the low-frequency connector are transmitted to the high-low frequency mixed voltage printed circuit board. The voltage is distributed through the multi-layer circuit traces inside the high-low frequency mixed voltage printed circuit board. The low-frequency signal after voltage distribution is transmitted to the multi-channel amplitude and phase control chip and the transceiver multi-function chip to realize the transmission of power supply and control signals.

[0010] Furthermore, the RF port connector, RF pitch port connector, and RF azimuth port connector are integrated on the lower cavity and connected to the high- and low-frequency mixed voltage printed circuit board through the RF button on the connector itself; the low-frequency connector is integrated on the lower cavity and receives power supply and control signals through its own Kovar alloy inner conductor, which is sintered onto the low-frequency connector by glass.

[0011] Furthermore, the multi-channel amplitude and phase control chip performs amplitude and phase modulation on the RF signal, and the transceiver multi-functional chip is used for power amplification and low-noise reception of the RF signal. The high- and low-frequency mixed-voltage printed circuit board includes RF chip control and power supply lines, an RF two-dimensional sum and difference beamforming network layer, an RF power distribution and combining network layer, a microstrip line to stripline to coaxial line transition line, a stripline to coaxial line to stripline transition line, stripline shielding vias, and high-density chip thermal vias. The RF chip control and power supply lines are used to receive power and control signals, the RF two-dimensional sum and difference beamforming network layer is used to perform amplitude and phase weighting on the RF signal to achieve independent amplitude and phase control in the four quadrants, and the RF power distribution and combining network layer is used to perform amplitude and phase weighting on the RF signal. The phase is evenly divided into amplitudes. The microstrip to stripline to coaxial line transition circuit is used to convert the RF signal from microstrip form to coaxial line form. The stripline to coaxial line to stripline transition circuit is used to convert the RF signal from stripline form to coaxial line form and then back to stripline form. The stripline shielding hole is used to shield the internal stripline RF signal from the outside to reduce mutual interference between RF traces. The high-density chip heat conduction hole is used to conduct the heat generated by the multi-channel amplitude and phase control chip and the transceiver multifunction chip. The RF chip control and power supply lines are respectively connected to the multi-channel amplitude and phase control chip and the transceiver multifunction chip. The RF power distribution and synthesis network layer, the multi-channel amplitude and phase control chip and the transceiver multifunction chip are bonded by gold wire.

[0012] Furthermore, multiple RF splitter connectors are fixed on the upper cavity, and the connectors have integrated snap buttons inside. The upper cavity is connected to the RF signals of the high and low frequency mixed voltage printed circuit board through the snap buttons inside the connectors.

[0013] Furthermore, multiple slots are provided on the side of the upper cavity near the high- and low-frequency mixed-voltage printed circuit board, and absorbing materials are placed in the slots to increase isolation and reduce the radio frequency signals radiated in the space.

[0014] Furthermore, the RF interface connector, RF pitch interface connector, RF azimuth interface connector, low-frequency connector, and high-low frequency mixed voltage printed circuit board are all fixed on the lower cavity. The lower cavity is connected to the RF signal of the high-low frequency mixed voltage printed circuit board through the internal buttons of the RF interface connector, RF pitch interface connector, and RF azimuth interface connector.

[0015] Furthermore, the upper cavity, welding ring, and lower cavity are sealed together by laser welding to achieve hermetically sealed assembly of the components.

[0016] The beneficial technical effects of this invention are as follows:

[0017] The tile-type phased array transceiver component of the present invention integrates a two-dimensional sum-difference beamforming network, with a clear and concise architecture, compact structure, small size, light weight, and strong engineering practicality.

[0018] The tile-type phased array transceiver component of the present invention adopts a high-low frequency mixed-voltage printed circuit board to achieve high-density integration. The high-low frequency mixed-voltage printed circuit board integrates a radio frequency two-dimensional sum and difference beamforming network layer and a radio frequency power distribution and combining network layer, which greatly improves the integration of the component and realizes the function of two-dimensional sum and difference beamforming network while miniaturizing it.

[0019] The tile-type phased array transceiver component of this invention uses an integrated button-type RF connector for RF transmission. The inner conductor of the button is elastic, which effectively enhances the adaptability of the RF vertical transition and reduces the difficulty of RF alignment. The power supply and control use a low-frequency connector with sealing characteristics, which achieves a high airtightness level while further miniaturizing the component.

[0020] The internal radio frequency signal routing of the tile-type phased array transceiver component of the present invention is implemented in the form of strip lines, which improves the isolation between channels while ensuring the quality of radio frequency signal transmission, minimizes crosstalk between channels, and enhances the overall stability of operation.

[0021] The tile-type phased array transceiver assembly of the present invention is arranged in a hierarchical structure of upper and lower cavities. The high and low frequency mixing plate and the radio frequency interface between the upper and lower cavities are precisely aligned by pins. The upper and lower cavities are laser-sealed to achieve hermetic packaging, which has strong electromagnetic compatibility performance. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is an exploded view of the overall structure of a tile-type phased array transceiver component integrating a two-dimensional sum-difference beamforming network provided in an embodiment of the present invention;

[0024] Figure 2 This is an overall schematic diagram of the tile-type phased array transceiver assembly with an integrated two-dimensional sum-difference beamforming network after hermetically sealed assembly, provided in an embodiment of the present invention.

[0025] Explanation of reference numerals in the attached diagram: 1-Fastening screw, 2-RF port connector, 3-RF pitch port connector, 4-RF azimuth port connector, 5-Low frequency connector, 6-Lower cavity, 7-High and low frequency mixed printed circuit board, 8-Pin, 9-Solder ring, 10-Upper cavity, 11-RF split port connector. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] A tile-type phased array transceiver assembly integrating a two-dimensional sum-difference beamforming network, such as Figure 1 As shown, the assembly includes fastening screws 1, RF interface connectors 2, RF pitch interface connectors 3, RF azimuth interface connectors 4, low-frequency connectors 5, a lower cavity 6, a high-low frequency mixed-voltage printed circuit board 7, pins 8, solder rings 9, an upper cavity 10, RF split interface connectors 11, a multi-channel amplitude and phase control chip, and a transceiver multifunction chip. The multi-channel amplitude and phase control chip and the transceiver multifunction chip are mounted on the high-low frequency mixed-voltage printed circuit board 7. The RF split interface connectors 11, upper cavity 10, solder rings 9, pins 8, high-low frequency mixed-voltage printed circuit board 7, lower cavity 6, RF interface connectors 2, RF pitch interface connectors 3, RF azimuth interface connectors 4, and low-frequency connectors 5 are stacked vertically layer by layer from top to bottom. The RF interface connectors 2, RF pitch interface connectors 3, RF azimuth interface connectors 4, and low-frequency connectors 5 are installed inside the lower cavity 6. The upper cavity 10 and the lower cavity 6 are fixed together by fastening screws 1.

[0028] RF connector 2, RF elevation connector 3, and RF azimuth connector 4 are used for transmitting RF signal input and receiving RF signal output. In the transmitting direction, the transmitting RF signal input from RF connector 2, RF elevation connector 3, and RF azimuth connector 4 is distributed through two layers of RF networks, multi-channel amplitude and phase control, and transmitted power amplification by the high-low frequency mixed voltage printed circuit board 7, and then output to the antenna via RF splitter connector 11. In the receiving direction, the receiving RF signal input from RF splitter connector 11 is amplified with low noise, multi-channel amplitude and phase control, and synthesized by two layers of RF distribution networks by the high-low frequency mixed voltage printed circuit board 7, and then output to the back-end via RF connector 2, RF elevation connector 3, and RF azimuth connector 4.

[0029] The radio frequency splitter connector 11 is installed inside the upper cavity 10, and the upper cavity 10 has reserved a position for the installation of the absorbing material.

[0030] The low-frequency connector 5, pin 8, RF connector 2, RF pitch connector 3, RF azimuth connector 4, and high / low frequency mixed-voltage printed circuit board 7 are installed inside the lower cavity 6. The RF connector 2, RF pitch connector 3, and RF azimuth connector 4 are fixed inside the lower cavity 6 and connected to the circular RF aperture plate of the high / low frequency mixed-voltage printed circuit board 7 through their internal snap fasteners, thus enabling RF signal communication between the high / low frequency mixed-voltage printed circuit board 7 and the lower cavity 6. The low-frequency connector 4 is soldered onto the lower cavity 6, and its low-frequency pins pass through the high / low frequency mixed-voltage printed circuit board 7 and are soldered to the RF aperture plate on the surface of the high / low frequency mixed-voltage printed circuit board 7 to achieve power supply and control signal input. The low-frequency connector receives power supply and control signals through its own Kovar alloy inner conductor, which is sintered onto the low-frequency connector through glass.

[0031] The low-frequency connector is used for power supply and control signal input. The power supply and control signals input from the low-frequency connector are transmitted to the high-low frequency mixed voltage printed circuit board. The voltage is distributed through the multi-layer circuit traces inside the high-low frequency mixed voltage printed circuit board. The low-frequency signal after voltage distribution is transmitted to the multi-channel amplitude and phase control chip and the transceiver multi-function chip to realize the transmission of power supply and control signals.

[0032] The upper cavity 10, lower cavity 6, welding ring 9 and fastening screw 1 are sealed together by laser sealing welding to achieve high quality and high-level hermetic sealing of the transceiver assembly.

[0033] Multiple RF split connectors 11 with built-in snap fasteners are fixed on the upper cavity 10. The connectors are connected to the RF vias on the high-low frequency mixed voltage printed circuit board 7 via snap fasteners, so as to realize the RF signal connection between the high-low frequency mixed voltage printed circuit board 7 and the upper cavity 10. The upper cavity 10 has multiple slots on the side near the RF chip, and the inside is bonded with absorbing material to eliminate crosstalk between RF channels and enhance the stability of chip operation. The number of RF split connectors 11 can be set according to actual needs.

[0034] The main function of the multi-channel amplitude and phase control chip is to realize amplitude control, phase control and gain amplification of radio frequency signals. For each radio frequency signal, the multi-channel amplitude and phase control chip includes a 1-to-2 network, two gain amplification chips, two phase shifting chips, two attenuation chips and two single-pole double-throw switches. The 1-to-2 network, gain amplification chip, phase shifting chip, attenuation chip and single-pole double-throw switch are all integrated into a single GaAs chip, which greatly improves the integration of transceiver components. The main function of the transceiver multi-function chip is to realize the transmission power amplification and reception low noise amplification of the radio frequency chip. The transceiver multi-function chip includes two gain amplification chips and two single-pole double-throw switches.

[0035] The high- and low-frequency mixed-voltage printed circuit board 7 includes RF chip control and power supply lines, RF two-dimensional sum and difference beamforming network layer, RF power distribution and combining network layer, microstrip line to stripline to coaxial line transition line, stripline to coaxial line to stripline transition line, stripline shielding hole and high-density chip heat conduction hole; the RF chip control and power supply lines, RF power distribution and combining network layer, multi-channel amplitude and phase control chip, and transceiver integrated multi-functional chip are interconnected by gold wire bonding.

[0036] The high-low frequency mixed-voltage printed circuit board 7 is implemented using a multi-layer RF mixed-voltage process. Chip control and power supply lines control and power the multi-channel amplitude and phase control chip and the transceiver multifunction chip. These lines are distributed across multiple layers within the high-low frequency mixed-voltage printed circuit board 7. The RF two-dimensional sum-difference beamforming network primarily performs amplitude and phase weighting on the RF signal, achieving independent amplitude and phase control in the four quadrants. The RF two-dimensional sum-difference beamforming network includes a stripline branch bridge, impedance matching circuitry, and RF shielding vias. The RF power distribution and combining network layer is used for equal amplitude and phase distribution of RF power. It includes stripline power divider and combiner circuitry, thin-film resistors, RF vertical transitions, impedance matching circuitry, and RF shielding vias. Adjacent layers are interconnected through their respective RF vertical transitions, and RF ground planes are added between different layers to enhance isolation and reduce mutual interference between different RF layers. The stripline shielding vias primarily shield the circuitry within the beamforming network and the RF power distribution and combining network, ensuring no interference between traces and preventing signal leakage from the RF circuitry. The RF signal shares the transceiver multifunction chip, further improving the integration of the transceiver components. The multi-channel amplitude and phase control chip and the transceiver integrated multi-functional chip are placed in the corresponding slot positions inside the high-low frequency mixed voltage printed circuit board 7. The high-low frequency mixed voltage printed circuit board 7 is soldered onto the lower cavity 6 to ensure the shortest heat dissipation path. High-density chip heat conduction holes are designed inside the slot positions to fully reduce thermal resistance. The microstrip line to stripline to coaxial line transition circuit mainly converts the microstrip line RF signal near the RF splitter side into an internal coaxial RF signal for transmission and transformation. The high-low frequency mixed voltage board 7 integrates multiple microstrip line to stripline to coaxial line transition circuits, the number of which is consistent with the number of RF splitter connectors 11. The stripline to coaxial line to stripline transition circuit mainly converts the stripline RF signal near the port side into an internal coaxial RF signal for transmission and transformation. The high-low frequency mixed voltage printed circuit board 7 integrates a total of three stripline to coaxial line to stripline transition circuits. The surface of the high-low frequency mixed voltage printed circuit board 7 has multiple circular RF apertures, the number, size and relative position of which correspond one-to-one with the number of pins of multiple RF splitter connectors 11, RF port connectors 2, RF pitch port connectors 3, RF azimuth port connectors 4 and low frequency connectors 5. The high-low frequency mixed voltage printed circuit board 7 is soldered to the lower cavity 6 with lead-tin using alignment pins 8.

[0037] Figure 2This is an overall schematic diagram of the tile-type phased array transceiver assembly with an integrated two-dimensional sum-difference beamforming network after hermetically sealed assembly, provided in an embodiment of the present invention.

[0038] The tile-type phased array transceiver component designed in this invention, which integrates a two-dimensional sum-difference beamforming network, has advantages such as high integration, lightweight, low assembly difficulty, high hermeticity packaging, and small size. It overcomes the problems of low integration and large size caused by the separate design of traditional transceiver components and two-dimensional sum-difference beamforming networks, and removes the limitations on the miniaturization and low-cost application of phased array transceiver systems. It has a wide range of application value on various platforms.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A tile-type phased array transceiver assembly integrating a two-dimensional sum-difference beamforming network, characterized in that, The transceiver assembly includes: fastening screws, RF interface connectors, RF pitch interface connectors, RF azimuth interface connectors, low-frequency connectors, an upper cavity, solder rings, pins, a lower cavity, a high-low frequency mixed-voltage printed circuit board, RF split interface connectors, a multi-channel amplitude and phase control chip, and a transceiver integrated multi-function chip. The multi-channel amplitude and phase control chip and the transceiver integrated multi-function chip are mounted on the high-low frequency mixed-voltage printed circuit board. The RF split interface connectors, upper cavity, solder rings, pins, high-low frequency mixed-voltage printed circuit board, lower cavity, RF interface connectors, RF pitch interface connectors, RF azimuth interface connectors, and low-frequency connectors are vertically stacked layer by layer from top to bottom. The RF split interface connectors are installed in the upper cavity, and the RF interface connectors, RF pitch interface connectors, RF azimuth interface connectors, and low-frequency connectors are installed in the lower cavity. The upper cavity and lower cavity are fixed together by fastening screws, and the upper cavity, lower cavity, and solder ring are sealed together by laser welding. The high- and low-frequency mixed-voltage printed circuit board includes RF chip control and power supply lines, an RF two-dimensional sum-difference beamforming network layer, an RF power distribution and combining network layer, a microstrip line to stripline to coaxial line transition line, a stripline to coaxial line to stripline transition line, stripline shielding vias, and high-density chip thermal vias. The RF chip control and power supply lines receive power and control signals. The RF two-dimensional sum-difference beamforming network layer performs amplitude and phase weighting on the RF signals to achieve independent amplitude and phase control in the four quadrants. The RF power distribution and combining network layer distributes RF power equally in phase and amplitude. The microstrip line to stripline to coaxial line transition line is used to transfer RF power to the coaxial line. The signal is converted from microstrip form to coaxial line form. The stripline-to-coaxial-to-stripline transition circuit is used to convert the RF signal from stripline form to coaxial line form and then back to stripline form. The stripline shielding vias are used to shield the internal stripline RF signal from the outside to reduce mutual interference between RF traces. The high-density chip heat dissipation vias are used to conduct heat generated by the multi-channel amplitude and phase control chip and the transceiver multifunction chip. The RF chip control and power supply lines are respectively connected to the multi-channel amplitude and phase control chip and the transceiver multifunction chip. The RF power distribution and synthesis network layer, the multi-channel amplitude and phase control chip, and the transceiver multifunction chip are bonded together with gold wires. The RF port connector, RF pitch port connector, and RF azimuth port connector are integrated on the lower cavity and connected to the high-low frequency mixed voltage printed circuit board through the RF button on the connector itself; the low frequency connector is integrated on the lower cavity and receives power and control signals through its own Kovar alloy inner conductor, which is sintered onto the low frequency connector with glass. Multiple RF connectors are fixed on the upper cavity. The connectors have integrated snap buttons inside, and the upper cavity communicates with the RF signals of the high and low frequency mixed voltage printed circuit board through the snap buttons inside the connectors.

2. The phased array transceiver component according to claim 1, characterized in that, The RF interface connector, RF elevation interface connector, and RF azimuth interface connector are used for transmitting RF signal input and receiving RF signal output. In the transmitting direction, the transmitting RF signal input from the RF interface connector, RF elevation interface connector, and RF azimuth interface connector is distributed through two layers of RF networks, multi-channel amplitude and phase control, and transmitted power amplification by a high-low frequency mixed voltage printed circuit board, and then output to the antenna through the RF interface connector. In the receiving direction, the receiving RF signal input from the RF interface connector is the opposite. After low-noise amplification, multi-channel amplitude and phase control, and synthesis by two layers of RF distribution networks by a transceiver multifunction chip, the receiving RF signal is output to the back-end through the RF interface connector, RF elevation interface connector, and RF azimuth interface connector.

3. The phased array transceiver component according to claim 1, characterized in that, The low-frequency connector is used for power supply and control signal input. The power supply and control signals input from the low-frequency connector are transmitted to the high-low frequency mixed voltage printed circuit board. The voltage is distributed through the multi-layer circuit traces inside the high-low frequency mixed voltage printed circuit board. The low-frequency signal after voltage distribution is transmitted to the multi-channel amplitude and phase control chip and the transceiver multifunction chip to realize the transmission of power supply and control signals. The multi-channel amplitude and phase control chip performs amplitude and phase modulation on the radio frequency signal, and the transceiver multifunction chip is used to amplify the power of the radio frequency signal and receive it with low noise.

4. The phased array transceiver component according to claim 1, characterized in that, Multiple slots are provided on the side of the upper cavity near the high- and low-frequency mixed-voltage printed circuit board, and wave-absorbing material is placed in the slots.

5. The phased array transceiver component according to claim 1, characterized in that, The RF interface connector, RF pitch interface connector, RF azimuth interface connector, low-frequency connector, and high-low frequency mixed voltage printed circuit board are all fixed on the lower cavity. The lower cavity is connected to the RF signal of the high-low frequency mixed voltage printed circuit board through the internal buttons of the RF interface connector, RF pitch interface connector, and RF azimuth interface connector.

6. The phased array transceiver component according to claim 1, characterized in that, The upper cavity, welding ring, and lower cavity are sealed together by laser welding to achieve hermetically sealed assembly of the components.

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