A polishing pad

Abstract

The utility model discloses a kind of abrasive discs, abrasive disc includes: substrate;Abrasive layer, set in one side of substrate, including silicon carbide micro powder, silicon carbide micro powder side away from substrate is concave-convex arrangement.The concave-convex arrangement of the abrasive disc makes the fiber height control more stable when grinding ferrule, and abrasive disc is directly watered to grind to replace traditional grinding fluid, solves the problem of unstable fiber height control, chemical pollution and low efficiency in traditional grinding process.

Description

Technical Field

[0001] This utility model belongs to the field of optical fiber technology, and specifically relates to a grinding disc. Background Technology

[0002] The grinding and polishing process includes four steps: adhesive removal, medium grinding, fine grinding, and precision polishing. In the fine grinding step, traditional technology uses polyurethane polishing cloth to change the fiber height in the ferrule; the fiber height varies depending on the cloth's stiffness. During this process, a polishing slurry is added for fiber pulling. Traditional polishing slurries include silicon carbide, alumina, and cerium oxide slurries. The main components of the polishing slurry include abrasive particles, deionized water, and chemical additives. The abrasive particles include silicon carbide and alumina, while the chemical additives include oxidants, pH adjusters, and surfactants. The specific composition of the polishing slurry varies depending on the application. In the fine grinding process for fiber pulling, incomplete cleaning during grinding can leave polishing slurry residue in the ferrule's splice holes, affecting the yield of subsequent polishing processes, resulting in scratches, black and white spots, etc. Existing grinding technologies suffer from drawbacks such as significant chemical fiber contamination, difficulty in cleaning, and a decrease in fiber height with each grinding cycle. Utility Model Content

[0003] To address the aforementioned problems, the primary objective of this utility model is to provide a grinding disc that solves the technical issues of poor grinding effect and environmentally unfriendly grinding fluid caused by the current grinding process of grinding consumables.

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] This utility model provides a grinding disc, comprising:

[0006] Substrate;

[0007] The grinding layer, disposed on one side of the substrate, includes silicon carbide micro powder, which is arranged in an uneven pattern on the side away from the substrate.

[0008] By arranging silicon carbide microparticles in a concave-convex pattern on the side furthest from the substrate relative to the surface of the grinding layer, a non-uniform grinding surface is created. This avoids the over-cutting or fiber height reduction problems caused by traditional planar grinding, allowing the silicon carbide microparticle surface of the grinding disc to grind the fiber end face of the ferrule to varying depths, thereby changing the fiber height within the ferrule. This concave-convex arrangement design of the silicon carbide microparticles solves the problems of unstable fiber height control, chemical pollution, and low efficiency in traditional grinding processes, combining high precision, environmental friendliness, and economy.

[0009] Furthermore, the polishing layer also includes:

[0010] A bonding layer is applied to one side of the substrate;

[0011] Silicon carbide micropowder is disposed in the connecting layer, and the connecting layer partially encapsulates the silicon carbide micropowder; the silicon carbide micropowder at least partially protrudes from the surface of the connecting layer away from the substrate.

[0012] Furthermore, the substrate is PET polyester film.

[0013] Furthermore, the standard for the coarseness of silicon carbide micro powder is 4000 mesh.

[0014] When the standard fineness of silicon carbide micro powder is 4000 mesh, its high hardness can enable ultra-precision grinding of materials such as optical fibers and semiconductors.

[0015] Furthermore, the bonding layer includes adhesive.

[0016] Furthermore, the abrasive layer is applied to the entire surface of the substrate.

[0017] Furthermore, the connecting layer completely covers the surface of the substrate.

[0018] Furthermore, silicon carbide microparticles are distributed across the entire surface of the connecting layer, and the silicon carbide microparticles are arranged at intervals.

[0019] Furthermore, the polishing layer is fixedly connected to the substrate.

[0020] Furthermore, silicon carbide particles and a connecting layer are fixedly connected, and the connecting layer is fixedly connected to the substrate.

[0021] Compared with existing technologies, the beneficial effects of this application are as follows: The grinding disc includes a substrate; a grinding layer disposed on one side of the substrate, comprising silicon carbide micropowder, wherein the silicon carbide micropowder is arranged in a concave-convex pattern on the side away from the substrate. By having the silicon carbide micropowder arranged in a concave-convex pattern relative to the surface of the grinding layer on the side away from the substrate, a non-uniform grinding surface is formed, avoiding the problems of over-cutting or fiber height reduction caused by traditional planar grinding. This allows the surface of the silicon carbide micropowder on the grinding disc to grind the fiber end face of the ferrule to different depths, thereby obtaining changes in the fiber height within the ferrule. Through the concave-convex arrangement design of the silicon carbide micropowder, the problems of unstable fiber height control, chemical pollution, and low efficiency in traditional grinding processes are solved, achieving a combination of high precision, environmental friendliness, and economy. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a grinding disc provided by this utility model.

[0023] Figure 2 yes Figure 1 A schematic diagram of the preparation method of the grinding disc.

[0024] Figure 3 This is a schematic diagram of the test of polishing optical fiber with water using a planar polishing plate in Example 1.

[0025] Figures 4-6 This is the first set of test data for the grinding process of the existing planar grinding disc in Example 1.

[0026] Figures 7-9 This is the second set of test data for the grinding process of the existing planar grinding disc in Example 1.

[0027] Figures 10-12 This is the third set of test data for the grinding process of the existing planar grinding disc in Example 1.

[0028] Figure 13 This is a schematic diagram of the test of polishing optical fiber with water using the polishing pad of this application in Example 2.

[0029] Figures 14-16 This is the first set of test data for the grinding process of the grinding disc in Example 2.

[0030] Figures 17-19 This is the second set of test data for the grinding process of the grinding disc in Example 2.

[0031] Figures 20-22 This is the third set of test data for the grinding process of the grinding disc in Example 2.

[0032] Figure 23 This is a schematic diagram of the test of polishing optical fiber with black cloth and polishing fluid in Example 3.

[0033] Figures 24-26 This is the first set of test data for the grinding process of the black cloth in Example 3.

[0034] Figures 27-29 This is the second set of test data for the grinding process of the black cloth in Example 3.

[0035] Figures 30-32 This is the third set of test data for the grinding process of the black cloth in Example 3.

[0036] In the diagram: 100, substrate; 200, polishing layer; 210, silicon carbide powder; 220, connecting layer. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0038] To achieve the above objectives, the technical solution of this utility model is as follows:

[0039] See Figures 1 to 32The present invention provides a grinding disc, comprising: a substrate 100; and a grinding layer 200 disposed on one side of the substrate 100, comprising silicon carbide micro powder 210, wherein the silicon carbide micro powder 210 is arranged in a concave-convex shape on the side away from the substrate 100.

[0040] By arranging the silicon carbide micropowder 210 in a concave-convex pattern on the side away from the substrate 100 relative to the surface of the polishing layer 200, a non-uniform polishing surface is formed. This avoids the over-cutting or fiber height reduction problems caused by traditional planar polishing, allowing the silicon carbide micropowder 210 surface of the polishing pad to polish the fiber end face of the ferrule to different depths, thereby changing the fiber height in the ferrule. The concave-convex arrangement design of the silicon carbide micropowder 210 solves the problems of unstable fiber height control, chemical pollution, and low efficiency in traditional polishing processes, combining high precision, environmental friendliness, and economy.

[0041] Furthermore, the polishing layer 220 is applied to the entire surface of the substrate 110.

[0042] Furthermore, the polishing layer 22 is fixedly connected to the substrate 100.

[0043] The grinding layer 220 completely covers the surface of the substrate 100, which can avoid local stress concentration or uneven processing and ensure the consistency of the workpiece surface. In addition, the grinding layer 220 completely covers the surface of the substrate 100, which increases the overall working area of ​​the grinding disc, thereby improving the grinding efficiency of the grinding disc in the later stages.

[0044] Furthermore, the polishing layer 200 also includes: a connecting layer 220, which is disposed on one side of the substrate 100; silicon carbide micro powder 210 is disposed on the connecting layer 220, and the connecting layer 220 partially encapsulates the silicon carbide micro powder 210; the silicon carbide micro powder 210 at least partially protrudes from the surface of the connecting layer 220 away from the substrate 100.

[0045] Furthermore, the connecting layer 220 completely covers the surface of the substrate 100.

[0046] Furthermore, silicon carbide micro powder 210 is distributed over the entire surface of the connecting layer 220, and the silicon carbide micro powder 210 is arranged at intervals.

[0047] Furthermore, the silicon carbide particles 210 and the connecting layer 220 are fixedly connected, and the connecting layer 220 is fixedly connected to the substrate 100.

[0048] The connecting layer 220 covers the entire surface of the substrate 100, and the silicon carbide micro powder 210 is distributed throughout the connecting layer 220. The silicon carbide micro powder 210 is arranged at intervals, which enables high-precision and uniform grinding when using this grinding disc for subsequent grinding. The spaced arrangement of the silicon carbide micro powder 210 avoids abrasive accumulation, ensures that each silicon carbide micro powder 210 effectively participates in cutting, reduces waste, and the uniformly distributed abrasive wear is more consistent, avoiding premature local failure and increasing the overall wear resistance of the grinding disc.

[0049] Furthermore, the substrate 100 is a PET polyester film.

[0050] Furthermore, the coarseness standard of silicon carbide micro powder 210 is 4000 mesh, that is, the particle diameter of silicon carbide micro powder 210 is approximately 3μm to 5μm. When the coarseness standard of silicon carbide micro powder 210 is 4000 mesh, its high hardness characteristics enable ultra-precision grinding of materials such as optical fibers and semiconductors.

[0051] Furthermore, the connecting layer 220 includes adhesive.

[0052] Furthermore, the connecting layer 220 completely covers the surface of the substrate 100.

[0053] Furthermore, silicon carbide micro powder 210 is distributed over the entire surface of the connecting layer 220, and the silicon carbide micro powder 210 is arranged at intervals.

[0054] Furthermore, the silicon carbide particles 210 and the connecting layer 220 are fixedly connected, and the connecting layer 220 is fixedly connected to the substrate 100.

[0055] The connecting layer 220 covers the entire surface of the substrate 100, and the silicon carbide micro powder 210 is distributed throughout the connecting layer 220. The silicon carbide micro powder 210 is arranged at intervals, which enables high-precision and uniform grinding when using this grinding disc for subsequent grinding. The spaced arrangement of the silicon carbide micro powder 210 avoids abrasive accumulation, ensures that each silicon carbide micro powder 210 effectively participates in cutting, reduces waste, and the uniformly distributed abrasive wear is more consistent, avoiding premature local failure and increasing the overall wear resistance of the grinding disc.

[0056] The grinding disc provided by this invention features a non-uniform grinding surface formed by the uneven arrangement of silicon carbide micropowder 210 on the side away from the substrate 100 relative to the surface of the grinding layer 200. This avoids the problems of over-cutting or fiber height reduction caused by traditional planar grinding. The silicon carbide micropowder 210 surface of this grinding disc can grind the fiber end face of the ferrule to different depths, thereby changing the fiber height within the ferrule. Through the uneven arrangement design of the silicon carbide micropowder 210, the problems of unstable fiber height control, chemical pollution, and low efficiency in traditional grinding processes are solved, resulting in a product that combines high precision, environmental friendliness, and economy.

[0057] Based on the grinding disc of this application, a method for preparing the grinding disc includes the following steps:

[0058] Step 100: Mix silicon carbide micro powder, acrylic resin, isocyanate and diluent into a mixture, stir the mixture under the conditions of rotation speed r, ultrasonic power p and stirring time T1 to form a slurry, and apply the slurry to the surface of substrate 100.

[0059] In step 100, the mixing ratio of silicon carbide micro powder, acrylic resin, isocyanate, and diluent is 3:5:1:1.

[0060] In step 100, the rotational speed r is 450 r / min; and / or, the ultrasonic power p is 100 W; and / or, the stirring time T1 is 45 min.

[0061] Specifically, in step 100, 30 parts of 4000# silicon carbide micro powder 210, 50 parts of acrylic resin, 10 parts of isocyanate, and 10 parts of diluent are used. The mixture is stirred evenly with a spiral stirrer at a speed of 450 r / min under ultrasonic action. The ultrasonic power is 100w and the stirring time is 45min to form a flowing liquid as the slurry to be used. Then, the slurry is evenly coated onto one side surface of the substrate 100 using a scraper.

[0062] Step 200: Bake the slurry surface at a first temperature t1 and a first baking time T2 until it is no longer sticky and then roll it up; and bake it a second time at a second temperature t2 and a second baking time T3 to form a grinding disc.

[0063] In step 200, the first temperature t1 is 60°C, and / or the first baking time T2 is 20s.

[0064] In step 200, the second temperature t2 is 40°C, and / or the second baking time T3 is 12h.

[0065] Specifically, in step 200, the slurry is first baked in a 60°C oven for 20 seconds to allow it to dry to the touch until the surface is no longer sticky, and then rolled up; a second baking is then performed at a temperature of 40°C for 12 hours.

[0066] After step 200 is completed, that is, after baking, a grinding disc is formed. The grinding disc can be used to grind with water. There is no need to repeatedly add fiber liquid. It is easy to clean, is water-based grinding, leaves no residue, and steadily improves the yield.

[0067] Based on the polishing disc provided in this application, in order to verify the actual effect of the polishing disc and its polishing process, traditional planar polishing discs, the polishing disc of this application, and traditional black cloth were used as polishing consumables to perform polishing tests on ferrules and optical fibers. Specific embodiments are as follows:

[0068] Example 1:

[0069] Example 1 uses a common flat abrasive pad with water to achieve fiber pulling. Specifically, the common flat abrasive pad includes: a substrate, a coating on the surface of the substrate, the coating being a silicon carbide coating, and the coating being a planar coating; the substrate is made of PET material. The common flat abrasive pad is used on an automatic abrasive machine to perform a polishing test on the optical fiber. During the test, specific time, rotation speed, and pressure need to be set. In this specific example, the time set for the flat abrasive pad is 70 seconds, the rotation speed is 120 r / min, and the pressure parameter is 4000g. The optical fiber height test data obtained after the polishing test is shown in Figure 3. Figure 12 As shown, the fiber heights in the planar polishing pad are all negative. The fiber height does not bulge out, but is instead ground down, indicating that if the coating is simply a planar coating, it does not have the ability to pull the fiber.

[0070] Example 2:

[0071] This embodiment 2 specifically relates to a water-based fiber optic drawing and polishing process for MPO / MT fiber optic connectors. More specifically, it relates to a water-based fiber optic drawing and polishing process that achieves fiber height variation through the surface texture of its polishing consumable. The polishing pad includes a substrate with a coating on its surface. The coating is a silicon carbide coating, and it is not planar but has an uneven, granular texture. The substrate is made of PET material. The polishing pad of this application is used to perform polishing tests on the optical fiber on an automatic polishing machine. The polishing pad includes silicon carbide micropowder 210 with raised protrusions. The polishing time is set to 80 seconds, the rotation speed to 160 r / min, and the pressure parameter to 7000 g. The fiber height test data obtained after the polishing test is as follows: Figures 13-22 As shown, the fiber height has a certain value, approximately 1300-1600 mm, indicating a certain fiber height. Therefore, the uneven structure of the silicon carbide micropowder 210 makes the fiber height control more stable. This application's polishing pad directly replaces traditional polishing slurries, such as those containing chemical additives, with water, avoiding residual contamination such as scratches, black and white spots, and other defects. Furthermore, post-polishing cleaning is convenient, saving time and increasing production capacity. Additionally, using this polishing pad eliminates the costs of purchasing polishing slurry and treating waste liquid, meeting green production requirements.

[0072] Example 3:

[0073] Example 3 involves applying a polishing solution to either black or white cloth to complete the fiber drawing process. Specifically, both the black and white cloth are made of polyester fiber. The optical fiber is polished on an automatic polishing machine using either black or white cloth. The parameters set for the black cloth polishing test are the same as those set for the polishing test using the polishing pad in Example 2, i.e., the polishing time is set to 80 seconds, the rotation speed to 160 r / min, and the pressure to 7000 g. Figures 23-32The data shows that the fiber height also reaches 1300-1600, which is similar to the data from the polishing test using a polishing pad in the example.

[0074] As can be seen from Examples 1 and 2, although the coating of the substrate is the same, the fiber pulling action cannot be achieved without an uneven, granular texture. Examples 2 and 3 show that although the substrates are different, the achieved effect is basically the same. Therefore, the abrasive pad of this application can completely replace the traditional black or white cloth. Thus, the water-based abrasive pad polishing process of this application can replace the traditional black cloth and abrasive liquid process, achieving a certain fiber height. The most significant advantage is that the water-based abrasive pad polishing process is easy to clean, leaving no abrasive liquid particles that could affect the next polishing step, reducing the proportion of polishing scratches, and further improving the yield.

[0075] It should be noted that traditional polyurethane polishing cloths are reusable, but wear and tear can cause incomplete polishing of the optical fiber, resulting in physical damage to the end face of the optical fiber and the appearance of cracks. In contrast, the polishing pad of this application is a disposable polishing consumable, which greatly improves the fiber height consistency after polishing the optical fiber with the polishing pad and completely solves the problem of fiber height reduction in traditional processes.

[0076] The grinding disc and its preparation method provided in this application are applied to the fine grinding process, where fiber drawing can be achieved using the grinding disc and water. In the optical fiber grinding process using this grinding disc, a PET polyester film replaces the traditional polyurethane polishing cloth as the substrate 100 or carrier, and water replaces the traditional polishing slurry as the polishing medium. Fiber drawing is achieved using the silicon carbide micropowder 210 on the surface of the grinding layer 200, i.e., using the uneven particles on the surface of the polishing consumable. The silicon carbide micropowder 210 on the surface of the grinding layer 200 provides a non-planar grinding state for the ferrule, i.e., making the ferrule surface undulating, thereby allowing for variations in fiber height.

[0077] Based on the above-mentioned polishing pad and its preparation method, the process of polishing optical fibers using polishing pads has the following advantages: 1. Polishing optical fibers directly with water using the polishing pad requires only one addition of water, eliminating the need for repeated addition of fiber slurry. This significantly improves the uniformity of fiber height after polishing, completely solving the problem of fiber height reduction in traditional processes, and ensuring stable polishing throughout the process; 2. Polishing optical fibers with water using this polishing pad is water-based polishing, leaving no residue. It saves 1-3 minutes per reel, resulting in a sharp increase in production capacity. Cleaning is also convenient and efficiency is improved; 3. It makes the end-face polishing quality of optical fibers more stable, significantly reducing the scrap rate, ensuring better quality, and achieving a yield rate exceeding 95%; 4. By replacing traditional polishing slurry with water, the use of chemical fiber slurry is reduced, lowering waste liquid treatment costs, making green production more compliant, and achieving environmental protection and energy conservation.

[0078] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A grinding disc, characterized in that, include: Substrate; The grinding layer, disposed on one side of the substrate, includes silicon carbide micro powder, which is arranged in an uneven pattern on the side away from the substrate.

2. The grinding disc according to claim 1, characterized in that, The polishing layer also includes: A bonding layer is applied to one side of the substrate; Silicon carbide micropowder is disposed in the connecting layer, and the connecting layer partially encapsulates the silicon carbide micropowder; the silicon carbide micropowder at least partially protrudes from the surface of the connecting layer away from the substrate.

3. The grinding disc according to claim 1, characterized in that, The substrate is PET polyester film.

4. The grinding disc according to claim 1, characterized in that, The standard for the coarseness of silicon carbide micro powder is 4000 mesh.

5. The grinding disc according to claim 1, characterized in that, The bonding layer includes adhesive.

6. The grinding disc according to claim 1, characterized in that, The abrasive layer covers the entire surface of the substrate.

7. The grinding disc according to claim 2, characterized in that, The bonding layer completely covers the surface of the substrate.

8. The grinding disc according to claim 7, characterized in that, Silicon carbide microparticles are distributed throughout the connecting layer, and the silicon carbide microparticles are arranged at intervals.

9. A grinding disc according to claim 6, characterized in that, The polishing layer is fixedly connected to the substrate.

10. A grinding disc according to claim 8, characterized in that, Silicon carbide particles and a connecting layer are fixedly connected, and the connecting layer is fixedly connected to the substrate.

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