A 400G DR4 optical engine

Abstract

The utility model relates to a 400G DR4 light engine, a sunken groove that is larger than the size of the cover plate in the optical fiber array is arranged on the upper surface of the PCB board, gold-plated copper sheets are respectively arranged on the upper surface of the PCB board and the groove bottom of the sunken groove, a pad block that is smaller than the size of the cover plate in the optical fiber array is fixed on the gold-plated copper sheet of the sunken groove bottom, the cover plate of the optical fiber array is bonded to the pad block by using glue, and a PD that is coupled with the optical fiber array is fixed on the gold-plated copper sheet on the upper surface of the PCB board below the optical fiber array. The cover plate of the optical fiber array is bonded to the pad block by using glue during coupling, so that the gap between the V groove in the optical fiber array and the gold-plated copper sheet is increased, the overflowed glue cannot be filled between the gold-plated copper sheet and the V groove in the optical fiber array, the V groove in the optical fiber array is prevented from being damaged due to the expansion of the glue at high and low temperatures, and the edge of the pad block can be wrapped by the glue, so that the optical fiber array is better prevented from falling off the pad block.

Description

Technical Field

[0001] This utility model relates to the field of optical engine technology, specifically to a 400G DR4 optical engine. Background Technology

[0002] The structure of a traditional 400G DR4 optical engine includes a PCB board and a fiber optic array. The upper surface of the PCB board has a gold-plated copper foil. The cover plate of the fiber optic array is bonded to spacers using adhesive, typically UV adhesive. A photodiode (PD) coupled to the fiber optic array is fixed below the fiber optic array on the gold-plated copper foil on the upper surface of the PCB board. A TIA chip electrically connected to the PD is also located on the gold-plated copper foil on the upper surface of the PCB board. The fiber optic array uses a 42.5° fiber optic array. The cover plate of the fiber optic array is made of glass. Since the thickness of the PD is typically 150μm... Therefore, the thickness of the cover plate in a fiber optic array is generally 150μm to 170μm. UV adhesive is used to fix the fiber optic array during coupling. Due to the small thickness of the cover plate, the UV adhesive easily overflows and fills the gap between the V-groove and the gold-plated copper foil in the fiber optic array. The coefficient of thermal expansion of the glass cover plate in the fiber optic array is 3.3ppm / ℃, while the coefficient of thermal expansion of the UV adhesive is generally >20ppm / ℃. At high and low temperatures (especially high temperatures), the expansion of the UV adhesive will push the V-groove in the fiber optic array to the upper left, causing damage to the V-groove. Figure 1 As shown, in addition, because the gold-plated copper sheet is too smooth, its adhesion to UV adhesive is very weak, which makes the fiber array easy to fall off. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a 400G DR4 optical engine to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A 400G DR4 optical engine includes a PCB board and an optical fiber array. A recessed groove larger than the cover plate of the optical fiber array is formed on the upper surface of the PCB board. Gold-plated copper foil is provided on the upper surface of the PCB board and the bottom of the recessed groove. A pad smaller than the cover plate of the optical fiber array is fixed on the gold-plated copper foil at the bottom of the recessed groove. The cover plate of the optical fiber array is glued to the pad. A PD coupled to the optical fiber array is fixed on the gold-plated copper foil on the upper surface of the PCB board below the optical fiber array.

[0005] The beneficial effects of this utility model are as follows: By opening a groove larger than the cover plate in the fiber optic array on the upper surface of the PCB board, and fixing a pad smaller than the cover plate in the fiber optic array on the gold-plated copper foil at the bottom of the groove, the cover plate of the fiber optic array is glued to the pad during coupling. This increases the gap between the V-groove in the fiber optic array and the gold-plated copper foil, preventing the overflowing glue from filling the gap between the gold-plated copper foil and the V-groove in the fiber optic array. At high and low temperatures, this avoids damage to the V-groove in the fiber optic array due to glue expansion. Since the size of the pad is smaller than the size of the cover plate in the fiber optic array, the glue can wrap around the edge of the pad, thus better preventing the fiber optic array from falling off the pad.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the pad is made of ceramic, and the adhesive is UV adhesive.

[0008] The further beneficial effect of adopting the above is that the rough surface of the ceramic pad has strong adhesion to the UV adhesive, thereby preventing the fiber array from falling off the ceramic pad.

[0009] Furthermore, the pad is fixed to the gold-plated copper sheet at the bottom of the settling tank by adhesive bonding.

[0010] Furthermore, the pads are bonded to the gold-plated copper sheet at the bottom of the settling tank using silver glue.

[0011] The further beneficial effects of the above are as follows: since the silver paste contains silver, it can be cured at a high temperature of 150°C, which makes the bonding force between the pad and the gold-plated copper sheet at the bottom of the settling tank reliable, thereby preventing the pad from falling off the gold-plated copper sheet at the bottom of the settling tank.

[0012] Furthermore, the upper surface of the pad is lower than the gold-plated copper foil on the upper surface of the PCB board.

[0013] The further beneficial effect of adopting the above is that the thickness of the cover plate in the fiber array can be designed to be 200μm to 300μm, thus becoming thicker and easier to process.

[0014] Furthermore, the thickness of the pad is above 0.3mm.

[0015] The further beneficial effect of adopting the above is that it has sufficient thickness to allow for a sufficiently large gap between the V-groove in the fiber array and the gold-plated copper foil.

[0016] Furthermore, the pad is 0.2 mm smaller on each side than the cover plate in the fiber array.

[0017] The further beneficial effect of adopting the above is that the glue can wrap around the edge of the pad, thereby better preventing the fiber array from falling off the pad.

[0018] Furthermore, a TIA chip electrically connected to the PD is located on the gold-plated copper foil on the surface of the PCB board.

[0019] Furthermore, the fiber array adopts a 42.5° fiber array, and the cover plate in the fiber array is made of glass. Attached Figure Description

[0020] Figure 1 This is a schematic diagram showing how the UV adhesive in a 400G DR4 optical engine expands and pushes against the V-groove in the upper left direction in the existing technology. Figure 2 This is a structural diagram of the 400G DR4 optical engine in this utility model.

[0021] The attached diagram lists the components represented by each number as follows: 1. PCB board, 110. Sink, 120. Gold-plated copper foil, 2. Fiber optic array, 210. Cover plate, 3. Spacer, 4. Adhesive, 5. PD, 6. Silver paste, 7. TIA chip. Detailed Implementation

[0022] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0023] Example 1 like Figure 2As shown, a 400G DR4 optical engine includes: a PCB board 1 and an optical fiber array 2. A recess 110 is formed on the upper surface of the PCB board 1. The size of the recess 110 is larger than the size of the cover plate 210 in the optical fiber array 2. A gold-plated copper sheet 120 is provided on the upper surface of the PCB board 1. A gold-plated copper sheet 120 is also provided at the bottom of the recess 110. A pad 3 is fixed on the gold-plated copper sheet 120 at the bottom of the recess 110. The size of the pad 3 is smaller than the size of the cover plate 210 in the optical fiber array 2. The cover plate 210 of the optical fiber array 2 is bonded to the pad 3 with glue 4. A PD5 coupled to the optical fiber array 2 is fixed on the gold-plated copper sheet 120 on the upper surface of the PCB board 1 below the optical fiber array 2. By forming a recess 110 on the upper surface of the PCB board 1, the PD5 is larger than the size of the cover plate 210 in the optical fiber array 2. In the fiber array 2, a large-sized recessed groove 110 is formed by fixing a pad 3 smaller than the cover plate 210 in the fiber array 2 onto the gold-plated copper sheet 120 at the bottom of the recessed groove 110. During coupling, the cover plate 210 of the fiber array 2 is bonded to the pad 3 with glue 4, thereby increasing the gap between the V-groove in the fiber array 2 and the gold-plated copper sheet 120. This prevents the overflowing glue 4 from filling the gap between the gold-plated copper sheet 120 and the V-groove in the fiber array 2. At high and low temperatures, this avoids damage to the V-groove in the fiber array 2 due to the expansion of the glue 4. Since the size of the pad 3 is smaller than the size of the cover plate 210 in the fiber array 2, the glue 4 can wrap around the edge of the pad 3, thus better preventing the fiber array 2 from falling off the pad 3.

[0024] Example 2 like Figure 2 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The pad 3 is made of ceramic, and the glue 4 is UV glue. The surface of the ceramic pad 3 is rough and the UV glue has strong adhesion, thus preventing the fiber array 2 from falling off the ceramic pad 3.

[0025] Example 3 like Figure 2 As shown, this embodiment is a further improvement on embodiment 2, as detailed below: The pad 3 is fixed to the gold-plated copper sheet 120 at the bottom of the sink 110 by adhesive bonding. As a preferred option, the pad 3 is bonded to the gold-plated copper sheet 120 at the bottom of the sink 110 using silver glue 6. Since the silver glue 6 contains silver, it can be cured at a high temperature of 150°C, which makes the adhesion between the pad 3 and the gold-plated copper sheet 120 at the bottom of the sink 110 reliable, thereby preventing the pad 3 from falling off the gold-plated copper sheet 120 at the bottom of the sink 110. The fiber array 2 cannot withstand a high temperature of 150°C, and it can only withstand 120°C.

[0026] Example 4 like Figure 2As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: The upper surface of the pad 3 is lower than the gold-plated copper foil 120 on the upper surface of the PCB board 1, which allows the cover plate 210 in the fiber array 2 to be designed to be 200μm to 300μm thick, thus becoming thicker (compared to 150μm to 170μm in the prior art), making it easier to process. The specific implementation method is to adjust the thickness of the pad 3 and / or the depth of the groove 110.

[0027] Example 5 like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 4, as detailed below: The thickness of the pad 3 is above 0.3mm, which means that the depth of the sink 110 is above 0.3mm. The pad 3 has sufficient thickness to make the gap between the V-groove in the fiber array 2 and the gold-plated copper sheet 120 large enough.

[0028] Example 6 like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below: The pad 3 is 0.2mm smaller on each side than the cover plate 210 in the fiber array 2, so that the glue 4 can wrap around the edge of the pad 3, thereby better preventing the fiber array 2 from falling off the pad 3.

[0029] Example 7 like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 6, as detailed below: A TIA chip 7, electrically connected to PD5, is mounted on the gold-plated copper foil 120 on the upper surface of PCB board 1. Fiber optic array 2 adopts a 42.5° fiber optic array, and the cover plate 210 in fiber optic array 2 is made of glass.

[0030] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A 400G DR4 optical engine, characterized in that, include: A PCB board (1) and an optical fiber array (2) are provided. A recessed groove (110) larger than the cover plate (210) in the optical fiber array (2) is opened on the upper surface of the PCB board (1). Gold-plated copper foil (120) is provided on the upper surface of the PCB board (1) and the bottom of the recessed groove (110). A pad (3) smaller than the cover plate (210) in the optical fiber array (2) is fixed on the gold-plated copper foil (120) at the bottom of the recessed groove (110). The cover plate (210) of the optical fiber array (2) is bonded to the pad (3) with glue (4). A PD (5) coupled to the optical fiber array (2) is fixed on the gold-plated copper foil (120) on the upper surface of the PCB board (1) below the optical fiber array (2).

2. A 400G DR4 optical engine according to claim 1, characterized in that, The pad (3) is made of ceramic, and the adhesive (4) is UV adhesive.

3. A 400G DR4 optical engine according to claim 1 or 2, characterized in that, The pad (3) is fixed to the gold-plated copper sheet (120) at the bottom of the sink (110) by adhesive bonding.

4. A 400G DR4 optical engine according to claim 3, characterized in that, The pad (3) is bonded to the gold-plated copper sheet (120) at the bottom of the sink (110) using silver glue (6).

5. A 400G DR4 optical engine according to claim 1, characterized in that, The upper surface of the pad (3) is lower than the gold-plated copper foil (120) on the upper surface of the PCB board (1).

6. A 400G DR4 optical engine according to claim 5, characterized in that, The thickness of the pad (3) is 0.3 mm or more.

7. A 400G DR4 optical engine according to claim 1, characterized in that, The pad (3) is 0.2 mm smaller on each side than the cover plate (210) in the fiber array (2).

8. A 400G DR4 optical engine according to claim 1, characterized in that, The PCB board (1) has a TIA chip (7) electrically connected to the PD (5) on the gold-plated copper skin (120) on its upper surface.

9. A 400G DR4 optical engine according to claim 1, characterized in that, The fiber array (2) adopts a 42.5° fiber array, and the cover plate (210) in the fiber array (2) is made of glass.

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