A carrier for electroplating and an electroplating apparatus

Abstract

This utility model belongs to the field of electroplating technology, and discloses an electroplating carrier and an electroplating apparatus. The electroplating carrier includes a conductive carrier strip and at least one fixed base. The conductive carrier strip is provided with at least one contact element, which can contact the terminals of the device to be electroplated. The fixed base is disposed on the conductive carrier strip, and the conductive carrier strip is used to support the fixed base. The fixed base is provided with a positioning cavity, which is used to accommodate the device to be electroplated and define the position of the device to be electroplated. This utility model can improve the consistency of the current-carrying opportunities of multiple terminals and can simultaneously plate multiple terminals, resulting in high plating efficiency. In addition, by setting up the conductive carrier strip, it not only transmits current to the exposed surface of the terminal for electroplating, but also supports the fixed base, which can be applied to continuous plating production lines. By combining the conductive carrier strip, contact element, and fixed base, a plating carrier can be used for electroplating, resulting in low cost.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to an electroplating carrier and electroplating device. Background Technology

[0002] In electronic devices such as inductors, the terminals require electroplating. However, due to the small size of these devices, barrel plating is commonly used. Barrel plating involves placing the component to be plated in a barrel, relying on the weight of the component itself or external force to connect the terminals to the cathode, allowing metal electrodeposition to occur during barrel rotation. However, with the integration of electronic devices, there are often multiple terminals with inconsistent distributions. In traditional barrel plating, the inconsistent distribution of the terminals leads to inconsistent electroplating, resulting in some terminals not being plated.

[0003] Alternatively, rack plating can be used to electroplate such electronic devices. In rack plating, the part to be plated is suspended on a rack, which is then immersed in the plating solution as the cathode. Anodes are placed at appropriate distances on both sides, and when energized, metal ions are deposited on the surface of the part. Existing rack plating uses hanging points to clamp inductors and other electronic devices for plating; however, because these devices have many terminals, rack plating efficiency is low and costs are high. Therefore, there is an urgent need for a plating carrier and plating apparatus to solve the aforementioned technical problems. Utility Model Content

[0004] The purpose of this utility model is to provide an electroplating carrier and electroplating device, which can improve the consistency of the timing of multiple terminals being powered, and can simultaneously plate multiple terminals, resulting in high plating efficiency and low cost, and can be applied to continuous plating production lines.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] On the one hand, an electroplating carrier is provided, comprising:

[0007] A conductive carrier tape, wherein the conductive carrier tape is provided with at least one contact element, the contact element being able to contact the terminals of the device to be electroplated;

[0008] At least one fixing base is disposed on the conductive carrier strip, the conductive carrier strip being used to support the fixing base; the fixing base is provided with a positioning cavity, the positioning cavity being used to accommodate the device to be electroplated and to define the position of the device to be electroplated.

[0009] In some possible implementations, the conductive carrier tape is provided with at least one first through hole, the contact is fixed to the conductive carrier tape and extends toward the first through hole, the contact is a sheet-like structure, and the contact can make elastic contact with the terminals of the device to be electroplated.

[0010] In some possible implementations, the conductive carrier tape and the contact form an integrated structure, the integrated structure including a first molded body and a first bent portion, the first bent portion being connected to the first molded body and capable of contacting the terminal.

[0011] In some possible implementations, the fixing seat includes a seat body and two hooks, the two hooks being disposed opposite each other on both sides of the seat body along the length direction, and together with the seat body forming the positioning cavity.

[0012] In some possible implementations, the hook has an operating element on the side away from the positioning cavity.

[0013] In some possible implementations, the base body has a first positioning protrusion on both sides along the width direction, and the first positioning protrusion can fit against the device to be electroplated.

[0014] In some possible implementations, the conductive carrier tape is provided with at least one set of fastening components, each fastening component being provided in a one-to-one correspondence with the fixing base. Each fastening component includes two fastening members, each fastening member having a fastening hole. Both sides of the fixing base are provided with buckles, and the two buckles are fastened in a one-to-one correspondence with the two fastening holes.

[0015] In some possible implementations, the conductive carrier tape is provided with a second through hole, and the fastener is fixed to the inner wall of the second through hole; the conductive carrier tape and the fastener form an integrated structure, the integrated structure including a second forming body and a second bending portion, the second bending portion being connected to the second forming body, and the second bending portion being provided with the fastening hole.

[0016] In some possible implementations, the end of the contact member is bent away from the positioning cavity to form a third bend, the bend of which can contact the terminal; and / or,

[0017] The contact element is first bent towards the positioning cavity, and then the end of the contact element is bent away from the positioning cavity to form a fourth bend, the bend of which can contact the terminal; and / or,

[0018] The end of the contact element is bent toward the positioning cavity to form a fifth bend, the end of which can contact the terminal; and / or,

[0019] Both the conductive carrier and the contact are provided with an insulating layer, and the fixing base is made of insulating material.

[0020] On the other hand, an electroplating apparatus is provided, including a cathode and an electroplating carrier as described in any of the above embodiments, wherein the cathode is electrically connected to the conductive carrier.

[0021] The beneficial effects of this utility model are:

[0022] This utility model provides an electroplating carrier, including a conductive carrier strip and at least one fixed base. During electroplating, the device to be electroplated is placed in a positioning cavity to accommodate and define its position. Simultaneously, a contact element contacts the terminals of the device to be electroplated. Current flows sequentially through the conductive carrier strip, the contact element, and to the exposed surface of the terminals, thereby electroplating the terminals. Since all terminals in contact with the contact element are energized and plated, the consistency of the energizing opportunities for multiple terminals is improved, and multiple terminals can be plated simultaneously, resulting in high plating efficiency. Furthermore, by providing the conductive carrier strip, it not only transmits current to the exposed surface of the terminals for electroplating but also supports the fixed base. The conductive carrier strip can act as a long roll, moving the device to be electroplated from one electroplating tank to another, making it suitable for continuous plating production lines. Combining the conductive carrier strip, contact element, and fixed base creates a plating carrier with low cost. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the electroplating carrier provided in Embodiment 1 of this utility model;

[0024] Figure 2 This is a first-view structural schematic diagram of the conductive carrier tape, contact, fixing base and the device to be electroplated involved in Embodiment 1 of this utility model;

[0025] Figure 3 This is an exploded view of the conductive carrier tape, contact, fixing base, and device to be electroplated according to Embodiment 1 of this utility model;

[0026] Figure 4 This is a second-view structural schematic diagram of the conductive carrier tape, contact, fixing base and the device to be electroplated involved in Embodiment 1 of this utility model;

[0027] Figure 5 This is a schematic diagram of the structure of the fixing base involved in Embodiment 1 of this utility model;

[0028] Figure 6 This is a schematic diagram of the electroplating carrier provided in Embodiment 2 of this utility model;

[0029] Figure 7 This is a first-view structural schematic diagram of the conductive carrier, contact, fixing base and the device to be electroplated involved in Embodiment 2 of this utility model;

[0030] Figure 8This is an exploded view of the conductive carrier tape, contact, fixing base, and device to be electroplated involved in Embodiment 2 of this utility model;

[0031] Figure 9 This is a structural schematic diagram of the fixing base involved in Embodiment 2 of this utility model.

[0032] In the picture:

[0033] 1. Conductive carrier tape; 11. First through hole; 12. Connecting hole; 13. Positioning hole; 14. Second through hole; 2. Contact element; 3. Fixing base; 31. Positioning cavity; 32. Base body; 321. First positioning protrusion; 322. Second positioning protrusion; 33. Hook; 34. Buckle; 4. Operating element; 5. Fastening element; 51. Fastening hole; 10. First bend; 20. Second bend; 30. Fourth bend; 40. Fifth bend; 50. Bending line;

[0034] 100. Component to be electroplated; 101. Terminal. Detailed Implementation

[0035] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar parts or parts having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0036] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0039] This invention provides an electroplating apparatus, including a cathode and an electroplating carrier, wherein the cathode is electrically connected to a conductive carrier belt 1. This electroplating apparatus can improve the consistency of the timing of the power supply to multiple terminals 101, and can simultaneously plate multiple terminals 101, resulting in high plating efficiency and low cost.

[0040] Optionally, the electroplating apparatus also includes a vibrating element, which is used to change the contact position between the contact 2 and the exposed surface of the terminal 101 during the electroplating process. This reduces the possibility that the contact 2 will always be in contact with one position of the terminal 101 during the electroplating process, resulting in the failure of film deposition at that contact position, and ensures the integrity of the electroplated layer in the electroplating area as much as possible. Optionally, the electroplating apparatus also includes an electroplating tank, which can move the device 100 to be electroplated on the fixed base 3 from one electroplating tank to another by pulling the conductive carrier belt 1.

[0041] Example 1

[0042] like Figures 1 to 5 As shown, this embodiment provides an electroplating carrier, including a conductive carrier strip 1 and at least one fixing base 3. The conductive carrier strip 1 is provided with at least one contact 2, which can contact the terminals 101 of the device 100 to be electroplated. The device 100 to be electroplated can be an electronic component such as an inductor, transformer, or capacitor. Specifically, one contact 2 can correspond to one terminal 101, or one contact 2 can correspond to multiple terminals 101, as long as the terminals 101 in the device 100 to be electroplated can be electrically connected through the contact 2. Optionally, as... Figure 1 As shown, the conductive carrier tape 1 is provided with a connection hole 12, which can be used to connect with the cathode component. The fixing seat 3 is disposed on the conductive carrier tape 1, and the conductive carrier tape 1 is used to support the fixing seat 3; the fixing seat 3 is provided with a positioning cavity 31, which is used to accommodate the device to be electroplated 100 and define the position of the device to be electroplated 100.

[0043] During electroplating, the device to be electroplated 100 is placed in the positioning cavity 31 to accommodate and define its position. Simultaneously, the contact 2 contacts the terminals 101 of the device to be electroplated 100, allowing current to flow sequentially through the conductive carrier strip 1, the contact 2, and to the exposed surface of the terminals 101, thus achieving electroplating of the terminals 101. Since all terminals 101 in contact with the contact 2 are energized and plated, the consistency of the energizing opportunities for multiple terminals 101 is improved, and multiple terminals 101 can be plated simultaneously, resulting in high plating efficiency. Furthermore, by providing the conductive carrier strip 1, it not only transmits current to the exposed surface of the terminals 101 for electroplating but also supports the fixing base 3. The conductive carrier strip 1 can act as a long roll, moving the device to be electroplated 100 on the fixing base 3 from one electroplating tank to another, applicable to continuous plating production lines. By combining the conductive carrier tape 1, the contact element 2, and the fixing base 3, it can be used as a carrier for electroplating to perform coating, which is relatively low cost.

[0044] Optionally, the conductive carrier tape 1 has at least one first through hole 11, and the contact 2 is fixed to the conductive carrier tape 1 and extends toward the first through hole 11. Specifically, the contact 2 can be fixed to the inner wall of the first through hole 11; and the contact 2 has a sheet-like structure, and the contact 2 can elastically contact the terminal 101 of the device to be electroplated 100. During electroplating, the electrolyte is in a flowing state, and the contact 2 elastically contacts the terminal 101 of the device to be electroplated, which can change the initial contact position between the contact 2 and the terminal 101, so that the contact 2 contacts another position of the terminal 101. Since the contact 2 contacts another position of the terminal 101, the electroplating solution can be located at the initial contact position of the terminal 101 and a film is deposited at the initial contact position, thereby ensuring the integrity of the electroplated layer on the exposed surface of the terminal 101 as much as possible.

[0045] In this embodiment, the fixing seat 3 is disposed at the first through hole 11. By disposing the fixing seat 3 at the first through hole 11, the area occupied by the fixing seat 3 on the conductive carrier 1 when connected to the conductive carrier 1 can be saved, making the structure more compact and facilitating the contact member 2 to contact the terminal 101.

[0046] Optionally, the conductive carrier tape 1 and the contact 2 form an integrated structure. This integrated structure includes a first forming body and a first bent portion 10. The first bent portion 10 is connected to the first forming body and can contact the terminal 101. This configuration allows the contact 2 to be formed through cutting and bending, facilitating processing, improving processing efficiency, and providing good elasticity. For example, the integrated structure formed by the conductive carrier tape 1 and the contact 2 can be obtained by cutting and bending a sheet metal. The bent portion is the first bent portion 10, and the unbent portion is the first forming body. Alternatively, the contact 2 can be detachably connected to the conductive carrier tape 1, as long as elastic contact between the contact 2 and the terminal 101 is achieved.

[0047] Please see Figure 2 , Figure 3 and Figure 4 In some specific embodiments, the device to be electroplated 100 may have three terminals 101. These three terminals 101 are not electrically connected inside the device to be electroplated 100 and are independent of each other. The three terminals 101 may be distributed on opposite sides of the exposed surface of the device to be electroplated 100. Specifically, the two terminals 101 exposed on the first side are also exposed on the second side of the device to be electroplated, and the third terminal 101 is on the exposed surface of the device to be electroplated (where...). Figure 4 The two smaller parts in the middle are both distributed on the second side of the device to be electroplated 100. Specifically, there are three contacts 2. Since there are two exposed surfaces of the terminals 101 on the first side of the device to be electroplated 100, the two terminals 101 corresponding to the two exposed surfaces cannot be electrically connected. Two contacts 2 are respectively in contact with the two exposed surfaces on the first side of the device to be electroplated 100, and the other contact 2 is in contact with both of the middle exposed surfaces on the second side of the device to be electroplated 100.

[0048] Optionally, the mounting base 3 includes a base body 32 and two hooks 33. The two hooks 33 are arranged opposite each other on both sides of the base body 32 along its length, and together with the base body 32, form a positioning cavity 31. When installing the device to be electroplated 100, the two hooks 33 are opened, and after the device to be electroplated 100 is placed in, the two hooks 33 automatically close to limit the position of the device to be electroplated 100. Through the above arrangement, the structure of the mounting base 3 is relatively simple, which facilitates the installation and removal of the device to be electroplated 100. In this embodiment, the hooks 33 are L-shaped rods. The L-shaped rods can fit against the top surface of the device to be electroplated 100 to limit the position of the device to be electroplated 100 along the thickness direction of the conductive carrier strip 1. The L-shaped rods can also fit against the side surface of the device to be electroplated 100 to limit the position of the device to be electroplated 100 along the length direction of the conductive carrier strip 1.

[0049] Optionally, the base 32 is provided with first positioning protrusions 321 on both sides along the width direction, and the first positioning protrusions 321 can fit against the device 100 to be electroplated. This arrangement is used to limit the position of the device 100 to be electroplated along the width direction of the conductive carrier tape 1, and the position limitation effect of the device 100 to be electroplated is better.

[0050] Optionally, the bottom of the base 32 is provided with a second positioning protrusion 322, and the conductive carrier tape 1 is provided with a positioning hole 13. The second positioning protrusion 322 is inserted into the positioning hole 13. By inserting the second positioning protrusion 322 into the positioning hole 13, it plays a positioning role when installing the fixing base 3.

[0051] Optionally, the conductive carrier tape 1 is provided with at least one set of fastening components, which are arranged one-to-one with the fixing base 3. The fastening components include two fastening parts 5, each with a fastening hole 51. The fixing base 3 has buckles 34 on both sides, and the two buckles 34 are fastened one-to-one with the two fastening holes 51. By fastening the buckles 34 with the fastening holes 51, the fixing base 3 can be directly installed on the conductive carrier tape 1 without the need for other auxiliary connection structures, which is convenient for installation and removal.

[0052] Optionally, the conductive carrier tape 1 has a second through hole 14, and the fastener 5 is fixed to the inner wall of the second through hole 14. This configuration saves materials and costs. Specifically, the conductive carrier tape 1 and the fastener 5 form an integrated structure, which includes a second forming body and a second bending portion 20. The second bending portion 20 is connected to the second forming body and has a fastening hole 51. This configuration allows the fastener 5 to be formed by cutting and bending, facilitating processing and improving processing efficiency. Of course, the fastener 5 can also be detachably connected to the conductive carrier tape 1, as long as the fastener 5 can be fastened to the fixing seat 3. Exemplarily, the integrated structure formed by the conductive carrier tape 1 and the fastener 5 can be obtained by cutting and bending a sheet metal, with the bent portion being the second bending portion 20 and the unbent portion being the second forming body.

[0053] Optionally, the end of the contact member 2 is bent away from the positioning cavity 31 to form a third bend, and the bend of the third bend can contact the terminal 101. With this configuration, it can be understood that the bend is an arc surface, allowing contact with the terminal 101 through the arc surface. This avoids directly contacting the terminal 101 with the end of the contact member 2 during the electroplating process and scratching the plating layer formed on the terminal 101 when relative displacement occurs, thus reducing the risk of scratching or damaging the plating layer on the terminal 101.

[0054] Optionally, in order to ensure that the contact 2 can better contact the terminal 101, the contact 2 is first bent towards the positioning cavity 31 to form a bending line 50, and the end of the contact 2 is then bent away from the positioning cavity 31 to form a fourth bending portion 30. Here, the fourth bending portion 30 refers to the flat plate structure formed by bending the end of the contact 2. The bending point of the fourth bending portion 30 can contact the terminal 101.

[0055] Optionally, at least two fixing seats 3 are spaced apart on the conductive carrier tape 1. This arrangement can improve electroplating efficiency. Optionally, at least two fixing seats 3 are equally spaced along the length direction of the carrier tape, or at least two fixing seats 3 are equally spaced along the width direction of the carrier tape.

[0056] Optionally, both the conductive carrier strip 1 and the contact element 2 are provided with an insulating layer. Optionally, the conductive carrier strip 1 and the contact element 2, except for the conductive contact areas, are all coated with insulating material. This configuration improves the safety performance of the electroplating fixture. Optionally, the fixing base 3 is made of insulating material. This configuration further improves the safety performance of the electroplating fixture.

[0057] Example 2

[0058] like Figures 6 to 9 As shown, this embodiment provides another electroplating carrier, including a conductive carrier strip 1 and at least one fixing base 3. The main difference between the electroplating carrier provided in this embodiment and that in Embodiment 1 is the structure of the contact member 2 and the operating member 4. This embodiment will not describe the same structure as that in Embodiment 1.

[0059] Optionally, the end of the contact 2 is bent toward the positioning cavity 31 to form a fifth bend 40, the end of which can contact the terminal 101. This arrangement facilitates contact between the end of the contact 2 and the exposed surface of the terminal 101, thus promoting electrical conductivity.

[0060] Optionally, such as Figure 8 As shown, an operating element 4 is provided on the side of the hook 33 away from the positioning cavity 31. By providing the operating element 4, it is convenient for the operator to move the operating element 4 to open the hook 33 when installing the device to be electroplated 100. In this embodiment, the operating element 4 has an L-shaped structure, specifically, the L-shaped structure includes a horizontal part and a vertical part. One end of the horizontal part is fixed to the hook 33, and the vertical part is located at the top of the other end of the horizontal part. This design facilitates the operator's movement. Furthermore, in this embodiment, the hook 33 and the operating element 4 are integrated. This design facilitates processing and saves assembly time.

[0061] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A carrier for electroplating, characterized in that, include: A conductive carrier tape (1) is provided with at least one contact (2), which can contact the terminal (101) of the device to be electroplated (100); At least one fixing seat (3) is disposed on the conductive carrier (1), the conductive carrier (1) is used to support the fixing seat (3); the fixing seat (3) is provided with a positioning cavity (31), the positioning cavity (31) is used to accommodate the device to be electroplated (100) and define the position of the device to be electroplated (100).

2. The electroplating carrier according to claim 1, characterized in that, The conductive carrier tape (1) is provided with at least one first through hole (11). The contact (2) is fixed to the conductive carrier tape (1) and extends toward the first through hole (11). The contact (2) is a sheet structure and can make elastic contact with the terminal (101) of the device to be electroplated (100).

3. The electroplating carrier according to claim 2, characterized in that, The conductive carrier tape (1) and the contact (2) form an integrated structure. The integrated structure includes a first molding body and a first bending portion (10). The first bending portion (10) is connected to the first molding body and can contact the terminal (101).

4. The electroplating carrier according to claim 1, characterized in that, The fixed seat (3) includes a seat body (32) and two hooks (33). The two hooks (33) are arranged opposite to each other on both sides of the seat body (32) along the length direction, and together with the seat body (32) form the positioning cavity (31).

5. The electroplating carrier according to claim 4, characterized in that, The hook (33) has an operating element (4) on the side away from the positioning cavity (31).

6. The electroplating carrier according to claim 4, characterized in that, The base (32) has a first positioning protrusion (321) on both sides along the width direction, and the first positioning protrusion (321) can fit with the device (100) to be electroplated.

7. The electroplating carrier according to claim 1, characterized in that, The conductive carrier tape (1) is provided with at least one set of fastening components. The fastening components are arranged one-to-one with the fixing base (3). The fastening components include two fastening parts (5). The fastening parts (5) are provided with fastening holes (51). The fixing base (3) is provided with buckles (34) on both sides. The two buckles (34) are fastened one-to-one with the two fastening holes (51).

8. The electroplating carrier according to claim 7, characterized in that, The conductive carrier tape (1) is provided with a second through hole (14), and the fastener (5) is fixed to the inner wall of the second through hole (14); the conductive carrier tape (1) and the fastener (5) form an integrated structure, the integrated structure includes a second forming body and a second bending part (20), the second bending part (20) is connected to the second forming body, and the second bending part (20) is provided with the fastening hole (51).

9. The electroplating carrier according to claim 1, characterized in that, The end of the contact (2) is bent away from the positioning cavity (31) to form a third bend, the bend of which can contact the terminal (101); and / or, The contact (2) is first bent toward the positioning cavity (31), and the end of the contact (2) is then bent away from the positioning cavity (31) to form a fourth bend (30), the bend of the fourth bend (30) being able to contact the terminal (101); and / or, The end of the contact (2) is bent toward the positioning cavity (31) to form a fifth bend (40), the end of which can contact the terminal (101); and / or, Both the conductive carrier (1) and the contact (2) are provided with an insulating layer, and the fixing base (3) is made of insulating material.

10. An electroplating apparatus, characterized in that, It includes a cathode and an electroplating carrier as described in any one of claims 1-9, wherein the cathode is electrically connected to the conductive carrier (1).

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