Highly versatile LED circuit board

Abstract

The application relates to the technical field of LED, in particular to a high-universality LED circuit board, which comprises a substrate, a circuit layer arranged on the surface of the substrate, a plurality of pad structures arranged on the circuit layer, wherein the pad structures are one of normal mounting pads and flip mounting pads, an isolation layer arranged above the pad structures, and an insulating layer covering the surface of the substrate and the circuit layer and part of the area of the isolation layer, wherein the isolation layer is provided with normal mounting pads or flip mounting pads to form bonding pads suitable for normal mounting elements or flip mounting elements. Compared with the prior art, the application reduces the cost and complexity of product development and material management through universal adaptation of normal mounting and flip mounting LEDs, and improves the universality and use flexibility of the circuit board.

Description

Technical Field

[0001] This application relates to the field of LED technology, and in particular to a highly versatile LED circuit board. Background Technology

[0002] Existing LED circuit boards are mainly designed with corresponding pad structures for LED chips in specific packaging forms (such as upright or flip-chip) to achieve electrical interconnection and mechanical fixation between the chip and the circuit board. The technical principle is to create metal pads of specific shapes on the circuit layer of the substrate and use soldering materials to connect the electrodes of the LED chip to the pads, thereby forming a conductive circuit and providing physical support for the chip.

[0003] However, due to the fundamental differences in electrode structure and soldering methods between conventional LEDs and flip-chip LEDs, the required pad designs are incompatible, resulting in a circuit board typically only being able to accommodate one type of LED package, failing to achieve universality, and significantly increasing the cost and complexity of product development and material management. Utility Model Content

[0004] This application provides a highly versatile LED circuit board to solve the technical problem that existing technologies cannot achieve universality, which significantly increases the cost and complexity of product development and material management.

[0005] This application proposes a highly versatile LED circuit board, comprising:

[0006] substrate;

[0007] A circuit layer is disposed on the surface of the substrate, and the circuit layer is provided with a plurality of pad structures, wherein the pad structures are either upright pads or flip-chip pads;

[0008] An isolation layer is disposed above the pad structure;

[0009] An insulating layer covers the surface of the substrate and the circuit layer, as well as a portion of the isolation layer, wherein the isolation layer is provided with positive or flip pads to form bonding pads suitable for positive or flip components.

[0010] Furthermore, the substrate is one of a metal substrate, a ceramic substrate, or FR-4 material.

[0011] Furthermore, the circuit layer is made of copper foil material, which is formed on the surface of the substrate by an etching process, and the pad structure array is distributed on the circuit layer.

[0012] Furthermore, the isolation layer is a copper sheet structure, which covers the pad structure, and the areas of the two are matched.

[0013] Furthermore, the insulating layer is formed by laying down white solder resist ink material, and the insulating layer covers the surface of the substrate, the non-pad area of ​​the circuit layer and the middle area of ​​the isolation layer. The isolation layer is divided into three pad mounting positions by the insulating layer.

[0014] Furthermore, the number of solder rods for the upright pad is two, and the number of solder rods for the inverted pad is three; when the upright pad is mounted on the isolation layer, the solder rods are mounted on the pad mounting positions on both sides; when the inverted pad is mounted on the isolation layer, the solder rods are mounted on the three pad mounting positions respectively.

[0015] Furthermore, the upright pad consists of two electrical connection electrodes with opposite polarities, and the flip pad consists of two electrical connection electrodes with opposite polarities and a heat dissipation electrode.

[0016] Furthermore, the bonding pad is connected to the pad structure via the copper sheet structure of the isolation layer to connect with the circuitry on the circuit layer.

[0017] Furthermore, the highly versatile LED circuit board also includes a heat dissipation structure, which includes heat-conducting holes or heat sinks disposed on the substrate.

[0018] Furthermore, the shape of the bonding pad is one of rectangle, circle or polygon.

[0019] The technical solutions provided in this application have the following advantages compared with the prior art:

[0020] This application addresses the problem in existing technologies where incompatibility between the pads of upright and flip-chip LEDs leads to poor circuit board versatility and increased product development and material management costs. It achieves universal compatibility for both upright and flip-chip LEDs, thereby reducing the cost and complexity of product development and material management, and improving the versatility and flexibility of the circuit board. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0024] Figure 1 Schematic diagrams of two embodiments of an LED circuit board provided by the prior art;

[0025] Figure 2 A schematic diagram of a highly versatile LED circuit board provided in this application embodiment;

[0026] Figure 3 An exploded view of a highly versatile LED circuit board provided in an embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Substrate; 11. Heat dissipation structure;

[0029] 2. Circuit layer; 21. Pad structure;

[0030] 3. Isolation layer; 31. Bonding pad; 311. Top mount pad; 312. Flip mount pad; 313. Pad mounting position;

[0031] 4. Insulation layer. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0034] For ease of description, spatial relative terms may be used in the text to describe the relative positional relationship or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or movement change, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0035] To address the technical problem that existing technologies cannot achieve universality, significantly increasing the cost and complexity of product development and material management, this application creates a combined pad 31 suitable for both upright and flip-chip components by setting an isolation layer 3 above the original pads on the circuit board and combining it with the covering design of the insulating layer 4. This solves the problem in existing technologies where the incompatibility of upright and flip-chip LED pad designs leads to poor circuit board universality and increased product development and material management costs. It achieves universal compatibility for both upright and flip-chip LEDs, thereby reducing the cost and complexity of product development and material management, and improving the universality and flexibility of the circuit board.

[0036] like Figure 1 As shown, it discloses an LED circuit board in the prior art, wherein the circuit layer 2 on the substrate 1 can only form one type of pad structure 21 (positive or negative) at a time during the etching process. The existing negative LED chip pads and conventional positive LED chip pads are quite different and cannot be shared, which leads to the need to repeatedly open different PCB circuit boards, resulting in low versatility and a significant increase in cost.

[0037] Please see Figures 2 to 3 This application proposes a highly versatile LED circuit board, comprising: a substrate 1; a circuit layer 2 disposed on the surface of the substrate 1, the circuit layer 2 having a plurality of pad structures 21, the pad structures 21 being one of positive pads 311 and flip pads 312; an isolation layer 3 disposed above the pads; and an insulating layer 4 covering the surfaces of the substrate 1 and the circuit layer 2, as well as a portion of the isolation layer 3, the isolation layer 3 having positive pads 311 or flip pads 312 to form bonding pads 31 suitable for positive or flip components.

[0038] Specifically, the manufacturing process of the circuit board in this embodiment is as follows: a substrate 1 is provided as a support structure; a circuit layer 2 is formed on the surface of the substrate 1, the circuit layer 2 including a pre-designed conductive pattern and several pad structures 21, which can be made into either a positive pad 311 or a flip pad 312 as required; an isolation layer 3 is provided above the circuit layer 2, the isolation layer 3 covering the pad area to achieve electrical isolation or mechanical protection; finally, an insulating layer 4 is applied to cover the exposed surfaces of the substrate 1 and the circuit layer 2, and partially covers the isolation layer 3, while positive pads 311 or flip pads 312 are formed on the isolation layer 3 through a patterning process, thereby constituting a combined pad 31 structure suitable for positive LED components or flip LED components. The entire implementation process achieves the versatility of the circuit board through layered manufacturing and selective pad configuration. Through the above implementation method, a single circuit board can be adapted to both positive and flip LED package types, significantly improving the versatility and production flexibility of the circuit board, and reducing the repetitive design and manufacturing costs caused by package differences.

[0039] In an optional embodiment, substrate 1 is one of a metal substrate, a ceramic substrate, or FR-4 material.

[0040] Specifically, substrate 1 is selected from any one of metal substrates, ceramic substrates, or FR-4 material. During manufacturing, the substrate material of the corresponding material is directly selected according to the circuit performance requirements (such as heat dissipation, insulation, or cost), and a support structure is formed through conventional substrate 1 processing technology (such as metal lamination, ceramic sintering, or FR-4 lamination). Subsequently, pad structures 21 and covering isolation layers 3 and insulating layers 4 are configured in the circuit layer 2. Through the selective design of substrate 1 material, the circuit board can flexibly adapt to the different requirements of heat dissipation, insulation, or mechanical strength in different application scenarios, significantly improving the environmental adaptability and design freedom of the circuit board.

[0041] like Figure 3 As shown, the circuit layer 2 is made of copper foil material, which is formed on the surface of the substrate 1 by etching process, and the pad structure 21 is arrayed on the circuit layer 2.

[0042] Specifically, the circuit layer 2 uses copper foil material, and a preset conductive pattern is formed on the surface of the selected substrate 1 through an etching process. The pad structures 21 are distributed in an array on the surface of the circuit layer 2, and their positions and sizes are determined according to the electrode layout requirements of the LED components. This structure achieves high-precision circuit and pad structure 21 array through copper foil etching process, ensuring the reliability and consistency of electrical connections. At the same time, the array layout optimizes the flexibility of component installation and the adaptability of circuit design.

[0043] like Figure 2-3As shown, the isolation layer 3 is a copper sheet structure, and the isolation layer 3 covers the pad structure 21, with the areas of the two being compatible.

[0044] Specifically, the isolation layer 3 is made of copper sheet material and is formed by stamping or etching to match the area of ​​the pad structure 21 of the circuit layer 2. The copper sheet isolation layer 3 directly covers and adheres to the surface of the pad structure 21, and its outline dimensions are aligned with the edge of the pad to achieve complete coverage. Through the area adaptation design between the copper sheet isolation layer 3 and the pad structure 21, the reliability of electrical isolation is ensured, while the mechanical support and heat conduction performance of the pad area are strengthened, thereby improving welding stability and structural durability.

[0045] like Figure 2-3 As shown, the insulating layer 4 is formed by laying white solder resist ink material. The insulating layer 4 covers the surface of the substrate 1, the non-pad area of ​​the circuit layer 2, and the middle area of ​​the isolation layer 3. The isolation layer 3 is divided into three pad mounting positions 313 by the insulating layer 4.

[0046] Specifically, the insulating layer 4 is formed by screen printing or coating with white solder resist ink. This insulating layer 4 covers the entire surface of the substrate 1, the non-conductive areas of the circuit layer 2 except for the solder pads, and the central area of ​​the isolation layer 3, dividing the isolation layer 3 into three independent solder pad mounting positions 313, thereby defining a clear soldering area. This method, through the precise coverage and division of the white solder resist ink insulating layer 4, achieves electrical isolation and mechanical protection for the solder pad mounting positions 313, while ensuring the precise definition of the soldering area, thus improving the reliability and soldering accuracy of the circuit board.

[0047] like Figure 2 As shown, the number of soldering rods for the upright pad 311 is two, and the number of soldering rods for the flip-chip pad 312 is three. When the upright pad 311 is installed on the isolation layer 3, the soldering rods are installed on the pad mounting positions 313 on both sides. When the flip-chip pad 312 is installed on the isolation layer 3, the soldering rods are installed on the three pad mounting positions 313 respectively.

[0048] Specifically, the upright pad 311 includes two solder rods, and the isolation layer 3 has corresponding pad mounting positions 313. During installation, the two solder rods are respectively installed on the pad mounting positions 313 on both sides of the isolation layer 3 to achieve positioning and fixation of the upright pad 311. The flip-chip pad 312 includes three solder rods, and the isolation layer 3 has three corresponding pad mounting positions 313. During installation, the three solder rods are respectively installed on the three pad mounting positions 313 to achieve positioning and fixation of the flip-chip pad 312. By configuring the number and installation position of the different solder rods, the same circuit board can be compatible with both upright and flip-chip LED packaging forms, improving the versatility and adaptability of the circuit board.

[0049] like Figure 2As shown, the upright pad 311 consists of two electrical connection electrodes with opposite polarities, and the flip pad 312 consists of two electrical connection electrodes with opposite polarities and a heat dissipation electrode.

[0050] Specifically, the upright pad 311 is formed into two isolated conductive solder bars through etching or deposition processes. These two solder bars are connected to the positive and negative electrodes respectively to achieve electrical interconnection. The flip-chip pad 312, based on a similar process, adds an independent heat dissipation solder bar. This heat dissipation solder bar is isolated from the electrical connection solder bar and is dedicated to thermal management. Among them, the upright pad 311 meets the basic electrical connection requirements, while the flip-chip pad 312 improves heat dissipation capability by adding a heat dissipation solder bar, thereby enhancing the compatibility and reliability of the circuit board for LEDs with different packages.

[0051] like Figure 2-3 As shown, the pad 31 is connected to the pad structure 21 through the copper sheet structure of the isolation layer 3 to connect with the circuit on the circuit layer 2.

[0052] Specifically, the bonding pad 31 is physically connected to the bonding pad structure 21 on the circuit layer 2 via a copper sheet isolation layer 3. This copper sheet isolation layer 3 is fixed to the surface of the bonding pad through soldering or lamination processes, forming an electrical path with the conductive lines in the circuit layer 2, thereby ensuring stable signal and energy transmission. Through the bridging effect of the copper sheet isolation layer 3, a highly reliable electrical interconnection between the bonding pad 31 and the circuit layer 2 is achieved, enhancing the mechanical stability and conductivity of the circuit structure, and improving the overall durability and signal transmission efficiency of the circuit board.

[0053] like Figure 3 As shown, the highly versatile LED circuit board also includes a heat dissipation structure 11, which includes heat conduction holes or heat sinks disposed on the substrate 1.

[0054] Specifically, the heat dissipation structure 11 is achieved by opening through heat-conducting holes on the substrate 1 or attaching metal heat sinks to the surface of the substrate 1. The heat-conducting holes are filled with heat-conducting materials to form vertical heat dissipation paths. The heat sinks are fixed to the back of the substrate 1 or a specific heat-generating area by welding or bonding, forming a heat-conducting connection with the heat source of the circuit layer 2, thereby accelerating heat dissipation, ensuring the temperature stability of the high-power LED during operation, extending the device life and maintaining optical performance.

[0055] In an alternative embodiment, the shape of the bonding pad 31 is one of rectangle, circle or polygon.

[0056] Specifically, the shape of the pad 31 is designed to be rectangular, circular, or polygonal, depending on the electrode layout requirements of the installed LED components. Pads of corresponding shapes are formed on the circuit layer 2 and the isolation layer 3 using etching or laser processing to ensure physical matching and soldering reliability with the component electrodes. This method, through the diversified design of pad shapes, significantly improves the circuit board's adaptability to LED components of different shapes, enhances soldering compatibility and mechanical stability, and simplifies the production process.

[0057] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0058] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0060] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0061] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0062] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0063] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0064] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A highly versatile LED circuit board, characterized in that, include: substrate; A circuit layer is disposed on the surface of the substrate, and the circuit layer is provided with a plurality of pad structures, wherein the pad structures are either upright pads or flip-chip pads; An isolation layer is disposed above the pad structure; An insulating layer covers the surface of the substrate and the circuit layer, as well as a portion of the isolation layer, wherein the isolation layer is provided with positive or flip pads to form bonding pads suitable for positive or flip components.

2. The highly versatile LED circuit board according to claim 1, characterized in that, The substrate is one of a metal substrate, a ceramic substrate, or FR-4 material.

3. The highly versatile LED circuit board according to claim 1, characterized in that, The circuit layer is made of copper foil material and is formed on the surface of the substrate by an etching process. The pad structure array is distributed on the circuit layer.

4. The highly versatile LED circuit board according to claim 3, characterized in that, The isolation layer is a copper sheet structure, which covers the pad structure, and the areas of the two are matched.

5. The highly versatile LED circuit board according to claim 4, characterized in that, The insulating layer is formed by laying down white solder resist ink material. The insulating layer covers the surface of the substrate, the non-pad area of ​​the circuit layer and the middle area of ​​the isolation layer. The isolation layer is divided into three pad mounting positions by the insulating layer.

6. The highly versatile LED circuit board according to claim 5, characterized in that, The number of solder rods for the upright pads is two, and the number of solder rods for the inverted pads is three. When the upright pads are mounted on the isolation layer, the solder rods are mounted on the pad mounting positions on both sides. When the inverted pads are mounted on the isolation layer, the solder rods are mounted on the three pad mounting positions respectively.

7. The highly versatile LED circuit board according to claim 6, characterized in that, The upright pad consists of two electrical connection electrodes with opposite polarities, and the inverted pad consists of two electrical connection electrodes with opposite polarities and a heat dissipation electrode.

8. The highly versatile LED circuit board according to claim 4, characterized in that, The bonding pad is connected to the pad structure via the copper sheet structure of the isolation layer to connect with the circuit on the circuit layer.

9. The highly versatile LED circuit board according to claim 1, characterized in that, It also includes a heat dissipation structure, which includes heat-conducting holes or heat sinks disposed on the substrate.

10. The highly versatile LED circuit board according to claim 1, characterized in that, The shape of the bonding pad is one of rectangle, circle or polygon.

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