A middle frame for electronic device and electronic device

Abstract

The utility model relates to the technical field of middle frame for electronic equipment, concretely relates to a kind of middle frame for electronic equipment and electronic equipment, middle frame includes: first frame body and the second frame body in the peripheral of the first frame body peripheral surface, antenna forming groove is formed between the first frame body and the second frame body, and glue injection antenna that connects the first frame body and the second frame body is formed in antenna forming groove by glue injection, it is characterized in that, at least one glue injection water port groove that is vertically communicated with antenna forming groove is equipped in the first frame body, glue is injected into antenna forming groove from glue injection water port groove, and glue injection port forming reinforcing part that is integrated with glue injection antenna is formed in glue injection water port groove.The utility model is vertically communicated in glue injection water port groove and antenna forming groove, and material filling effect in glue injection process is optimized, meanwhile, glue injection port forming reinforcing part and glue injection antenna form integrated structure by vertical connection, and the stability of overall structure is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of mid-frame technology for electronic devices, and more specifically, to a mid-frame for electronic devices and an electronic device. Background Technology

[0002] For electronic devices, such as mobile phone frames, existing technologies generally enhance structural stability and sealing through an injection molding process. By injecting a specific adhesive material between the inner and outer frames of the frame, minor gaps are filled while preventing the intrusion of external dust and moisture. This improves the bonding strength between the various components of the frame and the frame, as well as between the frame and other parts such as the screen and back cover, thereby extending the lifespan of the device.

[0003] Since the adhesive material only has a bonding surface with the inner and outer frames, during equipment use, external factors such as temperature changes, external impacts, or long-term vibrations may cause the bonding surface between the adhesive material and the inner or outer frame to loosen or crack. This will not only reduce the overall stability of the middle frame, but may also affect the sealing performance of the equipment, thereby increasing the risk of dust and moisture intrusion. Utility Model Content

[0004] In view of this, the present invention provides a mid-frame for electronic devices and an electronic device, aiming to solve the problem of how to improve the bonding strength between the colloidal material and the mid-frame.

[0005] This utility model discloses a mid-frame for an electronic device, comprising a first frame and a second frame located on the periphery of the first frame. An antenna molding groove is formed between the first frame and the second frame, and an adhesive-filled antenna is formed in the antenna molding groove to connect the first frame and the second frame. The first frame is characterized in that at least one adhesive injection port groove is provided on it, which is perpendicularly connected to the antenna molding groove. Adhesive is injected into the antenna molding groove through the adhesive injection port groove, and an adhesive injection port molding reinforcement part integrally formed with the adhesive-filled antenna is formed in the adhesive injection port groove.

[0006] Preferably, the glue injection groove is provided on the outer edge of one surface of the first frame, and the outer surface of the glue injection gate forming reinforcement formed in the glue injection groove is flush with one surface of the first frame.

[0007] Preferably, there are two glue injection slots, which are distributed on one of the diagonal lines of the first frame.

[0008] Preferably, the two glue injection slots are symmetrically distributed or staggered parallel distributed.

[0009] Preferably, there are three glue injection slots, which form a triangle.

[0010] Preferably, the bottom of the glue injection groove is a horizontal or inclined plane.

[0011] Preferably, an annular process groove is formed on the injection port molding reinforcement section.

[0012] Preferably, the width of the glue injection port groove gradually increases from the glue injection point to the connection between the glue injection port groove and the antenna forming groove; or the width of the glue injection port groove is constant.

[0013] Preferably, the first frame is formed by metal stamping and the glue injection groove is directly formed on the first frame.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: a glue injection port groove is provided on the first frame, which is perpendicularly connected to the antenna molding groove, and a glue injection port molding reinforcement part is formed in the glue injection port groove. The glue injection port molding reinforcement part is perpendicular to and connected to the glue injection antenna to form an integral structure. First, the vertical connection between the glue injection port groove and the antenna molding groove helps to optimize the material filling effect during the glue injection process, ensuring a more stable connection between the glue injection port molding reinforcement part and the glue injection antenna, thereby further enhancing the stability of the overall structure. Second, the integral structure formed by the vertical connection between the glue injection port molding reinforcement part and the glue injection antenna can effectively disperse external impact forces. When the device is subjected to external forces, the impact force will be evenly transmitted along the connection path between the glue injection port groove and the antenna molding groove, avoiding stress concentration at a certain point that could lead to cracking or loosening of the joint surface. Finally, the integral structure of the glue injection port molding reinforcement part and the glue injection antenna further increases the connection area and bonding strength between the first frame and the glue injection antenna, making it more resistant to external impacts or deformations, improving the overall connection stability of the electronic device, and thus extending the service life of the device.

[0015] On the other hand, this utility model provides an electronic device, including the aforementioned mid-frame for an electronic device. It is understood that an electronic device has the same beneficial effects as the mid-frame for an electronic device, and will not be elaborated further here. Attached Figure Description

[0016] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A cross-sectional view of a mid-frame for an electronic device provided in an embodiment of this utility model; Figure 2 A three-dimensional structural diagram of the first frame provided in an embodiment of this utility model; Figure 3 A three-dimensional structural diagram of the injection antenna and the injection port molding reinforcement provided in the embodiment of this utility model.

[0017] In the figure: 1. First frame; 11. Glue injection port groove; 2. Second frame; 3. Antenna molding groove; 4. Glue injection antenna; 5. Glue injection port molding reinforcement; 51. Annular process groove. Detailed Implementation

[0018] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0019] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Example 1, combined with Figures 1 to 3As shown, this embodiment provides a mid-frame for an electronic device, including a first frame 1 and a second frame 2 located on the periphery of the first frame 1. An antenna molding groove 3 is formed between the first frame 1 and the second frame 2, and an adhesive-filled antenna 4 is formed in the antenna molding groove 3 to connect the first frame 1 and the second frame 2. The first frame 1 is provided with at least one adhesive injection groove 11 that is perpendicularly connected to the antenna molding groove 3. Adhesive is injected into the antenna molding groove 3 through the adhesive injection groove 11, and an adhesive injection groove forming reinforcement part 5 that is integrally connected with the adhesive-filled antenna 4 is formed in the adhesive injection groove 11.

[0023] It is understood that in this embodiment, a glue injection port 11 communicating with the antenna molding groove 3 is provided on the first frame 1. Glue is injected into the antenna molding groove 3 through the glue injection port 11. The filling medium fills the antenna molding groove 3 from the inner cavity outward along the glue injection port 11, and then fills the glue injection port 11, thereby integrally molding the glue-injected antenna 4 and the glue injection port molding reinforcement part 5. The vertical connection between the glue injection port 11 and the antenna molding groove 3 optimizes the material filling effect during the glue injection process and improves production efficiency.

[0024] Furthermore, the integrated structure formed by the vertical connection of the injection port molding reinforcement 5 and the injection antenna 4 can effectively disperse external impact forces and avoid stress concentration at a certain point, which could lead to cracking or loosening of the joint surface.

[0025] Furthermore, the integrated structure of the injection port molding reinforcement 5 and the injection antenna 4 increases the connection area and bonding strength between the first frame 1 and the injection antenna 4, thereby improving the overall connection stability of the electronic device and extending the service life of the device.

[0026] Preferably, one of the outer edges of the first frame 1 is provided with a glue injection groove 11, and the outer surface of the glue injection groove 11 forming the glue injection nozzle forming reinforcement 5 is flush with one of the surfaces of the first frame 1.

[0027] Specifically, flush surfaces are easier to clean and maintain, and during subsequent assembly or installation, they can fit better with other components, reducing gaps and errors and improving overall assembly accuracy.

[0028] Preferably, there are two glue injection slots 11, which are distributed on one of the diagonal lines of the first frame 1. The two glue injection slots 11 are symmetrically distributed or staggered parallel distributed.

[0029] Specifically, the two glue injection slots 11 are symmetrically or staggeredly parallel. During glue injection, the filling medium is filled from the two glue injection slots 11 facing each other into the antenna forming groove 3. This firstly speeds up the glue injection process and improves the uniformity and stability of the glue injection. Secondly, the two glue injection slots 11 located on one of the diagonal lines of the first frame 1 can be integrally formed with two glue injection port forming reinforcement parts 5 that are perpendicularly connected to the glue injection antenna 4. The two glue injection port forming reinforcement parts 5 are arranged opposite each other, further enhancing the connection strength between the first frame 1 and the glue injection antenna 4, making the overall structure of the device more stable.

[0030] Preferably, there are three glue injection slots 11, which form a triangle.

[0031] Specifically, the three glue injection slots 11 help ensure that the glue can be fully and evenly filled into the antenna molding slot 3. At the same time, the three glue injection port molding reinforcement parts 5, which are vertically connected to the glue injection antenna 4, can be integrally formed during glue injection, forming multi-point support and reinforcement. This can effectively improve the overall rigidity and load-bearing capacity of the connection, so that the connection part can better maintain stability when subjected to external forces and is less prone to displacement or damage.

[0032] Preferably, the bottom of the glue injection groove 11 is a horizontal or inclined surface.

[0033] Specifically, when the bottom of the injection sprue groove 11 is horizontal, it ensures that the filling medium maintains a uniform flow rate and distribution during injection. A horizontal surface also simplifies mold manufacturing, reduces production costs, and facilitates subsequent cleaning and maintenance. When the bottom of the injection sprue groove 11 is sloped, it helps guide the filling medium to flow quickly to all corners of the antenna forming groove 3, reducing the possibility of air bubble residue and further improving injection efficiency.

[0034] Preferably, the injection port molding reinforcement part 5 has an annular process groove 51.

[0035] Specifically, the annular process groove 51 is used to assemble with related accessories, which can save the time and process required for subsequent individual processing.

[0036] Preferably, the width of the glue injection slot 11 gradually increases from the glue injection point to the connection between the glue injection slot 11 and the antenna forming slot 3; or the width of the glue injection slot 11 is constant.

[0037] Specifically, as the width of the glue injection port groove 11 gradually increases from the glue injection point to the connection between the glue injection port groove 11 and the antenna forming groove 3, the flow rate of the filling medium decreases as it flows from the narrow glue injection point to the gradually widening groove, resulting in a smoother flow and reducing the generation of air bubbles. This facilitates the uniform filling of the filling medium within the antenna forming groove 3. Simultaneously, the gradually widening glue injection port groove 11 design increases the connection area, improving the connection strength between the first frame 1 and the glue injection port forming reinforcement 5. When the width of the glue injection port groove 11 is constant, the manufacturing process is simplified, while ensuring the stability of the filling medium flow and avoiding uneven flow rate problems caused by width variations.

[0038] Preferably, the first frame 1 is formed by metal stamping and the glue injection groove 11 is directly formed on the first frame 1.

[0039] Specifically, the glue injection groove 11 is integrated with the first frame 1, and no post-processing is required after demolding, which simplifies the processing steps and reduces production costs.

[0040] Example 2: This utility model provides an electronic device, including the aforementioned mid-frame for an electronic device. It is understood that an electronic device has the same beneficial effects as the aforementioned mid-frame for an electronic device, and will not be described again here.

[0041] It will be understood by those skilled in the art that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A mid-frame for an electronic device, comprising a first frame (1) and a second frame (2) located on the periphery of the first frame (1), wherein an antenna molding groove (3) is formed between the first frame (1) and the second frame (2), and an adhesive-molded antenna (4) connecting the first frame (1) and the second frame (2) is injection molded in the antenna molding groove (3), characterized in that, The first frame (1) is provided with at least one glue injection groove (11) that is vertically connected to the antenna molding groove (3). Glue is injected into the antenna molding groove (3) through the glue injection groove (11), and a glue injection groove forming reinforcement part (5) that is integrally connected with the glue injection antenna (4) is formed in the glue injection groove (11).

2. The mid-frame for an electronic device according to claim 1, characterized in that, The outer edge of one of the surfaces of the first frame (1) is provided with the glue injection groove (11), and the outer surface of the glue injection groove (11) forming the glue injection nozzle forming reinforcement (5) is flush with one of the surfaces of the first frame (1).

3. A mid-frame for an electronic device according to claim 1 or 2, characterized in that, There are two glue injection slots (11), which are distributed on one of the diagonal lines of the first frame (1).

4. A mid-frame for an electronic device according to claim 3, characterized in that, The two glue injection slots (11) are symmetrically distributed or staggered parallel.

5. A mid-frame for an electronic device according to claim 1 or 2, characterized in that, There are three glue injection slots (11), and the three glue injection slots (11) form a triangle.

6. A mid-frame for an electronic device according to claim 1, characterized in that, The bottom of the glue injection groove (11) is a horizontal or inclined plane.

7. A mid-frame for an electronic device according to claim 1, characterized in that, The injection port forming reinforcement part (5) has an annular process groove (51) formed on it.

8. A mid-frame for an electronic device according to claim 1, characterized in that, The width of the glue injection slot (11) gradually increases from the glue injection point to the connection between the glue injection slot (11) and the antenna forming slot (3); or the width of the glue injection slot (11) is equal.

9. A mid-frame for an electronic device according to claim 1, characterized in that, The first frame (1) is formed by metal stamping and the glue injection groove (11) is directly formed on the first frame (1).

10. An electronic device, characterized in that, Includes a mid-frame for an electronic device as described in any one of claims 1-9.

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