Large-size code disc inner hole splitting device
Patent Information
- Application Number
- CN202522479365.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-23
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-11-23
AI Technical Summary
[0003]纳秒切割是使用不间断激光从玻璃底层一层层往上灼烧玻璃达到切断玻璃的目的,纳秒切割能应对大部分能透光的产品,但是它的缺点是无法加工不透光的产品,而且由于是一层层往上灼烧,所以切割缝的宽度和产品切割的同心度都较低,崩边比较大,最关键一点是纳秒切割的大小是由激光切割机的振镜大小来决定的,所以大尺寸的产品无法切割,而皮秒切割是使用激光束将玻璃打穿成一个个几微米的小孔,小孔按照固定的间距排列成行,然后使用高功率的激光通过加温二氧化碳使其在小孔内膨胀裂开来完成切割裂片,所以皮秒激光的优点是切割精度高,切割边缘光滑,崩边小,但是皮秒也有缺点,由于皮秒切割后是靠二氧化碳膨胀裂片,所以低膨胀率的基材,还有被外圈封住的位置都无法靠膨胀来裂片,较为不便
本实用新型利用超声机构、模具板和承载机构相互配合的设置方式,在使用皮秒激光切割机来切出外形小孔后,可将产品放在沿着产品形状制作的模具板上,然后使用超声波振头从上往下轻压产品内孔,使产品内孔废料与产品裂开脱离,解决了大尺寸环形产品无法使用纳秒切割,并且皮秒切割后内孔无法裂片的问题,且模具板和承载机构的设置可以一边进行脱离废料一边进行上下料处理,提高了大尺寸码盘的加工效率,便于使用。
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Figure CN224866741U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of code disk processing technology, and in particular to a device for splitting the inner hole of a large-size code disk. Background Technology
[0002] Laser cutting of glass code disks is now the mainstream glass processing technology, and laser cutting is divided into nanosecond cutting and picosecond cutting.
[0003] Nanosecond cutting uses a continuous laser to burn the glass layer by layer from the bottom up to cut it. Nanosecond cutting can handle most translucent products, but its disadvantage is that it cannot process opaque products. Also, because it burns layer by layer, the width of the cut and the concentricity of the product are relatively low, resulting in larger chipping. Most importantly, the size of a nanosecond cut is determined by the size of the galvanometer of the laser cutting machine, so large products cannot be cut. Picosecond cutting, on the other hand, uses a laser beam to pierce the glass into tiny holes a few micrometers in size. These holes are arranged in rows at fixed intervals, and then a high-power laser is used to heat carbon dioxide, causing it to expand and crack within the holes to complete the cutting. Therefore, the advantages of picosecond lasers are high cutting precision, smooth cutting edges, and small chipping. However, picosecond lasers also have disadvantages. Because picosecond cutting relies on carbon dioxide expansion to crack the glass, it cannot crack substrates with low expansion rates or areas sealed by the outer ring, making it less convenient. Utility Model Content
[0004] The purpose of this invention is to provide a large-size code disk inner hole splitting device to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a large-size code disk inner hole splitting device, comprising: A workbench, the top of which is fixedly mounted with a mounting bracket; An ultrasonic mechanism, which is mounted on a fixed frame, is used to cause the waste material inside the forming code disk to crack and detach. A mold plate, wherein the mold plate is disposed below the ultrasonic mechanism; A support mechanism is provided on the workbench and is used to fix the mold plate and drive the mold plate to move.
[0006] Preferably, the ultrasound mechanism includes: A cylinder, which is fixedly mounted on the top of a mounting bracket; An ultrasonic generator, wherein the output end of the cylinder is connected to the ultrasonic generator via a transmission connection; An ultrasonic transducer is located at the bottom of an ultrasonic generator.
[0007] Preferably, a collection box is symmetrically slidably arranged on the mold plate, and the collection box is used to collect the broken and detached waste material.
[0008] Preferably, the load-bearing mechanism includes: The slide rod has a groove at the top of the worktable, and the end of the slide rod is slidably inserted into the inner cavity of the groove. A slider, wherein the slider is slidably interlocked with a sliding rod; Mounting plate, which is fixedly connected to the top of the slider; The mounting block is fixedly connected to the top of the mounting plate, and the bottom of the mold plate is provided with mounting grooves at equal intervals. The mounting block is slidably inserted into the inner cavity of the mounting groove. A drive assembly, which is disposed inside the worktable, is used to drive the displacement of the mold plate; A snap-fit assembly is disposed between the mounting plate and the mounting block and is used to position the mold plate.
[0009] Preferably, the driving component includes: An electric telescopic rod is provided, wherein the inside of the workbench is provided with a groove that communicates with the slide, and the electric telescopic rod is fixedly installed on one side of the inner wall of the groove; A drive plate is fixedly connected to the bottom end of the slider, and the output end of the electric telescopic rod is connected to the drive plate for transmission.
[0010] Preferably, the snap-fit assembly includes: The mounting block has a snap-fit groove on its outer wall and a snap-fit hole on its inner wall. One end of the snap-fit rod is slidably inserted into the inner cavity of the snap-fit groove, and the other end of the snap-fit rod is slidably inserted into the inner cavity of the snap-fit hole. A compression spring, wherein the compression spring is disposed inside the snap-fit groove; Pull block: Both sides of the mounting plate are provided with pull grooves, and the pull block is slidably disposed inside the pull grooves; A handle, which is rotatably mounted on one side of the pull block; A connecting rope, one end of which is fixedly connected to a clamping rod, and the other end of which is fixedly connected to a pull block.
[0011] Preferably, one end of the compression spring is fixedly connected to the snap-fit rod, and the other end of the compression spring is fixedly connected to the inner wall of the snap-fit groove.
[0012] Preferably, both the mounting plate and the mounting block have guide grooves inside, and guide wheels that cooperate with the connecting rope are rotatably arranged inside the guide grooves.
[0013] The technical effects and advantages of this utility model are as follows: This invention utilizes a combination of an ultrasonic mechanism, a mold plate, and a support mechanism. After using a picosecond laser cutting machine to cut out small holes, the product can be placed on a mold plate made along the product's shape. Then, an ultrasonic transducer gently presses down on the inner hole of the product from top to bottom, causing the waste material in the inner hole to separate from the product. This solves the problem that large-sized ring-shaped products cannot be cut using nanosecond lasers, and that the inner hole cannot be split after picosecond laser cutting. Furthermore, the mold plate and support mechanism allow for simultaneous waste material removal and loading / unloading, improving the processing efficiency of large-sized encoders and making them easier to use. Attached Figure Description
[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the overall front internal structure of this utility model; Figure 3 This is a schematic diagram of the internal structure of the support mechanism of this utility model from the front. Figure 4 For the present utility model Figure 3 Enlarged structural diagram at point A in the middle.
[0015] In the attached image: 1. Workbench; 2. Fixing frame; 3. Ultrasonic mechanism; 31. Cylinder; 32. Ultrasonic generator; 33. Ultrasonic transducer; 4. Mold plate; 5. Bearing mechanism; 51. Slide rod; 52. Slider; 53. Mounting plate; 54. Mounting block; 55. Electric telescopic rod; 56. Drive plate; 57. Connecting rod; 58. Compression spring; 59. Pull block; 510. Handle; 511. Connecting rope; 512. Guide wheel; 6. Collection box. Detailed Implementation
[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0017] This utility model provides, for example Figures 1-4 The image shows a large-size code disk inner hole splitting device.
[0018] Example 1: A large-size code disk inner hole splitting device includes a worktable 1, an ultrasonic mechanism 3, a mold plate 4, and a support mechanism 5. A fixed frame 2 is fixedly installed on the top of the worktable 1. The ultrasonic mechanism 3 is set on the fixed frame 2 to cause the waste material in the inner hole of the formed code disk to split and detach. The mold plate 4 is set below the ultrasonic mechanism 3. The support mechanism 5 is set on the worktable 1 to fix the mold plate 4 and drive the mold plate 4 to move. After using a picosecond laser cutting machine to cut out small holes, the product can be placed on the mold plate 4 made along the shape of the product. Then, the ultrasonic transducer 33 is used to gently press the inner hole of the product from top to bottom, causing the waste material in the inner hole of the product to split and detach from the product. This solves the problem that large-size ring products cannot be cut using nanosecond cutting and the inner hole cannot be split after picosecond cutting. Moreover, the mold plate 4 and the support mechanism 5 can be set up to remove waste material while loading and unloading, improving the processing efficiency of large-size code disks and making them easy to use.
[0019] Specifically, the ultrasonic mechanism 3 includes a cylinder 31, an ultrasonic generator 32, and an ultrasonic transducer 33. The cylinder 31 is fixedly installed on the top of the mounting bracket 2. The output end of the cylinder 31 is connected to the ultrasonic generator 32 for transmission. The ultrasonic transducer 33 is located at the bottom of the ultrasonic generator 32. The cylinder 31 is electrically connected to an external power supply through an external switch. The height of the ultrasonic transducer 33 on the ultrasonic generator 32 can be adjusted by the cylinder 31, so that waste separation processing can be performed on large-sized code disks at any time.
[0020] Furthermore, a collection box 6 is symmetrically slidably arranged on the mold plate 4. The collection box 6 is used to collect the broken and separated waste material. The collection box 6 can collect the separated waste material in a concentrated manner, which is convenient for centralized waste disposal after processing.
[0021] In Embodiment Two, based on Embodiment One, the supporting mechanism 5 includes a sliding rod 51, a slider 52, a mounting plate 53, a mounting block 54, a driving assembly, and a snap-fit assembly. A groove is formed at the top of the worktable 1. The end of the sliding rod 51 is slidably inserted into the inner cavity of the groove. The slider 52 is slidably inserted into the sliding rod 51. The mounting plate 53 is fixedly connected to the top of the slider 52. The mounting block 54 is fixedly connected to the top of the mounting plate 53. Mounting grooves are equidistantly formed at the bottom of the mold plate 4. The mounting block 54 is slidably inserted into the inner cavity of the mounting groove. The driving assembly is... The clamping assembly is located inside the worktable 1 and is used to drive the displacement of the mold plate 4. The clamping assembly is set between the mounting plate 53 and the mounting block 54 and is used to position the mold plate 4. The mold plate 4 can be fixedly installed on the top of the mounting plate 53 by using the clamping assembly. Then, the slider 52 is driven to move on the slide rod 51 by the driving assembly. Thus, when the ultrasonic transducer 33 is separating waste material from one of the code disks on the mold plate 4, the other code disk can be loaded and unloaded. Therefore, the processing can be carried out continuously without stopping the machine, which improves the working efficiency of processing large batches of code disks.
[0022] Furthermore, the drive assembly includes an electric telescopic rod 55 and a drive plate 56. The interior of the worktable 1 has a groove communicating with the slide. The electric telescopic rod 55 is fixedly installed on one side of the inner wall of the groove. The drive plate 56 is fixedly connected to the bottom end of the slider 52. The output end of the electric telescopic rod 55 is connected to the drive plate 56 for transmission. The electric telescopic rod 55 is electrically connected to an external power supply through an external switch. The electric telescopic rod 55 can drive the drive plate 56 to move, thereby driving the mold plate 4 on the mounting plate 53 to move through the slider 52, so that the two stations on the mold plate 4 can be accurately positioned below the ultrasonic transducer 33.
[0023] Furthermore, the snap-fit assembly includes a snap-fit rod 57, a compression spring 58, a pull block 59, a handle 510, and a connecting rope 511. The outer wall of the mounting block 54 has a snap-fit groove, and the inner wall of the groove has a snap-fit hole. One end of the snap-fit rod 57 is slidably inserted into the inner cavity of the snap-fit groove, and the other end is slidably inserted into the inner cavity of the snap-fit hole. The compression spring 58 is disposed inside the snap-fit groove, with one end fixedly connected to the snap-fit rod 57 and the other end fixedly connected to the inner wall of the groove. The compression spring 58 consistently provides a stable elastic force to the snap-fit rod 57, thereby ensuring stable snap-fit between the snap-fit rod 57 and the snap-fit hole. This allows the mold plate 4 to be stably mounted on the mounting plate 53. Both sides of the mounting plate 53... The device has a slot, with a pull block 59 slidably disposed inside the slot. A handle 510 is rotatably disposed on one side of the pull block 59. One end of a connecting rope 511 is fixedly connected to a locking rod 57, and the other end of the connecting rope 511 is fixedly connected to the pull block 59. By pulling the pull block 59 through the handle 510, the locking rod 57 can be moved horizontally through the connecting rope 511 and separated from the locking hole, allowing for the disassembly and assembly of the mold plate 4. At the same time, after the locking rod 57 retracts into the locking slot, the handle 510 can rotate 90°. At this time, the handle 510 will be locked outside the slot by the elastic force of the compression spring 58, thus maintaining the retracted state. This facilitates the replacement of mold plates 4 of different specifications, improves the applicability of the device, and makes it easy to use.
[0024] Furthermore, both the mounting plate 53 and the mounting block 54 have guide grooves inside. Inside the guide grooves, guide wheels 512 are rotatably arranged to cooperate with the connecting rope 511. The guide wheels 512 play a supporting and reversing role for the connecting rope 511, avoiding direct friction and pulling of the connecting rope 511, and extending its service life.
[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A large-size code disk inner hole splitting device, characterized in that, include: Workbench (1), with a fixed frame (2) fixedly installed on the top of the workbench (1); An ultrasonic mechanism (3) is mounted on a fixed frame (2) and is used to cause the waste material inside the forming code disk to crack and detach. Mold plate (4), the mold plate (4) is disposed below the ultrasonic mechanism (3); The support mechanism (5) is set on the workbench (1) and is used to fix the mold plate (4) and drive the mold plate (4) to move.
2. The large-size code disk inner hole splitting device according to claim 1, characterized in that, The ultrasonic mechanism (3) includes: Cylinder (31), the cylinder (31) is fixedly installed on the top of the fixing frame (2); An ultrasonic generator (32) is provided, with the output end of the cylinder (31) being connected to the ultrasonic generator (32) via a transmission connection. An ultrasonic transducer (33) is located at the bottom of an ultrasonic generator (32).
3. The large-size code disk inner hole splitting device according to claim 1, characterized in that, A collection box (6) is symmetrically slidably arranged on the mold plate (4), and the collection box (6) is used to collect the broken and detached waste material.
4. The large-size code disk inner hole splitting device according to claim 1, characterized in that, The supporting mechanism (5) includes: The slide rod (51) has a groove at the top of the workbench (1), and the end of the slide rod (51) is slidably inserted into the inner cavity of the groove. The slider (52) is slidably interlocked with the slide rod (51); Mounting plate (53), which is fixedly connected to the top of slider (52); Mounting block (54), which is fixedly connected to the top of mounting plate (53), and mounting grooves are provided at equal intervals at the bottom of the mold plate (4), and the mounting block (54) is slidably inserted into the inner cavity of the mounting groove. A drive assembly is disposed inside the worktable (1) and is used to drive the displacement of the mold plate (4); A snap-fit assembly is disposed between the mounting plate (53) and the mounting block (54) for positioning the mold plate (4).
5. The large-size code disk inner hole splitting device according to claim 4, characterized in that, The driving component includes: Electric telescopic rod (55), the inside of the workbench (1) is provided with a groove that communicates with the slide, and the electric telescopic rod (55) is fixedly installed on one side of the inner wall of the groove; The drive plate (56) is fixedly connected to the bottom end of the slider (52), and the output end of the electric telescopic rod (55) is connected to the drive plate (56) in a transmission manner.
6. The large-size code disk inner hole splitting device according to claim 4, characterized in that, The snap-fit assembly includes: The outer wall of the mounting block (54) is provided with a snap-fit groove, and the inner wall of the mounting groove is provided with a snap-fit hole. One end of the snap-fit rod (57) is slidably inserted into the inner cavity of the snap-fit groove, and the other end of the snap-fit rod (57) is slidably inserted into the inner cavity of the snap-fit hole. Compression spring (58), the compression spring (58) is disposed inside the snap-fit groove; Pull block (59), both sides of the mounting plate (53) are provided with pull grooves, and the pull block (59) is slidably disposed inside the pull groove; A handle (510) is rotatably disposed on one side of the pull block (59); A connecting rope (511) is fixedly connected at one end to a snap-fit rod (57) and at the other end to a pull block (59).
7. The large-size code disk inner hole splitting device according to claim 6, characterized in that, One end of the compression spring (58) is fixedly connected to the snap-fit rod (57), and the other end of the compression spring (58) is fixedly connected to the inner wall of the snap-fit groove.
8. The large-size code disk inner hole splitting device according to claim 6, characterized in that, Both the mounting plate (53) and the mounting block (54) have guide grooves inside, and guide wheels (512) that cooperate with the connecting rope (511) are rotatably arranged inside the guide grooves.