A potting glue injection buffer device

Abstract

The utility model belongs to the field of potting technology discloses a kind of potting glue injection buffering devices, including the potting mold that its inside is provided with potting cavity and glue injection channel, the glue injection channel is used to guide potting glue to flow into the potting cavity;The glue injection channel includes at least two overflow buffer cavities in series communication, at least two overflow buffer cavities include a first buffer cavity with glue injection port and a second buffer cavity communicated with the potting cavity by glue distribution port, adjacent overflow buffer cavities are communicated by glue overflow port, the central axis of the glue injection port, the glue distribution port and the glue overflow port is not collinear in axial direction.The above, the kinetic energy when potting glue flows into potting cavity is reduced by overflow buffer cavity, effectively avoid the bubble defect caused by turbulent flow of potting glue;One of overflow buffer cavities is communicated potting cavity by multiple glue distribution ports evenly distributed, to ensure that potting glue can overflow evenly into potting cavity, and then improve the uniformity and integrity of potting.

Description

Technical Field

[0001] This utility model belongs to the field of potting technology, specifically relating to a potting and injection buffer device. Background Technology

[0002] With the development of electronic technology and related assembly technologies, the reliability requirements for electronic products are increasing. Coils are commonly installed in electronic products today. Prolonged exposure to air can easily lead to coil aging and oxidation, posing safety hazards and shortening the coil's lifespan. Therefore, coil potting is necessary to improve product reliability. However, in existing potting processes, the rapid injection of potting compound into the potting cavity via a dispensing device can easily generate turbulence, causing air to mix into the potting compound and form bubbles, affecting potting quality and the product's internal insulation. Utility Model Content

[0003] In view of this, in order to solve the problems mentioned in the background art, the purpose of this utility model is to provide a potting and dispensing buffer device.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A potting and dispensing buffer device includes a potting mold having a potting cavity and a dispensing channel therein. The dispensing channel is used to guide the potting adhesive to flow into the potting cavity. The dispensing channel includes at least two overflow buffer cavities connected in series. The at least two overflow buffer cavities include a first buffer cavity with a dispensing port and a second buffer cavity connected to the potting cavity through a dispensing port. Adjacent overflow buffer cavities are connected through overflow ports. The central axes of the dispensing port, the dispensing port, and the overflow port are not collinear in the axial direction.

[0006] Preferably, the overflow port includes multiple overflow holes, the diameter of which is smaller than the smaller diameter of the glue injection port and the glue leveling port.

[0007] Preferably, the plurality of overflow holes includes a first overflow hole and a second overflow hole surrounding the first overflow hole, and at least the central axis of the first overflow hole and part of the central axis of the second overflow hole are not collinear with the central axis of the overflow buffer cavity in the axial direction.

[0008] Preferably, multiple glue-spreading nozzles are evenly arranged around the central axis of the filling cavity.

[0009] Preferably, the potting mold includes a base and a bottom support, the first buffer cavity is disposed inside the base, the second buffer cavity is disposed between the base and the bottom support, and the bottom support has a plurality of uniform dispensing nozzles connected to the potting cavity and the second buffer cavity evenly arranged in a ring array.

[0010] Preferably, the potting mold further includes a housing surrounding the potting cavity, the base includes a base and at least one spacer sealed between the base and the housing, the first buffer cavity is disposed between the base and a spacer, the second buffer cavity is disposed between the base and a spacer, and the cavity between adjacent spacers forms an overflow buffer cavity.

[0011] Preferably, at least one spacer is stacked along the axial direction, and each spacer includes a central portion, an edge portion, and an axially extending connecting portion to connect the central portion and the edge portion. The overflow port is provided on the central portion, and sealing grooves capable of engaging sealing rings are provided on both axial end faces of the edge portion and on the inner and outer circumferential surfaces of the connecting portion.

[0012] Preferably, the potting mold is further provided with an overflow channel communicating with the potting cavity, so as to guide the potting glue or air in the potting cavity to overflow to the outside of the potting cavity when the potting cavity is filled with potting glue.

[0013] Preferably, the overflow channel includes a venting chamber with an exhaust port and an overflow port connecting the venting chamber and the filling chamber, and multiple overflow ports are evenly arranged around the central axis of the filling chamber.

[0014] Preferably, the potting mold further includes a sealing cap, the sealing cap having at least a central portion disposed opposite to the potting cavity, the overflow channel being disposed within the central portion of the sealing cap, the central portion extending at least partially into the potting cavity, so that the inner and outer spaces of the potting cavity are relatively isolated and sealed.

[0015] Compared with the prior art, this utility model has the following advantages:

[0016] (1) This utility model provides a potting and injection buffer device, which is provided with an injection channel, a potting cavity and an overflow channel; the injection channel includes at least two overflow buffer cavities connected in series, thereby reducing the kinetic energy of the potting glue flowing into the potting cavity and effectively avoiding air bubble defects caused by turbulent flow of the potting glue; the overflow channel ensures that the air in the potting cavity can be completely discharged, and the glue overflowing into the overflow channel can backfill the problem of incomplete filling caused by shrinkage during curing, thereby improving the potting quality.

[0017] (2) In this utility model, one of the overflow buffer chambers is connected to the potting chamber through a plurality of uniformly distributed glue outlets, thereby ensuring that the potting glue can overflow evenly into the potting chamber, thereby improving the uniformity and integrity of the potting.

[0018] (3) In this utility model, a modular base structure including a base and at least one partition is provided, which makes the forming and assembly of the overflow buffer cavity more convenient. Attached Figure Description

[0019] Figure 1 This is a three-dimensional sectional view of the present invention;

[0020] Figure 2 This is a planar sectional view of the present invention;

[0021] Figure 3 This is an exploded view of the base structure in this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the partition component of this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the base support in this utility model;

[0024] Figure 6 This is a perspective sectional view of the sealing cap in this utility model;

[0025] In the diagram: potting mold-1; base-11; base-111; spacer-112; center part-113; edge part-114; connecting part-115; sealing ring-116; bottom support-12; shell-13; sealing cap-14; potting cavity-2; injection channel-3; overflow buffer cavity-31; first buffer cavity-311; second buffer cavity-312; uniform glue port-32; overflow port-33; first overflow hole-331; second overflow hole-332; injection port-34; overflow channel-4; vent-41; venting cavity-42; overflow port-43. Detailed Implementation

[0026] To further understand the content of this utility model, a detailed description of it is provided in conjunction with the accompanying drawings and embodiments. The structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes and to aid those skilled in the art; they are not intended to limit the implementation of this utility model and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives of this utility model, should still fall within the scope of the technical content disclosed herein. Similarly, terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity and not intended to limit the scope of implementation. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of implementation of this utility model. It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein.

[0027] like Figure 1 and Figure 2 As shown, the potting and dispensing buffer device provided by this utility model includes a potting mold 1 having a potting cavity 2, a dispensing channel 3, and an overflow channel 4. During the potting operation, the dispensing channel 3 is connected to an external dispensing device to guide the potting adhesive into the potting cavity 2; the overflow channel 4 is connected to an external vacuum pump to guide the potting adhesive or air in the potting cavity 2 to overflow out of the potting cavity 2 when it is filled with potting adhesive, thereby preventing residual air bubbles from forming inside the product.

[0028] Continue to refer to Figure 1 and Figure 2 As shown, the potting mold 1 includes a base 11, a bottom support 12, a housing 13, and a sealing cap 14. The base 11 serves as the mounting foundation for the overall mold. The housing 13 is mounted on top of the base 11, the bottom support 12 is mounted inside the housing 13, and the sealing cap 14 is mounted on top of the housing 13. Specifically, the injection channel 3 includes at least two overflow buffer chambers 31 connected in series. These at least two overflow buffer chambers 31 include a first buffer chamber 311 disposed inside the base 11 and a second buffer chamber 312 disposed between the base 11 and the bottom support 12. The potting cavity 2 is disposed inside the housing 13, and the overflow channel 4 is disposed inside the sealing cap 14, thereby achieving a reasonable assembly of the overall structure.

[0029] like Figure 3As shown, the base 11 includes a base 111 and at least one spacer 112 that is sealed between the base 111 and the housing 13; the first buffer cavity 311 is disposed between the base 111 and a spacer 112, and the second buffer cavity 312 is disposed between the base 12 and a spacer 112.

[0030] In this utility model Figures 1-3 In one typical embodiment shown, a structural example with only one spacer 112 is illustrated. Correspondingly, the glue injection channel 3 includes only two overflow buffer chambers 31, that is, the first buffer chamber 311 and the second buffer chamber 312 are directly connected.

[0031] In this embodiment, to achieve sequential flow of the glue injection channel 3, the potting cavity 2, and the overflow channel 4, the bottom of the first buffer cavity 311 is connected to a glue injection port 34 that communicates with an external glue supply device. The first buffer cavity 311 and the second buffer cavity 312 are connected through an overflow port 33, and the second buffer cavity 312 and the potting cavity 2 are connected through a glue leveling port 32. The overflow channel 4 is directly connected to the potting cavity 2. Specifically, the injection port 34 is disposed on the substrate 111, the overflow port 33 is disposed on the spacer 112, and the uniform dispensing port 32 is disposed on the base 12. Based on this, the glue supply device, through its connection with the injection port 34, allows the potting compound to enter the first buffer chamber 311. The flow rate of the potting compound is initially slowed down in the first buffer chamber 311, and then overflows through the overflow port 33 into the second buffer chamber 312. The flow rate of the potting compound is slowed down again in the second buffer chamber 312, thereby leveling and buffering the high-speed liquid supplied by the glue supply device into a stable low-speed fluid, so as to avoid excessive flow rate causing air to mix into the potting compound and cause bubble defects.

[0032] To ensure the deceleration effect of the first buffer chamber 311 and the second buffer chamber 312 on the potting compound, it is preferable that the central axes of the injection port 34, the uniform dispensing port 32, and the overflow port 33 are not collinear in the axial direction. That is, after the potting compound enters the corresponding buffer chamber, it can only overflow from the buffer chamber after the buffer chamber is completely filled with potting compound. During this process, the kinetic energy of the potting compound flow is reduced and becomes a stable laminar flow, which can effectively reduce the flow rate of the potting compound and avoid the formation of internal air bubbles due to turbulence.

[0033] To further eliminate air bubbles in the potting compound, the overflow port 33 includes, for example... Figure 4The diagram shows multiple overflow holes, the diameter of which is smaller than the smaller diameter of the injection port 34 and the uniform dispensing port 32. The multiple overflow holes include a first overflow hole 331 and a second overflow hole 332 surrounding the first overflow hole 331. At least the central axis of the first overflow hole 331 and partly the central axis of the second overflow hole 332 are not collinear with the central axis of the overflow buffer chamber 31 in the axial direction. Based on this, a further uniform flow guiding effect is achieved for the potting compound. Furthermore, the small diameter of the overflow holes 332 causes a certain shearing effect on the potting compound as it passes through the multiple small-diameter overflow holes 332, breaking up tiny air bubbles mixed within the potting compound.

[0034] To further improve the uniformity and integrity of the potting seal, the preferred method is as follows: Figure 5 The dispensing nozzles 32 shown are evenly arranged around the central axis of the potting cavity 2, so that the potting adhesive in the second buffer cavity 312 can overflow evenly to various areas in the potting cavity 2 through the multiple dispensing nozzles 32.

[0035] Regarding the structure shown in the figures of this utility model, which has two or more spacers 112, the dispensing channel 3 includes only two or more overflow buffer chambers 31. That is, the first buffer chamber 311 and the second buffer chamber 312 are indirectly connected through the overflow buffer chamber 31 located between them, and adjacent overflow buffer chambers 31 are connected through overflow ports 33. Under this structural design, on the one hand, the flow rate of the potting compound is further reduced through multiple overflow buffer chambers 31, and on the other hand, the potting compound is repeatedly homogenized and sheared through multiple overflow ports 33, so that the tiny air bubbles mixed in the potting compound can be fully broken.

[0036] Regarding the assembly of two or more spacers 112, it is preferable that the spacers 112 are stacked along the axial direction. Specifically, as follows... Figure 3 As shown, each of the spacers 112 includes a central portion 113, an edge portion 114, and a connecting portion 115 extending axially to connect the central portion 113 and the edge portion 114. An overflow port 33 is disposed on the central portion 113. Sealing grooves capable of engaging sealing rings 116 are provided on both axial end faces of the edge portion 114 and on the inner and outer circumferential surfaces of the connecting portion 115, thereby ensuring the sealing performance of the stacked adjacent spacers 112, and further ensuring the sealing performance of the overflow buffer cavity 31 formed between adjacent spacers 112. Specifically, Figure 3 and Figure 4The partition 112 shown is a convex plate structure, and an overflow buffer cavity 31 is formed through the concave cavity at the bottom of the convex plate structure. When adjacent partitions 112 are stacked, the center part 113 of the lower adjacent partition 112 is inserted into the bottom concave cavity of the upper adjacent partition 112, so that the overflow buffer cavity 31 is specifically formed between the adjacent center parts 113 of the adjacent partitions 112, thereby making the forming and assembly of the overflow buffer cavity 31 more convenient.

[0037] Regarding the sealing cap 14 and the overflow channel 4, as follows: Figure 6 As shown, the sealing cap 14 includes at least a central portion opposite to the filling cavity 2, which at least partially extends into the filling cavity 2, thereby achieving a sealed assembly between the sealing cap 14 and the housing 13. The overflow channel 4 includes an overflow port 43, a venting chamber 42, and an exhaust port 41 disposed in the central portion of the sealing cap 14. Multiple overflow ports 43 are evenly arranged around the central axis of the filling cavity 2, and the venting chamber 42 connects the overflow port 43 and the exhaust port 41. Based on this, during the potting process, the air in the potting cavity 2 can be discharged sequentially through the overflow port 43, the venting cavity 42, and the exhaust port 41. When the potting cavity 2 is filled with potting compound, the potting compound overflows through multiple overflow ports 43 into the venting cavity 42. At this point, it is determined that the potting cavity 2 has completed the potting process. The venting cavity 42 serves two purposes: firstly, it connects multiple overflow ports 43 with the exhaust port 41; secondly, it allows the overflowing potting compound to fill the venting cavity 42, preventing blockage of the exhaust port 41. It also flushes back the potting compound in the potting cavity 2 to prevent incomplete filling caused by shrinkage during curing, thereby improving the potting quality.

[0038] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A potting and dispensing buffer device, comprising a potting mold (1) having a potting cavity (2) and a dispensing channel (3) therein, wherein the dispensing channel (3) is used to guide the potting adhesive to flow into the potting cavity (2), characterized in that: The glue injection channel (3) includes at least two overflow buffer chambers (31) connected in series. The at least two overflow buffer chambers (31) include a first buffer chamber (311) with a glue injection port (34) and a second buffer chamber (312) connected to the potting chamber (2) through a glue leveling port (32). Adjacent overflow buffer chambers (31) are connected through overflow ports (33). The central axes of the glue injection port (34), the glue leveling port (32) and the overflow port (33) are not collinear in the axial direction.

2. The potting and dispensing buffer device according to claim 1, characterized in that: The overflow port (33) includes multiple overflow holes, the diameter of which is smaller than the smaller diameter of the glue injection port (34) and the glue leveling port (32).

3. The potting and dispensing buffer device according to claim 2, characterized in that: The plurality of overflow holes include a first overflow hole (331) and a second overflow hole (332) surrounding the first overflow hole (331), wherein at least the central axis of the first overflow hole (331) and part of the central axis of the second overflow hole (332) are not collinear with the central axis of the overflow buffer cavity (31) in the axial direction.

4. The potting and dispensing buffer device according to claim 1, characterized in that: Multiple uniform dispensing nozzles (32) are evenly arranged around the central axis of the filling cavity (2).

5. A potting and dispensing buffer device according to claim 1 or 4, characterized in that: The potting mold (1) includes a base (11) and a bottom support (12). The first buffer cavity (311) is disposed inside the base (11), and the second buffer cavity (312) is disposed between the base (11) and the bottom support (12). Multiple glue-spreading ports (32) are evenly opened on the bottom support (12) in a ring array to connect the potting cavity (2) and the second buffer cavity (312).

6. The potting and dispensing buffer device according to claim 5, characterized in that: The potting mold (1) further includes a shell (13) surrounding the potting cavity (2). The base (11) includes a base (111) and at least one spacer (112) that is sealed between the base (111) and the shell (13). The first buffer cavity (311) is disposed between the base (111) and a spacer (12). The second buffer cavity (312) is disposed between the base (12) and a spacer (112). The cavity between adjacent spacers (112) forms an overflow buffer cavity (31).

7. A potting and dispensing buffer device according to claim 6, characterized in that: At least one spacer (112) is stacked along the axial direction. Each spacer (112) includes a central portion (113), an edge portion (114), and a connecting portion (115) extending axially to connect the central portion (113) and the edge portion (114). The overflow port (33) is provided on the central portion (113). The two axial end faces of the edge portion (114) and the inner and outer circumferential surfaces of the connecting portion (115) are provided with sealing grooves that can engage the sealing ring (116).

8. The potting and dispensing buffer device according to claim 1, characterized in that: The potting mold (1) is also provided with an overflow channel (4) communicating with the potting cavity (2) so as to guide the potting glue or air in the potting cavity (2) to overflow to the outside of the potting cavity (2) when the potting cavity (2) is filled with potting glue.

9. A potting and dispensing buffer device according to claim 8, characterized in that: The overflow channel (4) includes a venting chamber (42) with an exhaust port (41) and an overflow port (43) connecting the venting chamber (42) and the filling chamber (2). Multiple overflow ports (43) are evenly arranged around the central axis of the filling chamber (2).

10. A potting and dispensing buffer device according to claim 8 or 9, characterized in that: The potting mold (1) also includes a sealing cap (14), which includes at least a central portion disposed opposite to the potting cavity (2). The overflow channel (4) is disposed within the central portion of the sealing cap (14), which extends at least partially into the potting cavity (2) so that the inner and outer spaces of the potting cavity (2) are relatively isolated and sealed.

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