A lighting device

Abstract

The utility model discloses a kind of lighting devices, the lighting device includes upper lamp body, lower lamp body, photoelectric component and optical assembly, the photoelectric component and optical assembly are fixedly installed on the upper lamp body, and the optical assembly is located at the light-emitting side of the photoelectric component, the outer diameter of the lower end of the upper lamp body is less than the inner diameter of the lower lamp body, the lower end of the upper lamp body is inserted into the inside of the lower lamp body and is fixedly connected with the bottom of the lower lamp body, there is gap between the lower end of the upper lamp body and the inner surface of the bottom of the lower lamp body, the inside of the lower lamp body is filled with heat-conducting potting adhesive, the heat-conducting potting adhesive is filled in the space between the upper lamp body and the lower lamp body and part is exposed to external air.The utility model is through the process of first assembly then external potting, saves the time of waiting for heat-conducting potting adhesive solidification in middle, shorten production cycle, improve production assembly efficiency;Part of heat-conducting potting adhesive contacts with external air, increases its convection heat dissipation area, improves whole lamp heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of lighting equipment technology, and in particular to a lighting device. Background Technology

[0002] Currently, the main functions of lamps and power supplies using potting technology are waterproofing and enhanced heat dissipation. In the assembly process of lamps, traditional potting involves filling the lamp body with adhesive. This process typically occurs after assembling heat-generating components (photoelectric modules). After potting, the adhesive needs to solidify naturally or be accelerated by heating before subsequent assembly steps can proceed. This potting process results in a long production cycle and low efficiency. Furthermore, while potting inside the lamp body increases the heat conduction path, the contact area with external air remains unchanged, limiting the improvement in convective heat transfer and resulting in minimal improvement in heat dissipation.

[0003] In summary, traditional lamps using potting processes suffer from technical problems such as low production efficiency and poor heat dissipation. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a lighting device that solves the technical problems of low production efficiency and poor heat dissipation performance of traditional lamps using potting process.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A lighting device includes an upper lamp body, a lower lamp body, a photoelectric component, and an optical component. The photoelectric component and the optical component are fixedly mounted on the upper lamp body, and the optical component is located on the light-emitting side of the photoelectric component. The outer diameter of the lower end of the upper lamp body is smaller than the inner diameter of the lower lamp body. The lower end of the upper lamp body extends into the interior of the lower lamp body and is fixedly connected to the bottom of the lower lamp body. A gap is left between the lower end of the upper lamp body and the inner surface of the bottom of the lower lamp body. The lower lamp body is filled with thermally conductive potting compound, which fills the space between the upper and lower lamp bodies and is partially exposed to the outside air.

[0006] Preferably, the distance A between the lower end of the upper lamp body and the inner surface of the bottom of the lower lamp body satisfies 2mm < A < B, where B is the internal height of the lower lamp body.

[0007] Preferably, the internal height B of the lower lamp body satisfies DC < B ≤ D, where D is the distance between the upper surface of the substrate of the optoelectronic component and the bottom inner surface of the lower lamp body, and C is the substrate thickness of the optoelectronic component.

[0008] Preferably, the lower end of the upper lamp body is fixedly connected to the bottom of the lower lamp body via a first snap-fit ​​structure.

[0009] Preferably, the first buckle structure includes multiple buckles disposed at the lower end of the upper lamp body and multiple slots disposed on the inner surface of the bottom of the lower lamp body, which are rotatably fitted with the buckles.

[0010] Preferably, the buckle includes a buckle connecting part connected to the lower end of the upper lamp body and a hook disposed at the end of the buckle connecting part; one end of the buckle groove is provided with a wide opening for the hook to be inserted, and the other end of the buckle groove is provided with a hook limiting part; after the hook is placed into the buckle groove, it enters the hollow space below the hook limiting part as the upper lamp body rotates relative to the lower lamp body.

[0011] Preferably, the optical component includes a diffuser plate and a reflector bowl, the diffuser plate and the reflector bowl are fixedly mounted on the upper lamp body, and the photoelectric component is fixedly connected to the reflector bowl.

[0012] Preferably, the reflector bowl is fixedly connected to the photoelectric component via a second snap-fit ​​structure.

[0013] Preferably, the optoelectronic component includes a substrate and an LED chip mounted on the substrate, wherein the substrate is an aluminum substrate.

[0014] Preferably, the thermally conductive potting compound has a thermal conductivity of 0.8-1.5 W / (m·K).

[0015] The beneficial technical effects of this utility model are as follows: In the above-mentioned lighting device, the outer diameter of the lower end of the upper lamp body is smaller than the inner diameter of the lower lamp body, and an external potting position is formed between the outer wall of the upper lamp body and the inner wall of the lower lamp body. Through the external potting position, potting can be performed from the outside of the upper lamp body. The lamp can be assembled first and then potted from the outside of the lamp body, which saves the time of waiting for the thermally conductive potting compound to solidify, shortens the production cycle, and improves the production and assembly efficiency. Part of the thermally conductive potting compound is in contact with the outside air, increasing its convective heat dissipation area and improving the overall heat dissipation efficiency of the lamp. Attached Figure Description

[0016] Figure 1 This is an exploded view of the lighting device of this utility model; Figure 2 This is a three-dimensional structural diagram of the lighting device of this utility model; Figure 3 This is a longitudinal sectional view of the lighting device of this utility model; Figure 4 for Figure 3 A magnified view of a section at point Z; Figure 5 This is a schematic diagram of the structure of the upper lamp body, photoelectric component, and optical component after assembly. Figure 6 for Figure 5 A magnified view of a section at point X; Figure 7 This is a three-dimensional structural diagram of the lower lamp body of this utility model; Figure 8 for Figure 7 A magnified view of a portion of point Y in the middle; Figure 9 This is a longitudinal sectional view of the lighting device of this utility model after glue filling. Detailed Implementation

[0017] To enable those skilled in the art to more clearly understand the purpose, technical solution and advantages of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] This invention provides a lighting device to solve the technical problems of low production efficiency and poor heat dissipation performance of traditional lamps using potting process.

[0019] like Figure 1 As shown, in one embodiment of the present invention, the lighting device includes an upper lamp body 10, a lower lamp body 20, a photoelectric component 30, and an optical component 40. The photoelectric component 30 and the optical component 40 are fixedly installed on the upper lamp body 10, and the optical component 40 is located on the light-emitting side of the photoelectric component 30. The lower end of the upper lamp body 10 extends into the interior of the lower lamp body 20 and is fixedly connected to the bottom of the lower lamp body 20. The lower lamp body 20 is filled with thermally conductive potting compound 50, which fills the space between the upper lamp body 10 and the lower lamp body 20 and is partially exposed to the outside air.

[0020] like Figure 2 As shown, the outer diameter of the lower end of the upper lamp body 10 is smaller than the inner diameter of the lower lamp body 20, thus forming an external potting position 51 between the outer wall of the upper lamp body 10 and the inner wall of the lower lamp body 20. Potting can be performed from the outside of the upper lamp body 10 through this external potting position 51. A gap is left between the lower end of the upper lamp body 10 and the bottom inner surface of the lower lamp body 20, allowing the injected thermally conductive potting compound 50 to flow into the interior of the upper lamp body 10 through this gap, thereby filling the space between the upper lamp body 10 and the lower lamp body 20. The thermal conductivity of the thermally conductive potting compound 50 can be 0.8 W / (m·K), or it can be 1.0 W / (m·K), 1.2 W / (m·K), 1.5 W / (m·K), or other higher values.

[0021] like Figure 1 and Figure 3As shown, the optoelectronic component 30 includes a substrate 31 and an LED chip 32 mounted on the substrate 31. The substrate 31 is made of aluminum. The optical component 40 includes a diffuser plate 41 and a reflector bowl 42. The diffuser plate 41 and the reflector bowl 42 are fixedly mounted on the upper lamp body 10, and the optoelectronic component 30 is fixedly connected to the reflector bowl 42. In this embodiment, the reflector bowl 42 is fixedly connected to the optoelectronic component 30 through a second snap-fit ​​structure. Specifically, a snap-fit ​​is provided at the rear end of the reflector bowl 42, and a slot is provided on the substrate 31 of the optoelectronic component 30. The snap-fit ​​at the rear end of the reflector bowl 42 cooperates with the slot on the substrate 31 to fix the optoelectronic component 30 to the reflector bowl 42.

[0022] like Figures 5 to 8 As shown, the lower end of the upper lamp body 10 is fixedly connected to the bottom of the lower lamp body 20 via a first snap-fit ​​structure. The first snap-fit ​​structure includes multiple snaps 11 disposed at the lower end of the upper lamp body 10 and multiple slots 21 disposed on the inner surface of the bottom of the lower lamp body 20, which are rotatably fitted with the snaps 11. In this embodiment, the buckle 11 includes a buckle connecting part 111 connected to the lower end of the upper lamp body 10 and a hook 112 disposed at the end of the buckle connecting part 111; the slot 21 adopts a hollow design, the slot 21 does not penetrate the bottom of the lower lamp body 20, one end of the slot 21 is provided with a wide opening 211 for the hook 112 to be inserted, and the other end of the slot 21 is provided with a hook limiting part 212. After the hook 112 is inserted into the slot 21 through the wide opening 211, it enters the hollow space below the hook limiting part 212 as the upper lamp body 10 rotates relative to the lower lamp body 20. The hook 112 cooperates with the hook limiting part 212 to achieve limiting.

[0023] The lower end of the upper lamp body 10 is fixed to the lower lamp body 20 by a first snap-fit ​​structure. The distance A between the lower end of the upper lamp body 10 and the bottom inner surface of the lower lamp body 20 must be higher than 2mm to ensure that the injected liquid thermally conductive potting compound 50 can flow smoothly into the interior of the upper lamp body 10. In addition, the distance A between the lower end of the upper lamp body 10 and the bottom inner surface of the lower lamp body 20 must not be higher than the interior height B of the lower lamp body 20 to ensure that the height of the injected thermally conductive potting compound 50 does not exceed the lower end of the upper lamp body 10, forming a closed space. Therefore, the distance A between the lower end of the upper lamp body 10 and the bottom inner surface of the lower lamp body 20 must satisfy 2mm < A < B.

[0024] According to the principle of pressure balance: when the same liquid is at rest in communicating vessels, the liquid levels in each container are the same. For example... Figure 9As shown, when the thermally conductive potting compound 50 is poured, the internal potting height 52 of the upper lamp body 10 is flush with the external potting height 53 of the upper lamp body 10. This invention performs potting from the outside of the upper lamp body 10, precisely controlling the internal potting height of the upper lamp body 10 by controlling the external potting height, ensuring greater heat dissipation while also controlling the amount of potting compound.

[0025] In a preferred embodiment, the internal height B of the lower lamp body 20 is designed not to be higher than the distance D between the upper surface of the substrate 31 of the photoelectric component 30 and the bottom inner surface of the lower lamp body 20. Even if too much glue is poured, it will only overflow outwards and will not cause excessive glue to cover the light source, thus avoiding quality problems caused by excessive glue. At the same time, the internal height B of the lower lamp body should be higher than the distance DC between the lower surface of the substrate 31 and the bottom inner surface of the lower lamp body 20, where C is the thickness of the substrate 31. This ensures that the glue height can contact the substrate 31 and partially wrap the substrate 31, so that the heat of the substrate 31 can be quickly transferred away through the thermally conductive potting compound 50. Therefore, the internal height B of the lower lamp body must satisfy DC < B ≤ D.

[0026] When assembling the lighting device of this utility model, first install the reflector bowl 42 and diffuser plate 41 on the upper lamp body 10, then fix the photoelectric component 30 on the reflector bowl 42, then fasten the upper lamp body 10 and the lower lamp body 20 together through the first snap-fit ​​structure, and finally inject thermally conductive potting compound 50 from the outside. After the thermally conductive potting compound 50 solidifies, the assembly of the whole lamp is completed, and the lighting effect is achieved. The whole lamp has a simple structure and is easy to assemble.

[0027] This invention involves exposing a portion of the thermally conductive potting compound to external air, increasing its convective heat dissipation area and improving the overall lamp's heat dissipation efficiency. To verify the heat dissipation effect of this invention, keeping the overall lamp design unchanged, plastic components and thermally conductive potting compounds of the same size were used. The only variable was whether the thermally conductive potting compound was in contact with external air. A set of control experiments was conducted to simulate and verify the heat dissipation effect. Specifically, the simulation was run in simulation software (such as FloEFD software), with the simulated ambient temperature set to 25℃, the thermal conductivity of the thermally conductive potting compound to 0.8W / (m·K), the photoelectric component substrate to an aluminum substrate, and other materials to plastic. A total lamp power of 10W was input, and other parameters remained consistent. The simulation showed that the Tsp temperature of the light source solder joint (Tsp temperature) of the lamp completely inside the lamp body was 91.48℃, while the Tsp temperature of the lighting device of this invention was 88.26℃, a decrease of 3.22℃, significantly reducing the overall lamp temperature.

[0028] In summary, the lighting device provided by this utility model has the following beneficial technical effects: (1) The outer diameter of the lower end of the upper lamp body is smaller than the inner diameter of the lower lamp body. An external potting position is formed between the outer wall of the upper lamp body and the inner wall of the lower lamp body. The upper lamp body can be potted from the outside through the external potting position. The lamp can be assembled first and then potted from the outside of the lamp body, saving the time of waiting for the heat-conducting potting glue to solidify, shortening the production cycle and improving the production and assembly efficiency.

[0029] (2) Part of the thermally conductive potting compound comes into contact with the outside air, increasing its convective heat dissipation area and improving the overall heat dissipation efficiency of the lamp.

[0030] (3) By utilizing the pressure balance principle and structural design, the potting height is precisely controlled to avoid the heat-conducting potting compound covering the light source, thus reducing quality problems.

[0031] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Those skilled in the art can make various equivalent changes and improvements based on the above embodiments. All equivalent changes or modifications made within the scope of the claims should fall within the protection scope of the present utility model.

Claims

1. A lighting device, characterized in that: The lighting device includes an upper lamp body, a lower lamp body, a photoelectric component, and an optical component. The photoelectric component and the optical component are fixedly mounted on the upper lamp body, and the optical component is located on the light-emitting side of the photoelectric component. The outer diameter of the lower end of the upper lamp body is smaller than the inner diameter of the lower lamp body. The lower end of the upper lamp body extends into the interior of the lower lamp body and is fixedly connected to the bottom of the lower lamp body. A gap is left between the lower end of the upper lamp body and the inner surface of the bottom of the lower lamp body. Thermally conductive potting compound is filled inside the lower lamp body. The thermally conductive potting compound fills the space between the upper lamp body and the lower lamp body and is partially exposed to the outside air.

2. The lighting device as described in claim 1, characterized in that: The distance A between the lower end of the upper lamp body and the inner surface of the bottom of the lower lamp body satisfies 2mm < A < B, where B is the internal height of the lower lamp body.

3. The lighting device as described in claim 1, characterized in that: The internal height B of the lower lamp body satisfies DC < B ≤ D, where D is the distance between the upper surface of the substrate of the optoelectronic component and the inner surface of the bottom of the lower lamp body, and C is the substrate thickness of the optoelectronic component.

4. The lighting device as claimed in claim 1, characterized in that: The lower end of the upper lamp body is fixedly connected to the bottom of the lower lamp body through a first snap-fit ​​structure.

5. The lighting device as described in claim 4, characterized in that: The first buckle structure includes multiple buckles disposed at the lower end of the upper lamp body and multiple slots disposed on the inner surface of the bottom of the lower lamp body, which are rotatably fitted with the buckles.

6. The lighting device as described in claim 5, characterized in that: The buckle includes a buckle connecting part connected to the lower end of the upper lamp body and a hook provided at the end of the buckle connecting part; one end of the buckle groove is provided with a wide opening for the hook to be inserted, and the other end of the buckle groove is provided with a hook limiting part. After the hook is placed into the buckle groove, it enters the hollow space below the hook limiting part as the upper lamp body rotates relative to the lower lamp body.

7. The lighting device as claimed in claim 1, characterized in that: The optical components include a diffuser plate and a reflector bowl, which are fixedly mounted on the upper lamp body, and the photoelectric component is fixedly connected to the reflector bowl.

8. The lighting device as claimed in claim 7, characterized in that: The reflector bowl is fixedly connected to the photoelectric component via a second snap-fit ​​structure.

9. The lighting device as claimed in claim 1, characterized in that: The optoelectronic component includes a substrate and an LED chip mounted on the substrate, wherein the substrate is an aluminum substrate.

10. The lighting device according to any one of claims 1-9, characterized in that: The thermal conductivity of the thermally conductive potting compound is 0.8-1.5 W / (m·K).

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