Wafer probe card inspection apparatus

Abstract

The utility model relates to probe card detection technical field, concretely is a wafer probe card detection device, detection platform, the detection device includes: install in the first electric push rod of detection platform middle part, the output of first electric push rod is provided with the lifting plate, the lateral wall of lifting plate is provided with two groups of second electric push rod, the utility model discloses a test device that can continuous automation makes probe card to circuit board chip and carries out test, through the bearing support of placing mechanism to multiple circuit board chips, can conveniently unload and convey after the test of circuit board chip, the driving of servo motor is placed dish rotation realizes multiple circuit board chip alternation and detection probe card contact, positioning mechanism cooperates with first electric push rod, realizes the restriction of placing dish rotation range, realizes the accurate control of placing dish movement range, in this way, realized the continuous automation test of wafer probe card to circuit board chip.

Description

Technical Field

[0001] This utility model relates to the field of probe card testing technology, specifically a wafer probe card testing device. Background Technology

[0002] Wafer probe cards are key components in the semiconductor testing field. Their main function is to enable precise electrical connections between the tester and thousands of chip pads on the wafer before the chip is packaged and diced, thereby completing the initial screening and classification of chip performance. The performance and testing accuracy of probe cards are directly related to the yield and production cost of semiconductor products. Therefore, the status and performance of probe cards need to be tested before use.

[0003] In the traditional wafer probe card testing process, the chip is usually clamped and fixed by a fixture and then contacts the probe card to achieve performance testing. However, the traditional method of clamping and testing chips by fixture has the problem that it cannot achieve continuous and automated testing of multiple chips. The individual clamping and placement of chips results in low testing efficiency of the probe card. Utility Model Content

[0004] This invention addresses the technical problems existing in the prior art by providing a wafer probe card inspection device. This solves the problem that traditional probe card inspection devices cannot achieve continuous automated inspection of multiple chips, and that the low efficiency of probe card inspection is caused by clamping and placing chips one by one.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A wafer probe card inspection device is provided, including an inspection stage, the inspection device comprising: The first electric push rod is installed in the middle of the testing platform. The output end of the first electric push rod is provided with a lifting plate. Two sets of second electric push rods are provided on the side wall of the lifting plate. The output end of the second electric push rod is provided with a mounting frame. The middle of the mounting frame is provided with a testing probe card. A support base is provided on the side wall of the testing table. A placement plate is rotatably connected to the top of the support base. A servo motor is bolted to the middle of the support base. The output end of the servo motor is fixedly connected to the placement plate. Multiple placement mechanisms for facilitating the placement and removal of probe cards are provided on the side wall of the placement tray; and A positioning mechanism is provided between the placement plate and the lifting plate.

[0006] Furthermore, the placement mechanism includes: Multiple placement slots are provided on the side wall of the placement tray, and the multiple placement slots are distributed at equal intervals. The placement slots are adapted to the circuit board chips. Multiple movable frames are arranged at the bottom of the placement tray. A bidirectional lead screw is provided in the middle of each movable frame. Movable blocks are provided on both sides of each movable frame. The movable blocks are adapted to the bidirectional lead screw. A drive motor is bolted to the side wall of each movable frame, and the output end of the drive motor is fixedly connected to the bidirectional lead screw. The support plates are arranged on the side wall of the movable block, with two support plates arranged as a group and the two groups of support plates respectively arranged on both sides of the bottom of the placement slot.

[0007] Furthermore, the positioning mechanism includes: Multiple positioning seats are disposed on the top of the placement tray, and the positioning seats are semi-circular tubes. A positioning rod is disposed on one side of the lifting plate, the positioning rod is movably connected to the lifting plate, and a limit plate is fixedly connected to the side wall of the positioning rod; and A support spring is sleeved on the side wall of the positioning rod, and the two ends of the support spring are in contact with the lifting plate and the limiting plate, respectively.

[0008] Furthermore, two sets of conveyor belts are provided on the side wall of the testing platform. The two sets of conveyor belts are arranged symmetrically, and the positions of the conveyor belts are adapted to the placement grooves.

[0009] Furthermore, sliding grooves are provided on both sides of the placement groove, and a clamping head is provided on the top of the support plate, the clamping head being movably connected to the sliding groove.

[0010] Furthermore, two sliding rods are fixedly connected to the side wall of the support plate, and multiple sliding blocks are fixedly connected to the side wall of the placement tray. Two sliding blocks are arranged as a group, and the sliding rods are movably connected to the sliding blocks.

[0011] Furthermore, the top of the placement tray is provided with multiple sets of control indicator lights, which are located on one side of the placement slot.

[0012] Furthermore, a mounting base is provided in the middle of the testing platform, and a testing camera is provided on the top of the mounting base.

[0013] The beneficial effects of this utility model are: This invention designs a testing device that enables continuous and automated testing of circuit board chips using a probe card. A placement mechanism supports multiple circuit board chips, facilitating their unloading and transport after testing. A servo motor drives the placement disk to rotate, allowing multiple circuit board chips to alternately contact the probe card. A positioning mechanism, in conjunction with a first electric push rod, limits the rotation range of the placement disk, achieving precise control over its movement. Thus, continuous and automated testing of circuit board chips using a wafer probe card is realized. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is the right view of the present invention; Figure 3 This is a three-dimensional cross-sectional view of the present invention; Figure 4 This is a schematic diagram of the placement mechanism in this utility model; Figure 5 This is a schematic diagram of the positioning mechanism in this utility model; The attached diagram lists the components represented by each number as follows: 1. Testing table; 2. First electric push rod; 3. Lifting plate; 4. Second electric push rod; 5. Mounting frame; 6. Testing probe card; 7. Support base; 8. Placement tray; 9. Servo motor; 10. Placement mechanism; 101. Placement slot; 102. Moving frame; 103. Two-way lead screw; 104. Moving block; 105. Drive motor; 106. Support plate; 11. Positioning mechanism; 111. Positioning seat; 112. Positioning rod; 113. Limiting plate; 114. Support spring; 12. Conveyor belt assembly; 13. Chute; 14. Clamping head; 15. Slide rod; 16. Slide block; 17. Control indicator light; 18. Mounting base; 19. Detection camera. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this utility model and are not intended to limit this utility model.

[0016] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0018] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0019] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0020] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0021] The present invention provides the following preferred embodiments: Example 1: Reference Figure 1 As shown, a wafer probe card inspection device includes an inspection stage 1, and the inspection device includes: The first electric push rod 2 is installed in the middle of the testing platform 1. The output end of the first electric push rod 2 is provided with a lifting plate 3. Two sets of second electric push rods 4 are provided on the side wall of the lifting plate 3. The output end of the second electric push rod 4 is provided with a mounting frame 5. The middle of the mounting frame 5 is provided with a testing probe card 6. The support base 7 is set on the side wall of the testing table 1. The top of the support base 7 is rotatably connected to the placement plate 8. The middle of the support base 7 is bolted with a servo motor 9. The output end of the servo motor 9 is fixedly connected to the placement plate 8. Multiple placement mechanisms 10 for easy placement and removal of probe cards are provided on the side wall of the placement tray 8; and The positioning mechanism 11 is located between the placement plate 8 and the lifting plate 3.

[0022] In use, the placement mechanism 10 supports multiple circuit board chips placed on the placement tray 8. Driven by the servo motor 9, the multiple circuit board chips move alternately to the bottom of the detection probe card 6. The output of the first electric push rod 2 and the second electric push rod 4 enables the detection probe card 6 to contact and test the circuit board chips. The positioning mechanism 11 and the first electric push rod 2 cooperate to achieve precise control of the movement range of the placement tray 8. The placement mechanism 10 facilitates the unloading of the tested circuit board chips, thereby enabling continuous testing of the circuit board chips and improving the testing efficiency of the circuit board chips.

[0023] Example 2: Reference Figure 4 As shown, the placement mechanism 10 includes: Multiple placement slots 101 are provided on the side wall of the placement disk 8. The multiple placement slots 101 are distributed at equal intervals and are adapted to the circuit board chips. Multiple movable frames 102 are arranged at the bottom of the placement tray 8. A bidirectional lead screw 103 is provided in the middle of the movable frame 102. Movable blocks 104 are provided on both sides of the movable frame 102. The movable blocks 104 are adapted to the bidirectional lead screw 103. A drive motor 105 is bolted to the side wall of the movable frame 102. The output end of the drive motor 105 is fixedly connected to the bidirectional lead screw 103. Support plates 106 are provided on the side wall of the movable block 104. Two support plates 106 are provided as a group, and the two groups of support plates 106 are respectively provided on both sides of the bottom of the placement groove 101.

[0024] In use, initially, the placement slot 101 matches the shape and size of the circuit board chip. Two support plates 106 are located below the placement slot 101, supporting the circuit board chip inside the placement slot 101. The rotation of the placement disk 8 can carry the circuit board chip inside the placement slot 101 one by one to the bottom of the detection probe card 6 for detection. After the circuit board chip is detected, according to the detection status, the drive motor 105 drives the bidirectional lead screw 103 to rotate, realizing the movement of the moving block 104 inside the moving frame 102. The moving block 104 drives the two support plates 106 to move outward of the placement slot 101, thereby releasing the support of the circuit board chip and allowing the circuit board chip to fall onto the corresponding conveyor belt group 12, which facilitates the unloading of the detected circuit board chip.

[0025] Example 3: Reference Figure 5 As shown, the positioning mechanism 11 includes: Multiple positioning seats 111 are provided on the top of the placement tray 8, and the positioning seats 111 are semi-circular tubes. A positioning rod 112 is disposed on one side of the lifting plate 3, and the positioning rod 112 is movably connected to the lifting plate 3. A limit plate 113 is fixedly connected to the side wall of the positioning rod 112; and A support spring 114 is sleeved on the side wall of the positioning rod 112, and the two ends of the support spring 114 are in contact with the lifting plate 3 and the limiting plate 113, respectively.

[0026] In use, initially, the first electric push rod 2 drives the lifting plate 3 downward, causing the positioning rod 112 to move downward. At this time, the placement plate 8 rotates, and the positioning seat 111 rotates accordingly. When the positioning seat 111 contacts the positioning rod 112, the servo motor 9 stops driving the placement plate 8. At this time, one of the placement slots 101 coincides with the position of the detection probe card 6, realizing the control of the rotation range of the placement plate 8. During the detection process, the first electric push rod 2 continues to drive the lifting plate 3 downward. During the contact between the positioning rod 112 and the positioning seat 111, the positioning rod 112 slides at one end of the lifting plate 3. During this process, the setting of the limit plate 113 and the support spring provides support and buffer for the positioning rod 112. After the first electric push rod 2 drives the lifting plate 3 to the appropriate position, the second electric push rod 4 drives the detection probe card 6 inside the mounting frame 5 to contact the circuit board chip, realizing the detection of the circuit board chip.

[0027] Example 4: Reference Figure 5 As shown, two sets of conveyor belts 12 are provided on the side wall of the testing table 1. The two sets of conveyor belts 12 are arranged symmetrically, and the positions of the conveyor belts 12 and the placement groove 101 are adapted to each other.

[0028] In use, two sets of conveyor belts 12 are symmetrically arranged, and the two sets of conveyor belts 12 respectively transport qualified circuit board chips and unqualified circuit board chips that are fed into the corresponding placement grooves 101.

[0029] Example 5: Reference Figure 3 As shown, sliding grooves 13 are provided on both sides of the placement groove 101, and a clamping head 14 is provided on the top of the support plate 106. The clamping head 14 is movably connected to the sliding groove 13.

[0030] In use, the cooperation of the slide groove 13 and the clamping head 14 enables the support plate 106 to support the circuit board chip inside the placement groove 101 while clamping and positioning the circuit board chip, so that the circuit board chip is stable inside the placement groove 101.

[0031] Example 6: Reference Figure 4 As shown, two slide rods 15 are fixedly connected to the side wall of the support plate 106, and multiple slide seats 16 are fixedly connected to the side wall of the placement plate 8. Two slide seats 16 are set as a group, and the slide rods 15 are movably connected to the slide seats 16.

[0032] In use, the sliding rod 15 and the sliding block 16 work together to guide and limit the movement of the support plate 106, so that the two support plates 106 can move in a stable state.

[0033] Example 7: Reference Figure 3 As shown, multiple sets of control indicator lights 17 are provided on the top of the placement tray 8, and the control indicator lights 17 are located on one side of the placement slot 101.

[0034] In use, by controlling the matching of the indicator light 17 with the electric motor of the detection device and the detection probe card 6, the status of the circuit board chip inside the placement slot 101 can be displayed. By controlling the indicator light 17 to display different statuses, the qualified and unqualified status of the circuit board chip can be observed.

[0035] Example 8: Reference Figure 3 As shown, a mounting base 18 is provided in the middle of the testing platform 1, and a testing camera 19 is provided on the top of the mounting base 18.

[0036] In use, by installing a detection camera 19 on the mounting base 18, the process of the detection probe card 6 contacting the circuit board chip can be visually detected by setting the detection camera 19.

[0037] Working principle: In use, multiple circuit board chips are first placed one by one inside the placement slot 101. Initially, the placement slot 101 matches the shape and size of the circuit board chips. Two support plates 106 are located below the placement slot 101 to support the circuit board chips inside. The servo motor 9 drives the multiple circuit board chips to move alternately to below the detection probe card 6. The first electric push rod 2 drives the lifting plate 3 to move downward, causing the positioning rod 112 to move downward. At this time, the placement disk 8 rotates, and the positioning seat 1... 11. Following the rotation, when the positioning seat 111 contacts the positioning rod 112, the servo motor 9 stops driving the placement plate 8. At this time, one of the placement slots 101 coincides with the position of the detection probe card 6, realizing the control of the rotation range of the placement plate 8. During the detection process, the first electric push rod 2 continues to drive the lifting plate 3 downward. At this time, during the contact between the positioning rod 112 and the positioning seat 111, the positioning rod 112 slides at one end of the lifting plate 3. During this process, the setting of the limit plate 113 and the support spring provides support and buffer for the positioning rod 112. When the first electric push rod 2 drives... After the lifting plate 3 is moved to the appropriate position, the second electric push rod 4 drives the detection probe card 6 inside the mounting frame 5 to contact the circuit board chip, realizing the detection of the circuit board chip. The contact state between the circuit board chip and the detection probe card 6 is visually detected by the detection camera 19, and the display light 17 is controlled to display the qualified status of the circuit board chip after detection. After one group of circuit board chips is detected, the first electric push rod 2 and the second electric push rod 4 are reset, so that the placement tray 8 continues to rotate. At this time, when the circuit board chip moves to the top of the corresponding conveyor belt group 12, the bidirectional lead screw 103 is driven by the drive motor 105 to rotate, realizing the movement of the moving block 104 inside the moving frame 102. The moving block 104 drives the two support plates 106 to move to the outside of the placement slot 101, thereby releasing the support of the circuit board chip and allowing the circuit board chip to fall on the corresponding conveyor belt group 12, which facilitates the unloading of the detected circuit board chip. The circuit board chip is then transported on the corresponding conveyor belt group 12. In this way, the automated detection of circuit board chips is realized, improving the detection efficiency of the wafer probe card for circuit board chips.

[0038] The beneficial effects of this utility model are specifically reflected in the fact that the above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer probe card inspection device, comprising an inspection stage (1), characterized in that, The detection device includes: The first electric push rod (2) is installed in the middle of the detection table (1). The output end of the first electric push rod (2) is provided with a lifting plate (3). Two sets of second electric push rods (4) are provided on the side wall of the lifting plate (3). The output end of the second electric push rod (4) is provided with a mounting frame (5). The middle part of the mounting frame (5) is provided with a detection probe card (6). A support base (7) is set on the side wall of the testing table (1). A placement plate (8) is rotatably connected to the top of the support base (7). A servo motor (9) is bolted to the middle of the support base (7). The output end of the servo motor (9) is fixedly connected to the placement plate (8). Multiple placement mechanisms (10) for facilitating the placement and removal of probe cards are provided on the side wall of the placement tray (8); and The positioning mechanism (11) is disposed between the placement plate (8) and the lifting plate (3).

2. The wafer probe card inspection device according to claim 1, characterized in that, The placement mechanism (10) includes: Multiple placement slots (101) are provided on the side wall of the placement tray (8), and the multiple placement slots (101) are distributed at equal intervals. The placement slots (101) are adapted to the circuit board chip. Multiple sets of movable frames (102) are arranged at the bottom of the placement tray (8). A bidirectional lead screw (103) is provided in the middle of each movable frame (102). Movable blocks (104) are provided on both sides of each movable frame (102). The movable blocks (104) are adapted to the bidirectional lead screw (103). A drive motor (105) is bolted to the side wall of the movable frame (102). The output end of the drive motor (105) is fixedly connected to the bidirectional lead screw (103). The support plates (106) are set on the side wall of the movable block (104), and the two support plates (106) are set as a group, and the two groups of support plates (106) are respectively set on both sides of the bottom of the placement groove (101).

3. The wafer probe card inspection device according to claim 1, characterized in that, The positioning mechanism (11) includes: Multiple positioning seats (111) are provided on the top of the placement tray (8), and the positioning seats (111) are semi-circular tubes. A positioning rod (112) is provided on one side of the lifting plate (3), the positioning rod (112) is movably connected to the lifting plate (3), and a limit plate (113) is fixedly connected to the side wall of the positioning rod (112); and A support spring (114) is sleeved on the side wall of the positioning rod (112), and the two ends of the support spring (114) are in contact with the lifting plate (3) and the limiting plate (113) respectively.

4. The wafer probe card inspection device according to claim 2, characterized in that, Two sets of conveyor belts (12) are provided on the side wall of the testing platform (1). The two sets of conveyor belts (12) are symmetrically arranged, and the positions of the conveyor belts (12) and the placement groove (101) are adapted to each other.

5. The wafer probe card inspection device according to claim 2, characterized in that, The placement groove (101) has sliding grooves (13) on both sides, and the support plate (106) has a clamping head (14) on the top, which is movably connected to the sliding groove (13).

6. The wafer probe card inspection device according to claim 2, characterized in that, Two slide rods (15) are fixedly connected to the side wall of the support plate (106), and multiple slide seats (16) are fixedly connected to the side wall of the placement plate (8). Two slide seats (16) are set as a group, and the slide rods (15) are movably connected to the slide seats (16).

7. The wafer probe card inspection device according to claim 2, characterized in that, The top of the placement tray (8) is provided with multiple sets of control indicator lights (17), which are located on one side of the placement slot (101).

8. The wafer probe card inspection device according to claim 2, characterized in that, The detection platform (1) is provided with a mounting base (18) in the middle, and a detection camera (19) is provided on the top of the mounting base (18).

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