A highly efficient heat sink

Abstract

The utility model discloses a kind of high-efficiency radiators, including bottom plate, heat pipe and fin. Bottom plate is provided with pipe groove, heat pipe has the contact plane closely combined with pipe groove, and bottom plate is fixedly installed with the heat conduction plate directly contacted with the contact plane of heat pipe and CPU, to form high-efficiency heat conduction path. Bottom plate is also provided with multiple groups of heat dissipation fins for assisting heat dissipation. Fin is connected with bottom plate by heat pipe, and is installed with protection frame by fastening bolt, and fixed frame is symmetrically arranged on both sides of protection frame, and heat dissipation fan is installed on each fixed frame, and cover is arranged outside fan. Two heat dissipation fans respectively implement blowing and air extraction, to form the forced convection through fin, to significantly improve heat dissipation efficiency. The utility model is compact in structure, and excellent in heat conduction performance, can effectively control CPU operating temperature, to ensure system stable operation.

Description

Technical Field

[0001] This utility model belongs to the field of radiator technology, and specifically relates to a high-efficiency radiator. Background Technology

[0002] With the rapid development of information technology, computers have become deeply embedded in daily life and all walks of life. In high-performance computing scenarios, the central processing unit (CPU), as the core of computing, often releases a large amount of heat. If this heat cannot be dissipated quickly and effectively, it can lead to system sluggishness or even system crashes, or even permanent damage to the CPU due to sustained high temperatures. To address this, conventional cooling solutions involve coating the CPU surface with thermal grease and installing a matching heatsink to enhance heat conduction and keep the processor temperature within a safe threshold. It can be said that efficient heat dissipation has become a key factor in ensuring stable CPU operation. However, facing the high heat flux density generated by new-generation high-performance CPUs, traditional air-cooling methods have gradually revealed their shortcomings in terms of insufficient heat dissipation rate and limited heat conduction efficiency. This causes the CPU to easily trigger protective frequency reduction due to heat accumulation, directly affecting the full release of its theoretical performance. Utility Model Content

[0003] The purpose of this invention is to provide a high-efficiency heat sink to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat sink, comprising a base plate, heat pipes, and fins. The base plate is provided with a pipe groove, and the fins are fixedly connected to the base plate through the heat pipes. The heat pipes are provided with a contact plane, and heat-conducting plates are fixedly installed on the base plate. The base plate is provided with heat dissipation fins, and the fins are fixedly installed with protective frames by fastening bolts. Fixed frames are symmetrically installed on both sides of the protective frames, and cooling fans are fixedly installed on each fixed frame. The cooling fans are fixedly installed with covers.

[0005] Preferably, the protective frame is fixedly mounted with a top shell, the top shell is fixedly mounted with a magnet, and the fastening bolts are made of stainless steel.

[0006] Preferably, the heat-conducting sheet is made of copper.

[0007] Preferably, the base plate has a through hole, a connecting bolt is movably installed in the through hole, a locking piece is fixedly connected to one end of the connecting bolt, a spring is provided between the connecting bolt and the base plate, and the connecting bolt has a connecting hole.

[0008] Preferably, the cover is provided with a buckle, the cooling fan is provided with a rib, and the buckle engages with the rib.

[0009] Compared with the prior art, the beneficial effects of this utility model are:

[0010] The base plate of this invention features a grooved tube, and the heat pipe has a contact plane, through which the heat pipe is tightly connected to the grooved tube of the base plate. A heat-conducting plate is fixedly mounted on the base plate, which is in close contact with the contact plane of the heat pipe and also in direct contact with the CPU, thereby effectively improving heat exchange efficiency. In addition, multiple heat sinks are provided on the base plate to further enhance the auxiliary heat dissipation effect. During operation, the heat generated by the CPU is sequentially conducted to the fins through the heat-conducting plate and heat pipes. Cooling fans located on both sides of the fins work together; one fan draws in cool external air and blows it onto the fins, while the other fan draws in hot air from the fins, forming a highly efficient airflow circulation. This structure significantly improves heat dissipation efficiency, ensuring that the CPU operating temperature remains stable. Attached Figure Description

[0011] Figure 1 This is the first perspective structural view of this utility model.

[0012] Figure 2 This is the second perspective structural view of this utility model.

[0013] Figure 3 This is an exploded structural view of the present invention.

[0014] Figure 4 This is an exploded structural view of the base plate of this utility model.

[0015] Figure 5 This is a structural view of the casing of this utility model.

[0016] Figure 6 This is a structural view of the top shell of this utility model.

[0017] Figure 7 This is a structural view of the heat pipe of this utility model.

[0018] The diagram is labeled as follows: base plate 1, heat pipe 2, fin 3, tube groove 4, contact plane 5, heat conduction plate 6, heat sink 7, fastening bolt 8, protective frame 9, fixing frame 10, cooling fan 11, cover 12, top shell 13, magnet 14, through hole 15, connecting bolt 16, locking plate 18, spring 19, connecting hole 20, buckle 21, rib 22. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1:

[0021] This utility model provides a high-efficiency heat sink, including a base plate 1, heat pipes 2, and fins 3. The base plate 1 has a pipe groove 4. The fins 3 are fixedly connected to the base plate 1 through the heat pipes 2. The heat pipes 2 have a contact surface 5. Heat-conducting plates 6 are fixedly installed on the base plate 1. The base plate 1 has heat dissipation fins 7. The fins 3 are fixedly installed with protective frames 9 by fastening bolts 8. Fixing frames 10 are symmetrically installed on both sides of the protective frames 9. Cooling fans 11 are fixedly installed on each fixing frame 10. The cooling fans 11 are fixedly installed with covers 12. The protective frame 9 is fixedly installed with a top shell 13. The top shell 13 is fixedly installed with magnets 14. The fastening bolts 8 are made of stainless steel. The heat-conducting plates 6 are made of copper. The base plate 1 has a through hole 15. A connecting bolt 16 is movably installed in the through hole 15. A locking piece 18 is fixedly connected to one end of the connecting bolt 16. A spring 19 is provided between the connecting bolt 16 and the base plate 1. The connecting bolt 16 has a connecting hole 20. The cover 12 is provided with a buckle 21, and the cooling fan 11 is provided with a rib 22. The buckle 21 and the rib 22 are engaged.

[0022] Through the above technical solution, the base plate 1 of this utility model is provided with a groove 4, and the heat pipe 2 has a contact plane 5. The heat pipe 2 is tightly connected to the groove 4 of the base plate 1 through the contact plane 5. A heat-conducting plate is fixedly installed on the base plate 1. The heat-conducting plate is in close contact with the contact plane 5 of the heat pipe 2 and is in direct contact with the CPU, thereby effectively improving the heat exchange efficiency. In addition, multiple heat sinks 7 are provided on the base plate 1 to further enhance the auxiliary heat dissipation effect. During operation, the heat generated by the CPU is conducted to the fins 3 through the heat-conducting plate and the heat pipe 2 in sequence. The cooling fans 11 located on both sides of the fins 3 work together. One fan draws in external cold air and blows it onto the fins 3, while the other fan draws in hot air from the fins 3, forming an efficient airflow circulation. This structure significantly improves the heat dissipation efficiency and ensures that the CPU operating temperature is maintained at a stable state.

[0023] Example 2:

[0024] In this embodiment, the base plate 1 is made of metal. Multiple grooves 4 are formed on the surface of the base plate 1, and the shape of the grooves 4 matches the shape of the heat pipes 2. The heat pipes 2 have a flat structure, and their outer walls are machined to form contact planes 5. The contact planes 5 are tightly fitted to the inner walls of the grooves 4 on the base plate 1, and are fixedly connected by mechanical pressure. The two ends of the heat pipes 2 extend to the edges of the base plate 1 and are assembled with the fins 3. Heat-conducting sheets 6 are fixedly installed on the bottom surface of the base plate 1. The heat-conducting sheets 6 are thin metal sheets, with their lower surface in direct contact with the central processing unit and their upper surface in surface contact with the contact planes 5 of the heat pipes 2. Multiple sets of heat sinks 7 are also provided on the sides of the base plate 1. The heat sinks 7 are arranged vertically to increase the surface area of ​​the base plate 1 and improve auxiliary heat dissipation capabilities.

[0025] The fin group 3 consists of multiple parallel metal fins, with equidistant gaps between each fin. The bottom of the fin 3 is fixedly connected to the end of the heat pipe 2 by fastening bolts 8, with pre-tightening force applied to the bolts 8 to ensure a tight fit between the contact surfaces. A protective frame 9 is installed on top of the fin 3. The protective frame 9 is a frame structure, with its four corners fixed to the fin 3 by fastening bolts 8. Fixing frames 10 are symmetrically welded to both sides of the protective frame 9. The fixing frames 10 are made of metal profiles, forming a support structure. Each fixing frame 10 is equipped with a cooling fan 11, which is connected to the fixing frame 10 by screws. The cooling fan 11 adopts an axial flow design, with one fan facing the intake of the fin group 3 and the other fan facing away from the exhaust of the fin group 3.

[0026] The cooling fan 11 is covered by a housing 12, which completely encloses the fan. The surface of the housing 12 can be processed with various textures and patterns; these decorative designs do not affect the heat dissipation function but enhance the product's aesthetics. The edges of the housing 12 are connected to the mounting bracket 10 using clips 21 for easy disassembly and maintenance.

[0027] When the heatsink is working, the heat generated by the CPU is first conducted to the heat-conducting fins 6 on the base plate 1, and then transferred to the contact surface 5 of the heat pipes 2. The heat is then rapidly conducted along the heat pipes 2 to the fins 3, where the fins 3 diffuse the heat to their surface. Simultaneously, the cooling fans 11 on both sides start. The intake fan blows cool air into the gaps between the fins 3, while the exhaust fan extracts hot air from the surface of the fins 3, creating forced convection. This dual-fan collaborative working mode continuously removes the heat accumulated on the surface of the fins 3, achieving an efficient heat dissipation cycle. Throughout the entire heat dissipation process, heat is exchanged through multiple layers of conduction and convection, ensuring that the CPU temperature remains stable within a safe range.

[0028] The heatsink's structural design prioritizes optimized heat conduction paths. The tight fit between the heat pipe 2's contact plane 5 and the base plate 1's pipe slot 4 reduces contact thermal resistance, while the direct contact between the heatsink 6 and the processor enhances initial heat exchange efficiency. The symmetrical arrangement of the cooling fans 11 creates directional airflow, increasing airflow speed on the fin surface 3. The protective bracket 9 not only provides stability but also prevents external objects from contacting the high-speed rotating fan blades. The casing 12 ensures safety while satisfying the aesthetic needs of different users through its design. This comprehensive cooling solution effectively addresses the heat dissipation requirements of high-performance processors under high load conditions.

[0029] Example 3:

[0030] In this embodiment, the base plate 1 is provided with a pipe groove 4, and the heat pipe 2 has a contact plane 5. The contact plane 5 is tightly connected to the pipe groove 4 of the base plate 1. A heat-conducting plate 6 is fixedly installed on the base plate 1. The heat-conducting plate 6 is in close contact with the contact plane 5 of the heat pipe 2 and is in direct contact with the central processing unit, thereby effectively improving the heat exchange efficiency. The base plate 1 is also provided with multiple sets of heat sinks 7 to further enhance the auxiliary heat dissipation effect. The fins 3 are fixedly installed with protective frames 9 by fastening bolts 8. Fixed frames 10 are symmetrically installed on both sides of the protective frames 9. Cooling fans 11 are fixedly installed on each fixed frame 10. The cooling fans 11 are fixedly installed with covers 12. The covers 12 are used to improve the appearance and can be set with various textures and patterns.

[0031] In this embodiment, the protective frame 9 is fixedly mounted with a top shell 13, and the top shell 13 is fixedly mounted with a magnet 14. The fastening bolt 8 is made of stainless steel. The magnet 14 and the fastening bolt 8 attract each other, firmly fixing the top shell 13 to the protective frame 9. This design makes the installation and removal of the top shell 13 simple and quick, requiring no additional tools; only appropriate external force is needed to install or remove the top shell 13. After long-term operation of the radiator, dust may accumulate on the fins 3 and internal structure, affecting heat dissipation performance. At this time, the user can easily remove the top shell 13 to thoroughly clean the inside of the radiator, removing accumulated dust and restoring heat dissipation efficiency. The fixing method of the top shell 13 relies on the magnetic attraction between the magnet 14 and the stainless steel fastening bolt 8. This connection is both stable and reliable, and easy to operate, greatly improving the maintenance convenience of the radiator.

[0032] The heatsink works as follows: The CPU generates a large amount of heat during operation. This heat is first conducted to the heat pipe 2 via the heat-conducting fins 6. The heat pipe 2, utilizing its contact surface 5 and the tight fit between its surface and the slot 4 of the base plate 1, efficiently transfers the heat to the fins 3. The fins 3, as the main heat dissipation component, accelerate heat dissipation by increasing their surface area. The cooling fans 11 on both sides of the protective frame 9 work in tandem. One fan draws in cool external air and blows it onto the surface of the fins 3, while the other fan draws in heated air from the fins 3, creating a continuous airflow circulation. This dual-fan design significantly enhances airflow efficiency, quickly removing heat from the fins 3 and ensuring that the CPU temperature remains within a safe range. The magnetic fixing structure of the top shell 13 not only facilitates daily maintenance but also ensures the integrity and stability of the overall heatsink structure, preventing complex disassembly from affecting heat dissipation performance.

[0033] The high-efficiency heat sink in this embodiment effectively solves the heat dissipation problem of high-performance central processing units under high load by optimizing the heat conduction path and enhancing airflow circulation. The magnetic fixation method using magnets 14 and stainless steel fastening bolts 8 simplifies the disassembly and assembly process of the top shell 13, greatly facilitating dust cleaning for users, thereby extending the heat sink's service life and ensuring the stable operation of the central processing unit. The entire heat dissipation system has a reasonable structure, is easy to operate and maintain, and is suitable for various high-performance computing scenarios.

[0034] Example 4:

[0035] In this embodiment, the heat-conducting plate 6 is made of copper. It is fixedly mounted on the base plate 1, closely fitting the contact surface 5 of the heat pipe 2, and directly contacting the surface of the central processing unit. Copper has excellent thermal conductivity, enabling it to quickly conduct heat generated by the central processing unit to the heat-conducting plate 6, and then transfer it to the fin structure 3 through the contact surface 5 of the heat pipe 2. Due to the high thermal conductivity of copper, heat loss during transfer is minimal, thus significantly improving the overall heat exchange efficiency.

[0036] During the operation of the heat sink, the central processing unit (CPU) generates a large amount of heat, which is first absorbed by the copper heatsink 6. The heatsink 6 is in direct contact with the CPU, and utilizing the high thermal conductivity of copper, the heat is quickly and evenly diffused across the entire surface of the heatsink 6. Subsequently, the heat is transferred through the other side of the heatsink 6 to the contact surface 5 of the heat pipe 2. The heat pipe 2 is filled with a working fluid, which undergoes a phase change upon heating, efficiently conducting heat to the distal fin assembly 3.

[0037] The copper heat-conducting fin 6 is fixedly connected to the base plate 1 to ensure the continuity of the heat conduction path. Multiple heat sinks 7 are provided on the surface of the base plate 1. These heat sinks 7 work in conjunction with the copper heat-conducting fin 6 to further increase the heat dissipation area. When heat is conducted to the fins 3, the cooling fans 11 located on both sides of the fins 3 begin to operate. One fan draws in cool external air and blows it onto the surface of the fins 3, while the other fan draws in hot air passing over the fins 3, forming forced convection cooling.

[0038] This design, employing a copper heatsink 6, effectively solves the heat dissipation problem in high heat flux density environments. The copper material not only accelerates the initial heat absorption but also ensures uniform heat distribution during conduction, preventing localized overheating. The entire cooling system achieves multi-layered, high-efficiency heat dissipation through the efficient heat conduction of the copper heatsink 6, combined with the rapid heat transfer of the heat pipe 2 and the forced convection of the cooling fan 11.

[0039] In practical applications, the contact surface between the copper heat sink 6 and the central processing unit is precision-machined to ensure a perfect fit and minimize contact thermal resistance. Simultaneously, the ductility of copper allows the heat sink 6 to adapt to minor deformations under different installation conditions, maintaining a stable thermal contact state. This design fully leverages the advantages of copper in heat conduction, providing reliable heat dissipation for high-performance computing devices.

[0040] Example 5:

[0041] In this embodiment, the base plate 1 is provided with a pipe groove 4, and the heat pipe 2 has a contact plane 5. The contact plane 5 is tightly connected to the pipe groove 4 of the base plate 1. A heat-conducting fin 6 is fixedly installed on the base plate 1. The heat-conducting fin 6 is in close contact with the contact plane 5 of the heat pipe 2 and is in direct contact with the central processing unit, thereby effectively improving the heat exchange efficiency. The base plate 1 is also provided with multiple sets of heat sinks 7 to further enhance the auxiliary heat dissipation effect. The fins 3 are fixedly installed with protective frames 9 by fastening bolts 8. Fixing frames 10 are symmetrically installed on both sides of the protective frame 9. Heat sinks are fixedly installed on each of the fixing frames 10. Fan 11, the cooling fan 11 is fixedly mounted with a cover 12. The cover 12 is used to improve the appearance and can be set with various textures and patterns. During operation, the heat generated by the central processing unit is conducted to the fins 3 through the heat conduction plate 6 and the heat conduction pipe 2. The cooling fans 11 located on both sides of the fins 3 work together. One fan draws in external cold air and blows it towards the fins 3, while the other fan draws in hot air from the fins 3, forming an efficient airflow circulation. This structure significantly improves the heat dissipation efficiency and ensures that the operating temperature of the central processing unit is maintained at a stable state.

[0042] In this embodiment, the base plate 1 has a through hole 15, on which a connecting bolt 16 is movably installed. One end of the connecting bolt 16 is fixedly connected to a locking piece 18. A spring 19 is provided between the connecting bolt 16 and the base plate 1. The connecting bolt 16 has a connecting hole 20, through which the connecting bolt 16 is connected to the mounting bracket of the motherboard. The spring 19 provides buffering to prevent damage to the central processing unit from a hard connection. Specifically, when the heat sink is installed on the central processing unit, the connecting bolt 16 is connected to the mounting bracket on the motherboard through the connecting hole 20. The spring 19 provides elastic support during the connection process, so that the contact pressure between the base plate 1 and the central processing unit is evenly distributed, preventing poor heat conduction or physical damage caused by excessive tightness or looseness. The locking piece 18 acts as a limit after the connecting bolt 16 is fixed, ensuring connection stability. At the same time, the buffering characteristics of the spring 19 can absorb the small displacement caused by motherboard deformation or vibration, reducing the direct impact on the central processing unit, thereby extending the service life of the central processing unit.

[0043] The heat sink in this embodiment achieves efficient heat dissipation by optimizing the heat conduction path and airflow organization. The tight connection between the heat pipe 2 and the base plate 1, as well as the direct contact of the heat conduction fins 6, ensures that heat is quickly dissipated from the central processing unit. The bidirectional airflow design of the cooling fan 11 accelerates the dissipation of heat from the surface of the fins 3, while the combination of the connecting bolts 16 and the spring 19 provides a reliable installation buffer mechanism. The overall structure is simple and practical, and can effectively cope with the high heat flux density generated by high-performance central processing units, avoiding performance degradation or damage caused by heat accumulation. In practical applications, this heat sink can be widely used in desktop computers, servers, and other electronic devices that require efficient heat dissipation to ensure stable system operation.

[0044] Example 6:

[0045] In this embodiment, the base plate 1 is provided with a pipe groove 4. The base plate 1 is fixedly connected to the fins 3 via heat-conducting pipes 2. The heat-conducting pipes 2 are provided with a contact surface 5. Heat-conducting plates 6 are fixedly installed on the base plate 1. The base plate 1 is provided with heat dissipation fins 7. The fins 3 are fixedly installed with protective frames 9 via fastening bolts 8. Fixing frames 10 are symmetrically installed on both sides of the protective frames 9. Cooling fans 11 are fixedly installed on each fixing frame 10. The cooling fans 11 are fixedly installed with covers 12. The covers 12 are provided with buckles 21. The cooling fans 11 are provided with ribs 22. The buckles 21 and the ribs 22 engage, facilitating disassembly and dust cleaning. The covers 12 are used to improve the aesthetic appearance, and the covers 12 can be designed with various textures and patterns.

[0046] In practice, the cover 12 is secured to the rib 22 of the cooling fan 11 via a snap-fit ​​21. The snap-fit ​​21 is designed as a flexible structure, ensuring a reliable connection with the rib 22 and maintaining stability of the cover 12 during radiator operation. When cleaning dust accumulated inside the cooling fan 11 or cover 12, the user can easily press the snap-fit ​​21 to disengage it from the rib 22, thus removing the cover 12 from the cooling fan 11. This snap-fit ​​method is simple to operate, requires no additional tools, and greatly improves maintenance convenience. After cleaning, simply align the cover 12 back with the cooling fan 11, allowing the snap-fit ​​21 to re-engage with the rib 22 to restore its original state. This design not only facilitates regular maintenance but also effectively prevents dust accumulation from affecting heat dissipation performance, extending the radiator's lifespan.

[0047] The heatsink works as follows: The base plate 1 directly contacts the central processing unit (CPU) via heat-conducting fins 6, absorbing the heat generated. The heat pipes 2 have contact surfaces 5, which are tightly connected to the pipe grooves 4 of the base plate 1 and also closely fitted to the heat-conducting fins 6, ensuring efficient heat conduction. Heat is rapidly transferred to the fins 3 via the heat pipes 2, where the fins 3 exchange heat with the air through their large surface area. The heat sinks 7 on the base plate 1 further assist in heat dissipation, enhancing the overall cooling effect. The protective frame 9 is fixed to the fins 3 with fastening bolts 8, providing structural support and protection. Mounting brackets 10 are symmetrically mounted on both sides of the protective frame 9, each mounting a cooling fan 11. The cooling fans 11 work in tandem; one fan draws in cool external air and blows it onto the fins 3, while the other fan draws in hot air from the fins 3, forming a continuous airflow circulation. This airflow circulation significantly improves heat dissipation efficiency, ensuring the CPU's operating temperature remains within a safe range.

[0048] The installation of the cover 12 not only enhances the appearance of the heatsink but also facilitates easy disassembly through the snap-fit ​​design of the clips 21 and the raised ribs 22. Users can choose cover 12 with different textures and patterns to match the overall style of the computer system. During long-term use, dust may accumulate inside the cooling fan 11 and cover 12, affecting airflow and heat dissipation. With simple removal of the clips 21, users can quickly remove dust and maintain the heatsink's efficient operation. This design balances aesthetics and practicality, making it suitable for various high-performance computing scenarios.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0050] The above description is only used to illustrate the technical solution of this utility model and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A high-efficiency heat sink, comprising a base plate, heat pipes, and fins, wherein the base plate is provided with pipe grooves, and the fins are fixedly connected to the base plate via heat pipes, characterized in that, The heat pipe has a contact plane, the base plate is fixedly installed with heat-conducting fins, the base plate is provided with heat dissipation fins, the fins are fixedly installed with protective frames by fastening bolts, the protective frames are symmetrically installed with fixing frames on both sides, the fixing frames are fixedly installed with cooling fans, and the cooling fans are fixedly installed with covers.

2. The high-efficiency heat sink according to claim 1, characterized in that, The protective frame is fixedly mounted with a top shell, and the top shell is fixedly mounted with a magnet. The fastening bolts are made of stainless steel.

3. The high-efficiency heat sink according to claim 1, characterized in that, The heat-conducting sheet is made of copper.

4. The high-efficiency heat sink according to claim 1, characterized in that, The base plate has a through hole, and a connecting bolt is movably installed in the through hole. A locking piece is fixedly connected to one end of the connecting bolt. A spring is provided between the connecting bolt and the base plate. The connecting bolt has a connecting hole.

5. A high-efficiency heat sink according to claim 1, characterized in that, The cover is provided with a buckle, and the cooling fan is provided with a rib. The buckle is engaged with the rib.

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