High thermal conductivity dual liquid cooling heat spreader

Abstract

The utility model relates to the technical field of radiator, specifically disclose a high thermal conductivity double liquid cooling radiator, including radiating base plate and set up on radiating base plate a plurality of fins, interval setting between adjacent fins, one or more fins are curved to interval side, and the top opening of interval is covered by the lap joint or the adhesion of bending edge. The utility model through the cooperation of double path, can reduce the heat load of single liquid cooling path greatly, significantly improve the overall heat dissipation efficiency, satisfy the heat dissipation demand of medium and high power density equipment.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, specifically to a high thermal conductivity dual liquid-cooled radiator. Background Technology

[0002] The heat sink is the core heat dissipation component in a liquid cooling system. Its structural design is based on a high thermal conductivity metal substrate, usually copper or aluminum alloy, which needs to be directly bonded to heat-generating components such as CPU and GPU. Through processes such as welding, integral extrusion molding or microchannel etching, a large number of dense metal heat dissipation fins are processed on the surface of the substrate. Regular coolant channels are formed between adjacent fins, constituting the core heat exchange unit of substrate-fin-channel.

[0003] During heat dissipation, heat transfer follows a fixed path: first, the heat-generating element transfers heat to the metal substrate via thermal conduction, and then the substrate conducts it evenly to the dense heat dissipation fins. At this time, the circulating pump drives the coolant to flow through the channels between the fins, and heat is transferred from the fins to the coolant through convection heat transfer. Finally, the coolant circulation system removes the heat from the equipment. The heat removal mainly relies on the convection circulation of the coolant, and the fins only serve as convection media for heat conduction and do not form an effective thermal connection with the metal casing of the equipment. This heat dissipation path, which relies solely on coolant circulation, can meet the heat dissipation requirements in low-power equipment. However, in medium-to-high power density scenarios, the heat load is too high, leading to insufficient heat dissipation efficiency and making it difficult to match the high heat requirements of the equipment. Utility Model Content

[0004] To address the shortcomings of the existing technology, this utility model provides a high thermal conductivity dual liquid cooling radiator. Through the synergy of the two paths, the heat load of a single liquid cooling path can be significantly reduced, the overall heat dissipation efficiency can be significantly improved, and the heat dissipation requirements of medium and high power density equipment can be met.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A high thermal conductivity dual liquid cooling radiator includes a heat dissipation base plate and a plurality of fins disposed on the heat dissipation base plate. Adjacent fins are spaced apart, and one or more fins are bent toward the spacer side and overlap or fit the top opening of the spacer by bending edges.

[0007] Preferably, the top of each fin is bent toward the opening between adjacent fins, and the bent edge directly overlaps the opening position of the corresponding interval.

[0008] Preferably, the bent edges are bent in the same direction.

[0009] Preferably, the top of some of the fins is higher than the top of the other fins, and the bent edge is set on the fin with the higher top.

[0010] The beneficial effects of this invention are as follows: adjacent fins are spaced apart to form a liquid cooling channel. One or more fins are bent toward the spacer side and overlap or fit the top opening of the spacer through the bent edge. When used with a liquid cooling system, by thermally welding the bent edge of the radiator fins to the metal shell in the liquid cooling system, a dual heat dissipation path for liquid cooling heating conduction can be constructed. Through the synergy of the dual paths, the heat load of a single liquid cooling path can be greatly reduced, the overall heat dissipation efficiency can be significantly improved, and the heat dissipation requirements of medium and high power density equipment can be met. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this utility model;

[0012] Figure 2 : This is a structural schematic diagram of Embodiment 2 of this utility model;

[0013] Figure 3 This is Embodiment Two of the present utility model. Figure 2 Enlarged structural diagram of section A;

[0014] Explanation of the symbols in the attached diagram: 10-heat dissipation substrate, 11-fins, 12-liquid cooling channel, 13-bent edge. Detailed Implementation

[0015] To more clearly illustrate the structural features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments:

[0016] Example 1: As Figure 1 As shown, a high thermal conductivity dual liquid-cooled radiator includes a heat dissipation base plate 10 and a plurality of fins 11 disposed on the heat dissipation base plate 10. Adjacent fins 11 are spaced apart to form liquid cooling channels 12. The top of each fin 11 is bent toward the gap opening of the adjacent fin 11, and its bent edge 13 is bent in the same direction, directly overlapping and covering the top opening of the gap to form a top seal. In use, it is used with a liquid cooling system. By directly heat-conductingly welding the bent edge 13 of the radiator's fins 11 to the metal shell of the liquid cooling system, compared to... Bolted connections, snap-fit ​​connections, and other methods result in a larger contact area, no assembly gaps, and lower contact thermal resistance, effectively enhancing heat conduction efficiency. The sealing structure of the overlapping bent edge 13 can effectively prevent solder from flowing into the gaps of the fins 11 during welding and blocking the liquid cooling channel 12, thus creating a dual heat dissipation path for liquid cooling and heating conduction. Liquid cooling quickly removes concentrated heat, while heat conduction assists in the diffusion of heat to the outer shell. Through the synergy of the dual paths, the heat load of a single liquid cooling path can be significantly reduced, and the overall heat dissipation efficiency can be significantly improved to meet the heat dissipation requirements of medium and high power density equipment.

[0017] At the same time, after the fins 11 are welded to the metal shell, the heat sink takes on an I-shape, which effectively strengthens the fins 11 and solves the problem that the fins 11 are becoming thinner and thinner as heat sink products become more refined, resulting in weaker and weaker fins 11.

[0018] Example 2: Figure 2-3 The diagram illustrates a high thermal conductivity dual liquid-cooled heat sink, comprising a heat sink base plate 10 and a plurality of fins 11 disposed on the heat sink base plate 10. Adjacent fins 11 are spaced apart to form liquid cooling channels 12. The tops of some of the fins 11 extend beyond the tops of other fins 11. The tops of these extended fins 11 are bent towards the openings between adjacent fins 11, with their bent edges 13 bent in the same direction, directly overlapping and covering the top openings of the gaps to form a top seal. In use, it is integrated with a liquid cooling system. The bent edges 13 of the heat sink fins 11 are aligned with the liquid cooling system's liquid cooling channels. The outer shell is directly welded for heat conduction. Compared with bolted or snap-fit ​​connections, this method has a larger contact area, no assembly gaps, and lower contact thermal resistance, effectively enhancing heat conduction efficiency. The sealing structure of the overlapping bent edge 13 can effectively prevent solder from flowing into the gaps of the fins 11 during welding and blocking the liquid cooling channel 12. This creates a dual heat dissipation path for liquid cooling and heating conduction. The liquid cooling quickly removes concentrated heat, while the heat conduction assists in the diffusion of heat to the outer shell. Through the synergy of the dual paths, the heat load of a single liquid cooling path can be significantly reduced, and the overall heat dissipation efficiency can be significantly improved to meet the heat dissipation requirements of medium and high power density equipment.

[0019] At the same time, after the fins 11 are welded to the metal shell, the heat sink takes on an I-shape, which effectively strengthens the fins 11 and solves the problem that the fins 11 are becoming thinner and thinner as heat sink products become more refined, resulting in weaker and weaker fins 11.

[0020] It should be noted that in the above embodiments one and two, the bent edge 13 can also be formed by bending a single fin 11 on the edge of the heat dissipation substrate 10, and the bent edge 13 overlaps or fits to cover all the top openings of the intervals.

[0021] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Therefore, any modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A high thermal conductivity dual liquid-cooled heat sink, comprising a heat sink substrate and a plurality of fins disposed on the heat sink substrate, with adjacent fins spaced apart, characterized in that: One or more fins are bent toward the gap side and overlap or fit the top opening of the gap by a bend edge. The top of some of the fins is higher than the top of other fins, and the bend edge is provided on the fin with the higher top.

2. The high thermal conductivity dual liquid-cooled heat sink according to claim 1, characterized in that: The top of each fin is bent toward the opening between adjacent fins, with the bent edge directly overlapping the opening of the corresponding interval.

3. The high thermal conductivity dual liquid-cooled heat sink according to claim 2, characterized in that: The bent edges are bent in the same direction.

Images