Chip production and processing device and bearing mechanism

Abstract

The utility model belongs to the technical field of semiconductor processing, concretely relates to a chip production and processing device and bearing mechanism, the device includes: bottom plate, its upper end face is provided with bearing mechanism, the bearing mechanism includes the bearing plate, and the upper end face of bearing plate is provided with a plurality of bosses, the work piece is by the drive control, and the lower end face of work piece and the upper end face of chip board abut, wherein the drive is suitable for controlling work piece and moves down along the height direction of bottom plate, and then the lower end face of each chip on chip board and the corresponding boss on bearing plate abut, through being provided with a plurality of bosses, when the upper end face of chip board and heating block abut, the lower end face of each boss and corresponding chip abut, and then when partial chip and heating block upper surface abscission abut after the slight deformation of chip board under stress, the clearance between chip and heating block upper end face is filled up by the boss, so that each chip and heating block abut closely, satisfy the follow -up operation needs.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, specifically relating to chip manufacturing and processing equipment and supporting mechanisms. Background Technology

[0002] In the semiconductor chip packaging process, the chip needs to be precisely fixed onto the chip board for subsequent operations such as wire bonding. During this process, a processing device called a "heating block" is typically used. Through vacuum adsorption and mechanical pressing, the frame containing the chip is smoothly fixed onto the heating block to ensure accurate wire bonding and stable product quality.

[0003] Traditional heating blocks have a flat surface. When the chip board is pressed onto the upper surface of the heating block by the pressing device, the pressing device only presses the two ends of the upper surface of the chip board. After being subjected to force, the chip board will undergo slight deformation and form an arch. The chips arranged in the central array of the chip board lack direct pressure and contact with the upper surface of the heating block. As a result, when the chip board deforms, some chips will detach from the upper surface of the heating block, thus affecting subsequent processing operations.

[0004] Therefore, a chip manufacturing and processing device and a support mechanism are designed to solve the technical problem in the prior art where the chip board deforms under stress, causing the upper part of the chip to detach from the upper surface of the heating block.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0006] This disclosure provides at least one chip manufacturing and processing apparatus and a support structure.

[0007] In a first aspect, embodiments of this disclosure provide a chip manufacturing apparatus, comprising: The base plate has a load-bearing mechanism on its upper surface; The supporting mechanism includes a supporting plate, and the upper surface of the supporting plate is provided with a plurality of protrusions; A mandrel, controlled by a driver, has its lower end face abutting against the upper end face of the chip board; wherein... The driver is adapted to control the I-shaped part to move downward along the height direction of the base plate, thereby abutting the lower end face of each chip on the chip board with the corresponding boss on the carrier plate.

[0008] In one alternative embodiment, each of the bosses is arranged in at least eighteen rows along the width direction of the support plate; Each of the bosses is arranged in at least two columns along the length of the bearing plate.

[0009] In one optional embodiment, the cross-section of each of the bosses is a right-angled triangle; wherein One of the acute angles α of the boss has an angle range of approximately 2°-2.4°; and The raised height H of the boss is approximately 0.025mm-0.030mm.

[0010] In one optional embodiment, the beveled surface of the boss serves as a bonding surface for attaching with the chip; wherein The planar dimension of the bonding surface is smaller than the dimension of the chip.

[0011] In one optional embodiment, the planar dimensions of the pressing surface are approximately 1.3 mm x 0.71 mm; and The chip measures approximately 1.4 mm x 0.813 mm.

[0012] In one alternative embodiment, each of the bosses has at least one through-channel vertically formed inside; Several vertical air extraction channels are provided on the base plate; The support plate is vertically provided with several connecting channels; wherein Each of the aforementioned connecting channels is connected to the bottom of the corresponding air extraction channel; and Each of the aforementioned air extraction channels is located directly below each boss and communicates with the through channel opened within the corresponding boss.

[0013] In one optional embodiment, the upper end face of the base plate is provided with at least one pair of limiting members; At least one pair of abutting members are provided on the outer walls of both ends of the bearing plate; wherein The connecting channel and the corresponding exhaust channel are adapted to be connected when the support plate slides along the width direction of the base plate until each limiting member and the corresponding abutting member abut.

[0014] Secondly, embodiments of this disclosure also provide a support mechanism, including: A support plate, wherein the upper surface of the support plate is provided with a plurality of protrusions; wherein Each of the aforementioned bosses is arranged in at least eighteen rows along the width direction of the support plate; Each of the bosses is arranged in at least two columns along the length of the bearing plate.

[0015] In one optional embodiment, the cross-section of each of the bosses is a right-angled triangle; wherein One of the acute angles α of the boss has an angle range of 2°-2.4°; and The raised height H of the boss is 0.025mm-0.030mm.

[0016] In one optional embodiment, the beveled surface of the boss serves as a bonding surface for attaching with the chip; wherein The planar dimensions of the pressed surface are approximately 1.3mm x 0.71mm.

[0017] The beneficial effect of this utility model is that, by setting a number of protrusions corresponding to each chip on the chip board, when the chip board abuts against the upper surface of the heating block, each protrusion abuts against the lower surface of the corresponding chip. Then, when the chip board undergoes slight deformation after being subjected to force and some chips separate from the upper surface of the heating block, the protrusions fill the gap between the chip and the upper surface of the heating block, so that each chip abuts tightly against the heating block, which meets the needs of subsequent processing operations.

[0018] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the processing apparatus provided in the embodiments of this disclosure; Figure 2 This is a front sectional view of the processing apparatus provided in an embodiment of the present disclosure; Figure 3 This is a front sectional view of the boss provided in an embodiment of this disclosure.

[0022] In the picture: 1. Base plate; 10. Air extraction channel; 11. Limiting components; 2. Bearing mechanism; 20. Bearing plate; 200. Connecting channel; 21. Boss; 210. Through channel; 211. Pressing surface; 22. Abutting component; 3. Chipboard; 30. Chip; 4. I-shaped parts. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0025] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0026] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0027] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0028] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0029] Research has revealed that traditional heating blocks have a flat surface. When the chip board is pressed onto the upper surface of the heating block by the pressing device, the pressing device only presses the two ends of the chip board along its length. After being subjected to force, the chip board will undergo slight deformation and form an arch. The chips arranged in the central array of the chip board lack direct pressure and contact with the upper surface of the heating block. Consequently, when the chip board deforms, some chips will detach from the upper surface of the heating block, thus affecting subsequent processing operations.

[0030] Based on the above research, this disclosure provides a chip manufacturing and processing apparatus and a support mechanism. By providing a plurality of protrusions corresponding to each chip on the chip board, when the chip board abuts against the upper surface of the heating block, each protrusion abuts against the lower surface of the corresponding chip. Then, when the chip board undergoes slight deformation after being subjected to force and some chips detach from the upper surface of the heating block, the protrusions fill the gap between the chip and the upper surface of the heating block, so that each chip abuts tightly against the heating block, meeting the needs of subsequent processing operations.

[0031] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] In some embodiments, such as Figure 1 and Figure 2 As shown, before processing each chip 30 on the chip board 3, the operator places the carrier plate 20 on the upper surface of the base plate 1, and then pushes the carrier plate 20 so that it slides along the width direction of the base plate 1 until the abutment members 22 fixed on both side walls of the carrier plate 20 abut against the corresponding limiting members 11 fixed on the upper surface of the base plate 1. When the abutment members 22 abut against the corresponding limiting members 11, the base plate 1 and the carrier plate 20 are in the following position: Figure 2 In the state shown, the several connecting channels 200 inside the support plate 20 are respectively connected to the corresponding air extraction channels 10 inside the base plate 1. Using an air extraction device (not shown in the figure), including but not limited to an air extraction machine, a multi-connector air pipe is inserted into the several air extraction channels 10 on the base plate 1 and connected to the air extraction machine. By starting the air extraction machine, a negative pressure is generated in each through channel 210 connected to the connecting channel 200 (the gas flow direction is as shown in the figure). Figure 2 (as shown in F2), so that each through-channel 210 can subsequently adsorb the corresponding chip 30.

[0035] In some embodiments, such as Figure 1 and Figure 2As shown, after the carrier plate 20 is connected to the base plate 1, the operator starts the driver (not shown in the figure). The driver includes, but is not limited to, using a cylinder. The output end of the cylinder is connected to the upper end face of the molded part 4. As the cylinder is started, it drives the molded part 4 and the chip plate 3 that abuts against the lower end face of the molded part 4 to move down until each chip 30 on the chip plate 3 abuts against the pressing surface 211 of the corresponding boss 21. Since the cross-section of the boss 21 is a right triangle and the inclined surface of the boss 21 is the pressing surface 211 that abuts against the lower end face of the chip 30, at this time, each chip on the chip plate 3 is lifted up by the corresponding boss 21 to a certain height, so that each chip 30 undergoes a certain deformation relative to the chip plate 30. Experiments have shown that the angle of one of the acute angles α of the boss 21 is approximately between 2° and 2.4°, and the lifting height of the boss 21 is approximately 0.0025mm-0. If the acute angle α is less than 2°, the height at which the chip 30 is lifted is too small. When the chip board 3 deforms later, some chips 30 will still detach from the boss 21. If the acute angle α is greater than 2.4°, the height at which the chip 30 is lifted is too high, causing deformation at the connection between the chip 30 and the chip board 3, affecting subsequent processing. Due to the presence of the boss 21, even if the die 4 presses the chip board 3 onto the upper surface of the carrier plate 20, causing the chip board 3 to undergo arched deformation, each chip 30 can always maintain contact with the boss 21. In conjunction with the above description, when the chip 30 contacts the corresponding boss 21, the negative pressure suction generated in the through channel 210 in each boss 21 acts on the lower surface of the corresponding chip 30, so that each chip 30 can be tightly adsorbed on the pressing surface 211, further avoiding the phenomenon of chip 30 detaching from the pressing surface 211.

[0036] It should be noted that the vacuum pump, multi-connector air pipe and cylinder mentioned above all use existing technology, and the connection method and working principle will not be described in detail here.

[0037] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0039] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0040] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0041] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A chip manufacturing and processing apparatus, characterized in that, include: The base plate (1) has a bearing mechanism (2) on its upper surface. The bearing mechanism (2) includes a bearing plate (20), and the upper surface of the bearing plate (20) is provided with a plurality of protrusions (21). The I-shaped part (4) is controlled by the driver, and the lower end face of the I-shaped part (4) abuts against the upper end face of the chip board (3); in The driver is adapted to control the die (4) to move downward along the height direction of the base plate (1), thereby abutting the lower end face of each chip (30) on the chip board (3) with the corresponding boss (21) on the carrier plate (20).

2. The chip manufacturing and processing apparatus as described in claim 1, characterized in that, Each of the bosses (21) is arranged in at least eighteen rows along the width direction of the support plate (20); Each of the bosses (21) is arranged in at least two columns along the length of the bearing plate (20).

3. The chip manufacturing and processing apparatus as described in claim 2, characterized in that, The cross-section of each of the aforementioned bosses (21) is a right-angled triangle; wherein The acute angle α of the boss (21) ranges from 2° to 2.4°; and The lifting height H of the boss (21) is 0.025mm-0.030mm.

4. The chip manufacturing and processing apparatus as described in claim 3, characterized in that, The bevel of the boss (21) is a pressing surface (211) for bonding with the chip (30); wherein The planar dimension of the pressing surface (211) is smaller than the dimension of the chip (30).

5. The chip manufacturing and processing apparatus as described in claim 4, characterized in that, The planar dimensions of the pressing surface (211) are approximately 1.3 mm x 0.7 mm; and The chip (30) has a size of approximately 1.4 mm x 0.8 mm.

6. The chip manufacturing apparatus as described in claim 5, characterized in that, Each of the aforementioned bosses (21) has at least one through-channel (210) vertically opened inside; The base plate (1) has several vertically opened air extraction channels (10); The support plate (20) is vertically provided with several connecting channels (200); wherein Each of the aforementioned connecting channels (200) is connected to the bottom of the corresponding exhaust channel (10); and Each of the aforementioned air extraction channels (10) is located directly below each boss (21) and is connected to the through channel (210) opened in the corresponding boss (21).

7. The chip manufacturing apparatus as described in claim 6, characterized in that, The upper end face of the base plate (1) is provided with at least one pair of limiting members (11). At least one pair of abutting members (22) are provided on the outer walls at both ends of the bearing plate (20); wherein The connecting channel (200) and the corresponding exhaust channel (10) are adapted to communicate when the bearing plate (20) slides along the width direction of the base plate (1) until each limiting member (11) and the corresponding abutting member (22) come into contact.

8. A load-bearing mechanism, characterized in that, include: The support plate (20) has a plurality of protrusions (21) on its upper end surface. in Each of the bosses (21) is arranged in at least eighteen rows along the width direction of the support plate (20); Each of the bosses (21) is arranged in at least two columns along the length of the bearing plate (20).

9. The bearing mechanism as described in claim 8, characterized in that, The cross-section of each of the aforementioned bosses (21) is a right-angled triangle; wherein The acute angle α of the boss (21) ranges from 2° to 2.4°; and The lifting height H of the boss (21) is 0.025mm-0.030mm.

10. The bearing mechanism as described in claim 9, characterized in that, The bevel of the boss (21) is a pressing surface (211) for bonding with the chip (30); wherein The planar dimensions of the pressing surface (211) are approximately 1.3 mm x 0.7 mm.

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