An adaptive picking device

Abstract

The utility model relates to a material taking device field especially takes a kind of self-adapting material taking device. Including substrate, the suction nozzle mechanism is arranged on the substrate, the suction nozzle mechanism can move along the axis direction of suction nozzle mechanism itself under the driving of suction nozzle drive assembly;The suction nozzle mechanism slidingly arranged in the side of substrate, the suction nozzle drive assembly is arranged in the other side of substrate;The transmission connecting groove is opened in the thickness direction of substrate along itself, the suction nozzle drive assembly has driver and transmission mechanism, the transmission mechanism is fixed with suction nozzle mechanism and is penetrated by transmission connecting groove;The transmission mechanism includes synchronous belt and a pair of synchronous pulley, one coaxially fixed in the execution end of driver in a pair of the synchronous pulley, another rotationally connected on the substrate, and the both ends of synchronous belt are sleeved on a pair of synchronous pulley;The connecting block is fixed with the synchronous belt perpendicular to the direction of motion itself, and the end of the connecting block away from the synchronous belt is fixed with suction nozzle mechanism and is penetrated by transmission connecting groove.

Description

Technical Field

[0001] This utility model relates to the field of material handling devices, and in particular to an adaptive material handling device. Background Technology

[0002] Chip picking and handling is a critical step in chip manufacturing and packaging. In the semiconductor industry, picking devices typically use fixed-structure nozzles, which are difficult to adapt to different chip or carrier sizes, resulting in poor compatibility. Furthermore, handling multiple chips simultaneously is inefficient, and chip orientation correction often requires manual or additional equipment after picking, increasing process time and complexity. Therefore, there is a need for a picking device that can adapt to various chip sizes, improve handling efficiency, and integrate orientation correction functionality. Utility Model Content

[0003] The purpose of this invention is to provide an adaptive material handling device to solve the problem of low chip adsorption and handling efficiency in the prior art.

[0004] The technical solution of this utility model is: an adaptive material handling device, including a base plate, on which a suction nozzle mechanism is provided, and the suction nozzle mechanism can move along its own axis under the drive of the suction nozzle driving component. The suction nozzle mechanism is slidably disposed on one side of the substrate, and the suction nozzle driving assembly is disposed on the other side of the substrate; the substrate has a transmission connection groove along its own thickness direction, and the suction nozzle driving assembly has a driver and a transmission mechanism, the transmission mechanism passing through the transmission connection groove and fixed to the suction nozzle mechanism; The transmission mechanism includes a synchronous belt and a pair of synchronous pulleys. One of the synchronous pulleys is coaxially fixed to the actuator end of the driver, and the other is rotatably connected to the base plate. The two ends of the synchronous belt are sleeved on the pair of synchronous pulleys. A connecting block is fixed to the synchronous belt perpendicular to its own direction of movement. The end of the connecting block away from the synchronous belt passes through the transmission connecting groove and is fixed to the suction nozzle mechanism.

[0005] Preferably, a slide rail is fixed on one side of the substrate in a vertical direction, and a suction nozzle mounting seat is connected to the slide rail by a slider that is slidably disposed thereon; one cross section of the suction nozzle mounting seat is configured as L-shaped, having a connecting end fixed to the slider and a mounting end perpendicular to the connecting end for mounting the suction nozzle mechanism.

[0006] Preferably, the suction nozzle mechanism includes a rotary driver, the end face of which is fixed to the mounting end, and the actuating end of the rotary driver passes through the mounting end and is coaxially connected to an adsorber, which is used to realize the adsorption function of the suction nozzle mechanism.

[0007] Preferably, multiple suction nozzle mechanisms are arranged on the substrate perpendicular to their own direction of movement, and at least two suction nozzle mechanisms are constructed as a group. Multiple suction nozzle driving mechanisms are arranged corresponding to the multiple groups of suction nozzle mechanisms.

[0008] Preferably, the substrate is slidably disposed on the substrate driving mechanism, the substrate driving mechanism includes a bracket, and a transfer driver is disposed on the bracket in the horizontal direction. The substrate is fixed to the execution end of the transfer driver and moves perpendicular to the direction of the nozzle movement under the drive of the transfer driver.

[0009] Preferably, a pulley cover is fixed to one side of the substrate, and a synchronous pulley coaxially connected to the driver is disposed inside the pulley cover, and the driver is fixed to the outer wall of the pulley cover.

[0010] Compared with the prior art, the advantages of this utility model are: (1) This application achieves efficient handling and automatic posture correction of multiple chips by setting up multiple suction nozzle mechanisms with separate actions and integrating a rotary driver, which significantly improves handling efficiency and operation accuracy. The transmission mechanism used to drive the suction nozzle mechanism to perform suction action is composed of a synchronous belt transmission mechanism and a slide rail, which ensures the smooth and accurate movement of the suction nozzle, so that the device can be flexibly compatible with chip carriers of different specifications.

[0011] (2) The present application places the substrate on a substrate driving mechanism that moves in the horizontal direction, so that the suction nozzle mechanism can pick up the chip and transfer it between multiple stations, which greatly optimizes the chip production process. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a structural diagram of an adaptive material handling device according to the present invention; Figure 2 This is a schematic diagram of the mounting method between the suction nozzle mechanism and the substrate described in this utility model; Figure 3 This is a structural diagram of the suction nozzle driving assembly described in this utility model; The components are: 1. substrate, 11. transmission connection groove, 12. pulley cover, 2. suction nozzle mechanism, 21. rotary driver, 22. suction unit, 3. suction nozzle drive assembly, 31. driver, 32. transmission mechanism, 321. synchronous belt, 322. synchronous pulley, 323. connecting block, 41. slide rail, 42. suction nozzle mounting base, 421. connecting end, 422. mounting end, 5. substrate drive mechanism, 51. bracket, 52. transfer driver. Detailed Implementation

[0013] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0014] The present invention will be further described in detail below with reference to specific embodiments: like Figures 1-3 As shown, an adaptive pick-up device is used for picking up and transporting chips. It includes a substrate 1, on which a suction nozzle mechanism 2 is disposed. The suction nozzle mechanism 2 is connected to a suction nozzle drive assembly 3, and under the drive of the suction nozzle drive assembly 3, it can move along its own axis, thereby bringing the suction nozzle mechanism 2 close to the chip to pick it up.

[0015] The substrate 1 is configured as a plate-shaped structure. The suction nozzle mechanism 2 is slidably disposed on one side of the substrate 1, and the suction nozzle drive assembly 3 is disposed on the other side of the substrate 1. The substrate 1 has a transmission connection groove 11 along its thickness direction. The suction nozzle drive assembly 3 has a driver 31 and a transmission mechanism 32. The driver 31 is fixed to the suction nozzle mechanism 2 through the transmission mechanism 32, which can pass through the transmission connection groove 11, thereby driving the suction nozzle mechanism 2 to move.

[0016] The transmission mechanism 32 includes a synchronous belt 321 and a pair of synchronous pulleys 322. One of the synchronous pulleys 322 is fixed to the actuating end of the driver 31, while the other is located below it and rotatably connected to the base plate 1. Both ends of the synchronous belt 321 are fitted onto the pair of synchronous pulleys 322. When the driver 31 is running, the pair of synchronous pulleys 322 can drive synchronous operation. A connecting block 323 is fixed on the synchronous belt 321 perpendicular to its own direction of movement. The end of the connecting block 323 away from the synchronous belt 321 passes through the transmission connecting groove 11 and is fixed to the suction nozzle mechanism 2. Furthermore, a pulley cover 12 is fixed to one side of the base plate 1. The synchronous pulleys 322, coaxially connected to the driver 31, are disposed inside the pulley cover 12. The driver 31 is fixed to the outer wall of the pulley cover 12.

[0017] Specifically, a slide rail 41 is fixed vertically on one side of the substrate 1, and the suction nozzle mechanism 2 is slidably connected to the substrate 1 via the slide rail 41. A suction nozzle mounting base 42 is connected to the slide rail 41 via a slider. One cross-section of the suction nozzle mounting base 42 is L-shaped, with a connecting end 421 fixed to the slider and a mounting end 422 perpendicular to the connecting end 421 for mounting the suction nozzle mechanism 2.

[0018] In this embodiment, the suction nozzle mechanism 2 includes a rotary driver 21. The rotary driver 21 drives the chip to rotate around a horizontal axis after it is picked up, thereby correcting the chip's orientation to adapt it to the workstation to which it will be transferred. The end face of the rotary driver 21 is fixed to the mounting end 422. The actuating end of the rotary driver 21 passes through the mounting end 422 and is coaxially connected to an adsorber 22. The adsorber 22, together with a negative pressure device, is used to achieve the adsorption function of the chip.

[0019] Furthermore, in this embodiment, multiple suction nozzle mechanisms 2 are arranged on the substrate 1 perpendicular to their own direction of movement, and at least two suction nozzle mechanisms 2 are constructed as a group. The suction nozzle driving mechanism is configured in multiple ways corresponding to the multiple groups of suction nozzle mechanisms 2. This allows one suction nozzle driving mechanism to drive multiple suction nozzle mechanisms 2 to perform suction operations simultaneously, improving the efficiency of chip handling. At the same time, the multiple groups of suction nozzle mechanisms 2 can also be compatible with chip carriers of different specifications when operating independently.

[0020] Furthermore, the substrate 1 is slidably disposed on the substrate driving mechanism 5 for transferring the chip between different workstations after it has been adsorbed. The substrate driving mechanism 5 includes a support 51, on which a transfer driver 52 is horizontally disposed. The substrate 1 is fixed to the actuating end of the transfer driver 52 and moves perpendicular to the direction of the suction nozzle under the drive of the transfer driver 52. The transfer driver 52 can be an electric cylinder.

[0021] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. An adaptive material handling device, characterized in that, Includes a substrate (1), on which a suction nozzle mechanism (2) is provided. The suction nozzle mechanism (2) can move along its own axis under the drive of the suction nozzle drive assembly (3). The suction nozzle mechanism (2) is slidably disposed on one side of the substrate (1), and the suction nozzle drive assembly (3) is disposed on the other side of the substrate (1); the substrate (1) has a transmission connection groove (11) along its own thickness direction, and the suction nozzle drive assembly (3) has a driver (31) and a transmission mechanism (32), and the transmission mechanism (32) passes through the transmission connection groove (11) and is fixed to the suction nozzle mechanism (2); The transmission mechanism (32) includes a synchronous belt (321) and a pair of synchronous pulleys (322). One of the pair of synchronous pulleys (322) is coaxially fixed to the execution end of the driver (31), and the other is rotatably connected to the base plate (1). The two ends of the synchronous belt (321) are sleeved on the pair of synchronous pulleys (322). A connecting block (323) is fixed to the synchronous belt (321) perpendicular to its own direction of movement. The end of the connecting block (323) away from the synchronous belt (321) passes through the transmission connecting groove (11) and is fixed to the suction nozzle mechanism (2).

2. The adaptive material handling device according to claim 1, characterized in that, A slide rail (41) is fixed on one side of the substrate (1) in the vertical direction. A suction nozzle mounting seat (42) is connected to the slide rail (41) by a slider that is slidably set. One section of the suction nozzle mounting seat (42) is set in an L shape, with a connecting end (421) fixed to the slider and a mounting end (422) perpendicular to the connecting end (421) for the suction nozzle mechanism (2) to be installed.

3. The adaptive material handling device according to claim 2, characterized in that, The suction nozzle mechanism (2) includes a rotary driver (21), the end face of which is fixed to the mounting end (422). The actuating end of the rotary driver (21) passes through the mounting end (422) and is coaxially connected to an adsorber (22). The adsorber (22) is used to realize the adsorption function of the suction nozzle mechanism (2).

4. The adaptive material handling device according to claim 3, characterized in that, Multiple suction nozzle mechanisms (2) are set on the substrate (1) perpendicular to their own direction of movement. At least two suction nozzle mechanisms (2) are constructed as a group. Multiple suction nozzle driving mechanisms are set in correspondence with multiple groups of suction nozzle mechanisms (2).

5. The adaptive material handling device according to claim 1, characterized in that, The substrate (1) is slidably disposed on the substrate driving mechanism (5). The substrate driving mechanism (5) includes a bracket (51). A transfer driver (52) is disposed on the bracket (51) in the horizontal direction. The substrate (1) is fixed to the execution end of the transfer driver (52) and moves perpendicular to the direction of the nozzle movement under the drive of the transfer driver (52).

6. The adaptive material handling device according to claim 1, characterized in that, A pulley cover (12) is fixed on one side of the substrate (1), and a synchronous pulley (322) coaxially connected to the driver (31) is disposed inside the pulley cover (12). The driver (31) is fixed on the outer wall of the pulley cover (12).

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